JPH0650382U - Flexible board fixing mechanism - Google Patents

Flexible board fixing mechanism

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Publication number
JPH0650382U
JPH0650382U JP9008092U JP9008092U JPH0650382U JP H0650382 U JPH0650382 U JP H0650382U JP 9008092 U JP9008092 U JP 9008092U JP 9008092 U JP9008092 U JP 9008092U JP H0650382 U JPH0650382 U JP H0650382U
Authority
JP
Japan
Prior art keywords
circuit
circuit board
flexible
board
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9008092U
Other languages
Japanese (ja)
Other versions
JP2569214Y2 (en
Inventor
文男 小林
裕士 北原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Sankyo Corp
Original Assignee
Nidec Sankyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Sankyo Corp filed Critical Nidec Sankyo Corp
Priority to JP1992090080U priority Critical patent/JP2569214Y2/en
Publication of JPH0650382U publication Critical patent/JPH0650382U/en
Application granted granted Critical
Publication of JP2569214Y2 publication Critical patent/JP2569214Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】基板の面積を小さくし、ブリッジ半田をなくし
て自動化を容易にかつ1回の半田付けで回路基板とフレ
キシブル回路基板と回路部品とを接続固定し、回路基板
とフレキシブル回路基板とが剥がれにくいフレキシブル
回路基板の固定機構を得る。 【構成】回路接続部12を有する回路パターン11が表
面に形成された回路基板10と、回路基板10の回路接
続部12に接続される回路接続部23を有する回路パタ
ーン22を備えたフレキシブル回路基板20と、フレキ
シブル回路基板20の回路接続部23と接続される端子
部36を有する回路部品35とを有し、回路基板10の
回路接続部12とフレキシブル回路基板20の回路接続
部23と回路部品35の端子部36とを略同一箇所に設
定し、これらを一体に半田付け接続し固定した。
(57) [Abstract] [Purpose] To reduce the area of the board, to eliminate bridge solder, to facilitate automation, and to connect and fix the circuit board, flexible circuit board, and circuit components with a single solder, (EN) A flexible circuit board fixing mechanism that is hard to peel off from a flexible circuit board. A flexible circuit board having a circuit board (10) on a surface of which a circuit pattern (11) having a circuit connecting section (12) and a circuit pattern (22) having a circuit connecting section (23) connected to the circuit connecting section (12) of the circuit board (10). 20 and a circuit part 35 having a terminal part 36 connected to the circuit connecting part 23 of the flexible circuit board 20, and the circuit connecting part 12 of the circuit board 10, the circuit connecting part 23 of the flexible circuit board 20, and the circuit part. The terminal portion 36 of 35 was set at substantially the same location, and these were integrally soldered and fixed together.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、回路部品を有するフレキシブル回路基板の基板への固定機構に関す るもので、例えば、光ピックアップやカメラの受光素子の出力信号を外部回路に 導くためのフレキシブル回路基板その他に適用可能なものである。 The present invention relates to a mechanism for fixing a flexible circuit board having circuit parts to the board, and is applicable to, for example, a flexible circuit board for guiding an output signal of an optical pickup or a light receiving element of a camera to an external circuit. It is a thing.

【0002】[0002]

【従来の技術】[Prior art]

