GB2162694A - Printed circuits - Google Patents

Printed circuits Download PDF

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Publication number
GB2162694A
GB2162694A GB08419941A GB8419941A GB2162694A GB 2162694 A GB2162694 A GB 2162694A GB 08419941 A GB08419941 A GB 08419941A GB 8419941 A GB8419941 A GB 8419941A GB 2162694 A GB2162694 A GB 2162694A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit board
insulating film
making
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08419941A
Other versions
GB8419941D0 (en
Inventor
G A Hill
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
British Aerospace PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aerospace PLC filed Critical British Aerospace PLC
Priority to GB08419941A priority Critical patent/GB2162694A/en
Publication of GB8419941D0 publication Critical patent/GB8419941D0/en
Publication of GB2162694A publication Critical patent/GB2162694A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A printed circuit board of which the substrate is a thermally-conductive metal member 11 with an electrically-insulating film 14 formed on it, the printed circuit track pattern 18 being formed on the substrate over the film. The substrate is preferably anodised aluminium, shaped to form a heat sink 12, 13 and provided with "through" holes 15. <IMAGE>

Description

SPECIFICATION Printed circuits This invention relates to printed circuits.
In order to dissipate the heat generated by the components of a printed circuit assembly, it has been proposed to interpose, between the component side of a conventional printed circuit board and the components, a metal plate which is adhesively bonded to the board and to the component side of which there is adhesively bonded a sheet of electrically-insulating material. A sheet of electrically-insulating material is also necessary on the board side of the metal plate if the board is double-sided. Holes are provided extending through the metal plate and the or each insulating layer and each hole is fitted with an electrically-insulating insert. The component leads extend through these inserts to connect up to the printed circuit board.
Putting this proposal into practice may be difficult due to the need for careful alignment of the holes in the metal plate with the printed circuit board connection points, the requirement for several adhesive bonding stages, and the need to fit insulating collars in each hole in the plate. Also, the overall thickness of the board and plate may be limited by the need for it to fit a 'slot' of standard dimensions. This, in turn, may mean that the printed circuit board has to be thinner than normal and hence a required stiffness of the overall structure may not be attainable. It also sets a limit on the thickness of the metal plate, which limit may be such as to render its heat transfer capability insufficient. The presence of one or two insulating sheets and the bonding adhesive will in any case reduce the heat dissipation efficiency.
According to one aspect of the invention, there is provided a printed circuit board of which the substrate comprises a thermally-conductive metal member with an electrically-insulating film formed thereon, and a printed circuit track pattern formed on the substrate over said film.
According to a second aspect of the invention, there is provided a method of making a printed circuit board comprising making a substrate by forming an electrically-insulating film on a thermallyconductive metal member, and then forming a printed circuit track pattern on the substrate over said film.
The metal member may be made of aluminium or aluminium alloy in which case said insulating film may be formed by anodisation. Alternatively, a suitable insulating film could be applied to the member by, for example, a vapour deposition process.
Advantageously, component lead holes are formed in the metal member prior to the formation of the insulating film. Then the process forming the insulating film can, at the same time, form an insulating film on the wall of each hole. When the printed circuit track pattern is formed, the holes can, at the same time, be 'plated-through' over the insulating film in each hole.
The metal member can be in the form of a flat plate or it can be 'three-dimensional', for example it can comprise a plate, one or more portions of which are provided with cooling fins or gills extending perpendicular to the plate. Then, any components which are particularly productive of heat, power transistors for example, can be mounted upon the fins or gills.
For a better understanding of the invention, reference will now be made, by way of example, to the accompanying drawing in which: Figure 1 shows a part of a thermally-conductive printed circuit board; and Figure 2 shows a 'three-dimensional' printed circuit board incorporating cooling fins.
The printed circuit of figure 1, comprises a substrate 1 in the form of an aluminium or aluminium alloy plate 2 with component lead holes 3 formed in it. Only one of these holes can be seen. The entire plate 2 has been anodised producing an electrically-insulating film 4 which covers both sides 5 and 6 of the plate 2 and the walls of the holes 3.
Each side of the substrate 1 has a copper printed circuit track pattern 7 applied to it over the film 4 and the holes 3 are 'plated-through'; ie the walls thereof are copper plated over the insulating film therein. Components 8, only one of which is shown, are mounted on the upper side 5 of the substrate 1 with their connection leads 9 passing through the holes 3 and soldered to the printed circuit track pattern 7.
The anodisation process is carefully controlled so as to produce a very thin, uniform film 4 which, while providing adequate electrical insulation, maximises the heat transfer from the components 8 to the plate 2.
The plate 2 may comprise a metal other than aluminium or aluminium alloy. The film 4 may be of any suitable electrically-insulating material, for example oxide material, and it may be applied using techniques such as vapour deposition.
The 'three-dimensional' board 10 shown in figure 2 consists of an aluminium or aluminium alloy plate 11 which has respective sets of cooling fins 12 and 13 formed at its ends. As in the figure 1 embodiment, the plate 11 is anodised to form an insulating film 14 extending over both sides of the plate, the surfaces of the cooling fins 12 and 13, and through the component lead holes such as the hole 15 in the plate 11. Power transistors 16 and 17 are mounted on the sides of respective ones of the cooling fins 12 and 13 so that the heat generated during their operation can be dissipated more quickly. A copper printed circuit track pattern 18 is formed on the lower side 19 of the plate 11 while components such as component 20 are mounted on the side 21 with their connection leads extending through the holes and soldered to the track pattern 18.
Further components, a series of leadless integrated circuits for example, may be mounted on the lower side 19 of the plate 11 and a further track pattern (not shown) may be formed on the upper side 21 and/or on parts of the fins 12 and 13.

