JPH0242736A - Bonding of ic-chip loading type flexible printed-circuit board - Google Patents
Bonding of ic-chip loading type flexible printed-circuit boardInfo
- Publication number
- JPH0242736A JPH0242736A JP63193219A JP19321988A JPH0242736A JP H0242736 A JPH0242736 A JP H0242736A JP 63193219 A JP63193219 A JP 63193219A JP 19321988 A JP19321988 A JP 19321988A JP H0242736 A JPH0242736 A JP H0242736A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- circuit board
- flexible printed
- carrier
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 6
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 230000008642 heat stress Effects 0.000 description 3
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
Landscapes
- Wire Bonding (AREA)
Abstract
Description
本発明は、ＩＣチップ搭載型のフレキシブル・プリント
基板のボンディング方法に係り、特にボンディング用治
具としてのキャリア上でＩＣチップをフレキシブル・プ
リント基板にワイヤーボンディングまたはダイレクトボ
ンディングする場合に、フレキシブル・プリント基板の
ボンディング領域をキャリア上に確実に平面的に密着さ
せることができるボンディング方法に関する。The present invention relates to a bonding method for a flexible printed circuit board mounted with an IC chip, and in particular, when wire bonding or direct bonding an IC chip to a flexible printed circuit board on a carrier as a bonding jig, the present invention relates to a method for bonding a flexible printed circuit board mounted with an IC chip. The present invention relates to a bonding method that can reliably bring a bonding region of a carrier into close contact with a carrier in a planar manner.
一般に、ＩＣチップ搭載型のフレキシブル・プリント基
板の製造工程において、ＩＣチップとフレキシブル・プ
リント基板とをワイヤーボンディングまたはダイレクト
ボンディングする場合、ボンディングを正確に行うため
にはフレキシブル・プリント基板全体が、特にそのボン
ディング領域が、上記キャリア上に確実に平面的に密着
・保持される必要がある。特に、プリント基板がフレキ
シブル基板である場合には、基板自体が柔軟性に富んで
変形しやすく、また、ボンディング目体が多くの熱工程
からなるために、その各工程において熱ストレスを受け
て基板自体に「反り」が生じやす（、正確なボンディン
グを行うためには、この「反り」を矯正して平面性を確
保した状態にフレキシブル・プリント基板をキャリア上
に固定保持してボンディングを行わなければならない。
このようなプリント基板のキャリアに対する固定力式と
しては、従来から二つの方式が提供されている。その一
つは、第３．４図に示した押さえ方式であり、他の一つ
は第５図に示した真空吸着方式である。
第３，４図に示した押さえ方式においては、ＩＣチップ
５３をその所定の位置に搭載したフレキシブル・プリン
ト基板５１が、キャリア５２の上に載置された状態でボ
ンディング位置まで搬送され、ボンディング位置に至っ
たところで押さえ金具５０によりキャリア５２に対して
押し付けられる。そして、その後ボンディング用の各ワ
イヤー５４の一端がＩＣチップ５３に接続され、その各
他端が第４図に示すようにフレキシブル・プリント基板
５１上の配線箔の各ターミナル５５に接続される。
一方、第５図に示した真空吸着方式においては、第３．
４図に示した押さえ金具と同様の押さえ金具５０により
フレキシブル・プリント基板５１がキャリア５２上に押
し付けられた状態でこのキャリア５２が真空吸引装置で
あるボンディングマシーンのマガジン５６上に載置され
る。キャリア５２には吸引間口５２ａが形成されている
。この方式においては、ボンディングマシーン５６によ
り空気吸引されると、フレキシブル・プリント基板５１
がキャリア５２上にしっかりと固定されることになり、
この固定がなされた上でワイヤーボンディングが行われ
る。Generally, in the manufacturing process of IC chip-mounted flexible printed circuit boards, when wire bonding or direct bonding is performed between the IC chip and the flexible printed circuit board, in order to perform bonding accurately, the entire flexible printed circuit board must be It is necessary that the bonding region is reliably adhered to and held on the carrier in a planar manner. In particular, when the printed circuit board is a flexible board, the board itself is highly flexible and easily deforms, and since the bonding body consists of many thermal processes, the board is subject to thermal stress during each process. The flexible printed circuit board itself tends to be warped (in order to perform accurate bonding, the flexible printed circuit board must be fixed and held on the carrier while the warp is corrected and flatness is ensured. Conventionally, two methods have been provided for fixing the printed circuit board to the carrier. One is the holding method shown in Figure 3.4, and the other is the holding method shown in Figure 3.4. is the vacuum suction method shown in FIG. 5. In the holding method shown in FIGS. The wires 54 for bonding are then transported to the bonding position, where they are pressed against the carrier 52 by the presser fitting 50. Then, one end of each bonding wire 54 is connected to the IC chip 53, and each The other end is connected to each terminal 55 of the wiring foil on the flexible printed circuit board 51 as shown in FIG. 4. On the other hand, in the vacuum suction method shown in FIG.
