JPH04223301A - Square chip resistor - Google Patents
Square chip resistorInfo
- Publication number
- JPH04223301A JPH04223301A JP2406502A JP40650290A JPH04223301A JP H04223301 A JPH04223301 A JP H04223301A JP 2406502 A JP2406502 A JP 2406502A JP 40650290 A JP40650290 A JP 40650290A JP H04223301 A JPH04223301 A JP H04223301A
- Authority
- JP
- Japan
- Prior art keywords
- electrode layers
- chip resistor
- pair
- layer
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000010410 layer Substances 0.000 claims description 75
- 239000011241 protective layer Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 230000007547 defect Effects 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- 238000010304 firing Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は高密度配線回路に用いら
れる角形チップ抵抗器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular chip resistor used in high-density wiring circuits.
【０００２】0002
【従来の技術】近年、電子機器の軽薄短小化に対する要
求がますます増大していく中、回路基板の配線密度を高
めるため、抵抗素子には非常に小型な角形チップ抵抗器
が多く用いられるようになってきた。また、更に近年で
は実装速度を速めるため、多数のチップ部品を同時に実
装する一括マウントが行われるようになってきている。[Background Art] In recent years, as the demand for lighter, thinner, and shorter electronic devices has increased, extremely small square chip resistors are increasingly being used as resistance elements in order to increase the wiring density of circuit boards. It has become. Moreover, in recent years, in order to increase the mounting speed, batch mounting, in which a large number of chip components are simultaneously mounted, has become popular.
【０００３】従来の厚膜タイプの角形チップ抵抗器の構
造の一例を、図４に示す。従来の角形チップ抵抗器は厚
み方向の長さが、幅方向の長さの１０％〜７０％の長さ
である角板形の絶縁性の９６アルミナ基板１０と、この
９６アルミナ基板１０上に形成された一対の厚膜電極に
よる上面電極層１１と、この上面電極層１１と接続する
ように形成されたルテニウム系厚膜抵抗による抵抗層１
２と、抵抗層を覆うガラス層１４と、上面電極層の一部
と重なる端面電極層１３とからなっており、露出電極面
にははんだ付け性を確保するためにＮｉめっき層１５と
はんだめっき層１６を電解メッキにより形成しているAn example of the structure of a conventional thick film type square chip resistor is shown in FIG. A conventional rectangular chip resistor has a rectangular plate-shaped insulating 96 alumina substrate 10 whose length in the thickness direction is 10% to 70% of the length in the width direction, and a 96 alumina substrate 10 on which the length in the thickness direction is 10% to 70% of the length in the width direction. A top electrode layer 11 formed of a pair of thick film electrodes and a resistance layer 1 formed of a ruthenium-based thick film resistor formed to be connected to the top electrode layer 11.
2, a glass layer 14 that covers the resistance layer, and an end electrode layer 13 that overlaps a part of the upper electrode layer, and the exposed electrode surface is coated with a Ni plating layer 15 and solder plating to ensure solderability. Layer 16 is formed by electrolytic plating.
【
０００４】[
0004
【発明が解決しようとする課題】しかし、従来の角形チ
ップ抵抗器は先に述べた一括マウントを行う場合、部品
が実装されるとき、図５のように角形チップ抵抗器１７
が基板の主面ではなく側面側で実装されると半田付けさ
れる半田１８の量（半田付け部の投射面積）が減るため
、十分な固着強度が得られない。また、一括実装機内の
搬送チューブは角形チップ抵抗器の方向を定めるため、
角型である必要があり、この角型の搬送チューブは角形
チップ抵抗器が途中で詰まり易いという欠点があった。[Problems to be Solved by the Invention] However, when the conventional rectangular chip resistor is mounted in bulk as described above, when the components are mounted, the rectangular chip resistor 17 as shown in FIG.
If it is mounted on the side surface of the board rather than on the main surface, the amount of solder 18 to be soldered (the projected area of the soldering part) will be reduced, making it impossible to obtain sufficient fixing strength. In addition, the transport tube in the batch mounting machine determines the direction of the square chip resistor.
It needs to be rectangular, and this rectangular carrier tube has the disadvantage that the rectangular chip resistor is easily clogged in the middle.
