JPS6058697A - Method of dividing ceramic substrate - Google Patents
Method of dividing ceramic substrateInfo
- Publication number
- JPS6058697A JPS6058697A JP16689583A JP16689583A JPS6058697A JP S6058697 A JPS6058697 A JP S6058697A JP 16689583 A JP16689583 A JP 16689583A JP 16689583 A JP16689583 A JP 16689583A JP S6058697 A JPS6058697 A JP S6058697A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- hybrid
- grooves
- divided
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（ａ）発明の技術分野
本発明は個々の基板に分離するセラミック基板の分割方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for dividing a ceramic substrate into individual substrates.
（ｂ）技術の背景
セラミック基板上に導体膜、抵抗膜を印刷焼成し、所望
の回路、素子を形成し、その後搭載部品を半田付けして
接着して１枚のセラミック基板よりハイブリッドＩＣを
同時に多数製造することが広く行われている。(b) Background of the technology A conductive film and a resistive film are printed and fired on a ceramic substrate to form the desired circuits and elements, and then mounted components are soldered and bonded to simultaneously create a hybrid IC from a single ceramic substrate. Manufacturing in large numbers is widely practiced.
（ｃ）従来技術と問題点
第１図は従来のセラミック基板の（イ）は斜視図、（ロ
）は分割時の断面図である。(c) Prior Art and Problems In FIG. 1, (a) is a perspective view and (b) is a sectional view of a conventional ceramic substrate when it is divided.
同図（イ）においてセラミック基板１の表面はレーザー
にてスクライビングされ数条の平行なＸ軸方向の■溝３
と数条の平行なＹ軸方向のＶｉ４とにより個々のハイブ
リッドＩＣ基板１１に区画されている。そしてそれぞれ
のハイ−ブリッドＩＣ基板１１には導体膜、抵抗膜が印
刷焼成されて、所望の回路、素子（いずれも図示せず）
が同時に形成されている。In the same figure (A), the surface of the ceramic substrate 1 is scribed with a laser to form several parallel grooves 3 in the X-axis direction.
and several parallel lines Vi4 in the Y-axis direction, into individual hybrid IC substrates 11. Then, a conductive film and a resistive film are printed and fired on each hybrid IC board 11 to form desired circuits and elements (none of which are shown).
are formed at the same time.
そして所望の回路部分に搭載部品２が半田接着されてい
る。搭載部品２を半田接着するにはまず搭載部品２が実
装される部分に半田層を印刷し、その半田層の上面に搭
載部品２を載置する。その後セラミック基板１の全体を
２４０度前後に加熱して半田をリフローさせ搭載部品２
を半田付けしている。Then, the mounting component 2 is soldered and bonded to a desired circuit portion. To solder and bond the mounted component 2, first, a solder layer is printed on the part where the mounted component 2 is to be mounted, and the mounted component 2 is placed on the top surface of the solder layer. After that, the entire ceramic board 1 is heated to around 240 degrees to reflow the solder and the mounted parts 2
are soldered.
そして個々のハイブリッドＩＣに分割するには（ロ）の
ように、それぞれのＶ溝３の両側縁を支持合６にて支持
し、Ｖ溝３の一裏面側よりポンチパー５を押圧して、■
溝３部分にて切断しセラミック基板１を短冊状に分離す
る。そしてさらに短冊状のものをＶ溝４部分にて切断し
て、個々のハイブリッドＩＣに分割する。Then, to divide into individual hybrid ICs, as shown in (b), support both side edges of each V-groove 3 with support joints 6, press the puncher 5 from one back side of the V-groove 3, and
The ceramic substrate 1 is separated into strips by cutting at the groove 3 portion. Then, the strip-shaped product is further cut at the 4 V-grooves and divided into individual hybrid ICs.
従来はこのようにしてセラミック基板１を分割している
のであるが、分割作業が煩雑であるばかりでなく、支持
台を当接する■溝の縁部には搭載部品を実装することが
できず、搭載部品の実装領域が制限されるという問題点
がある。Conventionally, the ceramic substrate 1 is divided in this way, but not only is the division work complicated, but it is also impossible to mount components on the edges of the grooves where the support base comes into contact. There is a problem in that the mounting area for mounted components is limited.
（ｄ）発明の目的
本発明の目的は、上記従来の問題点が除去されたセラミ
ック基板の分割方法を提供することにある。(d) Object of the Invention An object of the present invention is to provide a method for dividing a ceramic substrate in which the above-mentioned conventional problems are eliminated.
（ｅ）発明の構成
この目的を達成するために本発明は、セラミック基板は
表面に７トリックス状に形成された■溝により個々の基
板に区画されてなり、該Ｖ溝内に金属膜を充填焼成形成
せしめ、該セラミック基板を加熱し、該金属膜の熱応力
により該Ｖｔ１部分にて個々の基板に分割するようにし
たもである。(e) Structure of the Invention In order to achieve this object, the present invention comprises a ceramic substrate divided into individual substrates by grooves formed in a 7-trix shape on the surface, and a metal film is filled in the V grooves. The ceramic substrate is heated and divided into individual substrates at the Vt1 portion due to the thermal stress of the metal film.
（ｆ）発明の実施例
以下図示実施例を参照して本発明について詳細に説明す
る。なお全図を通して同一符号は同一対象物を示す。(f) Embodiments of the Invention The present invention will be described in detail below with reference to illustrated embodiments. Note that the same reference numerals indicate the same objects throughout the figures.
第２図は本発明の一実施例のセラミック基板の斜視図で
ある。FIG. 2 is a perspective view of a ceramic substrate according to an embodiment of the present invention.