光ディスク用光ピックアップや、オートフォーカス機能を有するカメラに用い る受光素子の出力信号を外部回路に導くためのフレキシブル回路基板の例として 特開平3−120631号公報記載のものが知られている。これは、受光素子の 出力信号を導くためのパターンを形成したフレキシブル基板と、フレキシブル基 板の一部を補強するために貼り合わせた金属板とを有し、フレキシブル基板に受 光素子の外形と略同形状の第1の孔を設け、金属板に第1の孔より大きい第2の 孔を設け、金属板の反対側から第1および第2の孔に受光素子を挿入し、フレキ シブル基板に受光素子の端子を半田付け固定したものである。 As an example of a flexible circuit board for guiding an output signal of a light receiving element used in an optical pickup for an optical disk or a camera having an autofocus function to the one described in Japanese Patent Laid-Open No. 3-120631, there is known. This has a flexible substrate on which a pattern for guiding the output signal of the light receiving element is formed, and a metal plate bonded to reinforce a part of the flexible substrate. A first hole of substantially the same shape is provided, a second hole that is larger than the first hole is provided in the metal plate, and a light receiving element is inserted into the first and second holes from the opposite side of the metal plate. The terminals of the light receiving element are fixed by soldering.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記公報記載のもののほか、従来のフレキシブル基板の固定機構は、受光素子 などの外付けの回路部品を一つの面に配線するものであるため、受光素子などの 外付けの回路部品のほかにチップコンデンサなどの外付け部品を設けようとする と、その分基板の面積が大きくなるという難点がある。また、受光素子などの回 路部品を先ず回路基板に半田付けし、回路部品の上からフレキシブル回路基板を 重ね、フレキシブル回路基板のパターンと回路部品の端子とをブリッジ半田で接 続し固定するようになっているが、ブリッジ半田付けの自動化は難しく、また、 半田付け工程が1回では済まないし、回路基板とフレキシブル回路基板とが剥が れやすいという難点がある。 In addition to the one described in the above publication, the conventional flexible board fixing mechanism wires external circuit components such as light-receiving elements on one surface, so in addition to external circuit components such as light-receiving elements, chip If an external component such as a capacitor is to be provided, there is a problem in that the area of the board becomes larger accordingly. Also, circuit components such as light receiving elements should be soldered to the circuit board first, then the flexible circuit board should be overlaid on top of the circuit component, and the pattern of the flexible circuit board and the terminals of the circuit component should be connected and fixed with bridge solder. However, automation of bridge soldering is difficult, and the soldering process does not have to be performed only once, and the circuit board and the flexible circuit board are easily separated.

【0004】 本考案はこのような従来技術の問題点を解消するためになされたもので、基板 の面積を小さくすることができ、ブリッジ半田をなくすことによって自動化を容 易にするとともに1回の半田付けで回路基板とフレキシブル回路基板と回路部品 とが接続固定され、かつ、回路基板とフレキシブル回路基板とが剥がれにくいフ レキシブル回路基板の固定機構を提供することを目的とする。The present invention has been made in order to solve the above-mentioned problems of the prior art. The area of the board can be reduced, and the bridge solder can be eliminated to facilitate automation and reduce An object of the present invention is to provide a flexible circuit board fixing mechanism in which a circuit board, a flexible circuit board, and circuit components are connected and fixed by soldering, and the circuit board and the flexible circuit board are hard to separate.

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

上記目的を達成するために本考案は、回路接続部を有する回路パターンが表面 に形成された回路基板と、この回路基板の回路接続部に接続される回路接続部を 有する回路パターンを一方側の面に備えたフレキシブル回路基板と、このフレキ シブル回路基板の回路接続部と接続される端子部を有する回路部品とを有し、回 路基板の回路接続部とフレキシブル回路基板の回路接続部と回路部品の端子部と を一体に半田付け接続するように略同一箇所に設定し、フレキシブル回路基板を 回路基板に接続固定した。 In order to achieve the above object, the present invention provides a circuit board having a circuit pattern having a circuit connecting portion on its surface and a circuit pattern having a circuit connecting portion connected to the circuit connecting portion of the circuit board on one side. A flexible circuit board provided on the surface, and a circuit component having a terminal portion connected to the circuit connecting portion of the flexible circuit board. The circuit connecting portion of the circuit board, the circuit connecting portion of the flexible circuit board, and the circuit. The flexible circuit board was connected and fixed to the circuit board by setting it at approximately the same location so that the terminal part of the component was integrally soldered and connected.

【0006】 フレキシブル回路基板の回路接続部の近傍に切除部を設け、この切除部から回 路基板の回路接続部を露出させ、上記切除部を通して回路部品の端子部をフレキ シブル回路基板の回路接続部に半田付けして、回路基板の回路接続部とフレキシ ブル回路基板の回路接続部と回路部品の端子部とを電気的に一体に半田付け接続 してもよい。また、フレキシブル回路基板の一部に切欠部を形成し、この切欠部 から回路基板の回路接続部を露出させ、この露出した回路接続部に別の回路部品 の端子部を半田付け接続してもよい。A cutout portion is provided in the vicinity of the circuit connection portion of the flexible circuit board, the circuit connection portion of the circuit board is exposed from the cutout portion, and the terminal portion of the circuit component is connected to the circuit of the flexible circuit board through the cutout portion. Alternatively, the circuit connection portion of the circuit board, the circuit connection portion of the flexible circuit board, and the terminal portion of the circuit component may be electrically and integrally soldered to each other. Also, by forming a notch in a part of the flexible circuit board, exposing the circuit connecting part of the circuit board from this notch, and soldering the terminal part of another circuit component to the exposed circuit connecting part. Good.