【０００５】本発明は、このような課題を一挙に解決す
るもので、角形チップ抵抗器が側面で実装されても十分
な固着強度が得られる角形チップ抵抗器を提供すること
を第１の目的とし、同時に搬送チューブ内で詰まりにく
い円筒チューブを採用することが可能な角形チップ抵抗
器を提供することを第２の目的とする。[0005] The present invention solves these problems at once, and a first object is to provide a rectangular chip resistor that can obtain sufficient fixing strength even when it is mounted on the side. A second object of the present invention is to provide a rectangular chip resistor that can employ a cylindrical tube that is not easily clogged in the conveying tube.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に本発明は、角板形の絶縁性の焼結基板と、この前記焼
結基板の一方の主面上に形成された一対の上面電極層と
、この一対の上面電極層の一部に重なる抵抗層と、前記
焼結基板の他方の主面上の一対の裏面電極層と、前記一
対の上面電極層と一対の裏面電極層とを電気的に接続す
る一対の端面電極層とを有し、完成寸法で厚み方向の長
さが幅方向の長さの８０％〜１２０％であるものである
。Means for Solving the Problems In order to achieve the above object, the present invention provides a rectangular plate-shaped insulating sintered substrate and a pair of upper surfaces formed on one main surface of the sintered substrate. an electrode layer, a resistance layer overlapping a part of the pair of upper electrode layers, a pair of back electrode layers on the other main surface of the sintered substrate, and the pair of upper electrode layers and the pair of back electrode layers. and a pair of end face electrode layers that electrically connect the ends, and the length in the thickness direction is 80% to 120% of the length in the width direction in the completed dimension.
【０００７】[0007]
【作用】本発明によれば、角形チップ抵抗器が側面で実
装されても側面電極に半田付けされる半田量は変化しな
いので十分な固着強度が得られるもので、更に、角形チ
ップ抵抗器の形状を円筒に近くすることで、実装機内の
搬送チューブとして円筒チューブを採用することができ
、搬送チューブ内で角形チップ抵抗器が詰まり難くなる
。なお、角形チップ抵抗器の形状が円筒に近くなるため
、従来の円筒チップ抵抗器用の一括実装機への適用性を
持たせることができる。[Function] According to the present invention, even if the square chip resistor is mounted on the side, the amount of solder soldered to the side electrode does not change, so sufficient fixing strength can be obtained. By making the shape close to a cylinder, a cylindrical tube can be used as the transport tube in the mounting machine, and the rectangular chip resistor is less likely to become clogged within the transport tube. Note that since the shape of the rectangular chip resistor is close to a cylinder, it can be applied to a conventional batch mounting machine for cylindrical chip resistors.
【０００８】[0008]
【実施例】以下、本発明の一実施例の角形チップ抵抗器
について、図面を用いて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A rectangular chip resistor according to an embodiment of the present invention will be described below with reference to the drawings.
【０００９】図１は本発明の実施例を示す断面図である
。図１において、本発明の角形チップ抵抗器は、９６ア
ルミナ基板１と、この９６アルミナ基板１の一方の主面
１上の銀系厚膜の一対の上面電極層２と、前記９６アル
ミナ基板１の他方の主面上の裏面電極層３と、前記上面
電極層２の一部に重なるルテニウム系厚膜の抵抗層４と
、前記抵抗層４を完全に覆う第１ガラス層６と、前記裏
面電極層層３の一部に重なる第２ガラス層７と、前記上
面電極層２と前記裏面電極層３の一部に重なる銀系厚膜
の端面電極層８とから構成される。なお、露出電極面に
ははんだ付け性を向上させるため、Ｎｉめっき層９とＳ
ｎ−Ｐｂめっき層１０を電解めっきにより施している。FIG. 1 is a sectional view showing an embodiment of the present invention. In FIG. 1, the rectangular chip resistor of the present invention includes a 96 alumina substrate 1, a pair of upper surface electrode layers 2 of a silver-based thick film on one main surface 1 of the 96 alumina substrate 1, and the 96 alumina substrate 1. a back electrode layer 3 on the other main surface, a ruthenium-based thick film resistance layer 4 that partially overlaps the top electrode layer 2, a first glass layer 6 that completely covers the resistance layer 4, and a first glass layer 6 that completely covers the resistance layer 4; It is composed of a second glass layer 7 overlapping a part of the electrode layer 3, and an end electrode layer 8 made of a silver-based thick film overlapping a part of the upper electrode layer 2 and the back electrode layer 3. Note that the exposed electrode surface is coated with Ni plating layer 9 and S to improve solderability.
