JP2818911B2 - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
JP2818911B2
JP2818911B2 JP3056544A JP5654491A JP2818911B2 JP 2818911 B2 JP2818911 B2 JP 2818911B2 JP 3056544 A JP3056544 A JP 3056544A JP 5654491 A JP5654491 A JP 5654491A JP 2818911 B2 JP2818911 B2 JP 2818911B2
Authority
JP
Japan
Prior art keywords
solder
conductor
wiring board
printed wiring
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3056544A
Other languages
Japanese (ja)
Other versions
JPH04291786A (en
Inventor
輝代隆 塚田
洋吾 川崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP3056544A priority Critical patent/JP2818911B2/en
Publication of JPH04291786A publication Critical patent/JPH04291786A/en
Application granted granted Critical
Publication of JP2818911B2 publication Critical patent/JP2818911B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits

Landscapes

  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、プリント配線板に関
し、特に電気検査等のために導体回路の一部を一旦断線
し、その後再接続を行うプリント配線板の改良に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to an improvement in a printed wiring board in which a part of a conductor circuit is temporarily disconnected for electrical inspection or the like and then reconnected.

【0002】[0002]

【従来の技術】一般にプリント配線板は、絶縁性の基材
上に銅箔等をエッチングして形成された導体回路を有し
ており、この導体回路を種々のパターンに形成すること
により、目的に合った電気回路を得るようになってい
る。
2. Description of the Related Art In general, a printed wiring board has a conductor circuit formed by etching a copper foil or the like on an insulating base material. To get an electrical circuit that matches

【0003】ところで、このようなプリント配線板の中
には、このプリント配線板に実装される電子部品の良否
等を検査するために、導体回路の一部を一旦断線させ、
その後再接続する必要のある電気回路を備えたものもあ
る。例えば、図に示したようなメモリーブロックを形
成する電気回路の場合には、メモリーブロック中の不良
を解析するために、コモンライン(共通ライン)を順次
一旦断線し、その部分を他の部分から回路的に独立させ
て不良箇所を発見し、不良を修復した後に断線箇所を再
接続する必要がある。そして、このような断線→修復→
再接続という工程は、従来より図に示すような手法で
行われていた。つまり、先ず、図(イ)に示すよう
に、ソルダーレジストで被覆された導体回路の一部をカ
ッターナイフ等によって切断して導体回路を一旦断線さ
せる。次に、図(ロ)に示すように、断線された導体
回路における両縁端のソルダーレジストを削除する。最
後に図(ハ)に示すように、ビニール線等を導体回路
の両縁端に半田付けして導体回路を再度接続する。
By the way, in such a printed wiring board, a part of a conductor circuit is temporarily disconnected in order to inspect the quality of an electronic component mounted on the printed wiring board, and the like.
Some have electrical circuits that need to be reconnected afterwards. For example, in the case of an electric circuit forming a memory block as shown in FIG. 5 , in order to analyze a defect in the memory block, the common line (common line) is disconnected once and the portion is replaced with another portion. It is necessary to find a defective part in a circuit independent from the above, and to repair the defect, and then reconnect the disconnected part. And such a disconnection → restoration →
Step of re-connection has been conventionally performed in the manner shown in FIG. That is, first, as shown in FIG. 4 (b), once to break the conductive circuit a part of the conductor circuit is coated with a solder resist is cut by a cutter knife or the like. Next, as shown in FIG. 4 (b), to remove the solder resist of both edges in being disconnected conductor circuit. Finally, as shown in FIG. 4 (c), again connecting the conductor circuits vinyl wire or the like soldered on both edges of the conductive circuit.

【0004】このように、従来の再接続は、ソルダーレ
ジストを除去した後にビニール線等を半田付けすること
によって行われていた。
As described above, the conventional reconnection is performed by removing a solder resist and then soldering a vinyl wire or the like.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、前述し
たような従来の再接続方法は、ソルダーレジストの除去
や、ビニール線等の半田付けといった煩雑な作業を必要
とするばかりか、導体回路を必要以上に切り過ぎたり、
あるいは、断線箇所が判りにくく、再接続する際に修復
し忘れる場合があるといった問題点を有していた。
However, the conventional reconnection method as described above not only requires a complicated operation such as removal of a solder resist and soldering of a vinyl wire or the like, but also requires a conductor circuit more than necessary. Cut too much,
Alternatively, there has been a problem that it is difficult to recognize a broken portion, and the user may forget to repair it when reconnecting.