【0007】[0007]

【作用】[Action]

回路基板の回路接続部とフレキシブル回路基板の回路接続部と回路部品の端子 部とを略同一箇所に設定して半田付けすることにより、これらが電気的に接続さ れるとともに、フレキシブル回路基板と回路部品が回路基板に一体に固定される ことになる。フレキシブル回路基板の回路接続部の近傍に切除部を設けておけば 、回路基板の回路接続部とフレキシブル回路基板の回路接続部と回路部品の端子 部との半田付けは、上記切除部を通して行うことができる。フレキシブル回路基 板の一部に切欠部を形成し、この切欠部から回路基板の回路接続部を露出させて おけば、この露出した回路接続部に別の回路部品の端子を半田付けによって接続 することができる。 The circuit connection part of the circuit board, the circuit connection part of the flexible circuit board, and the terminal part of the circuit component are set at approximately the same location and soldered so that they are electrically connected and the flexible circuit board and the circuit The parts will be integrally fixed to the circuit board. If a cutout part is provided near the circuit connection part of the flexible circuit board, solder the circuit connection part of the circuit board, the circuit connection part of the flexible circuit board and the terminal part of the circuit component through the cutout part. You can By forming a cutout in a part of the flexible circuit board and exposing the circuit connection part of the circuit board from this cutout, connect the terminal of another circuit component to this exposed circuit connection part by soldering. be able to.

【0008】[0008]

【実施例】【Example】

以下、図面を参照しながら本考案にかかるフレキシブル基板の固定機構の実施 例について説明する。 本考案の実施例は、回路基板とフレキシブル回路基板と回路部品とを主要な構 成部品としているので、まず、各構成部品の具体例について説明する。 Embodiments of a flexible substrate fixing mechanism according to the present invention will be described below with reference to the drawings. In the embodiment of the present invention, the circuit board, the flexible circuit board, and the circuit parts are the main constituent parts. First, concrete examples of the respective constituent parts will be described.

【0009】 図2は、フレキシブル回路基板を補強するための回路基板10の例を示す。図 2において、回路基板10はアルミニウム等の板からなり、中央部に後述の回路 部品本体を受け入れるべき四角形の窓孔15が形成されている。回路基板10は 表面が絶縁処理され、回路基板10の一方の表面には絶縁層の上に適宜数の回路 パターン11が形成されている。回路パターン11は、後述のフレキシブル回路 基板の回路パターンとの組み合わせで回路部品の端子部を所定の外部回路に接続 するためのもので、各回路パターン11の両端部あるいは一部の回路パターン1 1の中間部ににおいて回路接続部12を有している。回路基板10の一方の表面 にはまた適宜数の回路接続部14が形成されている。各回路接続部12,14は 窓孔15を挾んで両側に配置され、一つの回路パターン11の回路接続部12と 第2の回路パターン11の回路接続部12が図2において左下側に並んでおり、 上記一つの回路パターン11の回路接続部12と第3の回路パターン11の回路 接続部12が右下側に並んでいる。FIG. 2 shows an example of a circuit board 10 for reinforcing a flexible circuit board. In FIG. 2, the circuit board 10 is made of a plate of aluminum or the like, and a rectangular window hole 15 for receiving a circuit component body described later is formed in the central portion. The surface of the circuit board 10 is insulated, and an appropriate number of circuit patterns 11 are formed on the insulating layer on one surface of the circuit board 10. The circuit pattern 11 is for connecting the terminal portion of the circuit component to a predetermined external circuit in combination with the circuit pattern of the flexible circuit board described later, and both ends of each circuit pattern 11 or a part of the circuit pattern 11 The circuit connecting portion 12 is provided in the middle portion of the. An appropriate number of circuit connecting portions 14 are also formed on one surface of the circuit board 10. The circuit connecting portions 12 and 14 are arranged on both sides of the window hole 15, and the circuit connecting portion 12 of one circuit pattern 11 and the circuit connecting portion 12 of the second circuit pattern 11 are arranged side by side on the lower left side in FIG. The circuit connecting portion 12 of the one circuit pattern 11 and the circuit connecting portion 12 of the third circuit pattern 11 are arranged on the lower right side.

