JPS6092627A - Mounting method of chip - Google Patents
Mounting method of chipInfo
- Publication number
- JPS6092627A JPS6092627A JP20207983A JP20207983A JPS6092627A JP S6092627 A JPS6092627 A JP S6092627A JP 20207983 A JP20207983 A JP 20207983A JP 20207983 A JP20207983 A JP 20207983A JP S6092627 A JPS6092627 A JP S6092627A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- supply tank
- adhesive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、セラミックパッケージ等に樹脂を用いて、
ＩＣチップ等をマウントするＩＣチップマウント方法に
関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] This invention uses a resin for a ceramic package, etc.
The present invention relates to an IC chip mounting method for mounting an IC chip or the like.
従来、この稙の樹脂を供給する方法としては、印刷等の
手段で基板の所定部分に接着剤を供給しておく方法や、
スタンプツールな用いて所定部分へ接着剤を供給する方
法、ディスペンサにより滴下供給する方法等があり、こ
れらはあらかじめ被接着ＩＣチップ（以下単にチップと
いう）等をマウントする部位に樹脂を付与するものであ
る。Conventionally, methods for supplying this type of resin include a method in which adhesive is supplied to a predetermined portion of the substrate by means such as printing,
There are methods such as using a stamp tool to supply adhesive to a predetermined area, and using a dispenser to supply adhesive dropwise.These methods involve applying resin in advance to the area where the IC chip to be adhered (hereinafter simply referred to as a chip) is to be mounted. be.
ところで、上記従来の樹脂供給方法のうち、印刷の手段
による方法では特別な装置やマスクが必要であるため、
生産性を阻害していた。また、スタンプやディスペンサ
により滴下供給する方法では均一性が乏しく、品質を一
定に保持することは困難で、また、チップの面と基板の
面とを平行にする必要があるため、特に光ＩＣのチップ
においては組立の歩留りが著しく低減する欠点があった
。By the way, among the conventional resin supply methods mentioned above, the method using printing means requires special equipment and masks;
It was hindering productivity. In addition, the drop-feeding method using a stamp or dispenser has poor uniformity, making it difficult to maintain constant quality.Also, the surface of the chip and the surface of the substrate need to be parallel, which is especially true for optical ICs. Chips had the disadvantage that the assembly yield was significantly reduced.
この発明は、上記の欠点を除去するためになされたもの
で、ポンドツールに吸着したチップの裏面を接着剤供給
槽ＩＣＩ！！潰し、所用量の樹脂を付与することＫより
、常に一定量の樹脂を均一に接着部に供給できる方法を
提供することを目的としている。This invention was made to eliminate the above-mentioned drawbacks, and the back side of the chip adsorbed on the pounding tool is removed from the adhesive supply tank ICI! ! The object of the present invention is to provide a method that can always uniformly supply a fixed amount of resin to the bonded part by crushing and applying the required amount of resin.
以下、この発明について説明する＠
第１図Ｃ８）〜（ｇ）はこの発明の一実施例を示す工程
図である。まず、鶴１図（ａ） において、１はポンド
ツールで、中央に透孔１ａが形成され、チップ２を吸引
により吸着するようになっている。This invention will be explained below. Figure 1 C8) to (g) are process diagrams showing one embodiment of this invention. First, in Figure 1 (a) of the crane, 1 is a pounding tool, which has a through hole 1a formed in the center, and is adapted to attract a chip 2 by suction.
次ＫＪＪ １ 図（ｂ） において、ポンドツール１に
チップ２の裏面である接着面を下にしてチップ２０表面
を真空吸着により吸着する。すなわち、通常はチップ２
の裏面に接着剤としての樹脂３が付着するようＫｊる。Next KJJ 1 In FIG. 1B, the surface of the chip 20 is vacuum-adsorbed to the pounding tool 1 with the adhesive surface, which is the back surface of the chip 2, facing down. That is, usually chip 2
Kj is applied so that the resin 3 as an adhesive adheres to the back surface of.
次いで、第１図（Ｃ）に示すように、チップ２を接着剤
である樹脂３が入っている接着剤供給槽４へ浸漬する。Next, as shown in FIG. 1(C), the chip 2 is immersed in an adhesive supply tank 4 containing resin 3 as an adhesive.