【0006】そこで、案出されたのが本発明であって、
その目的とするところは、再接続が容易であって、導体
回路を切り過ぎたり、修復し忘れたりすることなく容易
に再接続することができるプリント配線板を提供するこ
とにある。
Accordingly, the present invention was devised,
An object of the present invention is to provide a printed wiring board that can be easily reconnected and can be easily reconnected without overcutting or forgetting to repair a conductor circuit.

【0007】特に前述したようなメモリーブロック回路
にあっては、1箇所の不良を発見・修復するためには多
くの箇所を断線、再接続する必要があり、このため上記
のような問題がさらに顕著に現れるのである。
In particular, in the above-described memory block circuit, it is necessary to disconnect and reconnect many points in order to find and repair one defect. It appears remarkably.

【0008】[0008]

【課題を解決するための手段】以上の様な課題を解決す
るために本発明が採った手段は、実施例に対応する図面
に使用した符号を付して説明すると、「電気検査等のた
めに導体回路10の一部を一旦断線し、その後再接続を
行うプリント配線板100において、導体回路10の一
部に、接続部23と、一方の端部が接続部23に近接し
て設けられ該端部23に向けて導体幅が漸減する半田溜
り部22と、この半田溜り部22の端部と接続部23と
を接続するように設けられ両者に比較して幅狭であって
電気検査等を実施するときに除去されるくびれ部21
と、から構成されるとともにソルダーレジストで被覆さ
れない導体パッド20を設け、半田溜り部22と接続部
23とを溶融半田により電気的に接続するようにしたこ
とを特徴とするプリント配線板100」をその要旨とす
るものである。
Means adopted by the present invention to solve the above-mentioned problems will be described with reference to the reference numerals used in the drawings corresponding to the embodiments. In the printed wiring board 100 in which a part of the conductor circuit 10 is once disconnected and then reconnected, a connection part 23 and one end are provided near the connection part 23 in a part of the conductor circuit 10. A solder pool portion 22 in which the conductor width gradually decreases toward the end portion 23, and a portion provided so as to connect the end portion of the solder pool portion 22 and the connection portion 23, and is narrower than both.
Constricted part 21 removed when conducting an electrical inspection or the like
And a conductor pad 20 which is not covered with the solder resist and is provided with a solder pool portion 22 and a connection portion.
23 is electrically connected to the printed wiring board 100 by molten solder .

【0009】つまり、断線する予定のある導体回路10
の一部に、接続部23とくびれ部21と半田溜り部22
とからなる導体パッド20を設けると共に、この導体パ
ッド20上のソルダーレジスト30を除去しておくので
ある。そして、電気検査等を実施するときは、くびれ部
21を除去して断線状態を形成し、再接続時には、半田
溜り部22に溜めた溶融半田を接続部23に向けて押し
だして両者間を電気的に接続するものである。
That is, the conductor circuit 10 which is to be disconnected
Of the connecting part 23, the constricted part 21, and the solder pool part 22
Is provided, and the solder resist 30 on the conductive pad 20 is removed. When conducting electrical inspections, etc.
21 is removed to form a disconnected state.
The molten solder stored in the pool 22 is pushed toward the connection 23.
However, they are electrically connected.

【0010】なお、くびれ部21の導体幅は、切断する
際の作業性から他の導体回路10の導体幅と同等または
それ以下であるのが好ましい。
The conductor width of the constricted portion 21 is preferably equal to or smaller than the conductor width of the other conductor circuit 10 from the viewpoint of workability in cutting.