【0010】 図6は、上記回路基板10に接続固定されるフレキシブル回路基板20の概略 を示し、図3はフレキシブル回路基板20の要部を示す。図6において、フレキ シブル回路基板20は各種機器、例えば光ピックアップ、カメラ等の限られた空 間を立体的に曲げながら引き回すために複雑な正面形状をしており、一部に上記 回路基板10との接続固定部21が形成されている。図3において、フレキシブ ル回路基板20の回路基板10との接続固定部21には、回路基板10の窓孔1 5と略同形同大の窓孔25が形成されるとともに多数の回路パターン22が形成 されている。回路パターン22は窓孔25を避けるようにして左右に振り分けら れており、各回路パターン22はその端部において回路接続部23を有している 。各回路接続部23は回路基板10の各回路接続部14と重なるように窓孔25 の両側に配置されている。FIG. 6 shows an outline of the flexible circuit board 20 connected and fixed to the circuit board 10, and FIG. 3 shows a main part of the flexible circuit board 20. In FIG. 6, the flexible circuit board 20 has a complicated front shape in order to route various equipment such as an optical pickup and a camera while bending it in a three-dimensional manner. A connection fixing part 21 is formed. In FIG. 3, a window hole 25 of substantially the same shape and size as the window hole 15 of the circuit board 10 is formed in the connection fixing portion 21 of the flexible circuit board 20 with the circuit board 10 and a large number of circuit patterns 22 are formed. Has been formed. The circuit patterns 22 are distributed right and left so as to avoid the window holes 25, and each circuit pattern 22 has a circuit connecting portion 23 at its end. The circuit connecting portions 23 are arranged on both sides of the window hole 25 so as to overlap the circuit connecting portions 14 of the circuit board 10.

【0011】 フレキシブル回路基板20の上記接続固定部21の図3において左右両側下端 部には切欠部29が形成されている。回路基板10に上記接続固定部21を重ね たとき、上記切欠部29から回路基板10の左右両側の回路接続部12が露出す るようになっている。フレキシブル回路基板20の断面構造、特にその接続固定 部21の断面構造は、図5に示すように、柔軟性があり絶縁性のベース31と、 このベース31の上に形成された回路接続部23およびこれに続く回路パターン と、これら回路接続部23および回路パターンを絶縁保護するためのオーバーレ イ26からなる。フレキシブル回路基板20の各回路接続部23には後述の回路 部品の端子部を半田付けによって接続するため、回路接続部23の近傍において オーバーレイ26に窓孔27が形成されている。また、回路部品の端子部の多く を回路基板10の回路接続部12,14にも半田付けによって接続固定するため に、図1、図5に示すように、フレキシブル回路基板20の回路接続部23およ びベース31を通して長円形の切除部24が形成されている。In FIG. 3, the connection fixing portion 21 of the flexible circuit board 20 has cutouts 29 formed at lower end portions on both left and right sides. When the connection fixing portion 21 is stacked on the circuit board 10, the circuit connecting portions 12 on both left and right sides of the circuit board 10 are exposed from the cutout portion 29. As shown in FIG. 5, the cross-sectional structure of the flexible circuit board 20, in particular, the connecting and fixing portion 21 thereof, has a flexible and insulating base 31, and a circuit connecting portion 23 formed on the base 31. And a circuit pattern following it, and an overlay 26 for insulating and protecting the circuit connecting portion 23 and the circuit pattern. A window hole 27 is formed in the overlay 26 in the vicinity of the circuit connecting portion 23 in order to connect a terminal portion of a circuit component described later to the circuit connecting portion 23 of the flexible circuit board 20 by soldering. Further, in order to connect and fix most of the terminal parts of the circuit component to the circuit connecting parts 12 and 14 of the circuit board 10 by soldering, as shown in FIGS. 1 and 5, the circuit connecting part 23 of the flexible circuit board 20 is connected. An oval cut portion 24 is formed through the base 31.