あるいは第１図（ｄ）に示すように、樹脂３を所要の厚
さに制限した接着剤供給槽４の押し付ｕＫよって、チッ
プ２の裏面に樹脂３を付着させた後、接着剤供給槽４か
ら取り出すことにより第１図＜ｅ）に示すようＫ、チッ
プ２に樹脂３が均一に付着される。次に、チップ２を第
１図（ｆ）に示すよ５に、基板５の所定の位置にマウン
トし１次いで、ポンドツール１の吸引を解除し【チップ
２をポンドツール１から離脱し、基板ＳＫ仮固定する（
第１図（ｇ）。この後、チップ２がマウントされた基板
５は、次の工程へ搬送され、再び新しい基板５にチップ
２がマウントされる。Alternatively, as shown in FIG. 1(d), after adhering the resin 3 to the back surface of the chip 2 by pressing the adhesive supply tank 4 with the resin 3 limited to the required thickness, By removing the resin 3 from the chip 4, the resin 3 is uniformly adhered to the chip 2, as shown in FIG. Next, as shown in FIG. 1(f), the chip 2 is mounted at a predetermined position on the substrate 5, and the suction of the pounding tool 1 is released. Temporarily fix SK (
Figure 1(g). Thereafter, the substrate 5 on which the chip 2 is mounted is transported to the next step, and the chip 2 is mounted on a new substrate 5 again.
第２図、第３図はこの発明のチップをマウントする方法
を実施するためのチップマウント装置とシーケンスダイ
ヤグラムを示すブロック図である。FIGS. 2 and 3 are block diagrams showing a chip mounting apparatus and a sequence diagram for implementing the chip mounting method of the present invention.
第２図において、第１図と同一符号は同一部分を示し、
１１はＸ軸、Ｙ軸方向（矢印Ｘ、Ｙ）Ｋ移動するＸ−Ｙ
テーブル、１２は前記ｘ−ｙチーフル１１に載置された
ホルダで、その先端部にポンドツール１が取り付けられ
ている。１３は前記基板５を載置する基板載架台、１４
は前記基板載架台１３を次工程へ搬送するコンベア、１
５は前記樹脂３が付着されていないチップ２が保管され
ているチップストッカ、１６はビックアンプで、前記チ
ップストッカ１５０チツプ２を真空数７ＩｉＫよりチッ
プ整列台１１へ移送する。１８はＩＴＶカメラである。In FIG. 2, the same symbols as in FIG. 1 indicate the same parts,
11 is an X-Y moving in the X-axis and Y-axis directions (arrows X, Y)
A table 12 is a holder placed on the xy chiffle 11, and the pounding tool 1 is attached to the tip thereof. 13 is a board mounting stand on which the board 5 is placed; 14
1 is a conveyor that conveys the substrate mounting stand 13 to the next process;
5 is a chip stocker in which the chips 2 to which the resin 3 is not attached is stored, and 16 is a big amplifier which transfers the 150 chips 2 from the chip stocker to the chip alignment table 11 using a vacuum number 7IiK. 18 is an ITV camera.
次に動作について第３図とともに説明する。Next, the operation will be explained with reference to FIG.
チップ２が保管されたチップストッカ１５で良品チップ
選択２１を行い、ピックアップ１６で真空吸着によりピ
ックアップ２２し、チップ整列台１Ｔに供給され、ここ
で位置を修正しチップ整列が行われる。Good chips are selected 21 in the chip stocker 15 where the chips 2 are stored, picked up 22 by vacuum suction in the pickup 16, and supplied to the chip alignment table 1T, where the positions are corrected and the chips are aligned.
ここまでは、この発明とは直接像わりはないが、この発
明を実現するための装置として上記の機構が一般的であ
り、代表例として説明したものである。しかし、この機
構が不用な場合は以下に示すポンドツール１で直接吸着
しても、もちろん支障はない。次に、整列したチップ２
をＸ−Ｙテーブル１１上に載架されたホルダ１２の先端
部に設けたポンドツール１の真空吸着によりポンドツー
ルチャック２４が行われ、接着剤供給槽４に浸漬し、チ
ップ２の裏面に樹脂３を付着し、基板載架台１３上の位
置合せが済んだ基板５ヘマウントして、接着剤スタンプ
２５とポンディング２６が行われる。Although the above mechanism is not directly related to the present invention, the above-mentioned mechanism is common as a device for realizing the present invention, and has been described as a representative example. However, if this mechanism is not needed, there is no problem in directly adsorbing it with the pound tool 1 shown below. Next, the aligned chips 2
The chip 2 is chucked by vacuum suction of the chip 1 mounted on the tip of the holder 12 mounted on the X-Y table 11, and the chip 2 is immersed in the adhesive supply tank 4, and resin is applied to the back surface of the chip 2. 3 is attached and mounted on the substrate 5 that has been aligned on the substrate mounting stand 13, and adhesive stamping 25 and bonding 26 are performed.