A flexible printed circuit board 51 is pressed onto a carrier 52 by a holding metal fitting 50 similar to the holding fitting shown in FIG. 4, and this carrier 52 is placed on a magazine 56 of a bonding machine which is a vacuum suction device. A suction opening 52a is formed in the carrier 52. In this method, when air is sucked by the bonding machine 56, the flexible printed circuit board 51
is firmly fixed on the carrier 52,
After this fixation, wire bonding is performed.
ところが、上述のような固定方式による従来技術にあっ
ては、次のような不具合があった。
即ち、押さえ方式においては、ＩＣチップ５３を所定の
位置に載置した状態でボンディング位置までキャリア５
２により搬送されて来たフレキシブル・プリント基板５
１が、この位置において初めて押さえ金具５０により押
し付は固定される。
ところが、キャリア５２上には多数のＩＣチップ５３が
次々と並んで載置されており、ボンディング処理の熱が
キャリア５２等を介する伝導や直接の輻射熱となってボ
ンディング位置に至る前の搬送中のフレキシブル・プリ
ント基板にも熱ストレスを与えて「反り」を生じさせる
。したがって、ボンディング位置へは既に「反り」のあ
る状態でフレキシブル・プリント基板５１が来ることに
なり、この状態から押さえ金具’５ Ｑで押し付は固定
しても正確な位置付けが困難である。
また、真空吸着方式においては、キャリアを搬送するボ
ンディングマシーンのマガジンに吸着機構をもたせてい
るので、キャリア上で吸着できる位置が決められてしま
う。従って、この方式を用いるには、フレキシブル・プ
リント基板のうち吸着の必要なＩＣ搭載部をこの吸着位
置に位置させる必要がある。従って、このフレキシブル
・プリント基板は形状が自ずと制約されてしまう。
ところが、フレキノプル・プリント基板は設計目的に応
じて様々な形状に形成されるものであり、殊にカメラの
ような装置に用いられるものは非常に複雑な形状に形成
されている。従って、このようなフレキシブル・プリン
ト基板に、形状に制約のある真空吸着方式によってＩＣ
チップをボンディングすることは不都合であった。なお
、この真空吸着方式にしても、搬送中のフレキシブル・
プリント基板に「反り」を生ずるのは上述の押さえ方式
と同様である。
本発明は上述のごとき従来技術の課題に鑑み、これを有
効に解決すべく創案されたものである。
したがって本発明の目的は、搬送中のフレキシブル・プ
リント基板に熱ストレスによる「反り」が生じるのを防
止し、また、複雑な形状のフレキシブル・プリント基板
にも適用可能なＩＣチップ搭載型フレキシブル・プリン
ト基板のボンディング方法を提供することにある。However, the conventional technology using the fixing method as described above has the following problems. That is, in the holding method, the carrier 5 is moved to the bonding position with the IC chip 53 placed in a predetermined position.
