JPS60189988A - Hybrid ic - Google Patents
Hybrid icInfo
- Publication number
- JPS60189988A JPS60189988A JP4541984A JP4541984A JPS60189988A JP S60189988 A JPS60189988 A JP S60189988A JP 4541984 A JP4541984 A JP 4541984A JP 4541984 A JP4541984 A JP 4541984A JP S60189988 A JPS60189988 A JP S60189988A
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- double
- inch
- lead
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は両面印刷もしくは両面部品実装した混成ＩＣの
両面接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a double-sided connection method for a hybrid IC having double-sided printing or double-sided component mounting.
従来の両面接続法は穴あき基板を用いて、該穴部の導体
膜によるものか、外部リードと反対側即ち上部でコの字
型金具による方法が一般的である。この方法はいずれも
両面接続のための領域が大きく、小形軽量化が困難であ
った。さらに汎用性にも乏しい欠点があった。Conventional double-sided connection methods generally use a holed board and use a conductor film in the hole, or use a U-shaped metal fitting on the side opposite to the external lead, that is, on the top. All of these methods require a large area for double-sided connection, making it difficult to reduce the size and weight. Furthermore, it had the disadvantage of lacking in versatility.
本発明の目的はかかる欠点を解消し、兼備な混成ＬＣを
提供することにある。It is an object of the present invention to overcome these drawbacks and provide a hybrid LC with multiple features.
外部リードはインチピンチに代えて１／２インチピンチ
のものを用い、一本おきに外部リードあるいは両面接続
用に使い分けることにより上記目的を達成できる。The above objective can be achieved by using 1/2 inch pinch external leads instead of inch pinch and using every other external lead or for double-sided connection.
以下、本発明の一実施例を第１図により説明する。フー
プ状となった１／２インチピンチの外部リード１を抵抗
印刷・部品搭載が完了した基板３に挿入し、はんだ接続
を行なう。An embodiment of the present invention will be described below with reference to FIG. The hoop-shaped 1/2 inch pinched external lead 1 is inserted into the board 3 on which resistor printing and component mounting have been completed, and solder connection is made.
さらに一本おきに外部リード１の根本部２から切断する
。これにより外部リードは１−１゜１−５．１−５でイ
ンチピッチとなり１−２゜１−４・・・は両面の接続用
にと区分される。この工程は自動化も容易で、抵抗印刷
一部品実装の不可能な領域を有効活用することができる
。Furthermore, every other lead is cut from the root portion 2 of the external lead 1. As a result, the external leads have an inch pitch of 1-1.degree. 1-5.1-5, and 1-2.degree. 1-4... are divided for connection on both sides. This process is easy to automate, and can effectively utilize areas where it is impossible to mount a single printed resistor component.
本発明によれば両面接続用の新たな部品・加工をするこ
となく、両面抵抗印刷・部品実装を可能とし小形＠量化
および経済化を図ることができる。According to the present invention, it is possible to perform double-sided resistor printing and component mounting without requiring any new parts or processing for double-sided connection, and it is possible to achieve miniaturization, quantity reduction, and economy.
第１ＦｇＪは本発明の一実施例の正面図および側面図で
ある。
１・・・外部リード、
６・・・基板。
代理人弁理士 高 橋 明 夫
第１図
（ｏＬ） （ｂ）1st FgJ is a front view and a side view of one embodiment of the present invention. 1... External lead, 6... Board. Representative Patent Attorney Akio Takahashi Figure 1 (oL) (b)
Claims (1)
板の取付において、所定位置へリード端子を挿入後、該
リード端子のくびれ部より１本おきに間引きして、イン
チピッチのリード端子として使用するとともに、間引き
したリード端子の抱え込み部は両面の電気的接続部とな
し得ることを特徴とする混成■Ｃ０1. When installing a hybrid IC board with picked-up lead terminals with inch pinch, after inserting the lead terminals into the specified position, thin out every other lead terminal from the narrow part of the lead terminal and use it as an inch-pitch lead terminal. , a hybrid ■C0 characterized in that the holding part of the thinned out lead terminals can be used as an electrical connection part on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4541984A JPS60189988A (en) | 1984-03-12 | 1984-03-12 | Hybrid ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4541984A JPS60189988A (en) | 1984-03-12 | 1984-03-12 | Hybrid ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60189988A true JPS60189988A (en) | 1985-09-27 |
Family
ID=12718744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4541984A Pending JPS60189988A (en) | 1984-03-12 | 1984-03-12 | Hybrid ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60189988A (en) |
-
1984
- 1984-03-12 JP JP4541984A patent/JPS60189988A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60189988A (en) | Hybrid ic | |
| JPS61193727A (en) | Fitting method of electronic component | |
| JPS58148964U (en) | Electrical component mounting structure | |
| JPS6057158U (en) | Printed circuit board parts mounting structure | |
| JPS5950463U (en) | Parts mounting terminal | |
| JPS58138370U (en) | LSI package spacer | |
| JPS60176294A (en) | Device for connecting lead wire | |
| JPS59192873U (en) | printed wiring board | |
| JPS60154697A (en) | Method of mounting electronic part | |
| JPH04120246U (en) | Lead shape for electronic components | |
| JPS5989578U (en) | Parts mounting structure | |
| JPS5962866U (en) | Jig for soldering plated wire | |
| JPS61247096A (en) | Mounting of terminal to printed circuit board | |
| JPS5925170U (en) | Lead wire shaping hook | |
| JPS5834727U (en) | Electronic components for printed circuit boards | |
| JPS5918464U (en) | Circuit board lead terminal attachment device | |
| JPS583061U (en) | Parts mounting structure | |
| JPS62163393A (en) | Method of mounting electronic parts | |
| JPS6045446U (en) | semiconductor equipment | |
| JPS5892779U (en) | terminal | |
| JPS5856466U (en) | Parts mounting device | |
| JPS59138267U (en) | Printed board | |
| JPS5931263U (en) | Mounting structure of electronic components | |
| JPS5895070U (en) | printed wiring board | |
| JPS5978655U (en) | Electrical component mounting equipment |