Claims (12)

1, A printed circuit board of which the substrate comprises a thermally-conductive metal member with an electrically-insulating film formed thereon, and a printed circuit track pattern formed on the substrate over said film.
2. A printed circuit board according to claim 1, wherein the metal member is made of aluminium or aluminium alloy and the insulating film is formed by anodisation.
3. A printed circuit board according to claim 1, wherein the metal member is in the form of a flat plate.
4. A printed circuit board according to claim 1, wherein the metal member is 'three-dimensional' and comprises a plate in which one or more portions are provided with cooling fins or gills extending perpendicular to the plate.
5. A method of making a printed circuit board comprising making a substrate by forming an electrically-insulating film on a thermally-conductive metal member, and then forming a printed circuit track pattern on the substrate over said film.
6. A method of making a printed circuit board according to claim 5, wherein the insulating film is formed by anodisation.
7. A method of making a printed circuit board according to claim 5, wherein the insulating film is applied by vapour deposition.
8. A method of making a printed circuit board according to claim 5, wherein component lead holes are formed in the metal member prior to the formation of the insulating film.
9. A method of making a printed circuit board according to claim 8, wherein the process forming the insulating film can form an insulating film on the wall of each hole.
10. A method of making a printed circuit board according to claim 9, wherein the holes are 'platedthrough' over the insulating film when the track pattern is formed.
11. A printed circuit board substantially as hereinbefore described with reference to figure 1 of the accompanying drawing.
12. A printed circuit board substantially as hereinbefore described with reference to figure 2 of the accompanying drawing.
GB08419941A 1984-08-04 1984-08-04 Printed circuits Withdrawn GB2162694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08419941A GB2162694A (en) 1984-08-04 1984-08-04 Printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08419941A GB2162694A (en) 1984-08-04 1984-08-04 Printed circuits

Publications (2)

Publication Number Publication Date
GB8419941D0 GB8419941D0 (en) 1984-09-05
GB2162694A true GB2162694A (en) 1986-02-05

Family

ID=10564955

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08419941A Withdrawn GB2162694A (en) 1984-08-04 1984-08-04 Printed circuits

Country Status (1)