Flexible printed circuit board 5 transported by 2
1 is pressed and fixed by the presser fitting 50 for the first time in this position. However, a large number of IC chips 53 are placed one after another on the carrier 52, and the heat from the bonding process becomes conduction through the carrier 52 or direct radiant heat, causing heat to be absorbed during transportation before reaching the bonding position. Heat stress is also applied to flexible printed circuit boards, causing them to warp. Therefore, the flexible printed circuit board 51 comes to the bonding position already in a "warped" state, and from this state it is difficult to position it accurately even if it is pressed and fixed with the presser fitting '5Q. Further, in the vacuum suction method, since the magazine of the bonding machine that conveys the carrier is provided with a suction mechanism, the position on the carrier where the carrier can be suctioned is determined. Therefore, to use this method, it is necessary to position the IC mounting portion of the flexible printed circuit board that requires suction at this suction position. Therefore, the shape of this flexible printed circuit board is naturally restricted. However, flexible printed circuit boards are formed into various shapes depending on the design purpose, and those used for devices such as cameras are particularly formed into very complicated shapes. Therefore, ICs can be attached to such flexible printed circuit boards using a vacuum suction method that has restrictions on the shape.
Bonding the chips was inconvenient. Note that even with this vacuum suction method, flexible and
It is the same as the above-mentioned pressing method that causes "warpage" in the printed circuit board. The present invention has been devised in view of the problems of the prior art as described above and to effectively solve the problems. Therefore, an object of the present invention is to prevent "warping" caused by heat stress in flexible printed circuit boards during transportation, and to provide an IC chip-mounted flexible printed circuit that can be applied to flexible printed circuit boards with complex shapes. An object of the present invention is to provide a method for bonding substrates.
本発明に係るボンディング方法は、上述のごとき従来技
術の課題を解決し、その目的を達成するために以下のよ
うに行われる。
即ち、磁性体よりなるキャリアと磁石を装着した搬送押
さえ金具との間にフレキシブル・プリント基板を挟持し
た状態のまま、このフレキシブル・プリント基板を所定
のボンディング位置へ搬送シてボンディングを行う。こ
のように、フレキシブル・プリント基板を磁石とキャリ
アとの間に挟持した状態で搬送しすることによって、フ
レキシブル・プリント基板がボンディング位置へ至るま
でに熱ストレスを受けて変形するのを防止でき、ボンデ
ィング位置では確実に平面性を維持した状態でボンディ
ングを行える。また、フレキシブル・プリント基板が複
雑な形状をしていて、たとえ貫通穴を有するものであっ
ても、基板をキャリア上に確実に密着させられる。The bonding method according to the present invention solves the problems of the prior art as described above, and is carried out as follows in order to achieve the object. That is, while the flexible printed circuit board is held between a carrier made of a magnetic material and a conveyance presser fitted with a magnet, the flexible printed circuit board is conveyed to a predetermined bonding position and bonded. In this way, by transporting the flexible printed circuit board while being held between the magnet and the carrier, it is possible to prevent the flexible printed circuit board from being deformed due to thermal stress before reaching the bonding position, and the bonding Bonding can be performed while reliably maintaining flatness at the position. Furthermore, even if the flexible printed circuit board has a complicated shape and has through holes, the flexible printed circuit board can be reliably attached to the carrier.
以下に本発明の好適な一実施例について、第１図および
第２図を参照して説明する。
第１図は本発明に係るボンディング方法を採用した一実
施例のプリント基板およびキャリアとの関係を示す平面
図であり、第２図は第１図の■−■線矢視断面図である
。図中１はキャリアであり、一般のキャリアと同様にア
ンバー材等の磁性材により構成されている。図中２はフ
レキシブル・プリント基板であり、キャリア１上で所定
の位置に載置され、キャリア１上に載置されたときから
搬送押さえ金具３で押し付けられて搬送される。搬送押
さえ金具３はその下面に磁石４が嵌装されており、キャ
リア１上のフレキシブル・プリント基板２の上に置かれ
た状態では磁石４の磁力でキャリアｌに吸着される。即
ち、フレキシブル・プリント基板２はキャリア１と搬送
押さえ金具３との間でずれないようにサンドイッチ状に
挟持された状態で搬送され、ボンディング時にもそのま
まの挟持された状態でボンディングされる。このように
、フレキシブル・プリント基板２は搬送時から磁力吸着
で挟持されるで、その搬送時中に受ける熱ストレスによ
っても「反り」を生じることはな（、また、形状を問わ
ず、貫通穴の有無にも拘わらずボンディング時には確実
に平面性を維持した状態でキャリアｌ上に載置されてい
る。なお、図中５はＩＣチップである。
【効果］
以上の説明より明らかなように、本発明によれば次のご
とき優れた効果が発揮される。
即ち、搬送中のフレキシブル・プリント基板に熱ストレ
スによる「反り」が生じるのを防止し、また、たとえフ
レキシブル・プリント基板の形状が複雑なものであって
も、このボンディング領域が確実且つ平面的にキャリア
上に密着させられる。A preferred embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the relationship between a printed circuit board and a carrier in an embodiment employing the bonding method according to the present invention, and FIG. 2 is a cross-sectional view taken along the line ■--■ in FIG. In the figure, numeral 1 denotes a carrier, which is made of a magnetic material such as amber material like a general carrier. In the figure, reference numeral 2 denotes a flexible printed circuit board, which is placed at a predetermined position on the carrier 1, and from the time it is placed on the carrier 1, it is pressed by a conveyance presser metal fitting 3 and conveyed. A magnet 4 is fitted on the lower surface of the conveyance presser metal fitting 3, and when placed on the flexible printed circuit board 2 on the carrier 1, it is attracted to the carrier l by the magnetic force of the magnet 4. That is, the flexible printed circuit board 2 is transported while being held in a sandwich-like manner between the carrier 1 and the transport presser 3 so as not to shift, and is also bonded while being held in that state during bonding. In this way, the flexible printed circuit board 2 is clamped by magnetic attraction from the time of transportation, so it will not warp due to the thermal stress it receives during transportation (also, regardless of the shape, the through holes Regardless of the presence or absence of the chip, the chip is placed on the carrier l while reliably maintaining its flatness during bonding. Note that 5 in the figure is an IC chip. [Effect] As is clear from the above explanation, According to the present invention, the following excellent effects are exhibited: In other words, it prevents "warping" caused by heat stress on flexible printed circuit boards during transportation, and even if the flexible printed circuit board has a complicated shape, Even in the case of a carrier, this bonding region can be brought into close contact with the carrier reliably and planarly.
第１図は本発明に係るボンディング方法を採用した一実
施例のプリント基板およびキャリアとの関係を示す平面
図であり、第２図は第１図の■−■線矢視断面図である
。第３〜５図は従来例を示し、第３．４図は押さえ方式
によりプリント基板をキャリア上に固定する方法を示す
側面図および平面図であり、第５図は真空吸着方式によ
りプリント基板をキャリア上に固定する方法を示す要部
断面図である。
１・・・キャリア、２・・・フレキシブル・プリント基
板、３・・・搬送押さえ金具、４・、、磁石第１ 図
第２図FIG. 1 is a plan view showing the relationship between a printed circuit board and a carrier in an embodiment employing the bonding method according to the present invention, and FIG. 2 is a cross-sectional view taken along the line ■--■ in FIG. Figures 3 to 5 show conventional examples, Figures 3.4 are a side view and a plan view showing a method of fixing a printed circuit board on a carrier using a holding method, and Figure 5 shows a method of fixing a printed circuit board on a carrier using a vacuum suction method. FIG. 3 is a cross-sectional view of main parts showing a method of fixing on a carrier. DESCRIPTION OF SYMBOLS 1...Carrier, 2...Flexible printed circuit board, 3...Transportation clamp, 4...Magnet Figure 1 Figure 2
Claims (1)
を装着した搬送押さえ金具（３）との間にフレキシブル
・プリント基板（２）を挟持した状態のまま該フレキシ
ブル・プリント基板（２）を所定のボンディング位置へ
搬送してボンディングを行うことを特徴とするＩＣチッ
プ搭載型フレキシブル・プリント基板のボンディング方
法。(1), carrier (1) made of magnetic material, and magnet (4)
Bonding is performed by transporting the flexible printed circuit board (2) to a predetermined bonding position while holding the flexible printed circuit board (2) between it and the transport presser fitting (3) equipped with the flexible printed circuit board (2). A bonding method for flexible printed circuit boards mounted with IC chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63193219A JPH0242736A (en) | 1988-08-02 | 1988-08-02 | Bonding of ic-chip loading type flexible printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63193219A JPH0242736A (en) | 1988-08-02 | 1988-08-02 | Bonding of ic-chip loading type flexible printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242736A true JPH0242736A (en) | 1990-02-13 |
Family
ID=16304294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63193219A Pending JPH0242736A (en) | 1988-08-02 | 1988-08-02 | Bonding of ic-chip loading type flexible printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242736A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006498A (en) * | 1988-04-23 | 1991-04-09 | Kim Kwang Shick | Artificial stone wick for a burner and processes for the preparation thereof |
| CN104944180A (en) * | 2014-03-24 | 2015-09-30 | 机科发展科技股份有限公司 | Automatic feeding and blanking machine for FPCs |
| WO2018120244A1 (en) * | 2016-12-31 | 2018-07-05 | 深圳市配天机器人技术有限公司 | Sandblasting production line system for flexible printed circuit board and feeding device |
-
1988
- 1988-08-02 JP JP63193219A patent/JPH0242736A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5006498A (en) * | 1988-04-23 | 1991-04-09 | Kim Kwang Shick | Artificial stone wick for a burner and processes for the preparation thereof |
| CN104944180A (en) * | 2014-03-24 | 2015-09-30 | 机科发展科技股份有限公司 | Automatic feeding and blanking machine for FPCs |
| WO2018120244A1 (en) * | 2016-12-31 | 2018-07-05 | 深圳市配天机器人技术有限公司 | Sandblasting production line system for flexible printed circuit board and feeding device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6581278B2 (en) | Process and support carrier for flexible substrates | |
| US6049656A (en) | Method of mounting an integrated circuit on a printed circuit board | |
| US6138892A (en) | Method for mounting an integrated circuit from a tape carrier package on a printed circuit board | |
| KR100950523B1 (en) | Printed circuit board assembly and electronic device | |
| JPH0242736A (en) | Bonding of ic-chip loading type flexible printed-circuit board | |
| CN113163699A (en) | Method and device for attaching radiating fins of circuit board | |
| KR102050741B1 (en) | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | |
| JP2008078522A (en) | Carrier jig for flexible wiring substrate and electronic parts mounting method using the same | |
| JP3013848B1 (en) | Handling unit for transporting large substrate devices | |
| JPH09309085A (en) | Conveying device and semiconductor manufacturing device using the conveying device | |
| JPH10321654A (en) | Bonding device for chip | |
| JPH04370957A (en) | Multichip package | |
| JP3881447B2 (en) | TAB tape pasting device and TAB tape pasting method | |
| JPH065652A (en) | Wire bonding device | |
| JP2004349570A (en) | Adhesion palette for conveying substrate | |
| KR20010038101A (en) | Die bonding apparatus comprising die collet having die contact part of porous material | |
| JP2001274179A (en) | Chip mounter and method of manufacturing semiconductor device | |
| JP2001127496A (en) | Method for mounting semiconductor device | |
| JPH03263348A (en) | Ic sucking conveyor | |
| JPS63172500A (en) | Electronic component and method of aligning and mounting the same | |
| JPH0362532A (en) | Bonding device | |
| JP2005044870A (en) | Bonding equipment and packaging method of semiconductor device | |
| JPH01183899A (en) | Board holding apparatus | |
| JPH05112379A (en) | Packing material for semiconductor device | |
| JP2018049891A (en) | Component supply device and component supply method |