JPS60172364U - Front and back connection device for double-sided printed wiring board - Google Patents
Front and back connection device for double-sided printed wiring boardInfo
- Publication number
- JPS60172364U JPS60172364U JP5874984U JP5874984U JPS60172364U JP S60172364 U JPS60172364 U JP S60172364U JP 5874984 U JP5874984 U JP 5874984U JP 5874984 U JP5874984 U JP 5874984U JP S60172364 U JPS60172364 U JP S60172364U
- Authority
- JP
- Japan
- Prior art keywords
- double
- wiring board
- printed wiring
- sided printed
- coil spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例に用いるコイルバネ第２図は
本考案の両面印刷配線板の表裏接続装置断面図を示す。
１・・・コイルバネ、１ａ・・・大径部、１ｂ・・・小
径部、２・・・両面印刷配線板、２ａ・・・表面、２ｂ
・・・導電部、２ｃ・・・裏面、２ｄ・・・導電部、２
ｅ・・・貫通孔、３・・・半田接続部、４・・−・電子
部品。FIG. 1 shows a coil spring used in an embodiment of the present invention. FIG. 2 shows a sectional view of the front and back connection device of a double-sided printed wiring board of the present invention. DESCRIPTION OF SYMBOLS 1... Coil spring, 1a... Large diameter part, 1b... Small diameter part, 2... Double-sided printed wiring board, 2a... Surface, 2b
...Conductive part, 2c...Back surface, 2d...Conductive part, 2
e...Through hole, 3...Solder connection part, 4...Electronic component.
Claims (1)
田付性の良好な金属細線を巻回し且つ略中夫に前記貫通
孔の内径よりも大である大径部を有すると共に、両端に
前記内径よりも小である小径部を有し、該大径部に半田
付着防止処理を施したコイルバネとを備え、 前記貫通孔に該コイルバネを配設し前記両面印刷配線板
の表面の導電部分と裏面の導電部分に、前記コイルバネ
の両端を半田付することにより両面印刷配線板の表裏両
面の電気的接続を行なうことを特徴とする両面印刷配線
板の表裏接続装置。[Scope of Claim for Utility Model Registration] A double-sided printed circuit board having a through hole penetrating the front and back surfaces, a thin metal wire with good solderability wound around the core, and a diameter approximately larger than the inner diameter of the through hole. a coil spring having a diameter portion, a coil spring having a small diameter portion smaller than the inner diameter at both ends, and having the large diameter portion subjected to solder adhesion prevention treatment; Front and back connection of a double-sided printed wiring board, characterized in that electrical connections are made between the front and back sides of the double-sided printed wiring board by soldering both ends of the coil spring to a conductive part on the front side and a conductive part on the back side of the printed wiring board. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5874984U JPS60172364U (en) | 1984-04-20 | 1984-04-20 | Front and back connection device for double-sided printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5874984U JPS60172364U (en) | 1984-04-20 | 1984-04-20 | Front and back connection device for double-sided printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60172364U true JPS60172364U (en) | 1985-11-15 |
Family
ID=30584546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5874984U Pending JPS60172364U (en) | 1984-04-20 | 1984-04-20 | Front and back connection device for double-sided printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60172364U (en) |
-
1984
- 1984-04-20 JP JP5874984U patent/JPS60172364U/en active Pending
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