JPS60963U - printed wiring board equipment - Google Patents

printed wiring board equipment

Info

Publication number
JPS60963U
JPS60963U JP1983092845U JP9284583U JPS60963U JP S60963 U JPS60963 U JP S60963U JP 1983092845 U JP1983092845 U JP 1983092845U JP 9284583 U JP9284583 U JP 9284583U JP S60963 U JPS60963 U JP S60963U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
board equipment
board
resin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983092845U
Other languages
Japanese (ja)
Inventor
司 伊藤
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP1983092845U priority Critical patent/JPS60963U/en
Publication of JPS60963U publication Critical patent/JPS60963U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来装置の側面図、第2図以下は本考案のもの
を示し、第2図はプリプレイブ付基板の側面図、第3図
は上記に所定の電気回路にエツチングされ且つパッチン
グ加工した側面図、第4図は上記プリプレイブに極部加
熱をしている電子部品との対応を示している側面図、第
5図は完成された装置の側面図で、1・・・基板、2・
・・プリプレイブ、5・・・電子部品、6・・・リード
線、7・・・ハンダ。
Fig. 1 is a side view of the conventional device, Fig. 2 and the following are the devices of the present invention, Fig. 2 is a side view of the pre-preserved board, and Fig. 3 is the above-described circuit etched into a predetermined electric circuit and patched. FIG. 4 is a side view showing the correspondence between the pre-previous and the electronic components that are heated at the extremes, and FIG.
...Pre-previous, 5...Electronic parts, 6...Lead wire, 7...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板表面にプリプレイブ樹脂シートを被膜し、該ブリプ
レイブ樹脂シートにレーザー等で極部加熱することで前
記基板の部分挿入部の表面を軟化させ、その後即時に部
品を挿入し端子をハンダ固定するようにしたプリント配
線基板装置。
A pre-preve resin sheet is coated on the surface of the board, and the surface of the partial insertion part of the board is softened by heating the pre-prev resin sheet with a laser or the like, and then the parts are immediately inserted and the terminals are fixed with solder. Printed wiring board equipment.
JP1983092845U 1983-06-17 1983-06-17 printed wiring board equipment Pending JPS60963U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983092845U JPS60963U (en) 1983-06-17 1983-06-17 printed wiring board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983092845U JPS60963U (en) 1983-06-17 1983-06-17 printed wiring board equipment

Publications (1)

Publication Number Publication Date
JPS60963U true JPS60963U (en) 1985-01-07

Family

ID=30223253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983092845U Pending JPS60963U (en) 1983-06-17 1983-06-17 printed wiring board equipment

Country Status (1)

Country Link
JP (1) JPS60963U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132408A (en) * 1987-11-18 1989-05-24 Taisho Inshiya:Kk Spike tire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132408A (en) * 1987-11-18 1989-05-24 Taisho Inshiya:Kk Spike tire

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