JPS5856466U - Parts mounting device - Google Patents
Parts mounting deviceInfo
- Publication number
- JPS5856466U JPS5856466U JP15140381U JP15140381U JPS5856466U JP S5856466 U JPS5856466 U JP S5856466U JP 15140381 U JP15140381 U JP 15140381U JP 15140381 U JP15140381 U JP 15140381U JP S5856466 U JPS5856466 U JP S5856466U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- mounting device
- component
- lead wire
- parts mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の部品取付装置の断側面図、第2図は本考
案の部品取付装置における一実施例の断側面図である。
10・・・・・・部品、11・・・・・・リード線、1
2・曲・スペーサ、13・・・・・・凹部、14・・・
・・・透孔、15・・・・・・プリント基板、16・・
・・・・取付孔、」7・・・・・・銅箔、18・・・・
・・半田。、 −FIG. 1 is a sectional side view of a conventional component mounting device, and FIG. 2 is a sectional side view of an embodiment of the component mounting device of the present invention. 10... Parts, 11... Lead wire, 1
2. Curved spacer, 13... recess, 14...
...Through hole, 15...Printed circuit board, 16...
...Mounting hole, 7...Copper foil, 18...
··solder. , −
Claims (1)
プリント基板に形成さ籠た取付孔より若、干ずれた位置
関係になるように上記部品のリード線挿入用透孔を形成
し、この透孔を介して上記取付孔に上記部品のリード線
を挿入したとき上記リード線が上記透孔と上記取付孔と
の間で挾持されるように構成した部品取付装置。A through hole for inserting the lead wire of the component is formed in a spacer interposed between the component and the printed circuit board so that the position is slightly shifted from the mounting hole formed in the printed circuit board, and A component mounting device configured such that when the lead wire of the component is inserted into the mounting hole through the hole, the lead wire is held between the through hole and the mounting hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15140381U JPS5856466U (en) | 1981-10-12 | 1981-10-12 | Parts mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15140381U JPS5856466U (en) | 1981-10-12 | 1981-10-12 | Parts mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5856466U true JPS5856466U (en) | 1983-04-16 |
Family
ID=29944091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15140381U Pending JPS5856466U (en) | 1981-10-12 | 1981-10-12 | Parts mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5856466U (en) |
-
1981
- 1981-10-12 JP JP15140381U patent/JPS5856466U/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5856466U (en) | Parts mounting device | |
JPS5877060U (en) | electronic components | |
JPS58142958U (en) | Printed board | |
JPS582974U (en) | Soldering fixing device for component terminals | |
JPS5939971U (en) | Printed board | |
JPS5911450U (en) | Mounting board for integrated circuit elements | |
JPS58186570U (en) | Circuit board lead terminal attachment device | |
JPS59173386U (en) | Printed circuit board connection structure | |
JPS58162646U (en) | electronic components | |
JPS5996775U (en) | Printed circuit board connection device | |
JPS58138370U (en) | LSI package spacer | |
JPS5827866U (en) | printed wiring board | |
JPS6083273U (en) | Component mounting structure | |
JPS58150862U (en) | Chip parts mounting device | |
JPS5851466U (en) | parts mounting device | |
JPS5849462U (en) | Printed board | |
JPS59127270U (en) | printed circuit board equipment | |
JPS6016581U (en) | printed wiring board | |
JPS59149662U (en) | Electrical component mounting device | |
JPS59159972U (en) | Printed board | |
JPS58131660U (en) | spacer | |
JPS5869978U (en) | Printed board | |
JPS588979U (en) | parts mounting device | |
JPS6045446U (en) | semiconductor equipment | |
JPS5872845U (en) | semiconductor equipment |