【0012】 図4は、回路基板10およびフレキシブル回路基板20に接続固定される回路 部品の例を示しており、本実施例の場合は光ピックアップにおける光検出素子で ある。図4において、回路部品35は四角形の本体を有し、この本体から左右両 側に適宜数の端子部36が突出した形になっている。回路部品35の種類や形態 などは特に限定されない。例えばICなどでもよいし、円形、円筒形あるいは長 方体状のチップ部品などでもよい。FIG. 4 shows an example of circuit components connected and fixed to the circuit board 10 and the flexible circuit board 20, and in the case of the present embodiment, it is a photodetection element in an optical pickup. In FIG. 4, the circuit component 35 has a quadrangular main body, and an appropriate number of terminal portions 36 project from the main body on both left and right sides. The type and form of the circuit component 35 are not particularly limited. For example, it may be an IC or the like, or may be a circular, cylindrical or rectangular chip part or the like.

【0013】 図1、図5に示すように、以上説明した回路基板10の上にフレキシブル回路 基板20の接続固定部21を重ね、さらにフレキシブル回路基板20の窓孔25 および回路基板10の窓孔15に回路部品35本体の半分を落し込み、回路部品 35の端子部36をフレキシブル回路基板20の回路接続部23の上に載せる。 回路基板10の各回路接続部12,14とフレキシブル回路基板20の各回路接 続部23と回路部品35の各端子部36とを位置合わせして半田付けする。フレ キシブル回路基板20に切除部24が形成された部分では、切除部24を通じて 半田が回路基板10の回路接続部12,14にまで至り、回路基板10の各回路 接続部12,14とフレキシブル回路基板20の各回路接続部23と回路部品3 5の各端子部36とが電気的に接続されるとともに回路基板10とフレキシブル 回路基板20と回路部品35とが一体に固定される。図5において符号32は、 上記のようにして回路基板10とフレキシブル回路基板20と回路部品35とを 一体に固定した半田を示している。As shown in FIGS. 1 and 5, the connection fixing portion 21 of the flexible circuit board 20 is superposed on the circuit board 10 described above, and the window hole 25 of the flexible circuit board 20 and the window hole of the circuit board 10 are further stacked. Half of the main body of the circuit component 35 is dropped into 15 and the terminal portion 36 of the circuit component 35 is placed on the circuit connecting portion 23 of the flexible circuit board 20. The circuit connecting portions 12 and 14 of the circuit board 10, the circuit connecting portions 23 of the flexible circuit board 20 and the terminal portions 36 of the circuit component 35 are aligned and soldered. In the portion where the cutout portion 24 is formed on the flexible circuit board 20, the solder reaches the circuit connection portions 12 and 14 of the circuit board 10 through the cutout portion 24 and the circuit connection portions 12 and 14 of the circuit board 10 and the flexible circuit. Each circuit connecting portion 23 of the board 20 and each terminal portion 36 of the circuit component 35 are electrically connected, and the circuit board 10, the flexible circuit board 20, and the circuit component 35 are integrally fixed. In FIG. 5, reference numeral 32 indicates solder that integrally fixes the circuit board 10, the flexible circuit board 20, and the circuit component 35 as described above.

【0014】 上記のように回路基板10とフレキシブル回路基板20と回路部品35とを一 体に固定した状態で、フレキシブル回路基板20の左右両側の切欠部29から回 路基板10の回路接続部12がそれぞれ左右両側において2個ずつ並んで露出し ている。そこで、左右両側に露出した2個の回路接続部12,12間に第2の回 路部品、例えば図2に符号18で示すようなチップコンデンサなどを半田付けし て接続する。チップコンデンサ18は、回路基板10の回路パターン11を通じ 、さらにはフレキシブル回路基板20の回路接続部23や回路パターン22を通 じて回路部品35の端子部36あるいは外部回路に接続される。With the circuit board 10, the flexible circuit board 20, and the circuit component 35 fixed together as described above, the circuit connecting portion 12 of the circuit board 10 is cut out from the notches 29 on both the left and right sides of the flexible circuit board 20. Two are exposed side by side on each side. Therefore, a second circuit component, for example, a chip capacitor as shown by reference numeral 18 in FIG. 2 is soldered and connected between the two circuit connecting portions 12, 12 exposed on the left and right sides. The chip capacitor 18 is connected to the terminal portion 36 of the circuit component 35 or an external circuit through the circuit pattern 11 of the circuit board 10, and further through the circuit connection portion 23 of the flexible circuit board 20 and the circuit pattern 22.

