GB8419941D0 - Printed circuits - Google Patents

Printed circuits

Info

Publication number
GB8419941D0
GB8419941D0 GB848419941A GB8419941A GB8419941D0 GB 8419941 D0 GB8419941 D0 GB 8419941D0 GB 848419941 A GB848419941 A GB 848419941A GB 8419941 A GB8419941 A GB 8419941A GB 8419941 D0 GB8419941 D0 GB 8419941D0
Authority
GB
United Kingdom
Prior art keywords
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB848419941A
Other versions
GB2162694A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
British Aerospace PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aerospace PLC filed Critical British Aerospace PLC
Priority to GB08419941A priority Critical patent/GB2162694A/en
Publication of GB8419941D0 publication Critical patent/GB8419941D0/en
Publication of GB2162694A publication Critical patent/GB2162694A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
GB08419941A 1984-08-04 1984-08-04 Printed circuits Withdrawn GB2162694A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08419941A GB2162694A (en) 1984-08-04 1984-08-04 Printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08419941A GB2162694A (en) 1984-08-04 1984-08-04 Printed circuits

Publications (2)

Publication Number Publication Date
GB8419941D0 true GB8419941D0 (en) 1984-09-05
GB2162694A GB2162694A (en) 1986-02-05

Family

ID=10564955

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08419941A Withdrawn GB2162694A (en) 1984-08-04 1984-08-04 Printed circuits

Country Status (1)

Country Link
GB (1) GB2162694A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2206451A (en) * 1987-04-09 1989-01-05 Reginald John Glass Substrates for circuit panels
JPH0621595A (en) * 1992-07-03 1994-01-28 Cmk Corp Material for printed circuit board
IL120866A0 (en) * 1997-05-20 1997-09-30 Micro Components Systems Ltd Process for producing an aluminum substrate
GB9803236D0 (en) * 1998-02-17 1998-04-08 Pressac Interconnect Limited Printed circuit assembly and method of making the same
IL127256A (en) 1998-11-25 2002-09-12 Micro Components Ltd Device for electronic packaging, a process for manufacturing thereof, and a pin jig fixture for use in the process
US7204917B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
GB2422249A (en) 2005-01-15 2006-07-19 Robert John Morse Power substrate
EP1991720A1 (en) * 2006-02-10 2008-11-19 Opulent Electronics International PTE Ltd. Anodised aluminium, dielectric, and method
CA2819313A1 (en) 2011-02-08 2012-08-16 Cambridge Nanolitic Limited Non-metallic coating and method of its production
US20150118391A1 (en) 2013-10-24 2015-04-30 Rogers Corporation Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
DE102014204116A1 (en) * 2014-03-06 2015-09-10 Osram Gmbh LED module with substrate body
US20160014878A1 (en) 2014-04-25 2016-01-14 Rogers Corporation Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom
DE102016209003B4 (en) * 2016-05-24 2021-04-22 Vitesco Technologies GmbH Device for cooling at least one (semiconductor) switch and at least one resistor, as well as manufacturing method
FR3104892B1 (en) 2019-12-12 2021-11-12 Valeo Systemes Thermiques SET OF AN ELECTRONIC BOARD AND A HEAT SINK, AND MOTOR-FAN GROUP INCLUDING SUCH A SET

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2074793B (en) * 1980-04-22 1983-09-07 Ferranti Ltd Thin film circuit assembly
GB2080630B (en) * 1980-08-21 1985-07-10 Ingram & Glass Ltd Printed circuit panels
GB2110475A (en) * 1981-11-04 1983-06-15 Philips Electronic Associated Substrate for hybrid and printed circuits
GB2133934B (en) * 1983-01-17 1987-07-29 Plessey Co Plc Improvements relating to thick film circuits
GB2144922B (en) * 1983-08-06 1986-06-18 Plessey Co Plc Substrate for thick-film electrical circuits

Also Published As

Publication number Publication date
GB2162694A (en) 1986-02-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)