JPH0786086A - Electronic component for printed board mounting and its fixing method - Google Patents

Abstract

PURPOSE:To obtain a mounting method wherein the falling-off of electronic components is prevented, the workability at the time of assembling is excellent, and the reliability is high, by forming a protruding part having elasticity on the side surface of a lead terminal, and inserting the protruding part into a board hole so as to penetrate it. CONSTITUTION:A protruding part 5 which is larger than the inner diameter of a board hole 2 and has elasticity is formed on the side surface of a lead terminal 4. The protruding part 5 is pushed and inserted into the board hole 2, and is made to penetrate it until the opposite side of the printed board. Thereby the falling-off of the electronic component 1 is prevented during the carriage of a printed board, so that the mounting work is facilitated and soldering reliability is improved. Hence the automating of an assembling line containing fixing work of electronic component is made easy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component in which a lead terminal is inserted into a board hole of a printed circuit board for mounting and a mounting method thereof.

[0002]

2. Description of the Related Art Usually, an electronic component with lead terminals is attached to a printed circuit board by inserting a lead terminal in a straight state into a hole in a board, penetrating the lead terminal, and soldering.

As a measure for preventing the electronic parts from falling off until soldering, a method of bending (clinching) the leads after inserting the leads into the holes of the substrate is generally used.

As the closest example known as a fall-out prevention measure before the application of the present invention, Japanese Patent Application Laid-Open No. 2-30197.
There is a mounting method using a shape memory alloy terminal disclosed in Japanese Patent Laid-Open Publication No. 2003-242242. The method is to provide a straight V-shaped bent terminal using a shape memory alloy at the portion to be inserted into the board hole, and to form a V-shaped bent portion, and insert the lead terminal into the corresponding board hole of the printed circuit board. It is a method of combining. According to this method, since the lead terminal is heated and returns to the straight state, there is an advantage that the bent portion of the lead terminal does not hinder the flow of the solder in the board hole during soldering. In this mounting method, since the bent part of the lead terminal is pressed into the board hole before soldering, transportation of the printed board,
There is no risk that the electronic component will fall off the printed circuit board during movement.

[0005]

However, the conventional method of bending (clinching) after inserting the lead into the substrate not only increases the number of work steps, but may not be able to perform clinching due to the thickness and shape of the lead. It was

Further, in the mounting method using the shape memory alloy disclosed in Japanese Patent Laid-Open No. 2-30197, since the lead terminals are deformed during soldering, the solder is fixed before the terminals are in a straight state, There is a risk that residual stress is generated in the attachment portion and the reliability of soldering is reduced.

The present invention was created in view of the above points, and it is an object of the present invention to provide a method of mounting an electronic component having good mounting workability.

[0008]

To achieve the above object, the present invention provides a lead terminal with a protrusion by forming a protrusion on the side surface of the lead terminal of an electronic component, the protrusion being larger than the substrate hole and having elasticity. To do.

By inserting and penetrating the projecting portion into the board hole, the electronic component is prevented from slipping off from the printed board when the printed board is transported.

[0010]

In the lead terminal with protrusion, the protrusion is formed on the side surface of the lead terminal, the protrusion being larger than the substrate hole and having elasticity.

Therefore, when the protruding portion is pushed into the board hole and inserted, and the protruding portion is pierced on the side opposite to the printed board, the protruding portion is supported by the printed circuit board, so that the electronic component can be carried even when the printed circuit board is transported or moved. Does not fall off the printed circuit board. That is, it is easy to handle and has good workability.

Further, since the projecting portion completely penetrates the board hole, no stress is generated in the soldered portion. That is, the reliability of soldering is high.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings. The same reference numerals denote the same objects throughout the drawings.

FIG. 1 is a sectional view showing the assembling process of the present invention.
2 to 4 are views showing an example of a specific structure of the lead terminal according to the present invention.

In FIG. 1, reference numeral 1 denotes an electronic component such as a power module having four lead terminals attached to its bottom surface,
Reference numeral 2 is a board hole such as a through hole, 3 is a printed circuit board, 4 is a lead terminal, 5 is a protruding portion of the lead terminal, and 6 is a soldering portion.

2 to 4 show a concrete embodiment of the lead terminal with a protrusion. FIG. 2 shows a lead terminal 4a with a protrusion, which is made of, for example, copper and is formed by cutting a side surface of the lead terminal 4 with a protrusion 5 larger than the inner diameter of the through hole 2 from the lower portion of the side surface. Figure 3
Is the same material as in FIG. 2, for example, a lead terminal with a cut portion, in which a protruding portion having the same size as that in FIG. 2 is formed by cutting a part of the terminal having a short sectional shape and performing bending processing. 4b. In FIG. 4, for example, a lead terminal 4 with a curved portion is formed by bending a part of a terminal made of the same material as in FIG. 2 to form a protrusion having the same size as in FIG.
c.

As an example, a method of mounting a power module of an inverter using the present invention will be described. First, in FIG. 1A, the electronic component 1 (power module) having the lead terminals with protrusions shown in FIG. 2 is inserted into the through hole 2 from the lower surface of the printed board 3 using, for example, a robot. As shown in FIG. 1B, the protruding portion 5 is penetrated while being aligned with the through hole 2. Next in FIG.
As shown in FIG. 1C, while the electronic component 1 is held on the printed board 3, the electronic component 1 is moved by, for example, a robot and mounted on a module soldering device such as a soldering iron device.
As shown in (d), they are fixed by soldering.

In the above description, the lead terminal with protrusions 4a in FIG. 2 is taken as an example of the lead terminal with protrusions, but the lead terminal with cutout portion 4b in FIG. 3 and the lead terminal with curved portion in FIG. The same work can be performed with 4c.

Further, in FIG. 1, the electronic component 1 is mounted on the printed board 3
Although the example of inserting and moving from the bottom has been shown, it is of course possible to insert from the printed board and move or reverse.

Furthermore, although an example of insertion and movement by a robot is shown above, it is also possible to perform insertion and movement by an automatic device using a jig.

[0021]

As described above, the present invention is a method of mounting an electronic component, which prevents the electronic component from falling off from the printed board by forming the protrusion on the side surface of the lead terminal. In this case, the workability is good and the soldering reliability is high. This also has the effect of facilitating automation when constructing an assembly line that includes the work of mounting electronic components.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of an assembling process of the present invention.

FIG. 2 is a diagram showing a specific example of the lead terminal of the present invention.

FIG. 3 is a diagram showing another specific example of the lead terminal of the present invention.

FIG. 4 is a diagram showing still another specific example of the lead terminal of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Board hole, 3 ... Printed board, 4
... lead terminal, 4a ... lead terminal with protrusion, 4b ...
Lead terminal with cut portion, 4c ... Lead terminal with curved portion, 5 ... Projection portion, 6 ... Solder portion.

Claims (2)

[Claims] 1. An electronic component for mounting on a printed circuit board, wherein a protruding portion having elasticity is formed on a side surface of a lead terminal portion of the electronic component. 2. A lead terminal portion side surface of an electronic component is formed with a projecting portion having a larger elasticity than a board hole inner diameter of a printed board through which the lead terminal penetrates, and the lead terminal having the projecting portion formed thereon. A method for mounting an electronic component for mounting a printed circuit board, characterized in that the printed circuit board mounting electronic component is press-inserted into the hole to penetrate the projection part to the opposite side of the printed circuit board, and the board hole part of the printed circuit board through which the lead terminal penetrates is fixed by soldering. .