JPH0254991A - Soldering of flexible printed-circuit board - Google Patents
Soldering of flexible printed-circuit boardInfo
- Publication number
- JPH0254991A JPH0254991A JP20592288A JP20592288A JPH0254991A JP H0254991 A JPH0254991 A JP H0254991A JP 20592288 A JP20592288 A JP 20592288A JP 20592288 A JP20592288 A JP 20592288A JP H0254991 A JPH0254991 A JP H0254991A
- Authority
- JP
- Japan
- Prior art keywords
- pallet
- circuit board
- opening
- flexible substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 239000006071 cream Substances 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000000717 retained effect Effects 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
に産業上の利用分野刀
本発明はフレキシブル基板の半田付は方法に係り、とく
に金属板から成るパレットを用い、このパレットトにフ
レキシブル載板を載せてリフロー炉に導入し、このりフ
ロー炉内でクリーム半田を溶融してマウントされている
チップ部品の半田付けを行なうようにしたフレキシブル
基数の半田角は方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for soldering flexible printed circuit boards, in particular, a pallet made of metal plates is used, a flexible mounting plate is placed on the pallet, and the plate is introduced into a reflow oven. , relates to a method for soldering a flexible radix to solder mounted chip components by melting cream solder in a flow furnace.
Ｋ発明の概要】
金属板から成るパレットを用いてフレキシブル基数をリ
フロー炉内で半田付けする方法において、パレットに中
抜きの開口を設け、この開口の部分にフレキシブル基板
を載置スることによって、リフロー炉内での加熱を均一
に行なうようにしたものである。Summary of the Invention: In a method of soldering a flexible base board in a reflow oven using a pallet made of metal plates, by providing a hollow opening in the pallet and placing a flexible substrate in the opening, This ensures uniform heating within the reflow oven.
Ｋ従来の技＃ｉｍ
電子回路の製造の合理化のために、例えば特開昭６１−
１６２２６５号公報に開示されているように、リフロー
炉を用−ルするようにしている。この場合にはプリント
基板の所定の位置に印刷によってクリーム半田が塗布さ
れる。そしてクリーム半田を塗布した部分にチップ状部
品をマウントする。K Conventional Technique #im In order to rationalize the manufacturing of electronic circuits, for example,
As disclosed in Japanese Patent No. 162265, a reflow oven is used. In this case, cream solder is applied by printing to a predetermined position on the printed circuit board. Then, mount the chip-shaped component on the area coated with cream solder.
そしてこのような部品をマウントしたプリント基板をリ
フロー炉内に導入し、炉内の熱によってクリーム半田を
溶融し、チップ部品をプリント基板の所定のランドと半
田付けするようにしている。The printed circuit board on which such components are mounted is then introduced into a reflow oven, and the cream solder is melted by the heat in the oven, and the chip components are soldered to predetermined lands on the printed circuit board.
が生じ、良好な半田付けを行なうことができなかった。, and it was not possible to perform good soldering.
本発明はこのような問題点に鑑みてなされたものであっ
て、均一な加熱を行なうことにより、半田付は不良を低
減するとともに、半田付は部の信頼性を向上させ、さら
には検査および修理工数を削減するようにした品質の高
い半田付は方法を提供することを目的とするものである
。The present invention was made in view of these problems, and by performing uniform heating, soldering reduces defects, improves the reliability of soldering parts, and further improves inspection and inspection. It is an object of the present invention to provide a method for high quality soldering that reduces repair man-hours.
