JP2018049891A - Component supply device and component supply method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a component supply device capable of transferring an electronic component without causing a positional shift or the like from a transfer jig.SOLUTION: A component supply device includes holding means 1, heating means 2, and transferring means 3. The holding means 1 holds a transfer jig 5 having an upper surface where an electronic component 4 is fixed by a magnetic force. The heating means 2 heats at least one of the transfer jig 5 or the electronic component 4. The transfer means 3 transfers the electronic component 4 from the upper surface of the transfer jig 5 to a unit of the following process when the at least one of the transfer jig or the electronic component is heated by the heating means 2 to a temperature at which the magnetic force is reduced.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a technology for conveying electronic components, and more particularly to a technology for supplying electronic components to an apparatus.

  Information devices and communication devices are becoming smaller and higher in performance, and electronic substrates such as wiring boards and semiconductor devices used in information devices and communication equipment are becoming finer and higher in density. In addition, along with miniaturization and high density, electronic components mounted on electronic substrates such as wiring boards and semiconductor devices have also been miniaturized, and high positional accuracy is required when mounting fine electronic components on electronic substrates. May be required. In addition, electronic components having various characteristics such as magnets are mounted on the electronic substrate.

  When mounting electronic components on an electronic board, for example, electronic components are aligned and mounted on a transport jig, transported to a mounting process device, and picked up and mounted from the transport jig. Is done. When carrying by such a method, it is necessary to securely fix the electronic component to the carrying jig in order to prevent displacement during the carrying.

  As a method of fixing the electronic component to the transport jig, for example, there is a method of forming an adhesive sheet on the transport jig and fixing the electronic component with the adhesive force of the adhesive sheet. However, in fixing with an adhesive sheet, when an electronic component is picked up from a conveying jig, if the holding force of the adhesive sheet is high, it may be difficult to peel the electronic component from the adhesive sheet. Moreover, if the holding force of the adhesive sheet is high, a large force is required at the time of picking up, and there is a possibility that picking up accuracy may be lowered. Therefore, in order to fix the electronic component and stably carry and pick up, development of a technique for holding the electronic component based on the characteristics of the electronic component has been performed. As a technique for holding an electronic component based on such characteristics, for example, a technique such as Patent Document 1 is disclosed.

  Patent Document 1 relates to a technique for fixing an electronic member partially including a magnetic material on a substrate. The mounting apparatus of Patent Document 1 includes an electronic component having a magnetic body, a substrate, and a magnetic induction element. The electronic component and the magnetic induction element are provided at positions facing each other through the substrate. In patent document 1, the electronic component which has a magnetic body is fixed on the board | substrate with the magnetic force which arises from the magnetic induction element provided in the position which opposes via a board | substrate. Japanese Patent Application Laid-Open No. H10-228667 describes that the electronic component can be accurately fixed at a predetermined position by fixing the electronic component to the substrate by such a method.

JP-A-62-242400

  However, the technique of Patent Document 1 is not sufficient in the following points. In patent document 1, the electronic component which has a magnetic body is being fixed with the magnetic force of the magnetic induction element with which the back surface side of the board | substrate was equipped. Therefore, when the technique of Patent Document 1 is used for conveyance by a conveyance jig and a pickup operation, it may be difficult to peel the electronic component from the conveyance jig due to the strength of fixing force due to magnetic force at the time of pickup. is there. Moreover, even if it can peel, there exists a possibility that position shift of an electronic component may arise by applying big force exceeding magnetic force. Therefore, Patent Document 1 is not sufficient as a technique for easily transporting an electronic component having a magnetic material to the next process without causing a positional shift or the like.

  In order to solve the above-described problems, an object of the present invention is to obtain a component supply apparatus that can easily transport an electronic component without causing a positional shift or the like from a conveying jig.

  In order to solve the above problems, the component supply apparatus of the present invention includes a holding unit, a heating unit, and a conveying unit. The holding means holds the conveyance jig in which the electronic component is fixed to the upper surface by magnetic force. The heating means heats at least one of the conveying jig or the electronic component. The conveying means conveys the electronic component from the upper surface of the conveying jig to the next process apparatus when heated by the heating means to a temperature at which the magnetic force decreases.

  The component supply method of this invention hold | maintains the conveyance jig with which the electronic component was fixed to the upper surface with magnetic force. The component supply method of the present invention heats at least one of the conveying jig or the electronic component. In the component supply method of the present invention, when heated to a temperature at which the magnetic force decreases, the electronic component is transferred from the upper surface of the transfer jig to the next process apparatus.

