JPS58137293A - Method of mounting circuit part and circuit part mounting board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit component mounting method and a circuit component mounting board, and aims to facilitate soldering of specific components in a subsequent process.

In recent years, electronic circuits in which chip components such as semiconductors, resistors, and capacitors are mounted on a bendable printed circuit board called a flexible printed circuit board have come into use. The above-mentioned electronic zero path is suitable for small, high-density packaging, and structures in which a support substrate is bonded to it are also often used to ensure heat dissipation characteristics or to provide some strength. On the other hand, electronic components mounted on circuit component mounting boards such as those mentioned above are usually soldered all at once in one process. However, for certain parts for which it is inappropriate to solder them together with other electronic parts, it is necessary to solder only those parts in a subsequent process.

As mentioned above, when retrofitting specific parts, it is necessary to consider thermal protection of the parts that have already been soldered, and remelting of the solder. It is appropriate to use soldering. However, local soldering in crowded electronic components is extremely difficult.

The present invention eliminates these drawbacks and provides a circuit component mounting method that allows specific components to be easily soldered in a subsequent process, and a circuit component mounting board suitable for implementing the method.

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view of a circuit component mounting board that is an embodiment of the present invention, and FIG. 2 is a mounting process diagram of a circuit component mounting method that is an embodiment of the present invention. A cross section of the section is shown.

In the figure, 1 is a hard board to which a flexible printed board 2 is attached. The hard board 1 is used for heat dissipation from the mounted electronic circuit components 9 or for reinforcing the mechanical strength of the flexible printed board 2.

6 is a specific part characterized by retrofitting, 3 and 4 are specific parts 6
This is an electrode for retrofitting. Reference numeral 5 denotes a hollow hole provided at least slightly below the electrode in the portion of the hard plate 1 on which the specific component 6 is placed. 7 is a component holding jig for placing and press-fitting a specific part 6 on the electrodes 3 and 4, and 8 melts the solder on the electrodes 3 and 4 and connects the specific part 6 by soldering. Next, this mounting method will be explained. First, a specific component 6, which is characterized by retrofitting, is placed on the electrodes 3 and 4 on which solder has been applied in advance, and the component holding jig 7 is used to press the specific component 6, and a hot iron 8 is used to clamp the hard plate 1. The flexible printed board 2 is directly pressed onto the flexible printed board 2 through the hole 5.
The specific component 6 is soldered to the electrodes 3 and 4 by melting the solder previously applied on the electrode 34 through the solder. By using the mounting method of this embodiment, it is possible to solder only the specific component 6 without causing any damage to the electronic component 9 that has already been mounted on the flexible printed circuit board.
Furthermore, unlike soldering from the surface, automatic soldering is easy for component mounting.In addition, in this embodiment, the hard plate is
Although shown as a circle, the shape of the hole can be arbitrarily selected, and is not limited to a hollow hole. For example, a slit may be provided in the direction A-A in Fig. 2. .

As described above, according to the method of the present invention, specific parts can be easily soldered in a subsequent process. Furthermore, if the substrate of the present invention is used, the above method can be carried out reliably.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a circuit component mounting board which is an embodiment of the present invention, and Fig. 2 is a mounting process diagram of a circuit component mounting method which is an embodiment of the present invention. Board, 2...
...Flexible printed board, 3.4...
For retrofitting, electrodes for soldering parts, 6... Hard plate 1
Clearance hole, 6...Specific parts for retrofitting, 7.
... Parts holding jig, 8 ... Heat iron. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2

Claims (2)

[Claims] (1) A print comprising a flexible printed board having electrodes for mounting and soldering electronic circuit components, and a hard plate laminated on the flexible printed board so as to provide a cutout at a position corresponding to the electrode. A circuit component mounting method comprising: pressing and fixing an electronic circuit component to the electrode of a substrate; heating the electrode from the direction of the hard plate; and soldering the electronic circuit component to the electrode. (2) A circuit component mounting board comprising a hard board laminated on an electric lint board on which electronic circuit components are mounted and soldered.