JPS60214589A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS60214589A JPS60214589A JP7196484A JP7196484A JPS60214589A JP S60214589 A JPS60214589 A JP S60214589A JP 7196484 A JP7196484 A JP 7196484A JP 7196484 A JP7196484 A JP 7196484A JP S60214589 A JPS60214589 A JP S60214589A
- Authority
- JP
- Japan
- Prior art keywords
- board
- hard
- printed wiring
- adhesive layer
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はフレキンプル基板の一部に硬質板を貼り、硬質
配線部と軟質配線部を構成した印刷配線基板の製造法に
関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a printed wiring board in which a hard plate is attached to a part of a flexible board to form a hard wiring part and a soft wiring part.
従来例の構成とその問題点
従来の印刷配線板の製造法によれば、硬質配線２ベ ノ
部と軟質配線部のフレキンプル基板に別々の工程で部品
実装し、その後に両配線部間を半田付で配線接続してい
た。Conventional configuration and its problems According to the conventional manufacturing method of printed wiring boards, components are mounted on the flexible board for the two hard wiring sections and the soft wiring section in separate processes, and then solder is applied between the two wiring sections. The wiring was connected with the attachment.
しかし、このような製造法では半田による配線接続等作
業数が多いという欠点があった。また軟質配線部のフレ
キシブル基板に部品を実装する時にはその部分が可撓性
により変形するため部品の位置決めなどの作業が非常に
困難であるという欠点があった。However, this manufacturing method has the disadvantage that it requires a large number of operations such as wiring connections using solder. Furthermore, when components are mounted on the flexible substrate of the soft wiring section, the part is deformed due to its flexibility, making it extremely difficult to position the components.
発明の目的
本発明の目的とするところは電子部品の実装の効率を向
上し作業性を良くすることにある。OBJECTS OF THE INVENTION An object of the present invention is to improve the efficiency of mounting electronic components and improve workability.
発明の構成
本発明は、硬質板に設けた長孔を境にして一方には全面
に接着剤層を設け、他方には縁にのみ接着剤層を設け、
これにフレキシブル印刷配線板を貼り付けてその状態で
電子部品を実装し、その後他方側の縁を切り離すことに
より他方側の硬質板が取り外され、硬質配線部と軟質配
線部とが連続した印刷配線基板ができるものであり、電
子部品３べ ／
の実装時にはフレキンプル印刷配線板と硬質板とが全面
的に一体となっているため作業性が良く実装精度も向−
１−するものである。Structure of the Invention The present invention provides an adhesive layer on one side of the entire surface of a long hole provided in a hard plate, and an adhesive layer only on the edge of the other side.
A flexible printed wiring board is attached to this and electronic components are mounted in that state, and then the hard board on the other side is removed by cutting off the edge on the other side, and the hard wiring part and the soft wiring part are printed wiring that is continuous. When mounting electronic components, the flexible printed wiring board and the hard board are completely integrated, which improves workability and mounting accuracy.
1- It is something that does.
実施例の酸、明
第１図は不発）！Ｉ’ｌの製造法により構成された印刷
配線基板１の旧祝図で、１ａ（ｌ−Ｉ硬質配線部、１ｂ
は軟質配線部、２は硬質板、３は硬質板２上に貼利けら
れたフンキンプル印刷配線基板である。４はフレキンプ
ル印刷配線）、（板３の表面に張った銅箔をエツチング
して形成したパターン、６はパターン」二に実装された
チップ部品である。The acid of the example, bright figure 1 did not explode)! This is an old diagram of the printed wiring board 1 constructed by the manufacturing method of I'l.
2 is a soft wiring part, 2 is a hard board, and 3 is a Funkinpur printed wiring board pasted on the hard board 2. 4 is a pattern formed by etching the copper foil pasted on the surface of the board 3, and 6 is a chip component mounted on the pattern (2).