  According to the present invention, the electronic component can be easily transported from the transport jig without causing a positional shift or the like.

It is a figure which shows the outline | summary of a structure of the 1st Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 2nd Embodiment of this invention. It is a figure which shows the conveyance jig and electronic component of the 2nd Embodiment of this invention. It is the figure which showed the example of the structure of the surface mounting system of the 2nd Embodiment of this invention. It is the figure which showed the operation | movement flow at the time of performing surface mounting in the 2nd Embodiment of this invention. It is a figure which shows the outline | summary of a structure of the 3rd Embodiment of this invention. It is a figure which shows the conveyance jig and electronic component of the 3rd Embodiment of this invention.

(First embodiment)
A first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 shows an outline of the configuration of the component supply apparatus of the present embodiment. The component supply apparatus of this embodiment includes a holding unit 1, a heating unit 2, and a transport unit 3. The holding means 1 holds a conveying jig 5 in which the electronic component 4 is fixed to the upper surface by magnetic force. The heating means 2 heats at least one of the conveying jig 5 or the electronic component 4. The conveying means 3 conveys the electronic component 4 from the upper surface of the conveying jig 5 to the next process apparatus when heated to a temperature at which the magnetic force decreases by the heating means 2.

  Since the component supply apparatus of this embodiment holds the conveyance jig 5 in which the electronic component 4 is fixed to the upper surface by the magnetic force in the holding means 1, the electronic component is conveyed when the conveyance jig 5 is conveyed and set to the component supply apparatus. The position of 4 does not shift. Further, by heating at least one of the conveying jig 5 or the electronic component 4 by the heating unit 2, the magnetic force is reduced, and the electronic component 4 can be moved from the upper surface of the conveying jig 5. Therefore, the electronic device 4 can be easily transferred from the transfer jig 5 to the next process apparatus by the transfer means 3. As a result, the component supply apparatus of the present embodiment can easily transport the electronic component without causing a positional shift or the like.

(Second Embodiment)
A second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 shows an outline of the configuration of the component supply apparatus of the present embodiment.

  The component supply apparatus of this embodiment includes a supply stage 11, a heating unit 12, and a pickup unit 13. In addition, when the component supply apparatus operates, a conveying jig 20 is set on the upper portion of the heating unit 12. A plurality of electronic components 30 are placed on the transport jig 20. The electronic component 30 is formed by bonding a magnet 31 and a circuit component 32 with a bonding material 33.

  The component supply device according to the present embodiment is used as a device that supplies, to a SMT device, an electronic component 30 having a magnetic force used for mounting on a circuit board in a surface mount device (SMT) device, for example. The conveying jig 20 having the electronic component 30 supplied to the SMT device fixed on the upper surface is set in the component supplying device of the present embodiment, and the electronic component 30 is conveyed by the pickup unit 13, so that the electronic component 30 is mounted on the surface mounting device. Supply is made.

  The supply stage 11 includes a heating unit 12 on the upper surface. A conveying jig 20 is set on the upper surface of the heating unit 12 on the upper surface of the supply stage 11. The supply stage 11 of the present embodiment corresponds to the holding unit 1 of the first embodiment.

  The heating unit 12 includes a heater inside, and heats the conveyance jig 20 set on the top. The heating unit 12 performs heating to a temperature at which the magnetic force of the magnet 31 of the electronic component 30 is weakened. The heating temperature of the heating unit 12 is set to a temperature at which the magnetic force of the magnet 31 does not return even if the temperature called irreversible demagnetization is lowered. That is, the heating unit 12 performs heating in a temperature range in which the magnetic force of the magnet 31 recovers when the temperature decreases after the magnetic force of the magnet 31 decreases due to heating. The heating unit 12 of the present embodiment corresponds to the heating unit 2 of the first embodiment. Supply stage 11 and heating unit 12 may be formed as an integral part. The heating unit 12 may be provided inside the supply stage 11.

  The pickup unit 13 picks up the electronic component 30 on the conveying jig 20 and conveys it onto a substrate or the like on which the electronic component 30 is mounted. The pickup unit 13 holds the electronic component 30 by, for example, vacuum suction, picks up the electronic component 30 from the transport jig 20, and transports it to the next process apparatus. The pickup unit 13 of the present embodiment corresponds to the transport unit 3 of the first embodiment.

