JPS5933273U

JPS5933273U - Printed board

Info

Publication number: JPS5933273U
Application number: JP12989482U
Authority: JP
Inventors: 中西　政貴
Original assignee: 日本電気ホームエレクトロニクス株式会社
Priority date: 1982-08-27
Filing date: 1982-08-27
Publication date: 1984-03-01

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来のプリント基板の平面図、第２図は第１図
の基板の部分拡大図、第３図は第２図の断面図で半田処
理後の状態を示し、第４図は本考案のブツシュバック式
プリント基板の要部平面図、及び第５図は第４図の断面
図である。１１・・・プリント基板、１２・・・配線ブロック部、
１３・・・保持フレーム部、１４・・・境界線、１５・
・・半田付は部分、１６・・・絶縁基板、１７・・・導
電ランド、１８・・・半田レジスト。Figure 1 is a plan view of a conventional printed circuit board, Figure 2 is a partially enlarged view of the board in Figure 1, Figure 3 is a cross-sectional view of Figure 2, showing the state after soldering, and Figure 4 is a printed circuit board. FIG. 5 is a plan view of the main parts of the invented bushback type printed circuit board, and FIG. 5 is a sectional view of FIG. 4. 11... Printed circuit board, 12... Wiring block section,
13... Holding frame part, 14... Boundary line, 15.
...Soldering is done in parts, 16...Insulating substrate, 17...Conductive land, 18...Solder resist.

Claims

[Scope of utility model registration request]

Soldering of a predetermined conductive land pattern and this pattern is performed by a wiring block portion and a holding frame portion that releasably connect insulating substrates on which solder resists are laminated in sequence at a predetermined boundary line. and after soldering and wiring a predetermined circuit component to the soldering portion, the block portion is separated from the frame portion to form a printed wiring body, wherein the pattern is formed on both sides of the boundary line. The expanding solder has a part, and the solder has a sawtooth-like boundary between the part and the solder resist along the boundary line, and when the block part and the frame part are separated after the soldering process. A printed circuit board characterized by preventing pattern peeling.