The n-Pb plating layer 10 is applied by electrolytic plating.
【００１０】次に、図１に示した本実施例の角形チップ
抵抗器の製造方法について説明する。まず、耐熱性およ
び絶縁性に優れた９６アルミナ基板１を受け入れる。こ
の９６アルミナ基板１には短冊状、および個片状に分割
するために、分割のための溝（グリーンシート時に金型
成形）が形成されている（基板の厚みは０．６３５ｍｍ
で、分割のための溝は１．５ｍｍおよび０．８ｍｍピッ
チで形成されている。）。次に、前記９６アルミナ基板
１の表面に厚膜銀ペーストをスクリーン印刷・乾燥し、
更に、前記９６アルミナ基板１の裏面に厚膜銀ペースト
をスクリーン印刷・乾燥し、ベルト式連続焼成炉によっ
て８５０℃の温度で、ピーク時間６分、ＩＮ−ＯＵＴ時
間４５分のプロファイルによって焼成し、上面電極層２
および裏面電極層３を同時に形成する。次に、上面電極
層２の一部に重なるように、ＲｕＯ２を主成分とする厚
膜抵抗ペーストをスクリーン印刷・乾燥し、ベルト式連
続焼成炉により８５０℃の温度でピーク時間６分、ＩＮ
−ＯＵＴ時間４５分のプロファイルによって焼成し、抵
抗層４を形成する。次に、前記上面電極層２間の前記抵
抗層４の抵抗値を揃えるために、レーザー光によって、
前記抵抗層４の一部を破壊し抵抗値修正（Ｌカット、１
００ｍｍ／秒、１２ｋＨｚ、５Ｗ）を行う。続いて、前
記抵抗層４を完全に覆うように、ホウケイ酸鉛系ガラス
ペースト（黒色）をスクリーン印刷・乾燥し、更に前記
裏面電極層３の一部に重なるようにホウケイ酸鉛系ガラ
スペースト（黒色）をスクリーン印刷・乾燥し、ベルト
式連続焼成炉によって５９０℃の温度で、ピーク時間６
分、ＩＮ−ＯＵＴ ５０分の焼成プロファイルによっ
て焼成し、第１ガラス層６および第２ガラス層７を同時
に形成する。次に、端面電極を形成するための準備工程
として、端面電極を露出させるために、アルミナ基板１
を短冊状に分割（１．５ｍｍピッチ側を分割）し、短冊
状アルミナ基板を得る。前記短冊状アルミナ基板の側面
に、前記上面電極層２および前記裏面電極層３の一部に
重なるように厚膜銀ペーストをローラーによって塗布し
、ベルト式連続焼成炉によって６００℃の温度で、ピー
ク時間６分、ＩＮ−ＯＵＴ４５分の焼成プロファイルに
よって焼成し端面電極層８を形成する。次に、電極メッ
キの準備工程として、前記端面電極層８を形成済みの短
冊上アルミナ基板を個片に分割（０．８ｍｍピッチ側を
分割）し、個片状アルミナ基板を得た。そして最後に、
露出している上面電極層２と裏面電極層３と端面電極層
８のはんだ付け時の電極喰われの防止およびはんだ付け
の信頼性の確保のため、電解めっきによってＮｉめっき
層９とＳｎ−Ｐｂのめっき層１０を形成する。Next, a method of manufacturing the rectangular chip resistor of this embodiment shown in FIG. 1 will be explained. First, a 96 alumina substrate 1 having excellent heat resistance and insulation properties is received. In order to divide this 96 alumina substrate 1 into strips and individual pieces, a dividing groove (molded with a mold when forming a green sheet) is formed (the thickness of the substrate is 0.635 mm).