【0011】また、半田溜り部22の形状については、
図1〜図に示すように種々のものが考えられるが、要
は、接続部23の端部即ちくびれ部21に近づくにつれ
てその導体幅が漸減する形状、つまり、徐々に窄む形状
であればいかなるものであっても良い。
The shape of the solder pool 22 is as follows.
Although various types are conceivable as shown in FIGS. 1 to 3 , the point is that the conductor width gradually decreases as it approaches the end of the connection part 23 , that is, the constricted part 21, that is, the shape gradually narrows. Anything may be used.

【0012】さらに、ソルダーレジスト30について
は、少なくとも導体パッド20上には被覆してはならな
いが、図1〜図に示すように、その周辺についても被
覆しなくても問題はない。
Furthermore, the solder resist 30, but must not be covered on top at least the conductive pad 20, as shown in FIGS. 1 to 3, there is no problem even if uncoated also surrounding.

【0013】[0013]

【発明の作用】そして、本発明は、以上のような手段を
採ることによって、次のような作用がある。即ち、この
プリント配線板100は、導体パッド20のくびれ部2
1を除去して断線状態を形成するので、断線予定箇所、
及び再接続箇所が簡単に識別できる。しかも、導体回路
10を切り過ぎることなく容易に断線することが可能と
なる。
The present invention has the following effects by adopting the above means. That is, the printed wiring board 100 is constricted portion 2 of the contact pads 20
1 is removed to form a disconnected state.
And the reconnection point can be easily identified. In addition, the conductor circuit 10 can be easily disconnected without overcutting.

【0014】また、導体パッド20を設けたことによ
り、断線箇所が判り易く、断線のし忘れや、修復のし忘
れがない。
Further, the provision of the conductor pads 20 makes it easy to recognize the location of the disconnection, and does not forget to disconnect or repair.

【0015】さらに、図2に示すように、この導体パッ
ド20の半田溜り部22に一旦半田を溜めておき、くび
れ部21方向に半田鏝で押し出すだけで、導体パッド2
0上の導体回路10の再接続を行うことができるため、
あるいはソルダーレジスト30を除去する必要がないた
め、容易に再接続することが可能となる。この際、半田
溜り部22は、導体幅が漸減する形状となっているた
め、ここに一旦溜められた半田をくびれ部21方向に追
い込み易く、確実に再接続することが可能となる。
Further, as shown in FIG. 2, the solder is temporarily stored in the solder pool 22 of the conductor pad 20, and the solder is pushed out toward the constricted portion 21 with a solder iron.
0 can be reconnected.
Alternatively, since there is no need to remove the solder resist 30, reconnection can be easily performed. At this time, since the solder pool portion 22 has a shape in which the conductor width gradually decreases, the solder once stored therein can be easily driven into the constriction portion 21 and can be reliably reconnected.

【0016】[0016]

【実施例】次に、本発明に係るプリント配線板100の
各実施例について説明する。
Next, embodiments of the printed wiring board 100 according to the present invention will be described.

【0017】(実施例1) 図1には、本発明に係るプリント配線板100の第一実
施例が示してある。この場合の導体パッド20は、図
に示したメモリーブロック回路のコモンライン(導体回
路10)上に設けてあり、断線予定となるくびれ部21
と、このくびれ部21に近づくにつれて導体幅が漸減す
る略三角形状の半田溜り部22と、前記くびれ部21と
コモンラインとの間に延設された略長方形状の接続部2
3とから構成されている。そして、この導体パッド20
の周辺は、ソルダーレジスト30で被覆されない状態と
なっており、この導体パッド20に半田が付着できるよ
うになっている。
(First Embodiment) FIG. 1 shows a first embodiment of a printed wiring board 100 according to the present invention. Conductor pads 20 in this case, 5
The constricted portion 21 provided on the common line (conductor circuit 10) of the memory block circuit shown in FIG.
A substantially triangular solder pool 22 whose conductor width gradually decreases as approaching the constricted portion 21; and a substantially rectangular connecting portion 2 extending between the constricted portion 21 and the common line.
And 3. And, this conductor pad 20
Is not covered with the solder resist 30 so that solder can be attached to the conductor pad 20.

