JP2878106B2 - Flexible board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible substrate, and more particularly to facilitation of work.

[0002]

2. Description of the Related Art Generally, wiring and circuits are provided on a flexible substrate by printing, and various components are mounted on the substrate. Such flexible substrates are used in various fields. Particularly, in recent years, a non-contact type card in which a coil is formed on a flexible substrate and a storage circuit and the like are mounted has been proposed.

FIG. 7A shows an example of a flexible substrate 100 provided with a coil used for a non-contact card or the like. A coil 90 is formed on the flexible substrate 100, and components such as an IC and a transistor are mounted thereon.
The coil 90 is connected to other components.

[0004] By connecting components such as an IC to the coil 90 formed on the flexible substrate 100, a non-contact card or the like is completed.

[0005]

However, the conventional flexible substrate has the following problems. A coil always has its start or end point inside or outside the coil. Therefore, as shown in FIG. 7, when connecting the coil 90 to other components, the terminal PX inside the coil is used.
Are extended to the terminal PY outside the coil.

The terminal P inside such a coil 90
Conventionally, wiring is also provided on the back surface of the flexible substrate 100 to extend X, and the terminal PX inside the coil 90 is extended to the outside PY of the coil. That is, in the flexible substrate on which the coil is formed, it is necessary to perform wiring over two layers, the front surface and the back surface, only for the wiring of the coil. However, if two-layer wiring is performed on the flexible substrate, there is a problem that the cost is extremely high.

Further, without performing the above-described two-layer wiring,
In order to extend the terminal PX inside the coil to the terminal PY outside the coil, the terminal PX inside the coil and the terminal PY outside the coil are connected by soldering or the like using a jumper wire or the like. However, since connection by this method requires precision, it has to be performed manually, which is very troublesome.

Accordingly, an object of the present invention is to provide a flexible substrate that can easily and reliably connect a coil to another component by using one-layer wiring.

[0009]

According to a first aspect of the present invention, there is provided a flexible substrate on which a circuit having a coil having an outer end and an inner end is formed, wherein the first terminal connected to the outer end is connected to the first terminal. While providing it outside the coil,
A folded portion was provided by cutting out the flexible substrate near an inner end, the inner end was foldable outside the coil across the coil, and a second terminal was provided at a position in contact with the folded inner end. It is characterized.

According to a second aspect of the present invention, there is provided a flexible substrate on which a circuit having a coil having an outer end and an inner end is formed, wherein a first terminal connected to the inner end is provided inside the coil. Providing a folded portion by cutting out the flexible substrate near the outer end, enabling the outer end to be folded inside the coil across the coil, and providing a second terminal at a position in contact with the folded outer end. It is characterized by that.

According to a third aspect of the present invention, there is provided the flexible substrate according to the first aspect.
Alternatively, in the flexible substrate according to claim 2, the second terminal is formed in a hole shape leaving a conductor portion in a peripheral portion, and the inner end or the outer end is formed by removing a substrate portion leaving a conductor portion. The second terminal and the inner end or the outer end are fixed by soldering so as to be in contact with each other at the time of folding.

According to a fourth aspect of the present invention, there is provided the flexible substrate according to the first aspect.
Alternatively, in the flexible substrate according to claim 2, the flexible substrate is formed in a rectangular or square shape and the coil is formed in a circular shape, and the center line of the folded portion substantially coincides with a diagonal line of the rectangle or the square. A fold is provided.

[0013]

In the flexible substrate according to the first or second aspect, the folded portion can fold the inside end or the outside end outside or inside the coil across the coil, and the second terminal is folded. It is provided at a position in contact with the inner end or the outer end. Therefore, the inner end or the outer end can be easily brought into contact with the second terminal simply by folding.

According to a third aspect of the present invention, in the flexible substrate, the second terminal is formed in a hole shape leaving a conductor portion in a peripheral portion, and the inner end or the outer end removes the substrate portion leaving a conductor portion. The second terminal and the inside end or the outside end are brought into contact with each other and fixed by soldering. Therefore, the inner end or the outer end and the second end
The terminals can be securely soldered.

