JPS582066Y2 - multilayer wiring board - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to a multilayer thick film wiring board.

Conventional multilayer thick film 1 wiring boards are usually formed by providing a layer with a large area of conductor circuits as the first layer, as shown in FIGS. 1 and 2, and an insulating layer 4 is provided between each layer. In this case, if the soldering part 1, the mounting part 2, and the bonding part 3 are printed on the first layer, the second and third layers, and the drying and baking process when forming the insulating layer and each conductor layer. Because they are exposed to high temperatures, the conductor portions are significantly oxidized, resulting in poor solderability, mountability, and bonding properties.

For these reasons, the adhesive strength of the soldering part 1, mount part 2, and punching part 3 decreases, causing quality deterioration, and adding an oxide film removal process, which requires extra man-hours and increases cost. It had become.

The object of the present invention is to provide a multilayer thick film wiring board that can eliminate the above-mentioned problems, improve solderability, mounting performance, and punching performance, and provide high quality.

That is, in the present invention, by bringing only the conductor portion to be soldered, mounted, and punched to the final step of the conductor printing process, that is, by providing it as the topmost conductor layer, the time exposed to the drying oven and firing oven is reduced. The purpose is to improve solderability, mountability, and bonding properties without being affected by oxidation by avoiding oxidation as much as possible.

Therefore, the conductor parts that are soldered, mounted, and bonded are exposed to the drying oven and firing oven for the same amount of time as normal thick film wiring boards, so the soldering, mounting, and bonding properties are not impaired. Alternatively, it can be done without providing an oxide film removal process, without deteriorating quality, and at a low cost.

Next, an embodiment of the present invention will be described using FIGS. 3 and 4.

FIG. 3 shows a multilayer thick film wiring board consisting of two conductor layers formed on a ceramic substrate 10 according to the present invention, with soldered conductor portions 1. Mount conductor part 2 and bonding conductor part 3
is provided as a second conductor layer with an insulating layer 4 formed by firing glass paste interposed therebetween.

Next, the manufacturing procedure of such a multilayer thick film wiring board will be explained with reference to FIG.

First, a conductive paste is applied onto the ceramic substrate 10 only in a pattern unrelated to the soldering portion, punching portion, and mounting portion, and is fired to form a first conductive layer.

Subsequently, a glass paste is applied onto the first layer conductor layer intersecting with the second layer conductor and baked to form an insulating layer.

(Not shown, corresponds to 4 in Figure 3.

) Next, solder part 1. Mount part 2. The wiring board shown in FIG. 3 is formed by forming a wiring conductor layer including bonding portions 3 by applying and baking a conductive paste, and then printing resistors 5.

The soldering part 1 mount part 2 and bonding part 3 of the wiring board formed in this way are affected by thermal effects during the manufacturing process.
It has excellent connectivity reliability as it is not subject to

Note that the present invention is not limited to the above-mentioned embodiments, and the shape and material may be changed as desired.
This method is also effective when more than one conductor layer is formed.

[Brief explanation of drawings]

FIG. 1 is a top plan view of a conventional multilayer thick film substrate, and FIG. 2 is a plan view illustrating the manufacturing procedure of its main parts. FIG. 3 is a top plan view of the multilayer thick film wiring board according to the present invention, and FIG. 4 is a plan view illustrating its main manufacturing process. Codes in the diagram 10...Ceramic substrate, 1...
...Soldering conductor part, 2...Mount conductor part, 3...Bonding conductor part, 4...
- Insulating layer, 5...Resistor.

Claims (1)

[Scope of utility model registration request] A multilayer conductor layer is formed on the substrate, and the portion of the lower conductor layer that intersects with the upper conductor layer is covered with an insulating film.
Most of the multilayer wiring board except for the intersections is exposed without being covered with the insulating film, and the conductor layer in the part connected to the mounted components mounted on the multilayer wiring board is the uppermost layer. A multilayer wiring board characterized in that it is formed as a conductor layer.