JP2509489Y2 - Hybrid integrated circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an improvement of a hybrid integrated circuit board, and more particularly to a hybrid integrated circuit board which enables high-quality and high-density mounting by improving a conductive path.

[Prior Art] Conventionally, in order to perform high-density mounting of a hybrid integrated circuit, a chip element may be placed on a thick film resistor. Mitsuko 47
Japanese Laid-Open Patent Publication No. 5698-56 discloses that the metal piece 6 is placed on the upper surface of the substrate through a resistor and an insulating layer, although it is not intended for high-density mounting.

[Problems to be Solved by the Invention] However, when the chip element is placed on the thick film resistor, each end of the thick film resistor and the chip element is connected to one conductive path. That is, the connection portion of the thick film resistor simultaneously becomes the connection portion of the chip element.

The thick film resistor has a resistance paste of about 850 printed on the substrate.
It is formed by applying heat of [° C.], and the non-metal component in the resistance paste diffuses into the conductive path during the baking. The conductive path in which the non-metal component is diffused deteriorates the solder leak property, that is, the solder adhesive property and strength. Therefore, conventionally, when a chip element is connected to the conductive path, there are many problems in soldering and reliability is low.

[Means for Solving Problems] This invention is intended to prevent diffusion of non-metal components of a resistance paste forming a thick film resistance with respect to a conductive path connecting a chip element and reduce defective soldering of the chip element. It is intended for.

And, in order to achieve the above object, a thick film resistor connecting portion,
Conducts a slit between the connection part of the adjacent chip element to prevent diffusion of non-metallic components in the resistance paste that forms the thick film resistance from the connection part of the thick film resistor toward the connection part of the chip element. Provided is a hybrid integrated circuit board provided by pattern printing of a road.

[Operation] When the thick film resistor is fired on one side of the conductive path provided with the slit as described above, that is, the connection portion of the thick film resistor, diffusion of the non-metal component of the resistance paste forming the thick film resistor. Does not proceed beyond the slit. For that reason,
On the other side of the conductive path, that is, on the connecting portion of the chip element, the solder leakability and strength are not deteriorated.

[Embodiment] FIGS. 1 and 2 of the accompanying drawings are drawings showing a preferred embodiment of the present invention.

In the figure, 1 is a substrate, 2 is a conductive path printed on the substrate 1, 3 is a thick film resistor printed by bridging between the conductive paths 2, and 4 is a thick film resistor 3. This is a chip element that is placed on top of each other and has its ends soldered to the conductive paths 2 with solder 5.

Each of the conductive paths 2 is provided with each slit 23 for separating the connecting portion 21 of the thick film resistor 3 and the connecting portion 22 of the chip element 4.

More specifically, the substrate 1 is made of ceramic or the like.

The conductive paths 2 are formed by printing a conductive paste on the substrate 1 in a predetermined pattern and firing it.

The thick film resistor 3 is formed by printing a resistor paste on the substrate 1 and each conductive path 2 in a predetermined pattern shape and baking the paste.

The firing step is performed by applying heat of about 850 [° C.] for about 15 [minutes] in an infrared firing furnace, for example.

After the firing of the thick film resistor 3 is completed, the solder paste is printed on the connection portion 22 of the chip element 4 to mount the chip element, and the chip element 4 is heated by a reflow furnace to be soldered.

Here, when the chip element is placed, the chip element 4 may be slightly displaced from a predetermined position, but the position is automatically corrected by the surface tension of the molten solder when the soldering is performed. Becomes

[Effects of the Invention] A hybrid integrated circuit board having a chip element, which is placed on top of a thick film resistor according to the present invention and is soldered at its end to a connecting portion of a chip element of a conductive path, is Connection part of
Conducts a slit between the connection part of the adjacent chip element to prevent diffusion of non-metallic components in the resistance paste that forms the thick film resistance from the connection part of the thick film resistor toward the connection part of the chip element. It is characterized by being provided by pattern printing of the road.

As a result, the non-metal component in the resistance paste forming the thick film resistor does not diffuse from the connection part of the thick film resistor toward the connection part of the chip element when firing the thick film resistance, and therefore the connection part of the chip element The solder leakability can be maintained, and therefore, the soldering failure at the connecting portion of the chip element can be reduced, and there is no need to perform special processing such as forming a hole in the substrate to form the slit. ,
There is an effect that it can be formed simply by pattern printing of the conductive path.

[Brief description of drawings]

FIG. 1 is a plan view showing a preferred embodiment of the present invention, and FIG.
The figure is a sectional view taken along the line AA of FIG. 1 ... Substrate, 2 ... Conductive path, 21 ... Connection part of thick film resistor,
22 ... Chip element connection, 23 ... Slit, 3 ... Thick film resistor, 4 ... Chip element, 5 ... Solder.

Claims (1)

(57) [Scope of utility model registration request] 1. A substrate (1), and a chip element formed on the substrate (1) and provided adjacent to the thick film resistor connecting portion (21) and the thick film resistor connecting portion (21). A conductive path (2) having a connecting part (22); and a thick film resistor (3) formed by bridging between the connecting parts (21) of the thick film resistors of the conductive path (2), A hybrid integrated circuit comprising a chip element (4) which is placed on top of a thick film resistor (3) and is soldered at its end to a connecting portion (22) of the chip element of the conductive path (2). In the substrate, between the thick film resistor connecting portion (21) and the adjacent chip element connecting portion (22), the thick film resistor connecting portion (21) to the chip element connecting portion (22) are provided. A slit (23) for preventing diffusion of a non-metal component in a resistance paste forming a thick film resistor (3) toward the surface is provided by pattern printing of the conductive path (2). Hybrid integrated circuit board, wherein the door.