According to a fourth aspect of the present invention, in the flexible substrate, the flexible substrate is formed in a rectangular or square shape and the coil is formed in a circular shape, and the folded portion has a center line with the diagonal line of the rectangular shape or the square. It is provided so as to substantially match. Thus, the fold can be formed in a rectangle or square.

[0016]

FIG. 1A is a plan view showing one embodiment of a flexible substrate according to the present invention. Various circuits 95 and coils 90 are formed on the flexible substrate 100.
The coil 90 has an outer end TM1 and an inner end TM2. Here, the first terminal FT is connected to the outer end TM1.
M1 is connected and connected to the circuit 95. Further, the inner end TM2 is provided in the folded portion 70 in the coil 90. Further, a second terminal STM2 is connected to the circuit 95. Note that the inner end TM2 and the second terminal STM
2 is provided as a VIA hole (conductive through hole) (via hole).

Here, the folded portion 70 is formed by cutting out the flexible substrate 100, and the coil 90
And the inner end TM2 can be folded outside the coil 90. FIG. 1B shows a side view of the flexible substrate 100 when the folded portion 70 is folded outside the coil 90.

The second terminal STM2 is provided at a position in contact with the folded inner end TM2. Accordingly, the inner end TM2 can be easily and reliably connected to the second terminal STM2 only by folding the folded portion 70 in the direction of arrow 200.
Contact with.

Next, FIG. 2 is an enlarged view showing the folded portion 70.
Listed in The folded portion 70 is connected to the flexible substrate 1
It is formed by cutting out 00. The cutout portion CN1 shown in FIG. 2 is formed by punching the flexible substrate 100 near the inner end TM2 with a mold or the like. The wiring 70W of the folded portion 70 is formed thicker than the wiring of the coil 90 in consideration of deterioration due to folding (prevention of disconnection and the like).

Next, as shown in FIG. 1B, the contacted inner end TM2 and the second terminal STM2 are fixed. Flexible substrate 1 when inner end TM2 and second terminal STM2 are fixed
FIG. 3 is a cross-sectional view showing the relationship between 00 and the folded portion 70. Here, the flexible substrate 100 and the folded portion 70
Are composed of a polyimide film 60 and a wiring 55 (copper foil).

FIG. 3A shows an inner end TM2 and a second terminal STM.
FIG. 3B shows a case where 2 is fixed by swaging 35
5 shows a case where the inner end TM2 and the second terminal STM2 are fixed by soldering. In either case, the wires 55 are in electrical contact with each other, and the inner end T
M2 and the second terminal STM2 are securely fixed, and the coil 90
And the circuit 95 are securely connected. In this figure, the wiring 55 is shown on each surface in order to clarify the electrical connection between the flexible substrate 100 and the folded portion 70, but actually only a part of the surface is provided with wiring. (FIG. 1A
reference).

As described above, when the flexible board 100 according to the present embodiment is used, the inner end TM2 can be easily and reliably brought into electrical contact with the second terminal STM2 and fixed simply by folding the folded portion 70. Becomes possible.

FIG. 4A is a plan view of another embodiment of the flexible substrate according to the present invention. FIG. 4A shows the tape 4
10 shows a flexible substrate 300 formed on the substrate. The coil 90 is formed on the flexible substrate 300 of the present embodiment, and various circuits 95 are provided in the coil 90. Inside the coil 90, an inner end TM3 and a first terminal FTM3 connected to the inner end are provided. In the coil 90, a second terminal STM4 is connected to the circuit 95 and provided.

On the other hand, a folded portion 70 is formed outside the coil 90 by cutting out the flexible substrate 100. In this embodiment, the outer end TM
The fourth and second terminals STM4 are provided as via holes (via holes).