同図においてセラミック基板工の表面は数条の平行なＸ
軸方向の■溝３と、数条の平行なＹ軸方向のＶ溝４とに
より、個々のハイブリッドＩＣ基板１１に区画されてい
る。そしてそれぞれのハイブリッドＩＣ基板１１には導
体膜、抵抗膜が印刷焼成されて、所望の回路、素子（い
ずれも図示せず）が同時に形成されている。In the same figure, the surface of the ceramic substrate has several parallel X lines.
Each hybrid IC board 11 is divided by an axial square groove 3 and several parallel V-grooves 4 in the Y-axis direction. A conductive film and a resistive film are printed and fired on each hybrid IC substrate 11, and desired circuits and elements (none of which are shown) are simultaneously formed.
そしてそれぞれのハイブリッドＩＣ基板１１に抵抗膜、
導体膜をを印刷した直後に、それぞれのＶ溝３およびＶ
溝４内に、熱膨張係数の大なる金属ペーストをスクリー
ン印刷し焼成して金属厚膜７を充填形成せしめである。And a resistive film on each hybrid IC substrate 11,
Immediately after printing the conductor film, each V groove 3 and V
A metal thick film 7 is filled and formed by screen printing a metal paste with a large coefficient of thermal expansion into the groove 4 and baking it.
このように金属厚膜７を形成せしめておくと、それぞれ
のハイブリッドＩＣ基板１１に搭載部品２を半田接着す
るするために、セラミック基板１を２４０度前後に加熱
すると、搭載部品２が接着されるとともに、金属膜１１
！７が熱膨張してＶ溝３およびＶ溝４の壁面に応力が附
加される。そしてＶ溝の頂点部分に応力集中する。した
がってセラミック基板１はそれぞれの■溝３．Ｖ溝４の
頂点部分より亀裂が入り、個々のハイブリッドＩＣ基板
１１に分離切断される。When the metal thick film 7 is formed in this way, when the ceramic substrate 1 is heated to around 240 degrees in order to solder and bond the mounted components 2 to each hybrid IC substrate 11, the mounted components 2 are bonded. Along with this, the metal film 11
! 7 thermally expands, stress is applied to the wall surfaces of the V-grooves 3 and 4. Stress is then concentrated at the apex of the V-groove. Therefore, the ceramic substrate 1 has each groove 3. A crack appears from the apex of the V-groove 4, and the hybrid IC substrate 11 is separated and cut.
なお本発明はハイブリッドＩＣ基板の分割に限定される
ものでなく、セラミック基板がＶ溝にて区画され、区画
されたそれぞれの表面あるいは表面、裏面の両面に、薄
膜あるいは厚膜の回路、素子などが形成された電子部品
の分割に適応できることは勿論である。Note that the present invention is not limited to the division of hybrid IC substrates; the ceramic substrate is divided into V-grooves, and thin or thick film circuits, elements, etc. It goes without saying that the present invention can be applied to the division of electronic components having been formed.
（ｇ）発明の詳細
な説明したように本発明は、セラミック基板を分割する
特別の作業工程を必要とせず、また個々のハイブリッド
ＩＣ基板の搭載部品の実装領域が広いなどと言う実用上
で優れた効果のあるセラミック基板の分割方法である。(g) Detailed Description of the Invention As described above, the present invention has practical advantages such as not requiring a special work process to divide the ceramic substrate, and having a wide mounting area for components mounted on each hybrid IC board. This is a method of dividing ceramic substrates that is effective.
第１図は従来のセラミ・ツク基板の（イ）番お斜視図、
（ロ）は分割時の断面図、第２図は本発明の一実施例の
セラミック基板の斜視図である。
図中１はセラミック基板、２は搭載部品、３゜４は■溝
、７は金属厚膜、１１はノ＼イブリ・ノドＩＣ基板をそ
れぞれ示す。
第１区
（イ）
（切
第２日
／Figure 1 is a perspective view of the conventional ceramic board (A).
(B) is a sectional view when divided, and FIG. 2 is a perspective view of a ceramic substrate according to an embodiment of the present invention. In the figure, 1 is a ceramic substrate, 2 is a mounted component, 3°4 is a groove, 7 is a metal thick film, and 11 is an IC board. Ward 1 (I) (Second day of cut/
Claims (1)
溝により個々の基板に区画されてなり、該Ｖ溝内に金属
膜を充填焼成形成せしめ、該セラミック基板を加熱し、
該金属膜の熱応力により該Ｖｍ部分にて個々の基板に分
割することを特徴とするセラミック基板の分割方法。The ceramic substrate has V formed in a matrix on the surface.
The ceramic substrate is divided into individual substrates by grooves, a metal film is filled and fired in the V grooves, and the ceramic substrate is heated.
A method for dividing a ceramic substrate, characterized in that the metal film is divided into individual substrates at the Vm portion by thermal stress.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16689583A JPS6058697A (en) | 1983-09-10 | 1983-09-10 | Method of dividing ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16689583A JPS6058697A (en) | 1983-09-10 | 1983-09-10 | Method of dividing ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6058697A true JPS6058697A (en) | 1985-04-04 |
Family
ID=15839612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16689583A Pending JPS6058697A (en) | 1983-09-10 | 1983-09-10 | Method of dividing ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6058697A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010021174A (en) * | 2008-07-08 | 2010-01-28 | Denso Corp | Method of manufacturing substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5248187A (en) * | 1975-10-14 | 1977-04-16 | Nippon Sheet Glass Co Ltd | Cutting method for highly hard ceramic boards |
-
1983
- 1983-09-10 JP JP16689583A patent/JPS6058697A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5248187A (en) * | 1975-10-14 | 1977-04-16 | Nippon Sheet Glass Co Ltd | Cutting method for highly hard ceramic boards |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010021174A (en) * | 2008-07-08 | 2010-01-28 | Denso Corp | Method of manufacturing substrate |
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