Ｋ発明が解決しようとする問題点】
このようにリフロー炉でフレキシブル基板の半田付けを
行なう場合には、金属製のパレットを用いるようにして
いる。すなわち第６図に示すように、フレキシブル基板
１上にチップ部品２をマウントするとともに、このフレ
キシブル基板１を平滑な金属板から成るパレット３上に
載置し、このパレット３をリフロー炉内に導入するよう
にしていた。このような従来のフレキシブル基板１の半
田付は方法によると、熱によってフレキシブル基板１が
反り、パレット３と接触する所としない所に問題点を解
決するための手段】
本発明は、フレキシブル基板上にクリーム半田を塗布す
るとともに、その上にチップ部品をマウントし、該フレ
キシブル基板を金属板から成るパレットに載せてリフロ
ー炉に導入し、該リフロー炉内で前記クリーム半田を溶
融して前記チップ部品の半田付けを行なうようにした方
法において、前記パレットを構成する金属板に開口を形
成し、前記開口の部分に前記フレキシブル基板を載置す
るとともに、前記開口の周縁部で前記フレキシブル基板
を支持するようになし、この状態で前記パレットを前記
リフロー炉内に導入するようにしたものである。K Problems to be Solved by the Invention] When soldering flexible circuit boards in a reflow oven as described above, a metal pallet is used. That is, as shown in FIG. 6, a chip component 2 is mounted on a flexible substrate 1, and this flexible substrate 1 is placed on a pallet 3 made of a smooth metal plate, and this pallet 3 is introduced into a reflow oven. I was trying to do that. According to such a conventional method of soldering the flexible substrate 1, the flexible substrate 1 is warped due to heat, and the present invention solves the problem that the flexible substrate 1 is warped in places where it comes into contact with the pallet 3 and in places where it does not come in contact with the pallet 3. A cream solder is applied to the board, a chip component is mounted thereon, the flexible board is placed on a pallet made of metal plates, and the board is introduced into a reflow oven.The cream solder is melted in the reflow oven and the chip component is In the method for soldering, an opening is formed in the metal plate constituting the pallet, the flexible substrate is placed in the opening, and the flexible substrate is supported at the periphery of the opening. In this state, the pallet is introduced into the reflow oven.
Ｋ作用Σ
従ってフレキシブル基板の大半の部分においては、その
下面に金属板から成るパレットが存在しなくなり、フレ
キシブル基板は開口に臨んだ状態でパレットに載置され
ることになる。従ってパレットをリフロー炉内に導入す
ることにより、フレキシブル基板を均一に加熱できるよ
うになる。K effect Σ Therefore, in most parts of the flexible substrate, there is no pallet made of metal plates on the lower surface thereof, and the flexible substrate is placed on the pallet facing the opening. Therefore, by introducing the pallet into the reflow oven, it becomes possible to uniformly heat the flexible substrate.
Ｋ実施例】
第３図は本考案の一実施例に係るフレキシブル基板の搬
送用のパレット１０を示すものであって、このパレット
１０は例えばステンレス板から構成されている。パレッ
ト１０はほぼ正方形の形状を有するとともに、その中央
部が後述するフレキシブル基板の形状に応じて打抜かれ
ており、これによって開口１１を形成するようになって
いる。このようなパレット１０上に載置されるフレキシ
ブル基板４は例えば第４図に示すような形状になってい
る。フレキシブル基板１２上の所定の位置には予めクリ
ーム半田が塗布されるとともに、このクリーム半田を塗
布した位置にチップ部品１３をマウントする。K Embodiment FIG. 3 shows a pallet 10 for transporting flexible substrates according to an embodiment of the present invention, and this pallet 10 is made of, for example, a stainless steel plate. The pallet 10 has a substantially square shape, and its central portion is punched out according to the shape of a flexible substrate to be described later, thereby forming an opening 11. The flexible substrate 4 placed on such a pallet 10 has a shape as shown in FIG. 4, for example. Cream solder is applied in advance to a predetermined position on the flexible substrate 12, and the chip component 13 is mounted at the position where the cream solder is applied.
チップ部品１３がマウントされたフレキシブル基板１２
は第１図および第２図に示すように、パレット１０上に
載置される。この場合においてフレキシブル基板１２の
周囲の部分が開口１１の周縁部によって支持されるよう
にし、フレキシブル基板１２の大半の部分はパレット１
ｏの開口１１に臨むようにする。また第２図に示すよう
に、パレット１０上にフレキシブル基板１２を載せる際
に、このフレキシブル基板１２の中央部が盛上がるよう
にしてパレット１０上に保持させる。Flexible substrate 12 on which chip components 13 are mounted
is placed on a pallet 10, as shown in FIGS. 1 and 2. In this case, the peripheral portion of the flexible substrate 12 is supported by the peripheral edge of the opening 11, and the majority of the flexible substrate 12 is supported by the pallet 1.
so that it faces the opening 11 of o. Further, as shown in FIG. 2, when the flexible substrate 12 is placed on the pallet 10, the flexible substrate 12 is held on the pallet 10 so that the central portion of the flexible substrate 12 is raised.