第２図〜第４図により製造法を説明する。第２図はあら
かじめパターン４が形成されたフレキシブル印刷配線基
板である。第３図は硬質板２の−に面図で、完成時に硬
質配線部と軟質配線部との境になる位置に長孔６が設け
られている。この硬質板２上に、図中ドツトでハツチン
グを施したように、長孔６より左方１１１１ （硬質配
線部となる側）は全面に、右方１１１１ （軟質配線部
となる側）は縁のみに接着剤層７を形成する。２ａ、２
ｂ、２０は上記接着剤層が設けられた縁である。そして
３方の縁と長孔６とに囲まれた。接着剤層のない硬質板
部２ｄが形成される。The manufacturing method will be explained with reference to FIGS. 2 to 4. FIG. 2 shows a flexible printed wiring board on which a pattern 4 is formed in advance. FIG. 3 is a - side view of the hard plate 2, in which a long hole 6 is provided at a position that will be the boundary between the hard wiring part and the soft wiring part when completed. On this hard plate 2, as shown by the dots in the figure, the left side 1111 of the long hole 6 (the side that will be the hard wiring part) is the entire surface, and the right side 1111 (the side that will be the soft wiring part) is the edge. An adhesive layer 7 is formed only on the surface. 2a, 2
b, 20 is the edge provided with the adhesive layer. It is surrounded by edges on three sides and a long hole 6. A hard plate portion 2d without an adhesive layer is formed.
」二記のフレキシブル印刷配線基板３と硬質板２とを貼
り合わせてローラまたは熱ローラにより圧力を加えると
一体基板が形成される。When the flexible printed wiring board 3 and the hard board 2 described in "2" are bonded together and pressure is applied using a roller or a heated roller, an integrated board is formed.
この状態で、クリーム半田７を用いてチップ部品６を装
着し％または半田槽中にて他の形状の電子部品等を実装
する。実装後の一体基板の側断面図を第４図に示す。In this state, the chip component 6 is attached using cream solder 7, and electronic components of other shapes are mounted in the solder bath. FIG. 4 shows a side sectional view of the integrated board after mounting.
次にプレス等により前記の縁２１Ｌ、２ｂ、２０を切除
するように切断する。第３図ウニ点鎖線Ｐ。Next, the edges 21L, 2b, and 20 are cut using a press or the like. Figure 3 Sea urchin dotted chain line P.
Ｑ、Ｒで示すものが切断線である。この切断により接着
剤層のない硬質板部２ｄが脱落する。したがって、第１
図に示すように、長孔６の右側にはフレキシブル印刷配
線基板のみとなり、軟質配線部１ｂが形成される。The lines indicated by Q and R are cutting lines. As a result of this cutting, the hard plate portion 2d without the adhesive layer falls off. Therefore, the first
As shown in the figure, on the right side of the elongated hole 6, there is only a flexible printed wiring board, and a soft wiring portion 1b is formed.
−に記の実施例によれば、電子部品の実装工程では一体
基板であり、後に軟質配線部となる部分にも一様に実装
を行なうことができ、全体的な工数６ベ 、・
を削減できる。さらにこの実装時には、硬質板２で全体
が裏打ちされた状態であるから、クリーム半田を溶かす
熱や半田の熱が加わってもフレキンプル印刷配線基板３
が熱変形することが少なく。According to the embodiment described in -, in the mounting process of electronic components, it is possible to uniformly mount even the part that will later become a soft wiring part because it is an integrated board, and the overall man-hours are reduced by 6. can. Furthermore, during this mounting, the entire printed wiring board 2 is lined with a hard plate 2, so even if the heat that melts the cream solder or the heat of the solder is applied, the flexible printed wiring board 3
is less likely to be deformed by heat.
実装精度が向上する。また機械的にも曲がり等の硬質配
線部１ａと軟質配線部１ｂが連続した印刷配線基板を得
ることができる。Mounting accuracy improves. Also, mechanically, it is possible to obtain a printed wiring board in which the hard wiring portion 1a and the soft wiring portion 1b, which are bent or the like, are continuous.