【0015】 以上説明した実施例によれば、回路基板10の回路接続部12,14とフレキ シブル回路基板20の回路接続部23と回路部品35の端子部36とを略同一箇 所に設定してこれらを一体に半田付けすることにより、フレキシブル回路基板2 0を回路基板10に接続固定するようにしたため、1回の半田付けで回路基板と フレキシブル回路基板と回路部品とを接続することができるとともにこれらを固 定することができるし、半田付けの自動化も容易である。According to the embodiment described above, the circuit connecting portions 12 and 14 of the circuit board 10, the circuit connecting portion 23 of the flexible circuit board 20 and the terminal portion 36 of the circuit component 35 are set in substantially the same place. Since the flexible circuit board 20 is connected and fixed to the circuit board 10 by integrally soldering them together, the circuit board, the flexible circuit board and the circuit component can be connected by one soldering. At the same time, these can be fixed, and automation of soldering is easy.

【0016】 さらに、回路基板10にも回路パターン11と回路接続部12,14を形成し 、フレキシブル回路基板20の回路パターン22と回路接続部23と合わせて所 定の回路を形成するようにしたため、全ての回路パターンをフレキシブル回路基 板20に集中して形成する場合に比べて回路基板10およびフレキシブル回路基 板20の面積を小さくすることができるし、回路基板10の回路接続部にも別の 回路部品18を接続することができるため、この点からも回路基板10およびフ レキシブル回路基板20の面積を小さくすることができ、小スペース化を図るこ とができる。Further, since the circuit pattern 11 and the circuit connecting portions 12 and 14 are formed also on the circuit board 10, and the circuit pattern 22 and the circuit connecting portion 23 of the flexible circuit board 20 are combined to form a predetermined circuit. The area of the circuit board 10 and the flexible circuit board 20 can be reduced as compared with the case where all the circuit patterns are concentrated on the flexible circuit board 20, and the circuit connecting portion of the circuit board 10 is also separately provided. Since the circuit components 18 can be connected, the area of the circuit board 10 and the flexible circuit board 20 can be reduced also from this point, and the space can be reduced.

【0017】 また、フレキシブル回路基板20の回路接続部23の近傍に切除部24を設け 、この切除部24から回路基板10の回路接続部12,14を露出させ、回路部 品35の端子部36をフレキシブル回路基板20の回路接続部23に半田付けす ることにより、回路基板10の回路接続部12,14とフレキシブル回路基板1 0の回路接続部23と回路部品35の端子部36とを電気的に一体に半田付け接 続するようにしたため、回路基板10とフレキシブル回路基板20とが剥がれに くいという利点がある。Further, a cutout portion 24 is provided near the circuit connection portion 23 of the flexible circuit board 20, the circuit connection portions 12 and 14 of the circuit board 10 are exposed from the cutout portion 24, and the terminal portion 36 of the circuit component 35. By soldering to the circuit connecting portion 23 of the flexible circuit board 20, the circuit connecting portions 12 and 14 of the circuit board 10, the circuit connecting portion 23 of the flexible circuit board 10 and the terminal portion 36 of the circuit component 35 are electrically connected. Since they are integrally soldered together, there is an advantage that the circuit board 10 and the flexible circuit board 20 are hard to peel off.

【0018】 本考案は、光ピックアップやカメラなどに限らず、フレキシブル回路基板を使 用するあらゆる回路に適用することができる。The present invention can be applied not only to optical pickups and cameras, but also to any circuits using flexible circuit boards.

【0019】[0019]

【考案の効果】[Effect of device]

請求項1記載の考案によれば、回路基板の回路接続部とフレキシブル回路基板 の回路接続部と回路部品の端子部とを略同一箇所に設定してこれらを一体に半田 付けすることにより、フレキシブル回路基板を回路基板に接続固定するようにし たため、1回の半田付けで回路基板とフレキシブル回路基板と回路部品とを接続 することができるとともにこれらを固定することができるし、半田付けの自動化 も容易である。さらに、回路基板にも回路パターンと回路接続部を形成し、フレ キシブル回路基板の回路パターンと回路接続部と合わせて所定の回路を形成する ようにしたため、全ての回路パターンをフレキシブル回路基板に集中して形成す る場合に比べて回路基板およびフレキシブル回路基板の面積を小さくすることが でき、小スペース化を図ることができる。 According to the invention as set forth in claim 1, the circuit connecting portion of the circuit board, the circuit connecting portion of the flexible circuit board, and the terminal portion of the circuit component are set at substantially the same location, and these are integrally soldered to each other, thereby making it flexible. Since the circuit board is connected and fixed to the circuit board, the circuit board, the flexible circuit board, and the circuit components can be connected and fixed by soldering once, and the soldering can be automated. It's easy. Furthermore, the circuit pattern and the circuit connection part are formed on the circuit board, and the circuit pattern and the circuit connection part of the flexible circuit board are combined to form a predetermined circuit, so that all circuit patterns are concentrated on the flexible circuit board. The area of the circuit board and the flexible circuit board can be made smaller than that in the case of being formed in this way, and the space can be reduced.