The grooves for division are formed at pitches of 1.5 mm and 0.8 mm. ). Next, a thick film silver paste is screen printed and dried on the surface of the 96 alumina substrate 1,
Furthermore, a thick film silver paste was screen printed and dried on the back side of the 96 alumina substrate 1, and fired in a belt type continuous firing furnace at a temperature of 850°C with a profile of a peak time of 6 minutes and an IN-OUT time of 45 minutes, Top electrode layer 2
and the back electrode layer 3 are formed at the same time. Next, a thick film resistor paste mainly composed of RuO2 was screen printed and dried so as to overlap a part of the upper electrode layer 2, and was heated in a belt-type continuous firing furnace at a temperature of 850°C for 6 minutes at a peak time.
- The resistive layer 4 is formed by firing according to a profile with an OUT time of 45 minutes. Next, in order to equalize the resistance values of the resistance layer 4 between the upper electrode layers 2, a laser beam is used to
A part of the resistance layer 4 is destroyed to correct the resistance value (L cut, 1
00mm/sec, 12kHz, 5W). Next, a lead borosilicate glass paste (black) is screen printed and dried so as to completely cover the resistance layer 4, and a lead borosilicate glass paste (black) is then applied so as to partially overlap the back electrode layer 3. Black) was screen printed and dried, and was heated to 590°C using a belt-type continuous firing furnace for a peak time of 6.
The first glass layer 6 and the second glass layer 7 are simultaneously formed by firing according to a firing profile of 50 minutes IN-OUT. Next, as a preparatory step for forming the end electrodes, the alumina substrate 1 is
is divided into strips (dividing on the 1.5 mm pitch side) to obtain strip-shaped alumina substrates. A thick film silver paste is applied by a roller to the side surface of the strip-shaped alumina substrate so as to partially overlap the top electrode layer 2 and the back electrode layer 3, and is heated to a peak temperature of 600° C. using a belt-type continuous firing furnace. The end face electrode layer 8 is formed by firing according to a firing profile of 6 minutes for 6 minutes and 45 minutes for IN-OUT. Next, as a preparation step for electrode plating, the rectangular alumina substrate on which the end surface electrode layer 8 had already been formed was divided into individual pieces (dividing the 0.8 mm pitch side) to obtain individual piece-like alumina substrates. And finally,
In order to prevent the exposed top electrode layer 2, back electrode layer 3, and end electrode layer 8 from being eaten away during soldering and to ensure soldering reliability, the Ni plating layer 9 and Sn-Pb are separated by electrolytic plating. A plating layer 10 is formed.
【００１１】以上の工程により、本実施例による角形チ
ップ抵抗器を試作した（完成品の寸法は、長さが１．６
ｍｍ、幅が０．８ｍｍ、厚さが０．７４ｍｍとなり、厚
み方向の寸法は幅方向の寸法の９２．５％となった。）
。[0011] Through the above steps, a square chip resistor according to this example was prototyped (the dimensions of the completed product were 1.6 mm in length).
mm, the width was 0.8 mm, and the thickness was 0.74 mm, and the dimension in the thickness direction was 92.5% of the dimension in the width direction. )
.
【００１２】本実施例の角形チップ抵抗器１９を図２の
ように基板の側面で実装したときでも十分な量の半田２
１で固定できるので、固着強度（角形チップ抵抗器のプ
リント基板と平行方向からの限界加重）は、基板の主面
で実装したときと同様となった（この場合、側面実装で
は約１０ｋｇ、表面実装は約１０ｋｇであり、従来例の
側面実装は５ｋｇであった。）。Even when the rectangular chip resistor 19 of this embodiment is mounted on the side surface of the board as shown in FIG.
1, the adhesion strength (limit load in the direction parallel to the printed circuit board of the rectangular chip resistor) is the same as when mounted on the main surface of the board (in this case, about 10 kg for side mounting, The mounting weight is approximately 10 kg, and the side mounting weight of the conventional example was 5 kg).
【００１３】また、本実施例の角形チップ抵抗器１９は
図３に示すように、ランドパターン２２を有したプリン
ト基板のスルーホール２０内に半田２１で実装する場合
も、従来の角形チップ抵抗器に比べ詰まり難く、ガタも
少ないといった効果も確認した。Furthermore, as shown in FIG. 3, the rectangular chip resistor 19 of this embodiment can be mounted with solder 21 in the through hole 20 of a printed circuit board having a land pattern 22, compared to the conventional rectangular chip resistor. We also confirmed that it is less likely to clog and has less backlash than the previous model.