このようにしてフレキシブル基板１２を載置したパレッ
ト１０は、第５図に示すリフロー炉２゜内に導入される
。リフロー炉２ｏはパレット１゜を搬送するコンベア２
１を有するとともに、上下にヒータユニット２２を備え
ている。それぞれのヒータユニット２２はヒータ２３と
送風ファン２４とを備えており、これによって上下のヒ
ータユニット２２間で矢印°で示すような熱風の循環が
起るようになっている。このようなヒータユニット２２
間をコンベア２１によってパレット１０を搬送すると、
パレット１０上に支持されているフレキシブル基板１２
に塗布されているクリーム半田が溶融し、溶融した半田
によってチップ部品１３の電極とフレキシブル基板１２
のランドとが接続されることになる。このようにしてフ
レキシブル基板１２上に所定の回路が形成されるように
なる。The pallet 10 on which the flexible substrate 12 is placed in this manner is introduced into a reflow oven 2° shown in FIG. The reflow oven 2o is a conveyor 2 that conveys a pallet 1°.
1 and is also provided with heater units 22 on the upper and lower sides. Each heater unit 22 is equipped with a heater 23 and a blower fan 24, so that hot air circulates between the upper and lower heater units 22 as indicated by the arrow °. Such a heater unit 22
When the pallet 10 is conveyed by the conveyor 21 between
Flexible substrate 12 supported on pallet 10
The cream solder applied to the board melts, and the melted solder connects the electrodes of the chip component 13 and the flexible board 12.
will be connected to the land. In this way, a predetermined circuit is formed on the flexible substrate 12.
このように本実施例に係る半田付は方法によれば、中抜
きされて開口１１が形成されたパレット１０を用いるよ
うにしているために、フレキシブル基板１２の曲げ応力
を利用することが可能になり、必要加熱部分をフラット
にしてフレキシブル基板１２を均一に加熱できるように
なる。従って従来のようにパレット上でフレキシブル基
板が波を打つように反ることが防止される。これによっ
て半田付は不良が低減でき、半田付は部分の信頼性が向
上する。ざらに検査および修理の工数が削減できるよう
になる。As described above, according to the method of soldering according to this embodiment, since the pallet 10 is hollowed out and has the opening 11 formed therein, it is possible to utilize the bending stress of the flexible substrate 12. This makes it possible to flatten the portion to be heated and uniformly heat the flexible substrate 12. Therefore, the flexible substrate is prevented from warping in a wavy manner on the pallet as in the prior art. This reduces soldering defects and improves the reliability of soldering parts. The number of man-hours required for inspection and repair can be significantly reduced.
Ｋ発明の効果】
以上のように本発明は、パレットを構成する金属板に開
口を形成し、開口の部分にフレキシブル基板を載置する
とともに、開口の周縁部でフレキシブル基板を支持する
ようになし、この状態でパレットをリフロー炉内に導入
するようにしたしのである。従ってフレキシブル基板は
その大部分がパレットの開口に臨むことになり、これに
よってその両面を均一に加熱することが可能になり、半
田付は不良を低減できるようになる。[Effects of the Invention] As described above, in the present invention, an opening is formed in a metal plate constituting a pallet, a flexible substrate is placed in the opening, and the flexible substrate is supported at the periphery of the opening. In this state, the pallet was introduced into the reflow oven. Therefore, most of the flexible substrate faces the opening of the pallet, which makes it possible to uniformly heat both sides of the flexible substrate, thereby reducing soldering defects.
