JPS59192871U - High-density mounting wiring structure of printed circuit boards - Google Patents
High-density mounting wiring structure of printed circuit boardsInfo
- Publication number
- JPS59192871U JPS59192871U JP8925983U JP8925983U JPS59192871U JP S59192871 U JPS59192871 U JP S59192871U JP 8925983 U JP8925983 U JP 8925983U JP 8925983 U JP8925983 U JP 8925983U JP S59192871 U JPS59192871 U JP S59192871U
- Authority
- JP
- Japan
- Prior art keywords
- land
- printed circuit
- density mounting
- wiring structure
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント板配線構造を示す斜視図、第２
図は本考案による高密度配線実装構造を示す斜視図、第
３図は部品リード部の側面断面図である。
１．１０・・・・・・硬質プリント板、２，７．１２・
・・・・・印刷配線、３，１１・・・・・・リード線挿
入スルーホール、４．８・・・・・・実装部品、５・・
・・・・ジャンパ線、６・・・・・・フレキシブルプリ
ント板、９・・・・・・フレキシブルプリント板の銅箔
部（ランド）、９ａ・・・・・・部品リード線圧入用孔
、１３・・・・・・外部接続用端子、１５・・・・・・
ハンダ。Figure 1 is a perspective view showing a conventional printed circuit board wiring structure;
The figure is a perspective view showing a high-density wiring mounting structure according to the present invention, and FIG. 3 is a side sectional view of a component lead portion. 1.10... Rigid printed board, 2,7.12.
...Printed wiring, 3,11... Lead wire insertion through hole, 4.8... Mounted parts, 5...
... Jumper wire, 6 ... Flexible printed board, 9 ... Copper foil part (land) of flexible printed board, 9a ... Hole for press-fitting component lead wire, 13...Terminal for external connection, 15...
Solder.
Claims (1)
ーホールに対応する位置に、実装すべき電子部品のリー
ド線径より少し小さい径の孔を有するランドを設けて硬
質プリント板に重ね合せ、所定のランドに所定の電子部
品のリード線を圧入してランドとリード線との間を圧接
状態にし、た後、硬質プリント板に搭載された電子部品
のリードとスルーホール間をハンダ付するように構成し
たプリント板の高密度実装配線構造。A land with a hole slightly smaller than the lead wire diameter of the electronic component to be mounted is provided on the flexible printed wiring board at a position corresponding to the through hole in the rigid printed wiring board, and the land is overlaid on the rigid printed wiring board, and the land is placed in the predetermined land. A printed circuit in which the lead wire of a specified electronic component is press-fitted to create pressure contact between the land and the lead wire, and then soldered between the lead of the electronic component mounted on a rigid printed board and the through-hole. High-density mounting wiring structure on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8925983U JPS59192871U (en) | 1983-06-10 | 1983-06-10 | High-density mounting wiring structure of printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8925983U JPS59192871U (en) | 1983-06-10 | 1983-06-10 | High-density mounting wiring structure of printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59192871U true JPS59192871U (en) | 1984-12-21 |
Family
ID=30219154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8925983U Pending JPS59192871U (en) | 1983-06-10 | 1983-06-10 | High-density mounting wiring structure of printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59192871U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650382U (en) * | 1992-12-07 | 1994-07-08 | 株式会社三協精機製作所 | Flexible board fixing mechanism |
-
1983
- 1983-06-10 JP JP8925983U patent/JPS59192871U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650382U (en) * | 1992-12-07 | 1994-07-08 | 株式会社三協精機製作所 | Flexible board fixing mechanism |
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