JPH0736476B2 - Method of manufacturing circuit module - Google Patents

Description

The present invention relates to a method for manufacturing a circuit module used in various electronic devices.

(Prior Art) FIG. 2 shows a conventional general manufacturing process of a circuit module having a shield case and external leads. In the figure, 11 is a wiring board, 12 is cream solder applied by a method such as printing or dispensing, 13 is a circuit component, 14 is a soldering point, 15 is an external lead made of a metal plate, and 16 is an external lead 15. Interconnection tie bars, 17 is a metal plate frame, 18 is a metal plate upper shield case, and 19 is a metal plate lower shield case.

FIG. 2 shows a basic manufacturing process diagram. According to this manufacturing process diagram, a shield case and a circuit module with external leads can be manufactured in a total of 11 processes.

(Problems to be Solved by the Invention) In the above-described conventional manufacturing method, four points of an external lead, a frame, an upper shield case, and a lower shield case are required as metal parts by thin plate processing, and further, four parts are required for mounting these. Times,
Since the soldering requires three steps, there is a drawback that the material cost and the processing cost are high.

An object of the present invention is to solve the conventional drawbacks and to provide a method for inexpensively manufacturing a circuit module having a plurality of sheet metal components.

(Means for Solving the Problem) In the method for manufacturing a circuit module of the present invention, the metal parts necessary for manufacturing a circuit module having a plurality of metal parts such as external leads, a shield plate, and a case formed by thin plate processing are developed. And the metal parts are connected to each other in a positional relationship required at the time of later assembly to form one flat expanded metal part assembly, and the wiring board is placed on the expanded metal part assembly. Then, after mounting the circuit components on this wiring board and soldering the necessary parts, the connecting parts of the expanded metal component assembly are cut off, bent, and these joint parts are processed to assemble the metal components, It is designed to be configured.

(Operation) According to the present invention, since a plurality of thin plate-processed metal parts are made into one metal part assembly, apparently the number of metal parts is only one, and mounting of the metal parts on the wiring board is possible. Since only one time is required and the metal parts can be soldered to the wiring board at the same time as the circuit parts are soldered, all the soldering can be performed at one time, resulting in significant material cost and processing cost. It can be reduced.

(Example) An example of the present invention will be described with reference to FIG. FIG. 1 shows the structure and basic steps of the present invention.
In the figure, (a) is an assembly of metal parts, 1 is a lead, 2 is a tie bar for connecting the leads, 3 is a lower shield,
Reference numeral 4 is a frame, 5 is an upper shield, and 6 is a connecting portion. These are formed, for example, by processing a metal such as iron or a copper alloy, or a plate material plated with these by a method such as cutting, pressing or etching.

FIGS. 1 (b) and 1 (c) show a manufacturing process and a processing state diagram of a circuit module according to the present invention. FIG. 1 (b) shows a state at the end of solder reflow and FIG. 1 (c) shows a state at the time of completion. 7 is a wiring board, 8 is a circuit component, and 9 is a soldering point.

In the above embodiment, first, the metal part assembly (a) is prepared, but the tip of the lead 1 is bent at a right angle. Next, a wiring board 7 having an opening 7a in the lead insertion portion is prepared, and the wiring board 7 is placed on the lower shield 3 while inserting the opening portion into the tip of the lead 1. After that, cream solder is applied to the soldering required portion 9 by a method such as dispensing or printing, and the circuit component 8 is mounted on the cream solder.

The cream solder is melted by heating in this state, and all soldering is completed. Next, the connecting portions of the four frames and the upper shield are bent at right angles to form a box-shaped shield case, and finally the tie bar is cut off to complete the circuit module. {FIG. 1 (c)} Although the surface mount type circuit component and the reflow soldering method have been shown in the above-described embodiment, the present invention can be applied to the insertion type circuit component and any other soldering method. Also, the type and number of thin plate metal parts are not particularly limited. Further, the metal parts may be joined together by a method such as soldering or welding, or the wiring board 7 and the lower shield 3 may be bonded together.

(Effects of the Invention) According to the present invention, the four thin plate-processed metal parts of the lead, the lower shield, the upper shield, and the frame are formed by one flat metal part assembly. Processing cost is low, and the number of times metal parts are mounted and soldered is also 1
It is possible to manufacture a circuit module with a shield case and external leads in a total of 6 steps, which is 5 steps shorter than the conventional method shown in FIG. 2, and the processing cost of the circuit module is also greatly reduced. , Its practical effect is extremely large.

[Brief description of drawings]

FIG. 1 shows a method for manufacturing a circuit module according to an embodiment of the present invention, in which (a) is a metal component assembly,
(B) is a process up to solder reflow and a state diagram at the time of solder reflow, (c) is a process up to completion and a state diagram of completion,
FIG. 2 is a manufacturing process diagram of a conventional shield case and a circuit module with external leads. 1 ... lead, 2 ... tie bar, 3 ... bottom shield, 4
…… Frame, 5 …… Upper shield, 6 …… Coupling part, 7 …… Wiring board, 7 a …… Open hole, 8 …… Circuit parts, 9 …… Soldering location.

Claims (1)

[Claims] 1. A metal component necessary for manufacturing a circuit module having a plurality of metal components such as external leads, a shield plate, and a case formed by thin plate processing is formed in an expanded state, and the metal component is required at a later time of assembling. And a wiring board is placed on the expanded metal part assembly, and circuit parts are mounted on the wiring board. A method for manufacturing a circuit module, characterized in that after the necessary portions are soldered, the connecting portions of the expanded metal component assembly are separated, bent, and the joint portions thereof are processed.