第１図は本発明の一実ｍ １９Ｑに係る方法により半田
付けされるプリント基板を載置したパレットの平面図、
第２図は第１図における■〜■線断面図、第３図はフレ
キシブル基板を載置する前の状態のパレットの平面図、
第４図はフレキシブル塞板の平面図、第５図はりフロー
炉の縦断面図、第６図は従来のパレ・ソト上のフレキシ
ブル基板の断９面図である。
また図面中の主要な部分の名称はつぎの通りである。
１０・・・パレット（金属板）
１１・・・開口
１２・・・フレキシブル基板
１３・・・チップ部品FIG. 1 is a plan view of a pallet on which printed circuit boards to be soldered by the method according to part 19Q of the present invention are mounted;
Figure 2 is a sectional view taken along the line ■ to ■ in Figure 1, Figure 3 is a plan view of the pallet before the flexible substrate is placed on it,
FIG. 4 is a plan view of a flexible plugging plate, FIG. 5 is a vertical cross-sectional view of a beam flow furnace, and FIG. 6 is a cross-sectional view of a flexible substrate on a conventional pare-soto. The names of the main parts in the drawings are as follows. 10... Pallet (metal plate) 11... Opening 12... Flexible board 13... Chip parts
Claims (1)
もに、その上にチップ部品をマウントし、該フレキシブ
ル基板を金属板から成るパレットに載せてリフロー炉に
導入し、該リフロー炉内で前記クリーム半田を溶融して
前記チップ部品の半田付けを行なうようにした方法にお
いて、前記パレットを構成する金属板に開口を形成し、
該開口の部分に前記フレキシブル基板を載置するととも
に、前記開口の周縁部で前記フレキシブル基板を支持す
るようになし、この状態で前記パレットを前記リフロー
炉内に導入するようにしたことを特徴とするフレキシブ
ル基板の半田付け方法。1. Cream solder is applied onto a flexible board, chip components are mounted on it, the flexible board is placed on a pallet made of metal plates, and introduced into a reflow oven, and the cream solder is melted in the reflow oven. In the method for soldering the chip components, an opening is formed in a metal plate constituting the pallet;
The flexible substrate is placed in the opening, and the flexible substrate is supported by the peripheral edge of the opening, and in this state, the pallet is introduced into the reflow oven. How to solder a flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20592288A JPH0254991A (en) | 1988-08-19 | 1988-08-19 | Soldering of flexible printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20592288A JPH0254991A (en) | 1988-08-19 | 1988-08-19 | Soldering of flexible printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254991A true JPH0254991A (en) | 1990-02-23 |
Family
ID=16514964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20592288A Pending JPH0254991A (en) | 1988-08-19 | 1988-08-19 | Soldering of flexible printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254991A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2672460A1 (en) * | 1991-02-05 | 1992-08-07 | Thomson Csf | METHOD FOR MOUNTING MINIATURE ELECTRONIC COMPONENTS WITH WELDING LEGS ON A FLEXIBLE SUBSTRATE. |
| JPH0494158U (en) * | 1990-12-28 | 1992-08-14 | ||
| EP0568087A2 (en) * | 1992-05-01 | 1993-11-03 | Mitsubishi Denki Kabushiki Kaisha | Reflow mounting of electronic component on mounting board |
| JP2001269602A (en) * | 2000-01-26 | 2001-10-02 | Spraying Syst Co | Quick disconnect nozzle assembly |
-
1988
- 1988-08-19 JP JP20592288A patent/JPH0254991A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0494158U (en) * | 1990-12-28 | 1992-08-14 | ||
| FR2672460A1 (en) * | 1991-02-05 | 1992-08-07 | Thomson Csf | METHOD FOR MOUNTING MINIATURE ELECTRONIC COMPONENTS WITH WELDING LEGS ON A FLEXIBLE SUBSTRATE. |
| US5143277A (en) * | 1991-02-05 | 1992-09-01 | Thomson-Csf | Method for the mounting of miniature electronic beam lead components |
| EP0568087A2 (en) * | 1992-05-01 | 1993-11-03 | Mitsubishi Denki Kabushiki Kaisha | Reflow mounting of electronic component on mounting board |
| EP0568087A3 (en) * | 1992-05-01 | 1995-11-15 | Mitsubishi Electric Corp | Reflow mounting of electronic component on mounting board |
| JP2001269602A (en) * | 2000-01-26 | 2001-10-02 | Spraying Syst Co | Quick disconnect nozzle assembly |
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