Country Link
GB (1) GB2162694A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels
GB2268630A (en) * 1992-07-03 1994-01-12 Nippon Cmk Kk Printed wiring board
EP0936849A1 (en) * 1998-02-17 1999-08-18 Pressac Interconnect Limited Printed circuit assembly and method of making the same
US6448510B1 (en) * 1997-05-20 2002-09-10 Micro Components Ltd. Substrate for electronic packaging, pin jig fixture
US6670704B1 (en) 1998-11-25 2003-12-30 Micro Components Ltd. Device for electronic packaging, pin jig fixture
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
US7204917B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
WO2007091976A1 (en) * 2006-02-10 2007-08-16 Opulent Electronics International Pte Ltd Anodised aluminium, dielectric, and method
WO2012107755A1 (en) 2011-02-08 2012-08-16 Cambridge Nanolitic Limited Insulated metal substrate
WO2015061649A1 (en) 2013-10-24 2015-04-30 Rogers Corporation Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
DE102014204116A1 (en) * 2014-03-06 2015-09-10 Osram Gmbh LED module with substrate body
WO2015164593A1 (en) 2014-04-25 2015-10-29 Rogers Corporation Metal core printed circuit board with insulation layer
DE102016209003B4 (en) * 2016-05-24 2021-04-22 Vitesco Technologies GmbH Device for cooling at least one (semiconductor) switch and at least one resistor, as well as manufacturing method
WO2021116561A1 (en) * 2019-12-12 2021-06-17 Valeo Systemes Thermiques Assembly of an electronic board and a heat sink, and motor-fan unit comprising such an assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2074793A (en) * 1980-04-22 1981-11-04 Ferranti Ltd Thin film circuit assembly
GB2080630A (en) * 1980-08-21 1982-02-03 Ingram & Glass Ltd Printed circuit panels
GB2110475A (en) * 1981-11-04 1983-06-15 Philips Electronic Associated Substrate for hybrid and printed circuits
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
GB2144922A (en) * 1983-08-06 1985-03-13 Plessey Co Plc Substrate for thick-film electrical circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2074793A (en) * 1980-04-22 1981-11-04 Ferranti Ltd Thin film circuit assembly
GB2080630A (en) * 1980-08-21 1982-02-03 Ingram & Glass Ltd Printed circuit panels
GB2110475A (en) * 1981-11-04 1983-06-15 Philips Electronic Associated Substrate for hybrid and printed circuits
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
GB2144922A (en) * 1983-08-06 1985-03-13 Plessey Co Plc Substrate for thick-film electrical circuits

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels
GB2268630A (en) * 1992-07-03 1994-01-12 Nippon Cmk Kk Printed wiring board
US6448510B1 (en) * 1997-05-20 2002-09-10 Micro Components Ltd. Substrate for electronic packaging, pin jig fixture
EP0936849A1 (en) * 1998-02-17 1999-08-18 Pressac Interconnect Limited Printed circuit assembly and method of making the same
US6670704B1 (en) 1998-11-25 2003-12-30 Micro Components Ltd. Device for electronic packaging, pin jig fixture
US7204917B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US7670473B1 (en) 1998-12-01 2010-03-02 Uzoh Cyprian E Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US8441796B2 (en) 2005-01-15 2013-05-14 Keronite International Limited Electrical power substrate
WO2006075176A1 (en) * 2005-01-15 2006-07-20 Thermastrate Limited Electrical power substrate
GB2422494B (en) * 2005-01-15 2010-12-01 Thermastrate Ltd Electrical power substrate
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
WO2007091976A1 (en) * 2006-02-10 2007-08-16 Opulent Electronics International Pte Ltd Anodised aluminium, dielectric, and method
WO2012107755A1 (en) 2011-02-08 2012-08-16 Cambridge Nanolitic Limited Insulated metal substrate
WO2015061649A1 (en) 2013-10-24 2015-04-30 Rogers Corporation Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
DE102014204116A1 (en) * 2014-03-06 2015-09-10 Osram Gmbh LED module with substrate body
WO2015164593A1 (en) 2014-04-25 2015-10-29 Rogers Corporation Metal core printed circuit board with insulation layer
DE102016209003B4 (en) * 2016-05-24 2021-04-22 Vitesco Technologies GmbH Device for cooling at least one (semiconductor) switch and at least one resistor, as well as manufacturing method
WO2021116561A1 (en) * 2019-12-12 2021-06-17 Valeo Systemes Thermiques Assembly of an electronic board and a heat sink, and motor-fan unit comprising such an assembly
FR3104892A1 (en) * 2019-12-12 2021-06-18 Valeo Systemes Thermiques SET OF AN ELECTRONIC BOARD AND A HEAT SINK, AND MOTOR-FAN GROUP INCLUDING SUCH A SET

Also Published As

Publication number Publication date
GB8419941D0 (en) 1984-09-05

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)