【0020】 請求項2記載の考案によれば、フレキシブル回路基板の回路接続部の近傍に切 除部を設け、この切除部から回路基板の回路接続部を露出させ、回路部品の端子 部をフレキシブル回路基板の回路接続部に半田付けすることにより、回路基板の 回路接続部とフレキシブル回路基板の回路接続部と回路部品の端子部とを電気的 に一体に半田付け接続するようにしたため、従来のようにブリッジ半田で接続す る場合に比べて、回路基板とフレキシブル回路基板とが剥がれにくいという利点 がある。According to the second aspect of the present invention, the cutout portion is provided near the circuit connection portion of the flexible circuit board, the circuit connection portion of the circuit board is exposed from the cutout portion, and the terminal portion of the circuit component is flexible. By soldering to the circuit connection part of the circuit board, the circuit connection part of the circuit board, the circuit connection part of the flexible circuit board, and the terminal part of the circuit component are electrically and integrally soldered together. As compared with the case of connecting with bridge solder as described above, there is an advantage that the circuit board and the flexible circuit board are less likely to be separated.

【0021】 請求項3記載の考案によれば、フレキシブル回路基板の一部に切欠部を形成し、 この切欠部から回路基板の回路接続部を露出させ、この露出した回路接続部に別 の回路部品の端子部を半田付け接続するようにしたため、この点からも回路基板 およびフレキシブル回路基板の面積を小さくすることができる。According to the third aspect of the present invention, a cutout is formed in a part of the flexible circuit board, the circuit connecting portion of the circuit board is exposed from the cutout, and another circuit is connected to the exposed circuit connecting portion. Since the terminal portions of the components are connected by soldering, the area of the circuit board and the flexible circuit board can be reduced also from this point.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案にかかるフレキシブル基板の固定機構の
実施例を示す正面図。
FIG. 1 is a front view showing an embodiment of a flexible board fixing mechanism according to the present invention.

【図2】同上実施例中の回路基板の正面図。FIG. 2 is a front view of a circuit board according to the above embodiment.

【図3】上記実施例中のフレキシブル回路基板の要部を
示す正面図。
FIG. 3 is a front view showing a main part of a flexible circuit board in the above embodiment.

【図4】上記実施例中の回路部品の正面図。FIG. 4 is a front view of the circuit component in the above embodiment.

【図5】上記実施例の要部の断面図。FIG. 5 is a cross-sectional view of a main part of the above embodiment.

【図6】上記実施例中のフレキシブル回路基板の概略を
示す正面図。
FIG. 6 is a front view showing an outline of a flexible circuit board in the above embodiment.

【符号の説明】[Explanation of symbols]

10 回路基板 11 回路パターン 12 回路接続部 18 別の回路部品 20 フレキシブル回路基板 22 回路パターン 23 回路接続部 24 切除部 29 切欠部 32 半田 35 回路部品 36 端子部 DESCRIPTION OF SYMBOLS 10 circuit board 11 circuit pattern 12 circuit connection part 18 different circuit component 20 flexible circuit board 22 circuit pattern 23 circuit connection part 24 cutout part 29 cutout part 32 solder 35 circuit part 36 terminal part