発明の効果
本発明は、長孔を設けた硬質板の一方に接着剤層を設は
他方には縁にのみ接着剤層を設けてフレキンプル印刷配
線基板を貼り付け、その状態で電子部品を実装するよう
にし、後に」二記縁を切り離すようにしたものであるか
ら、実装時にフレキシブル印刷配線基板の機械的、熱的
要因による変形がなく、高精度・高密度実装ができ、作
業工数も減少した、硬質配線部ど軟質配線部が連続した
印刷配線基板を製造できる優れた効果を奏する。Effects of the Invention The present invention provides an adhesive layer on one side of a hard plate provided with long holes, and an adhesive layer only on the edges on the other side to attach a flexible printed wiring board, and then mounts electronic components in this state. Since the two edges are separated later, there is no deformation of the flexible printed wiring board due to mechanical or thermal factors during mounting, allowing for high-precision, high-density mounting and reducing work hours. This provides an excellent effect of manufacturing a printed wiring board in which the hard wiring portion and the soft wiring portion are continuous.
６ページ 第１図は完成した印刷配線基板を示す斜視図。6 pages FIG. 1 is a perspective view showing a completed printed wiring board.
第２図は本発明の製造法に用いるフレキシブル印刷配線
基板の上面図、第３図は同じく硬質板の上面図、第４図
は一体基板に構成後実装した状態を示す側断面図である
。FIG. 2 is a top view of the flexible printed wiring board used in the manufacturing method of the present invention, FIG. 3 is a top view of the same hard board, and FIG. 4 is a side sectional view showing the state in which the flexible printed wiring board is constructed and mounted on an integrated board.
１・・・・・・印刷配線基板％ １ａ・・・・・・硬質
配線部、１ｂ・・・・・・軟質配線部、２・・・・・・
硬質板、２ａ、２ｂ、２ｃ・・・・・・縁、２ｄ・・・
・・・接着剤層のない硬質板部％３・・・・・・フレキ
シブル印刷配線基板、６・・・・・・長孔、７・・・・
・・接着剤層。1...Printed wiring board% 1a...Hard wiring part, 1b...Soft wiring part, 2...
Hard plate, 2a, 2b, 2c...edge, 2d...
...Hard plate portion without adhesive layer %3...Flexible printed wiring board, 6...Long hole, 7...
...Adhesive layer.
Claims (1)
」二面全部と他方の硬質板上面の縁とに接着剤層を設け
、この接着剤層にフレキシブル印刷配線板を貼付けて一
体となし、フレキンプル印刷配線板」二に電気部品を実
装し、その後前記長孔の他方側の縁を切り離してこの他
方側の硬質板を取り外し硬質配線部と軟質配線部とが連
続した印刷配線基板を得ることを性徴とする印刷配線基
板の製造法。A long hole is provided in the hard board, an adhesive layer is provided on all two sides of one hard board and the edge of the top surface of the other hard board, and a flexible printed circuit board is pasted on this adhesive layer. Electrical components are mounted on the flexible printed wiring board (2), and then the other edge of the elongated hole is cut off and the hard board on the other side is removed to create printed wiring in which the hard wiring part and the soft wiring part are continuous. A method of manufacturing printed wiring boards whose characteristic is to obtain a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7196484A JPS60214589A (en) | 1984-04-11 | 1984-04-11 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7196484A JPS60214589A (en) | 1984-04-11 | 1984-04-11 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60214589A true JPS60214589A (en) | 1985-10-26 |
Family
ID=13475663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7196484A Pending JPS60214589A (en) | 1984-04-11 | 1984-04-11 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60214589A (en) |
-
1984
- 1984-04-11 JP JP7196484A patent/JPS60214589A/en active Pending
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