【００１４】更に、角形チップ抵抗器の形状を円筒に近
くすることで、実装機内の搬送チューブとして円筒チュ
ーブを採用することができ、搬送チューブ内で角形チッ
プ抵抗器が詰まり難くなる。Furthermore, by making the shape of the rectangular chip resistor close to a cylinder, a cylindrical tube can be used as the transport tube in the mounting machine, and the rectangular chip resistor is less likely to become clogged within the transport tube.
【００１５】また、角形チップ抵抗器の形状が円筒に近
くなるため、従来の円筒チップ抵抗器用の一括実装機へ
の適用性を持たせることができる。Furthermore, since the shape of the rectangular chip resistor is close to a cylinder, it can be applied to a conventional batch mounting machine for cylindrical chip resistors.
【００１６】なお、本実施例において基板の厚みを０．
６３５ｍｍ、角形チップ抵抗器の幅を０．８ｍｍとした
が、当然他の寸法でも効果は得られ、比率として厚み方
向の長さが幅方向の長さの７５％〜１１０％の基板であ
れば適用できることは言うまでもない（望ましくは、９
０％〜１００％）。ただし、完成品で８０％〜１２０％
の範囲を外れると、表面実装時と側面実装時での固着強
度に大きな差がでてくる。In this embodiment, the thickness of the substrate is 0.
635mm, and the width of the rectangular chip resistor is 0.8mm, but the effect can of course be obtained with other dimensions, and as long as the length of the board in the thickness direction is 75% to 110% of the length in the width direction. It goes without saying that it can be applied (preferably 9
0% to 100%). However, 80% to 120% for finished products
Outside this range, there will be a large difference in the adhesion strength between surface mounting and side mounting.
【００１７】また、実施例では保護層はガラス系のもの
を用いたが、これは他の保護層（例えば樹脂等）でもよ
い。また、保護層を角形チップ抵抗器の両主面に形成し
たがこれは、その他の側面にも形成してよい。Further, in the embodiment, a glass-based protective layer was used, but other protective layers (for example, resin, etc.) may be used. Further, although the protective layer is formed on both main surfaces of the square chip resistor, it may be formed on the other side surfaces as well.
【００１８】[0018]
【発明の効果】以上の説明より明らかなように、本発明
の角形チップ抵抗器によれば、形状が従来の角形チップ
抵抗器に比べ円筒形に近くなるので、角形チップ抵抗器
が側面で実装されても側面電極に半田付けされる半田量
は変化しないので十分な固着強度が得られる。また一括
実装機内の搬送チューブで方向を定める必要がなくなり
、搬送チューブとして円筒チューブを用いることができ
るので一括マウント時の搬送時の詰まりが減少する。
更に従来の円筒チップ抵抗器の一括実装機との互換性を
もつといった優れた効果を有する。Effects of the Invention As is clear from the above explanation, according to the rectangular chip resistor of the present invention, the shape is closer to a cylindrical shape than the conventional rectangular chip resistor, so that the rectangular chip resistor is mounted on the side. Since the amount of solder soldered to the side electrodes does not change even if the soldering is done, sufficient adhesion strength can be obtained. Furthermore, it is no longer necessary to determine the direction using the transport tube in the batch mounting machine, and a cylindrical tube can be used as the transport tube, reducing clogging during transport during batch mounting. Furthermore, it has excellent compatibility with conventional cylindrical chip resistor batch mounting machines.
【図１】本発明の一実施例の角形チップ抵抗器の構造を
示す断面図FIG. 1 is a sectional view showing the structure of a rectangular chip resistor according to an embodiment of the present invention.
【図２】本発明の一実施例の角形チップ抵抗器が側面で
実装された状態を示す説明図[Fig. 2] An explanatory diagram showing a state in which a rectangular chip resistor according to an embodiment of the present invention is mounted on the side.
