JPS6235695A - Soldering of double side packaged part - Google Patents
Soldering of double side packaged partInfo
- Publication number
- JPS6235695A JPS6235695A JP17433685A JP17433685A JPS6235695A JP S6235695 A JPS6235695 A JP S6235695A JP 17433685 A JP17433685 A JP 17433685A JP 17433685 A JP17433685 A JP 17433685A JP S6235695 A JPS6235695 A JP S6235695A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- board
- components
- jig
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
両面実装部品の半田付は方法であって、基板裏面の部品
取付位置に対応する位置に凹部を有する治具を用い、該
凹部に取付部品を半田付は部を上向きに入れ、その冶具
上に両面に半田ペーストを印刷した基板をのせ、さらに
その上に表面に実装すべき部品をのせてからりフロー炉
を通すことにより基板両面の半田付けを同時に行なうこ
とを可能とする。[Detailed Description of the Invention] [Summary] Soldering of double-sided mounted components is a method in which a jig having a recess at a position corresponding to the component mounting position on the back side of the board is used, and the mounting component is soldered into the recess. Place the board with the part facing upwards, place the board with solder paste printed on both sides on the jig, then place the parts to be mounted on the surface and pass it through a flow furnace to solder both sides of the board at the same time. make it possible to do so.
本発明は、電子回路用基板の両面に部品を半田付は実装
するための両面実装部品の半田付は方法に関するもので
ある。The present invention relates to a method for soldering double-sided mounted components for soldering and mounting components on both sides of an electronic circuit board.
基板の両面にリフロー半田付は法で実装する場合の従来
の方法を第3図及び第4図に示す。第3図に示す方法は
、予め表裏両面に半田ペーストを印刷した基板1の裏面
に接着剤2を用いて裏面実装部品4を仮止めし、表面に
表面実装部品3をのせた状態でリフロー炉を通し、表裏
両面の部品を同時に半田付けするものであり、第4図に
示す方法は、先ず第4図aに示すように予め表裏両面に
半田ペーストを印刷した基板1の表を上にして接着剤2
を用いて表面実装部品3を接着したのちりフロー炉を通
して半田付けし、次いで第4図すのように基板1を裏返
しその上に裏面実装部品4をのせたのちりフロー炉を通
して裏面実装部品4の半田付けを行なうのである。FIGS. 3 and 4 show a conventional method for mounting on both sides of a board by reflow soldering. In the method shown in FIG. 3, a back-mounted component 4 is temporarily attached using an adhesive 2 to the back surface of a board 1 on which solder paste has been printed on both the front and back surfaces, and a reflow oven is used with the surface-mounted component 3 placed on the front surface. The method shown in Fig. 4 is to solder components on both the front and back sides at the same time through a . adhesive 2
The surface mount components 3 are bonded using a dust flow oven, and then soldered using a dust flow furnace.Then, as shown in FIG. soldering.
上記従来方法では、何れも下面の部品がリフロー半田付
は中に落下するのを防止するため接着剤を用いて仮止め
する必要があるため、工程数が増え、また接着剤の使用
量の調節がむずかしくまた硬化に時間を要し量産を阻害
するといった問題がある。また従来方法は2回の加熱が
加わるため最初の半田付は部分が劣化するという問題も
あった。In all of the above conventional methods, the parts on the bottom side need to be temporarily fixed using adhesive to prevent them from falling into the reflow soldering, which increases the number of steps and requires adjustment of the amount of adhesive used. There are problems in that it is difficult to cure and takes time to harden, which hinders mass production. In addition, the conventional method has the problem that the first soldering process deteriorates because heating is applied twice.
本発明はこのような点に鑑みて創作されたもので、接着
剤による部品の仮止めを必要とせず、且つ1回の加熱で
表裏両面の部品を半田付けできる両面実装部品の半田付
は方法を提供することを目的としている。The present invention was created in view of these points, and is a method for soldering double-sided mounted components that does not require temporary fixing of components with adhesive and can solder components on both the front and back sides with one heating. is intended to provide.
c問題点を解決するための手段〕
このため本発明においては、基板裏面の部品取付位置に
対応する位置に凹部11が掘設された冶具10を用意し
、該治具10の凹部11に裏面実装部品12を半田付は
部を上にして挿入し、その上に、両面に予め半田ペース
ト13を印刷した基板14を載置し、さらに該基板14
表面に表面実装部品15を載置したのち、リフロー炉を
通して加熱し、基板14両面の実装部品12 、15を
同時に半田付けすることを特徴としている。c. Means for Solving Problems] For this reason, in the present invention, a jig 10 having a recess 11 dug at a position corresponding to the component mounting position on the back side of the board is prepared, and the recess 11 of the jig 10 is The mounted component 12 is inserted with the soldering side facing up, and a board 14 on which solder paste 13 is printed on both sides in advance is placed on top of it.
