GB2074793B - Thin film circuit assembly - Google Patents

Thin film circuit assembly

Info

Publication number
GB2074793B
GB2074793B GB8013164A GB8013164A GB2074793B GB 2074793 B GB2074793 B GB 2074793B GB 8013164 A GB8013164 A GB 8013164A GB 8013164 A GB8013164 A GB 8013164A GB 2074793 B GB2074793 B GB 2074793B
Authority
GB
United Kingdom
Prior art keywords
thin film
circuit assembly
film circuit
assembly
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8013164A
Other versions
GB2074793A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB8013164A priority Critical patent/GB2074793B/en
Publication of GB2074793A publication Critical patent/GB2074793A/en
Application granted granted Critical
Publication of GB2074793B publication Critical patent/GB2074793B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB8013164A 1980-04-22 1980-04-22 Thin film circuit assembly Expired GB2074793B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8013164A GB2074793B (en) 1980-04-22 1980-04-22 Thin film circuit assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8013164A GB2074793B (en) 1980-04-22 1980-04-22 Thin film circuit assembly

Publications (2)

Publication Number Publication Date
GB2074793A GB2074793A (en) 1981-11-04
GB2074793B true GB2074793B (en) 1983-09-07

Family

ID=10512921

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8013164A Expired GB2074793B (en) 1980-04-22 1980-04-22 Thin film circuit assembly

Country Status (1)

Country Link
GB (1) GB2074793B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
EP0092019A3 (en) * 1982-04-19 1985-12-27 Olin Corporation Improved semiconductor package
GB2123316B (en) * 1982-07-14 1985-10-23 Atomic Energy Authority Uk Substrates for electronic devices
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
DE3447520A1 (en) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol COMPOUND CIRCUIT BOARD, METHOD FOR PRODUCING A COMPOUND CIRCUIT BOARD AND USE OF ALUMINUM OXIDE AS THE INSULATING LAYER OF A COMPOUND CIRCUIT BOARD

Also Published As

Publication number Publication date
GB2074793A (en) 1981-11-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee