JPS58129674U - How to solder chip type components to a composite board - Google Patents
How to solder chip type components to a composite boardInfo
- Publication number
- JPS58129674U JPS58129674U JP2422282U JP2422282U JPS58129674U JP S58129674 U JPS58129674 U JP S58129674U JP 2422282 U JP2422282 U JP 2422282U JP 2422282 U JP2422282 U JP 2422282U JP S58129674 U JPS58129674 U JP S58129674U
- Authority
- JP
- Japan
- Prior art keywords
- composite board
- type components
- chip type
- holes
- solder chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のはんだ付は方法によるはんだ量の状態図
、第２図及び第３図は本考案によるはんだレジストを印
刷した説明図にして、第２図は加熱処理前、第３図は加
熱処理後を示すものである。
１．２＝基板、３：基板接合用はんだ、４：チップ型部
品、５：チップ部品接合用はんだ、６：スルーホール、
７：はんだレジスト。Figure 1 is a state diagram of the amount of solder depending on the conventional soldering method, Figures 2 and 3 are explanatory diagrams printed with the solder resist according to the present invention, Figure 2 is before heat treatment, and Figure 3 is The figure is shown after heat treatment. 1.2 = board, 3: solder for board bonding, 4: chip type components, 5: solder for chip component bonding, 6: through hole,
7: Solder resist.
Claims (1)
板を貼り合わせた複合基板において、部品取付面のスル
ーホーレレ周囲をはさんだレジストすることによって、
部品取付用のはんだがスルーホールに流れ込むのを防ぐ
ようにしたことを特徴とするチップ型部品はんだ付は方
法。In a composite board made by bonding multiple printed circuit boards that have through-holes for electrical connection, by applying resist around the through-holes on the component mounting surface,
A method for soldering chip-type components characterized by preventing solder for mounting components from flowing into through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2422282U JPS58129674U (en) | 1982-02-24 | 1982-02-24 | How to solder chip type components to a composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2422282U JPS58129674U (en) | 1982-02-24 | 1982-02-24 | How to solder chip type components to a composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58129674U true JPS58129674U (en) | 1983-09-02 |
Family
ID=30036230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2422282U Pending JPS58129674U (en) | 1982-02-24 | 1982-02-24 | How to solder chip type components to a composite board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58129674U (en) |
-
1982
- 1982-02-24 JP JP2422282U patent/JPS58129674U/en active Pending
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