【0018】さて、このように構成されたプリント配線
板100は、図2に示すように、導体パッド20のくび
れ部21をカッターナイフ等で切断して断線し、所定の
電気検査等が終了した後に、半田溜り部22に一旦半田
を溜め、くびれ部21方向に半田鏝で押し出すことによ
り、半田が半田溜り部22と接続部23との間に架設さ
れることによって、導体回路10(コモンライン)を確
実に再接続することができるのである。
As shown in FIG. 2, the constricted portion 21 of the conductive pad 20 is cut by a cutter knife or the like to disconnect the printed wiring board 100 thus configured, and a predetermined electrical test or the like is completed. Thereafter, the solder is temporarily stored in the solder pool portion 22 and is pushed out toward the constricted portion 21 by a soldering iron, so that the solder is bridged between the solder pool portion 22 and the connection portion 23, thereby forming the conductor circuit 10 (common line). ) Can be reliably reconnected.

【0019】(実施例2) 図3には、第二実施例が示してある。この実施例では、
田溜り部22が正方形状となっており、また接続部2
3が長方形状となっているため、第二実施例と同様に一
般的な方形状のパターンを使用することができ、パター
ンデザインが簡単であるという効果を有する。
Embodiment 2 FIG. 3 shows a second embodiment. In this example ,
Handa reservoir portion 22 has a square shape, also the connecting portion 2
Since 3 has a rectangular shape, a general rectangular pattern can be used similarly to the second embodiment, which has an effect that the pattern design is simple.

【0020】[0020]

【発明の効果】以上、詳述したように本発明に係るプリ
ント配線板は、「電気検査等のために導体回路の一部を
一旦断線し、その後再接続を行うプリント配線板におい
て、前記導体回路の一部に、接続部と、一方の端部が前
記接続部に近接して設けられ該端部に向けて導体幅が漸
減する半田溜り部と、この半田溜り部の端部と前記接続
部とを接続するように設けられ両者に比較して幅狭であ
って電気検査等を実施するときに除去されるくびれ部
と、から構成されるとともにソルダーレジストで被覆さ
れない導体パッドを設け、前記半田溜り部と前記接続部
とを溶融半田により電気的に接続するようにしたことを
特徴とするプリント配線板。」をその構成上の特徴とし
ている。
As described in detail above, the printed wiring board according to the present invention is characterized in that in a printed wiring board in which a part of a conductor circuit is disconnected once for electrical inspection or the like and then reconnected, A connection part, a solder pool part whose one end is provided close to the connection part and the conductor width gradually decreases toward the end part, and an end of the solder pool part and the connection part; narrow der compared to both provided so as to connect the parts
A constricted portion which is removed when carrying out the electrical inspection, the contact pads are not covered with the solder resist while being composed provided I, wherein said solder reservoir connecting part
Wherein the printed circuit board is electrically connected to the printed circuit board by molten solder . ] In its configuration.

【0021】従って、このプリント配線板によれば、導
体パッドのくびれ部を除去することにより断線予定箇所
を簡単に切断でき、導体回路を切り過ぎることなく容易
に断線することができ、また、導体パッドを設けたこと
により、断線箇所が判り易く、断線のし忘れや、修復の
し忘れがない。
Therefore, according to the printed wiring board, the portion to be disconnected can be easily cut by removing the constricted portion of the conductor pad, and the conductor circuit can be easily disconnected without excessively cutting the conductor circuit. The provision of the pad makes it easy to see the location of the disconnection, and does not forget to disconnect or repair.

【0022】さらに、この導体パッドの半田溜り部に一
旦半田を溜めておき、くびれ部方向に半田鏝で押し出す
だけで、導体パッド上の導体回路の再接続を行うことが
できるため、あるいはソルダーレジストを除去する必要
がないため、容易に再接続することができる。この際、
半田溜り部は、導体幅が漸減する形状となっているた
め、ここに一旦溜められた半田をくびれ部方向に追い込
み易く、確実に再接続することができる。
Further, the solder can be temporarily stored in the solder pool portion of the conductor pad, and the conductor circuit on the conductor pad can be reconnected only by pushing the solder in the constricted portion direction with a solder iron. , It is possible to easily reconnect. On this occasion,
Since the solder pool has a shape in which the conductor width gradually decreases, the solder once stored therein can be easily driven into the constricted section, and can be reliably reconnected.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係るプリント配線板の第一実施例で
あって、導体パッド近傍の部分拡大平面図である。
FIG. 1 is a partially enlarged plan view of a first embodiment of a printed wiring board according to the present invention, in the vicinity of a conductive pad.

