JPS6235695A - Soldering of double side packaged part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Summary] Soldering of double-sided mounted components is a method in which a jig having a recess at a position corresponding to the component mounting position on the back side of the board is used, and the mounting component is soldered into the recess. Place the board with the part facing upwards, place the board with solder paste printed on both sides on the jig, then place the parts to be mounted on the surface and pass it through a flow furnace to solder both sides of the board at the same time. make it possible to do so.

[Industrial application field]

The present invention relates to a method for soldering double-sided mounted components for soldering and mounting components on both sides of an electronic circuit board.

[Conventional technology]

FIGS. 3 and 4 show a conventional method for mounting on both sides of a board by reflow soldering. In the method shown in FIG. 3, a back-mounted component 4 is temporarily attached using an adhesive 2 to the back surface of a board 1 on which solder paste has been printed on both the front and back surfaces, and a reflow oven is used with the surface-mounted component 3 placed on the front surface. The method shown in Fig. 4 is to solder components on both the front and back sides at the same time through a . adhesive 2
The surface mount components 3 are bonded using a dust flow oven, and then soldered using a dust flow furnace.Then, as shown in FIG. soldering.

[Problem that the invention seeks to solve]

In all of the above conventional methods, the parts on the bottom side need to be temporarily fixed using adhesive to prevent them from falling into the reflow soldering, which increases the number of steps and requires adjustment of the amount of adhesive used. There are problems in that it is difficult to cure and takes time to harden, which hinders mass production. In addition, the conventional method has the problem that the first soldering process deteriorates because heating is applied twice.

The present invention was created in view of these points, and is a method for soldering double-sided mounted components that does not require temporary fixing of components with adhesive and can solder components on both the front and back sides with one heating. is intended to provide.

c. Means for Solving Problems] For this reason, in the present invention, a jig 10 having a recess 11 dug at a position corresponding to the component mounting position on the back side of the board is prepared, and the recess 11 of the jig 10 is The mounted component 12 is inserted with the soldering side facing up, and a board 14 on which solder paste 13 is printed on both sides in advance is placed on top of it.
It is characterized in that after the surface mount components 15 are placed on the surface, the components 12 and 15 on both sides of the board 14 are simultaneously soldered by heating through a reflow oven.

[For production]

By using a jig with a recess into which the components can be inserted, placing the backside mount components in the recess, and then placing the board with the surface mount components on top of it and passing it through a reflow oven, both the front and back surfaces can be bonded without using adhesives. It becomes possible to solder mounted components with one heating.

〔Example〕

1 and 2 are diagrams for explaining the present invention in detail, FIG. 1 is a diagram for explaining the process, and FIG. 2 is a diagram for explaining the jig used in this embodiment.

In this embodiment, first, a jig 10 as shown in the perspective view of FIG. 2A and the sectional view of FIG. 2A is prepared. This jig is made of a material that cannot be wetted by solder, such as ceramic 1. A recess 11 is provided in the position corresponding to the back-mounted components of the double-sided component-mounted circuit, and the depth of the recess 11 is set such that the soldering of each inserted component is The part should protrude slightly from the jig surface.

Next, the soldering method of this embodiment will be explained using FIG.

First, a jig 10 and a back mount component 12 are prepared as shown in FIG. 1A, and the back mount component 12 is inserted into the recess 11 of the jig 10 as shown in FIG. Next, as shown in FIG. Place the surface mount component 15 at a predetermined position. Next, when this is inserted into a reflow oven and heated, the solder paste 13 is melted as shown in FIG. 1d, and the parts 12 and 15 on both the front and back sides are soldered to the pads.

As described above, according to the soldering method of this embodiment, it is not necessary to temporarily fix the components to the board with an adhesive, and the components on both the front and back surfaces can be simultaneously reflow soldered by one heating operation. Therefore, the number of man-hours required for soldering can be reduced, and soldering does not cause deterioration of the parts.

Although it has been explained that the solder paste is printed on both sides of the board in advance, it is also possible to print only on the back side first, and then print the solder paste on the back side when reflow soldering the back side components.

〔Effect of the invention〕

As described above, according to the present invention, components can be simultaneously soldered to both sides of a board using an extremely simple method, which is extremely useful in practice.

[Brief Description of the Drawings] Figure 1 is a diagram for explaining the method for soldering double-sided mounted components according to the embodiment of the present invention, and Figure 2 is a diagram showing the jig used in the method for soldering double-sided mounted components according to the embodiment. , where a is a perspective view, b is a cross-sectional view taken along line bb in figure a, and Figures 3 and 4 are diagrams for explaining the conventional soldering method for double-sided mounting components. . In FIGS. 1 and 2, 10 is a jig, 11 is a four part into which a back mount component is inserted, 12 is a back mount component, 13 is solder, 14 is a board, and 15 is a surface mount component. Diagram showing the jig used in the method for soldering double-sided mounted components of the present invention: 4s2 Cause 10 Jig 11... Recessed portion 12 into which the back-mounted component is inserted Back-mounted device No. 1 Figure 1 Conventional soldering of double-sided mounted components Figure 3 to explain the method of soldering Surface mount components 4 Back side mount parts W product Diagram to explain the method for conventional soldering of double-sided mount components 1. Board 4 Back side mounting parts

Claims (1)

[Claims] 1. Create a recess (1
1) is prepared, and the jig (10) is dug.
) into the recess (11) with the soldered part facing up, place the board (14) on which solder paste (13) has been printed in advance on both sides, and then A double-sided mount component characterized in that the surface mount component (15) is placed on the surface of the board (14) and then heated through a reflow oven to simultaneously solder the mounted components (12, 15) on both sides of the board (14). How to solder.