The folding section 70 is formed by the flexible substrate 30
0 is formed on the tape 400 in a rectangular shape having a width WD1, and when the coil 90 is formed in a circular shape, the center line of the folded portion 70 is provided at a position substantially matching the diagonal line TK1 of the rectangular shape (FIG. 4A). Thereby, the width WD1
The coil 90 and the folded portion 70 can be formed in the rectangle of the above, and the tape 400 can be used effectively.

Also in this embodiment, the folded portion 7
0 is formed by cutting out the flexible substrate 300 near the outer end TM4 by punching using a mold or the like. Further, the wiring of the folded portion 70 is formed to be thicker than the wiring of the coil 90 in consideration of deterioration due to folding (prevention of disconnection and the like).

Here, the folding portion 70 is formed so that the outer end TM4 can be folded inside the coil 90 across the coil 90. FIG. 4B shows a flexible substrate 30 when the folded portion 70 is folded inside the coil 90.
0 is a side view.

In this embodiment, the second terminal STM2 is
It is provided at a position where it comes into contact with the folded outer end TM4. Therefore, the flexible substrate 3 according to the present embodiment
00, the outer end TM4 can be easily and reliably formed by folding the folded portion 70 in the direction of the arrow 400.
Contact with terminal STM4.

The outer end TM4 contacted as shown in FIG.
The second terminal STM4 is fixed by caulking or soldering in the same manner as in the above embodiment (see FIG. 3).

As described above, when the flexible substrate 300 of this embodiment is used, only the folding part 70 is folded,
Easily and surely electrically contact the outer end to the second terminal,
In addition to being able to fix, the tape 40
0 can be effectively used, and a flexible substrate can be effectively formed.

By the way, in both of the above embodiments, FIG.
The inner or outer end and the second terminal were fixed in the manner shown in FIG. However, if the inner terminal or the outer end can be fixed to the second terminal by an easy and reliable method, the fixing may be performed by another method. For example, as shown in FIG. 5A, the wiring 55 of the flexible substrate 100 is removed by etching while remaining longer than the polyimide film 60. Next, FIG.
As shown in B, a part of the polyimide film 60 is removed by etching while leaving the wiring 55 of the folded portion 70.
Such a folded portion 70 may be folded in the direction of arrow 200, brought into contact with the flexible substrate 100 (FIG. 5A), and fixed by soldering.

FIG. 5C is a cross-sectional view of the flexible substrate 100 and the folded portion 70 thus fixed.
Further, FIG. 5D shows a cross-sectional view when the inner terminal or the outer end and the second terminal are fixed by a method similar to FIG. 5C. Here, the etched portion of the flexible substrate 100 is larger than that of FIG. 5C.

Further, as shown in FIG. 5E, the wiring 55 of the flexible substrate 100 is formed in an overhang shape so as to contact the wiring 55 of the folded portion 70. next,
The formed overhang portion 58 is soldered.
When the inner terminal or the outer terminal is fixed to the second terminal in this manner, the solder 30 covers all of the overhang portion 58 and the wiring 55 of the folded portion 70, so that more secure fixing can be achieved.

In the above-described embodiment, the inner terminal or the outer terminal is fixed to the second terminal by folding the folded portion 70 in the direction of arrow 200 or arrow 400. That is, the folded portion 70 passes under the flexible board 100 or the flexible board 300, and contacts the inside end or the outside end with the second terminal across the coil 90. However, if these contacts can be reliably and easily made, the folded portion 70 may be folded in another direction to make contact.

FIG. 6A shows that the inside end TM2 and the second terminal STM2 are folded by folding the folded portion 70 in the direction of the arrow 500.
The side view when contacting is shown. 6B, the folded portion 70 is folded in the direction of the arrow 500 so that the inner end T
A sectional view in the case where M2 and the second terminal STM2 are fixed by swaging 35 is shown. Further, the folded portion 70 is folded in the direction of arrow 500 so that the inner end TM2 and the second terminal ST
FIG. 6C is a sectional view when M2 is fixed by solder 30.
Listed in

In this embodiment, the folded portion 70 is folded in the direction of the arrow 500 so that the inner end TM2 and the second terminal S
TM2 was fixed, but the folded portion 70 was folded in the direction of arrow 600 as shown in FIG.
And the second terminal STM4 may be fixed.