【図３】本発明の一実施例の角形チップ抵抗器をプリン
ト基板のスルーホール内に実装した状態を示す説明図FIG. 3 is an explanatory diagram showing a state in which a rectangular chip resistor according to an embodiment of the present invention is mounted in a through hole of a printed circuit board.
【
図４】従来の角形チップ抵抗器の構造を示す断面図[
Figure 4: Cross-sectional view showing the structure of a conventional square chip resistor
【図
５】従来の角形チップ抵抗器が側面で実装された状態を
示す説明図[Figure 5] An explanatory diagram showing a state in which a conventional square chip resistor is mounted on the side.
１ ９６アルミナ基板 ２ 上面電極層 ３ 裏面電極層 ４ 抵抗層 ６ 第１ガラス層 ７ 第２ガラス層 ８ 端面電極層 ９ Ｎｉめっき層 １０ Ｓｎ−Ｐｂめっき層 1 96 alumina substrate 2 Top electrode layer 3 Back electrode layer 4 Resistance layer 6 First glass layer 7 Second glass layer 8 End electrode layer 9 Ni plating layer 10 Sn-Pb plating layer
Claims (2)
結基板の一方の主面上に形成された一対の上面電極層と
、この一対の上面電極層の一部に重なる抵抗層と、前記
焼結基板の他方の主面上の一対の裏面電極層と、前記一
対の上面電極層と一対の裏面電極層とを電気的に接続す
る一対の端面電極層とを有し、完成寸法で厚み方向の長
さが幅方向の長さの８０％〜１２０％であることを特徴
とする角形チップ抵抗器。1. A square plate-shaped insulating sintered substrate, a pair of upper surface electrode layers formed on one main surface of the sintered substrate, and a portion of the upper surface electrode layers overlapped with each other. It has a resistance layer, a pair of back electrode layers on the other main surface of the sintered substrate, and a pair of end electrode layers that electrically connect the pair of top electrode layers and the pair of back electrode layers. A rectangular chip resistor characterized in that the length in the thickness direction is 80% to 120% of the length in the width direction in completed dimensions.
１００％の長さの角板形の絶縁性の焼結基板と、この前
記焼結基板の一方の主面上に形成された一対の上面電極
層と、この一対の上面電極層の一部に重なる抵抗層と、
この抵抗層を完全に覆う第１保護層と、前記焼結基板の
他方の主面上の一対の裏面電極層と、この裏面電極層の
一部に重なる第２保護層と、前記一対の上面電極層と一
対の裏面電極層とを電気的に接続する一対の端面電極層
とから構成されることを特徴とする請求項１記載の角形
チップ抵抗器。Claim 2: The length in the thickness direction is 90% or more of the length in the width direction.
A square plate-shaped insulating sintered substrate having a length of 100%, a pair of upper surface electrode layers formed on one main surface of the sintered substrate, and a part of this pair of upper surface electrode layers. Overlapping resistance layers,
a first protective layer that completely covers the resistance layer; a pair of back electrode layers on the other main surface of the sintered substrate; a second protective layer that partially overlaps the back electrode layer; 2. The rectangular chip resistor according to claim 1, comprising a pair of end surface electrode layers electrically connecting the electrode layer and the pair of back surface electrode layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2406502A JPH04223301A (en) | 1990-12-26 | 1990-12-26 | Square chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2406502A JPH04223301A (en) | 1990-12-26 | 1990-12-26 | Square chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04223301A true JPH04223301A (en) | 1992-08-13 |
Family
ID=18516125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2406502A Pending JPH04223301A (en) | 1990-12-26 | 1990-12-26 | Square chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04223301A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017117873A (en) * | 2015-12-22 | 2017-06-29 | Koa株式会社 | Chip resistor and mounting structure of chip resistor |
| JP2018050017A (en) * | 2016-09-23 | 2018-03-29 | Koa株式会社 | Chip resistor |
-
1990
- 1990-12-26 JP JP2406502A patent/JPH04223301A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017117873A (en) * | 2015-12-22 | 2017-06-29 | Koa株式会社 | Chip resistor and mounting structure of chip resistor |
| JP2018050017A (en) * | 2016-09-23 | 2018-03-29 | Koa株式会社 | Chip resistor |
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