基板５上へ多数のチップ２をマウン）する場合は上記を
繰り返し、所定数が終了すると基板載架台１３に載置さ
れた基板５は基板取り出し２７が行われ、コンベア１４
により矢印Ａ方向へ送り出される。そして、次の基板、
挿入２Ｂが行われ、再び基板５に良品チップ選択２１が
行われてこの工程が繰り返される。When mounting a large number of chips 2 onto the substrate 5, the above steps are repeated, and when a predetermined number of chips 2 are mounted, the substrate 5 placed on the substrate mounting stand 13 is taken out 27 and transferred to the conveyor 14.
is sent out in the direction of arrow A. And the next board,
Insertion 2B is performed, good chip selection 21 is performed again on the board 5, and this process is repeated.
以上説明したように、この発明は、ポンドツールにより
チップを吸着してから接着剤供給槽内の接着剤に浸漬し
て所定量の接層剤を付着させるようにしたので、チップ
をマウントする基板ごとに常に一定条件で繰り返し樹脂
を自動的に付着することができる。したがって、チップ
の固定が均一になり、光デバイスのように固定の寸法精
度の敵しいものや、樹脂のたれＫよる不良発生を皆、無
にすることが可能になり、また、チップの移動はポンド
ツールで真空吸着により行われるので、チップを損傷さ
せることがなく歩留りの向上が図れる利点がある。As explained above, in this invention, a chip is adsorbed by a pounding tool and then immersed in adhesive in an adhesive supply tank to adhere a predetermined amount of adhesive to the substrate on which the chip is mounted. The resin can be applied automatically and repeatedly under constant conditions every time. Therefore, the chips are fixed uniformly, and it is possible to eliminate defects caused by the dimensional accuracy of fixing such as optical devices and resin dripping, and the movement of the chips is eliminated. Since this is done by vacuum suction using a pound tool, there is an advantage that the yield can be improved without damaging the chips.
第１図（ａ）〜（ｇ）はこの発明の一実施例を示す工程
図、第２図はこの発明のチップマウントする方法を実施
するためのチップマウント装置を示す図、第３図はシー
ケンスダイヤグラムのブロック図である。
図中、１はポンドクール、１ａは透孔、２はチップ、３
は樹脂、４は接着剤供給槽、５は基板、１１はＸ−Ｙチ
ーノル、１２はホルダ、１３は基板載架台、１４はコン
ベア、１５はチップストッカ、１６はピックアップ、１
Ｔはチップ整列台、１８はＩＴＶカメラである。
なお、図中の同一符号は同一または相当部分を示す・
代理人 大岩増雄 （外２名）
第１図
（ａ） （ｂ） （ｃ）
（ｄ） （ｅ） （ｆ）FIGS. 1(a) to (g) are process diagrams showing one embodiment of the present invention, FIG. 2 is a diagram showing a chip mounting apparatus for carrying out the chip mounting method of the present invention, and FIG. 3 is a sequence diagram. FIG. 3 is a block diagram of the diagram. In the figure, 1 is a pond cool, 1a is a through hole, 2 is a tip, and 3
1 is a resin, 4 is an adhesive supply tank, 5 is a substrate, 11 is an X-Y link, 12 is a holder, 13 is a substrate mounting stand, 14 is a conveyor, 15 is a chip stocker, 16 is a pickup, 1
T is a chip alignment table, and 18 is an ITV camera. In addition, the same reference numerals in the figures indicate the same or equivalent parts. Agent: Masuo Oiwa (2 others) Figure 1 (a) (b) (c) (d) (e) (f)
Claims (1)
着した後、前記ポンドツールを移動して前記被接着ＩＣ
チップを接着剤供給槽内の接着剤に浸漬して接着面に前
記接着剤を所定量付着せしめた後、前記被接着ＩＣチッ
プを基板にマウントし固着することを特徴とするチップ
マウント方法。After the surface of the IC chip to be bonded is vacuum-adsorbed by the pound tool, the pound tool is moved to remove the IC chip to be bonded.
A chip mounting method comprising: immersing a chip in an adhesive in an adhesive supply tank to adhere a predetermined amount of the adhesive to the adhesive surface, and then mounting and fixing the IC chip to be adhered onto a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20207983A JPS6092627A (en) | 1983-10-26 | 1983-10-26 | Mounting method of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20207983A JPS6092627A (en) | 1983-10-26 | 1983-10-26 | Mounting method of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6092627A true JPS6092627A (en) | 1985-05-24 |
Family
ID=16451605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20207983A Pending JPS6092627A (en) | 1983-10-26 | 1983-10-26 | Mounting method of chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6092627A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0238735U (en) * | 1988-09-08 | 1990-03-15 |
-
1983
- 1983-10-26 JP JP20207983A patent/JPS6092627A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0238735U (en) * | 1988-09-08 | 1990-03-15 |
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