【図2】 図1において半田を押し出して導体回路を接
続する状態を示す部分拡大平面図である。
FIG. 2 is a partially enlarged plan view showing a state in which solder is pushed out and a conductor circuit is connected in FIG. 1;

【図3】 本発明に係るプリント配線板の第二実施例で
あって、導体パッド近傍の部分拡大平面図である。
FIG. 3 shows a printed wiring board according to a second embodiment of the present invention .
FIG. 4 is a partially enlarged plan view near a conductor pad .

【図4】 従来の再接続方法を工程順に示す平面図であ
る。
FIG. 4 is a plan view showing a conventional reconnection method in the order of steps .

【図5】 再接続が必要な導体回路の一例を示すブロッ
ク図である。
FIG. 5 is a block diagram showing an example of a conductor circuit requiring reconnection .
FIG .

【符号の説明】[Explanation of symbols]

100 プリント配線板 10 導体回路(コモンライン) 20 導体パッド 21 くびれ部 22 半田溜り部 23 接続部 30 ソルダーレジスト DESCRIPTION OF SYMBOLS 100 Printed wiring board 10 Conductor circuit (common line) 20 Conductor pad 21 Constriction part 22 Solder pool part 23 Connection part 30 Solder resist

フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H05K 1/11,3/40,1/02Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 1 / 11,3 / 40,1 / 02

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 電気検査等のために導体回路の一部を一
旦断線し、その後再接続を行うプリント配線板におい
て、 前記導体回路の一部に、 接続部と、 一方の端部が前記接続部に近接して設けられ該端部に向
けて導体幅が漸減する半田溜り部と、 この半田溜り部の端部と前記接続部とを接続するように
設けられ両者に比較して幅狭であって電気検査等を実施
するときに除去されるくびれ部と、から構成されるとと
もにソルダーレジストで被覆されない導体パッドを設
け、前記半田溜り部と前記接続部とを溶融半田により 電気的
に接続するようにしたことを特徴とするプリント配線
板。
1. A printed wiring board in which a part of a conductor circuit is disconnected once for electrical inspection or the like and then reconnected, a part of the conductor circuit is connected to a connection part, and one end is connected to the connection part. a solder reservoir that conductor width is gradually reduced toward the end portion provided near the parts, narrow in comparison to both provided so as to connect the connection portion and the end portion of the solder reservoir And conduct electrical inspections
And a constricted portion that is removed when the solder pad is formed, and a conductor pad that is not covered with the solder resist is provided, and the solder pool portion and the connection portion are electrically connected by molten solder. Printed wiring board.
JP3056544A 1991-03-20 1991-03-20 Printed wiring board Expired - Lifetime JP2818911B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3056544A JP2818911B2 (en) 1991-03-20 1991-03-20 Printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3056544A JP2818911B2 (en) 1991-03-20 1991-03-20 Printed wiring board

Publications (2)

Publication Number Publication Date
JPH04291786A JPH04291786A (en) 1992-10-15
JP2818911B2 true JP2818911B2 (en) 1998-10-30

Family

ID=13030035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3056544A Expired - Lifetime JP2818911B2 (en) 1991-03-20 1991-03-20 Printed wiring board

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JP (1) JP2818911B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4912917B2 (en) * 2007-02-22 2012-04-11 京セラ株式会社 Circuit board, portable electronic device, and circuit board manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5551005U (en) * 1978-09-25 1980-04-03
JPS6194370U (en) * 1984-11-26 1986-06-18
JPS61203697A (en) * 1985-03-07 1986-09-09 キヤノン株式会社 Printed wiring board

Also Published As

Publication number Publication date
JPH04291786A (en) 1992-10-15

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