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 回路接続部を有する回路パターンが表面
に形成された回路基板と、 この回路基板の回路接続部に接続される回路接続部を有
する回路パターンを一方側の面に備えたフレキシブル回
路基板と、 このフレキシブル回路基板の回路接続部と接続される端
子部を有する回路部品とを有し、 上記回路基板の回路接続部と上記フレキシブル回路基板
の回路接続部と上記回路部品の端子部とが一体に半田付
け接続されるように略同一箇所に設定され、 上記フレキシブル回路基板が上記回路基板に接続固定さ
れることを特徴とするフレキシブル基板の固定機構。
1. A flexible circuit comprising a circuit board having a circuit pattern having a circuit connecting portion formed on its surface and a circuit pattern having a circuit connecting portion connected to the circuit connecting portion of the circuit board on one surface. A circuit part having a terminal part connected to the circuit connecting part of the flexible circuit board; a circuit connecting part of the circuit board; a circuit connecting part of the flexible circuit board; and a terminal part of the circuit part. Is set in substantially the same place so that they are integrally connected by soldering, and the flexible circuit board is connected and fixed to the circuit board.
【請求項2】 フレキシブル回路基板の回路接続部の近
傍に切除部が設けられ、この切除部から回路基板の回路
接続部が露出しており、 上記回路部品の端子部をフレキシブル回路基板の上記回
路接続部に半田付けすることにより、上記回路基板の回
路接続部と上記フレキシブル回路基板の回路接続部と上
記回路部品の端子部とが電気的に一体に半田付け接続さ
れることを特徴とする請求項1記載のフレキシブル基板
の固定機構。
2. A cutout portion is provided in the vicinity of the circuit connection portion of the flexible circuit board, the circuit connection portion of the circuit board is exposed from the cutout portion, and the terminal portion of the circuit component is connected to the circuit of the flexible circuit board. The circuit connection portion of the circuit board, the circuit connection portion of the flexible circuit board, and the terminal portion of the circuit component are electrically and integrally soldered and connected by soldering to the connection portion. Item 2. A flexible board fixing mechanism according to Item 1.
【請求項3】 フレキシブル回路基板の一部には切欠部
が形成され、この切欠部から回路基板の回路接続部が露
出しており、この露出した回路接続部に別の回路部品の
端子部が半田付け接続されることを特徴とする請求項1
記載のフレキシブル基板の固定機構。
3. A cutout is formed in a part of the flexible circuit board, and a circuit connecting portion of the circuit board is exposed from the cutout, and a terminal portion of another circuit component is exposed in the exposed circuit connecting portion. 2. A connection by soldering
A fixing mechanism for the flexible substrate described.
JP1992090080U 1992-12-07 1992-12-07 Flexible board fixing mechanism Expired - Fee Related JP2569214Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1992090080U JP2569214Y2 (en) 1992-12-07 1992-12-07 Flexible board fixing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1992090080U JP2569214Y2 (en) 1992-12-07 1992-12-07 Flexible board fixing mechanism

Publications (2)

Publication Number Publication Date
JPH0650382U true JPH0650382U (en) 1994-07-08
JP2569214Y2 JP2569214Y2 (en) 1998-04-22

Family

ID=13988546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1992090080U Expired - Fee Related JP2569214Y2 (en) 1992-12-07 1992-12-07 Flexible board fixing mechanism

Country Status (1)

Country Link
JP (1) JP2569214Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151142A (en) * 2010-01-20 2011-08-04 Nidec Sankyo Corp Flexible substrate, device with the flexible substrate, method of soldering flexible substrate, and method of manufacturing device with flexible substrate
CN102573297A (en) * 2010-12-20 2012-07-11 株式会社电装 Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158364U (en) * 1983-04-11 1984-10-24 イビデン株式会社 Composite multilayer wiring board
JPS59192871U (en) * 1983-06-10 1984-12-21 日本電気株式会社 High-density mounting wiring structure of printed circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59158364U (en) * 1983-04-11 1984-10-24 イビデン株式会社 Composite multilayer wiring board
JPS59192871U (en) * 1983-06-10 1984-12-21 日本電気株式会社 High-density mounting wiring structure of printed circuit boards

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151142A (en) * 2010-01-20 2011-08-04 Nidec Sankyo Corp Flexible substrate, device with the flexible substrate, method of soldering flexible substrate, and method of manufacturing device with flexible substrate
CN102573297A (en) * 2010-12-20 2012-07-11 株式会社电装 Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board
JP2012134196A (en) * 2010-12-20 2012-07-12 Denso Corp Mounting structure of chip type electronic component
US8901686B2 (en) 2010-12-20 2014-12-02 Denso Corporation Mounting structure of chip type electric element and electric apparatus having chip type electric element on flexible board

Also Published As

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