JPS62163393A - Method of mounting electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for mounting electronic components on a printed circuit board, and in particular, to a method for mounting electronic components on a printed circuit board. Solder the wires and insert them into the through holes on the printed circuit board.
e) This relates to a method for mounting an electronic component in the case of soldering the lead wire of the electronic component to be inserted into the device.

[Conventional technology]

FIG. 2 shows a flowchart showing the entire conventional method and sectional views corresponding to each step of this flowchart. In the figure, (1) is a printed circuit board, (2) is a surface-mounted electronic component, (3) is an insertion-mounted electronic component, (4) is a lead wire, (
5) is an electronic component mounting land, (6) is a cream solder, and (21) to (26) are each step.

In step (21), an electronic component mounting land (cream solder 6) on one side (temporarily referred to as the first side) of the printed circuit board is printed. In step (22), all the lead wires of the surface-mounted electronic component (2) are placed on the corresponding electronic component mounting land (5). In step (23), when the solder paste is placed in a reflow oven (not shown) and the temperature is raised, the cream solder (21) flows and reflow soldering is performed. When the IJ-wire of a surface-mounted electronic component is soldered to the first surface, the surface on the opposite side of the first surface (temporarily referred to as the second surface)
Steps (21) to (23) are performed on the board, and when it is determined in step (24) that double-sided mounting has been completed, step (25) is entered and the electronic component to be inserted and mounted is inserted into the through hole of the printed circuit board (1). Insert all lead wires (4) in step (3) and insert the lead wires (4) inserted in step (26).
4) Soldering is done manually.

FIG. 5 is a sectional view showing the state after step (26) in FIG. 2 is completed.

[Problem that the invention seeks to solve]

The conventional method is as described above, and most of the steps can be performed by automatic machines, but as shown in Figure 5, the lead wire (4) of the electronic component (3) to be inserted
protrudes to the second surface of the printed circuit board +11, so if this inserted electronic component (3) is inserted into the printed circuit board (1)
If you automatically solder the surface-mounted electronic components on both sides of the printed circuit board (1) at the same time as the surface-mounted electronic components, it will be difficult to print cream solder on the second surface. After installing 2), insert and install electronic components (3).
) All components must be attached, and at the time of this work, other parts have already been soldered, so traditional flow soldering cannot be used, and the soldering must be done manually. However, the problem was that the work required a lot of time.

This invention was made to solve the above-mentioned problems, and enables flow soldering of insertion-mounted electronic components in the same process as reflow soldering of surface-mounted electronic components.

[Means for solving problems]

In this invention, the length of the lead wire of the inserted electronic component is made shorter than the thickness of the printed circuit board so that the tip of the lead wire does not protrude from the opposite side of the printed circuit board after soldering. Even after soldering the insert-mounted electronic components, cream solder can be printed on the second side of the printed circuit board.

[Effect]

According to this invention, when soldering the leads of surface-mounted electronic components to the first surface of the printed circuit board by reflow soldering, the leads of the insertion-mounted electronic components are soldered by flow soldering, and then Cream solder can be printed on the second side of the printed circuit board, so
゛The work time required for mounting electronic components can be reduced.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a flowchart showing an embodiment of the present invention;
Sectional views corresponding to each step of this flowchart are shown.

In FIG. 1, the same reference numerals as in FIG. 2 indicate the same or corresponding parts, and (11) to (17) indicate each step. FIG. 3 is a sectional view showing the state after step (17) in FIG. 1 is completed, and FIG. 4 is a partially enlarged view of FIG. 3. As is clear from a comparison between FIG. 5 and FIG. 3, in this invention, the length t of the lead wire (4) of the electronic component (3) to be inserted and mounted is set to be less than the thickness t of the printed circuit board (1). Therefore, even after the lead (4) of component 13) is soldered to the through hole, the tip of the lead (4) does not protrude from the second surface of the printed circuit board (1), and cream solder is applied to this second surface. All are easy to print.

Preferably in a relationship.

Therefore, in this invention, cream solder is printed on the first surface of the printed circuit board (1) in step (11), and at the same time, in step (12), the IJ-wire of the surface-mounted electronic component (2) is placed. Insert the electronic component (3) into the lead i +41't through hole and proceed to step (1).
In step 3), the lead wire inside the distle hole is soldered by flow soldering, and the lead wire of the electronic component (2) mounted on the surface is soldered to the electronic component mounting land by reflow soldering. When step (13) is completed, step (14)
), the surface of the printed circuit board (1) is reversed and electronic components are mounted on the second surface. Step (15).

(16) and (17) are step C21 in Figure 2)
, (22), C23).

Although the above embodiment describes the case where surface-mounted electronic components are mounted on both sides of a printed circuit board, the method of the present invention can be applied in the same manner even when surface-mounted electronic components are mounted only on the second surface. It has the following effects.

〔Effect of the invention〕

As described above, according to the present invention, even after the lead wires of the insertion-mounted electronic component are shortened by the thickness of the printed circuit board and the lead wires of the insertion-mounted electronic component are soldered to all the through-holes, the opposite side Since cream solder can be printed on the board, it is possible to shorten the work time required to attach electronic components.

[Brief explanation of drawings]

FIG. 1 shows a flowchart showing one embodiment of the present invention and sectional views corresponding to each step of this flowchart. FIG. 2 shows a flowchart showing a conventional method and sectional views corresponding to each step of this flowchart. Figures 3 and 4
The figure is a cross-sectional view showing the state in which step (17) in Fig. 1 has been completed, and Fig. 5 shows the state in which step (26) in Fig. 2 has been completed. (2
) is a surface-mounted playback component, (3) is an insertion-mounted electronic component, (4) is a lead wire, (5) is an electronic component mounting land,
(6) is cream solder. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (2)

[Claims] (1) Mounting method of electronic components when surface-mounted electronic components are soldered and mounted on both sides of the printed circuit board, and the leads of the electronic components to be inserted and mounted are inserted into the through-holes of the printed circuit board and then soldered and mounted. A step of printing cream solder on the electronic component mounting land on which the surface-mounted electronic component is to be mounted on the first surface of the printed circuit board, and placing a lead wire of the surface-mounted electronic component onto the corresponding electronic component mounting land. an insertion process in which the length of the lead wire of the electronic component to be inserted is made shorter than the thickness of the printed circuit board and inserted into the corresponding through hole; the lead wire in the through hole is soldered to the through hole by flow soldering; a step of soldering a lead wire on an electronic component mounting land to the land by reflow soldering, on a second surface opposite to the first surface of the printed circuit board;
a step of printing cream solder on an electronic component mounting land on which a surface-mounted electronic component is to be mounted; a step of arranging a lead wire of a corresponding surface-mounted electronic component on the electronic component mounting land on the second surface; A step of soldering the lead wire of an electronic component to be surface-mounted on the second surface to a corresponding electronic component mounting land by reflow soldering on the second surface. Method. (2) In the insertion process, the length of the lead wire of the electronic component to be inserted is shorter than the thickness of the printed circuit board and inserted into the corresponding through hole, the length of the lead is longer than half the thickness of the printed circuit board. A method for mounting an electronic component according to claim 1, characterized in that: