JPS61208288A - Circuit board for mounting terminal - Google Patents
Circuit board for mounting terminalInfo
- Publication number
- JPS61208288A JPS61208288A JP60050016A JP5001685A JPS61208288A JP S61208288 A JPS61208288 A JP S61208288A JP 60050016 A JP60050016 A JP 60050016A JP 5001685 A JP5001685 A JP 5001685A JP S61208288 A JPS61208288 A JP S61208288A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductor
- solder
- board
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器を構成する回路基板の構造、とシわ
け両面印刷配線板への端子リードの装着とリフロウはん
だ付けに適合した構造に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to the structure of a circuit board constituting an electronic device, and in particular, to a structure suitable for attaching terminal leads to a double-sided printed wiring board and reflow soldering. be.
従来の技術
両面印刷配線板または両面配線磁器板等の基板に対して
、端子リードを端部に装着するに際して、他の部品装着
はんだ付は後端面ディップソルダリングを行っていた。Conventional Technology When attaching terminal leads to the ends of a board such as a double-sided printed wiring board or a double-sided wiring porcelain board, dip soldering was performed on the rear end surface for soldering other parts.
従ってまず第１に基板に対してはんだ加熱が追加される
プロセスとなり、基板ず、前記端子リードの周囲を取り
巻く形態である。Therefore, first of all, solder heating is added to the substrate, which surrounds not only the substrate but also the terminal leads.
発明が解決しようとする問題点
第１の欠点は、プロセスの増大、基板の熱的損傷であシ
第２の欠点は、はんだ付は有数面積が、比較的せまく接
合強度が低いことである。Problems to be Solved by the Invention The first disadvantage is that the process increases and thermal damage to the substrate occurs.The second disadvantage is that the soldering area is relatively small and the bonding strength is low.
本発明はこれらの問題点を解決することを目的とするも
のである。The present invention aims to solve these problems.
問題点を解決するための手段
本発明は、印刷配線端部に端子リードをり７０ウソルダ
リングによってはんだ接合するために、前記端子リード
の当接部に開孔を設け、同開孔とこれに接する配線ラン
ドとに、はんだペーストを配設した構造の端子接着用回
路基板である。Means for Solving the Problems The present invention provides a method of providing an opening in the abutting portion of the terminal lead and making contact with the opening in order to solder the terminal lead to the end of the printed wiring by soldering. This is a terminal bonding circuit board with a structure in which solder paste is placed on the wiring land.
作 用
本発明によると、回路基板の端部の配線ランド部分に両
面を貫通する開孔を設け、この部分にはんだペーストを
配設したことにより、同部分に端子リードのクリップ端
を接着させて、はんだリフロウ処理を行うことにより、
接着部分に対して十分なはんだ供給がなされ、端子リー
ドの安定した接続ができる。According to the present invention, the wiring land portion at the end of the circuit board is provided with an opening that passes through both sides, and the solder paste is placed in this portion, so that the clip end of the terminal lead can be adhered to the same portion. , by performing solder reflow treatment,
Sufficient solder is supplied to the adhesive part, allowing stable connection of the terminal leads.
実施例
基板１の片面導体２および他面導体３に対して、はんだ
ペースト４の印刷をおこなう。A solder paste 4 is printed on the conductor 2 on one side and the conductor 3 on the other side of the example board 1.
このはんだペースト４の印刷は、他の表面装着部品の接
合導体部分と共におこなう。この際、端子リードに当接
する両面の導体配線ランド部分に貫通孔５を設けておき
はんだペースト４の基板上面への印刷に際して、基板下
面への印刷形成を同時におこない、５を通して一体化充
填する。端子コム６の挿入をおこなう。続いてこの方法
により、はんだ付は再加熱はなくなり、はんだの供給プ
ロセスは一回ですみ、更に端子リードと両面の導体配線
ランド間に、はんだ接合が形成され、はんだ付は面積は
実質的に拡大され、はんだ接合強度は増加する。This solder paste 4 is printed together with the bonding conductor portions of other surface-mounted parts. At this time, through-holes 5 are provided in the conductor wiring land portions on both sides that contact the terminal leads, and when the solder paste 4 is printed on the upper surface of the board, printing is simultaneously performed on the lower surface of the board, and integrally filled through the solder paste 4. Insert the terminal comb 6. Subsequently, with this method, reheating is no longer required for soldering, the solder supply process is only performed once, and a solder joint is formed between the terminal lead and the conductor wiring lands on both sides, and the soldering area is substantially reduced. expanded, the solder joint strength increases.
具体例により、さらに詳しくのべる。This will be explained in more detail using specific examples.
ガラス布基材エポキシ樹脂積層板の厚さ１．２−の両面
銅張積層板１の銅箔を選択的にエツチングし、導体パタ
ーン２及び導体パターン３を形成する。直径０．Ｂｔｒ
ｒｍの孔５をドリルによりあける。導体２及び導体３の
幅は１．２−とし、孔５はその中心線に開口させる０メ
タルマスクを用いて、市販の錫−鉛６３／３７のペース
ト４を導体３の配置されている基板面に印刷し、はんだ
ペースト４が導体２、導体３および孔５を通じて一体化
充填される。はんだペースト４が、孔６から滴下する現
象はみられず、８０℃、３０分の基板加熱によって、基
板に固化定着せしめた構造とする。基板が紙基材フェノ
ール樹樹積層板、紙基材エポキシ樹脂積層板、エポキシ
ガラスコンポジフト積層板、アルミナ磁器板であっても
同様の構造が形成され得ることはいうまでもない。The copper foil of the 1.2-thick double-sided copper-clad laminate 1 of the glass cloth base epoxy resin laminate is selectively etched to form conductor patterns 2 and 3. Diameter 0. Btr
rm hole 5 is drilled. The width of the conductor 2 and the conductor 3 is 1.2 -, and the hole 5 is opened at the center line.Using a metal mask, commercially available tin-lead 63/37 paste 4 is applied to the substrate on which the conductor 3 is placed. The surface is printed and the solder paste 4 is integrally filled through the conductor 2, conductor 3 and hole 5. The solder paste 4 does not drip from the holes 6, and the solder paste 4 is solidified and fixed to the substrate by heating the substrate at 80° C. for 30 minutes. It goes without saying that a similar structure can be formed even if the substrate is a paper-based phenolic resin laminate, a paper-based epoxy resin laminate, an epoxy glass composite laminate, or an alumina porcelain board.
発明の効果
表面実装部品の載置、端子コムの挿入を終った本発明の
基板は、２１６℃、１０秒の条件で赤外放射雰囲気を１
回通過させることによって、はんだ接合が完成される。Effects of the Invention The substrate of the present invention, on which surface mount components have been placed and terminal combs have been inserted, is exposed to an infrared radiation atmosphere for 10 seconds at 216°C.
The solder joint is completed by multiple passes.
他の表面装着部品用のはんだペーストと同じものを同時
に印刷ししかも両面形成するので、はんだペーストの印
刷プロセスの増加はない。端子リード６のみをディップ
ソルダリングする手間を省略できる。端手リード６のは
んだ接合の有数面積が、端子リード６と基板の導体２，
３との間において増加するので接合強度が増大する。Since the same solder paste for other surface-mounted parts is printed at the same time and is formed on both sides, there is no increase in the number of solder paste printing processes. The effort of dip soldering only the terminal leads 6 can be omitted. The significant area of the solder joint of the terminal lead 6 is between the terminal lead 6 and the conductor 2 of the board,
3, the bonding strength increases.
図面は本発明実施例回路基板の断面図である。
１・・・・・・基板、２・・・・・・片面導体、３・・
・・・・他面導体、４・・・・・・はんだペースト、６
・・・・・・孔、６・・・・・・端子リード０
代理人の氏名 弁理士 中 尾 敏 男 ほか１名。
ｆ−基板
２− 汁ｆＩＪ１ト
３− 慴面薯禾
侮−−−１丁んだ１°−１卜
５−−一夛ＬThe drawing is a sectional view of a circuit board according to an embodiment of the present invention. 1... Board, 2... Single-sided conductor, 3...
...Other side conductor, 4...Solder paste, 6
...hole, 6 ... terminal lead 0 Name of agent: Patent attorney Toshio Nakao and one other person. f-board 2-juice fIJ1 to 3-face side 1°-1 5--1 L
Claims (1)
リングによってはんだ接合するために、前記端子リード
の当接部に開孔し、開孔部の両ランドに、はんだペース
トを一体として充填した端子装着用回路基板。A double-sided printed wiring board, in which a hole is formed in the abutting portion of the terminal lead and both lands of the hole are integrally filled with solder paste in order to solder the terminal lead by reflow soldering. Circuit board for mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60050016A JPH0644500B2 (en) | 1985-03-13 | 1985-03-13 | Circuit board for terminal mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60050016A JPH0644500B2 (en) | 1985-03-13 | 1985-03-13 | Circuit board for terminal mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61208288A true JPS61208288A (en) | 1986-09-16 |
| JPH0644500B2 JPH0644500B2 (en) | 1994-06-08 |
Family
ID=12847200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60050016A Expired - Lifetime JPH0644500B2 (en) | 1985-03-13 | 1985-03-13 | Circuit board for terminal mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644500B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018074078A1 (en) * | 2016-10-21 | 2018-04-26 | 株式会社村田製作所 | Printed circuit board with connector |
-
1985
- 1985-03-13 JP JP60050016A patent/JPH0644500B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018074078A1 (en) * | 2016-10-21 | 2018-04-26 | 株式会社村田製作所 | Printed circuit board with connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644500B2 (en) | 1994-06-08 |
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