It is characterized in that after the surface mount components 15 are placed on the surface, the components 12 and 15 on both sides of the board 14 are simultaneously soldered by heating through a reflow oven.
部品が入る凹所を有する治具を用い、その凹所に裏面実
装部品を入れ、その上から表面実装部品をのせた基板を
のせてリフロー炉を通すことにより、接着剤を用いずに
表裏両面の実装部品を一回の加熱で半田付けすることが
可能となる。By using a jig with a recess into which the components can be inserted, placing the backside mount components in the recess, and then placing the board with the surface mount components on top of it and passing it through a reflow oven, both the front and back surfaces can be bonded without using adhesives. It becomes possible to solder mounted components with one heating.
第1図及び第2図は本発明の詳細な説明するための図で
あり、第1図は工程説明図、第2図は本実施例に使用す
る治具を説明するための図である。1 and 2 are diagrams for explaining the present invention in detail, FIG. 1 is a diagram for explaining the process, and FIG. 2 is a diagram for explaining the jig used in this embodiment.
本実施例は先ず第2図aの斜視図及び第2図すの断面図
に示す如き治具10を用意する。この治具は半田にぬれ
ない材料、例えばセラミ1.りを用い、両面部品実装回
路の裏面実装部品に対応する位置にそれらの部品を挿入
することができる凹部11を設けたものであり、その凹
部11の深さはそれぞれ挿入した部品の半田付は部が治
具表面から僅かに出る程度とする。In this embodiment, first, a jig 10 as shown in the perspective view of FIG. 2A and the sectional view of FIG. 2A is prepared. This jig is made of a material that cannot be wetted by solder, such as ceramic 1. A recess 11 is provided in the position corresponding to the back-mounted components of the double-sided component-mounted circuit, and the depth of the recess 11 is set such that the soldering of each inserted component is The part should protrude slightly from the jig surface.
次に第1図を用いて本実施例の半田付は方法を説明する
。Next, the soldering method of this embodiment will be explained using FIG.
先ず第1図aの如く治具10及び裏面実装部品12を用
意し、この治具10の凹部11に第1図すの如く裏面実
装部品12を挿入する。次に第1図Cの如く予め両面の
パッド上に半田ペースト13を印刷した基板14と表面
実装部品15とを用意し、この基板14を治具10の上
にのせ、さらに基板14の表面の所定位置に表面実装部
品15をのせる。次いでこれをリフロー炉に挿入して加
熱すれば第1図dに示す如く半田ペースト13が溶融し
て表裏両面の部品12 、15をパッドに半田付けする
のである。First, a jig 10 and a back mount component 12 are prepared as shown in FIG. 1A, and the back mount component 12 is inserted into the recess 11 of the jig 10 as shown in FIG. Next, as shown in FIG. Place the surface mount component 15 at a predetermined position. Next, when this is inserted into a reflow oven and heated, the solder paste 13 is melted as shown in FIG. 1d, and the parts 12 and 15 on both the front and back sides are soldered to the pads.
このように本実施例の半田付は法によれば、部品を接着
剤により基板に仮止めする必要がなく、且つ1回の加熱
で表裏両面の部品を同時にリフロー半田付けすることが
できる。従って半田付は工数の削減ができ、また半田付
は部の劣化が生ずることもない。As described above, according to the soldering method of this embodiment, it is not necessary to temporarily fix the components to the board with an adhesive, and the components on both the front and back surfaces can be simultaneously reflow soldered by one heating operation. Therefore, the number of man-hours required for soldering can be reduced, and soldering does not cause deterioration of the parts.
なお基板への半田ペーストの印刷は予め両面に印刷する
ように説明したが、これは先ず裏面のみに印刷し、裏面
部品をリフロー半田付は後表面に半田ペーストを印刷し
ても良い。Although it has been explained that the solder paste is printed on both sides of the board in advance, it is also possible to print only on the back side first, and then print the solder paste on the back side when reflow soldering the back side components.