When the folded portion 70 is folded, even if the wiring 55 of the folded portion 70 may come into contact with the coil 90, both are covered by the protective film (not shown). ), There is no risk of short circuit.

As described above, when the flexible board 100 and the flexible board 300 according to the present invention are used, the outer end or the inner end can be easily and reliably brought into electrical contact with the second terminal only by folding the folded portion 70. , And can be fixed.

In the above embodiment, the case where the inner end or the outer end is connected to the terminal of the circuit when both the coil and the circuit are formed on the flexible substrate has been described. However, it is not always necessary that both the coil and the circuit are formed on the flexible substrate. When only the coil is formed on the flexible substrate, the connection between the coil and the outside of the flexible substrate is achieved by folding the fold 70. It may be performed.

[0040]

According to the flexible substrate according to the first or second aspect, the second terminal is provided at a position in contact with the folded inner end or outer end. That is, it is possible to easily bring the inner end or the outer end into contact with the second terminal simply by folding.

According to a third aspect of the present invention, the conductive portion around the second terminal and the inside end or the outside end are brought into contact with each other and fixed by soldering. That is, it is possible to securely solder the inner end or the outer end to the second terminal. The flexible board according to claim 4 is provided such that the folded portion has a center line of the folded portion substantially coincident with a diagonal line of the rectangle or the square. That is, the folded portion can be formed in a rectangle or a square. Therefore,
It becomes possible to effectively form a flexible substrate.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a flexible substrate according to the present invention.

FIG. 2 is an enlarged view showing a folding unit 70 shown in FIG.

FIG. 3 is a cross-sectional view illustrating a relationship between a flexible substrate and a folded portion when an inner end and a second terminal are fixed.

FIG. 4 is a plan view showing another embodiment of the flexible substrate according to the present invention.

5 is a cross-sectional view illustrating a relationship between a flexible board and a folded portion when the inner end and the second terminal illustrated in FIG. 3 are fixed by another method.

6A and 6B are a side view showing a case where the folded portion 70 is folded and an inner end and a second terminal are brought into contact with each other, and a cross-sectional view showing a relationship between the flexible substrate and the folded portion at this time.

FIG. 7 is a plan view showing a conventional flexible substrate 100.

[Explanation of symbols]

 70 Folding part 90 Coil 95 Circuit 100 Flexible substrate TM2 Inner end STM2 Second terminal

Claims (4)

(57) [Claims] 1. A flexible substrate on which a circuit having a coil having an outer end and an inner end is formed, wherein a first terminal connected to an outer end is provided outside the coil and the first terminal is provided near an inner end. A folded portion is provided by cutting out a flexible substrate, and the inner end can be folded outside the coil across the coil,
A second terminal provided at a position in contact with the folded inner end. 2. A flexible substrate on which a circuit having a coil having an outer end and an inner end is formed, wherein a first terminal connected to an inner end is provided inside the coil, and a first terminal near the outer end is provided. A folded portion is provided by cutting out a flexible substrate, and the outer end can be folded inside the coil across the coil,
A second terminal provided at a position in contact with the folded outer end. 3. The flexible substrate according to claim 1, wherein the second terminal is formed in a hole shape leaving a conductor portion in a peripheral portion, and the inner end or the outer end is formed with a conductor portion. A flexible substrate formed by removing a remaining substrate portion, and fixing the second terminal and the inner end or the outer end by soldering so as to contact the second terminal at the time of folding. 4. The flexible substrate according to claim 1, wherein the flexible substrate is formed in a rectangular or square shape and the coil is formed in a circular shape, and a center line of the folded portion is formed in the rectangular shape or the square shape. A flexible substrate, wherein the folded portion is provided so as to substantially coincide with a diagonal line.