以上述べてきたようにに、本発明によれば、極めて簡易
な方法で基板の両面に同時に部品を半田付けすることが
でき、実用的には極めて有用である。As described above, according to the present invention, components can be simultaneously soldered to both sides of a board using an extremely simple method, which is extremely useful in practice.
【図面の簡単な説明】
第1図は本発明の実施例の両面実装部品の半田付は方法
を説明するための図、
第2図は実施例の両面実装部品の半田付は方法に用いる
冶具を示す図であり、aは斜視図、bはa図のb−b線
における断面図、
第3図及び第4図は従来の両面実装部品の半田付は方法
を説明するための図である。
第1図、第2図において、
10は治具、
11は裏面実装部品を挿入する四部、
12は裏面実装部品、
13は半田、
14は基板、
15は表面実装部品である。
本発明の両面実装部品の半田付は
方法に用いる治具を示す図
:4s2 因 10 治具11・・・裏面
実装部品を
挿入する凹部
12 裏面実装置
第 1 図
従来の両面実装部品の半田付は
方法を説明するだめの図
3 表面実装部品
4 裏面実装部品
W品
従来の両面実装部品の半田付は
方法を説明するだめの図 1.基板4 裏面実装部
品[Brief Description of the Drawings] Figure 1 is a diagram for explaining the method for soldering double-sided mounted components according to the embodiment of the present invention, and Figure 2 is a diagram showing the jig used in the method for soldering double-sided mounted components according to the embodiment. , where a is a perspective view, b is a cross-sectional view taken along line bb in figure a, and Figures 3 and 4 are diagrams for explaining the conventional soldering method for double-sided mounting components. . In FIGS. 1 and 2, 10 is a jig, 11 is a four part into which a back mount component is inserted, 12 is a back mount component, 13 is solder, 14 is a board, and 15 is a surface mount component. Diagram showing the jig used in the method for soldering double-sided mounted components of the present invention: 4s2 Cause 10 Jig 11... Recessed portion 12 into which the back-mounted component is inserted Back-mounted device No. 1 Figure 1 Conventional soldering of double-sided mounted components Figure 3 to explain the method of soldering Surface mount components 4 Back side mount parts W product Diagram to explain the method for conventional soldering of double-sided mount components 1. Board 4 Back side mounting parts
Claims (1)
1)が掘設された治具(10)を用意し、該治具(10
)の凹部(11)に裏面実装部品(12)を半田付け部
を上にして挿入し、その上に、両面に予め半田ペースト
(13)を印刷した基板(14)を載置し、さらに該基
板(14)表面に表面実装部品(15)を載置したのち
、リフロー炉を通して加熱し、基板(14)両面の実装
部品(12、15)を同時に半田付けすることを特徴と
する両面実装部品の半田付け方法。1. Create a recess (1
1) is prepared, and the jig (10) is dug.
) into the recess (11) with the soldered part facing up, place the board (14) on which solder paste (13) has been printed in advance on both sides, and then A double-sided mount component characterized in that the surface mount component (15) is placed on the surface of the board (14) and then heated through a reflow oven to simultaneously solder the mounted components (12, 15) on both sides of the board (14). How to solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17433685A JPS6235695A (en) | 1985-08-09 | 1985-08-09 | Soldering of double side packaged part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17433685A JPS6235695A (en) | 1985-08-09 | 1985-08-09 | Soldering of double side packaged part |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6235695A true JPS6235695A (en) | 1987-02-16 |
Family
ID=15976855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17433685A Pending JPS6235695A (en) | 1985-08-09 | 1985-08-09 | Soldering of double side packaged part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6235695A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0388373U (en) * | 1989-12-25 | 1991-09-10 | ||
JP2007305764A (en) * | 2006-05-11 | 2007-11-22 | Teikoku Tsushin Kogyo Co Ltd | Manufacturing method of different shape component mounting substrate |
-
1985
- 1985-08-09 JP JP17433685A patent/JPS6235695A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0388373U (en) * | 1989-12-25 | 1991-09-10 | ||
JP2007305764A (en) * | 2006-05-11 | 2007-11-22 | Teikoku Tsushin Kogyo Co Ltd | Manufacturing method of different shape component mounting substrate |
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