  The conveyance jig 20 has a function as a conveyance pallet that conveys a plurality of electronic components 30 in a state of being placed on the upper surface. The conveyance jig 20 has a flat surface portion for fixing the electronic component 30 on the upper surface. Further, the conveying jig 20 has thermal conductivity that transfers heat generated by the heating unit 12 to the electronic component 30. The conveying jig 20 is made of a magnetic material. The conveyance jig 20 formed of a magnetic body uses the magnetic force of the electronic component 30 having the magnet 31 to fix and hold the electronic component 30 on the upper surface. The conveyance jig 20 of the present embodiment is made of iron. The conveyance jig 20 may be formed of a magnetic material other than iron. Further, the conveying jig 20 may be a composite member of a magnetic material such as iron and a resin or ceramic as long as it has thermal conductivity.

  The electronic component 30 is a member in which a magnet 31 and a circuit component 32 are joined by a joining material 33. The magnet 31 of the present embodiment has a flat portion on the bottom surface. The magnet 31 loses its magnetic force when the temperature rises due to the heating of the heating unit 12, and recovers when the temperature falls due to cooling. For the bonding material 31, for example, an adhesive or solder is used. The circuit component 32 is a circuit element used in combination with the magnet 31. The electronic component 30 only needs to generate magnetic force and be fixed to the conveying jig 20, and does not need to have the magnet 31 on the bottom surface side. Further, the electronic component 30 may be a single magnet 31 or a plurality of circuit components may be laminated on the upper layer.

  The operation of the component supply apparatus of this embodiment will be described. First, a plurality of electronic components 30 are arranged and placed on the conveying jig 20. FIG. 3 shows a state in which the magnet 31 and the circuit component 32 joined by the joining material 33 are arranged and placed on the conveying jig 20. The electronic component 30 is fixed to the surface of the conveying jig 20 formed of a magnetic material by the magnetic force of the magnet 31 on the bottom side. Therefore, even when the transport jig 20 is transported, the positional deviation of the electronic component 30 placed on the upper surface does not occur.

  When the electronic component 30 is fixed to the conveyance jig 20, the conveyance jig 20 is set on the heating unit 12 of the supply stage 11. The transport jig 20 is transported by, for example, a transport arm and set on the heating unit 12.

  When the conveying jig 20 is set on the heating unit 12, the heating unit 12 turns on the heater and heats the conveying jig 20. The heater of the heating unit 12 may be always on. When the heater of the heating unit 12 is turned on, the bottom surface of the transport jig 20 is heated. When the bottom surface is heated, the heat is transmitted through the conveying jig 20 to the magnet 31 of the electronic component 30. Therefore, the magnet 31 of the electronic component 30 is heated by the heating unit 12 via the transport jig 20, and the temperature rises.

  When the temperature of the magnet 31 of the electronic component 30 increases, the magnetic force of the magnet 31 decreases. When the magnetic force of the magnet 31 is reduced, the pickup unit 13 picks up the electronic component 30 and conveys it onto the substrate on which the mounting is performed. When the electronic component 30 is transported onto the substrate to be mounted, the temperature of the magnet 31 is lowered, so that the magnet 31 again generates a magnetic force.

  The time from when the conveying jig 20 is set on the heating unit 12 to when the pickup unit 13 starts the pickup operation is set in advance based on the temperature and the time information until the magnetic force of the magnet 31 decreases. ing. A temperature sensor that measures the temperature of the conveying jig 20 may be attached, and the pickup unit 13 may start the pickup operation when the measured temperature becomes equal to or higher than the reference temperature.

  The electronic component 30 conveyed by the pickup unit 13 is mounted on the substrate. The pickup unit 13 repeats the pickup of the electronic component 30 and the conveyance onto the substrate until the electronic component 30 on the conveyance jig 20 runs out or the mounting process is completed.

  When the pickup and transport of the electronic component 30 are all completed, the heating unit 12 turns off the heater. When the heater of the heating unit 12 is always on, the heating unit 12 does not perform an operation of turning off the heater.

  When the operation of picking up the electronic component 30 is completed, the conveying jig 20 is removed from the heating unit 12. When there is a transport jig 20 on which the electronic component 30 to be operated next is placed, the transport jig 20 to be operated next is set on the heating unit 12 and the above operation is repeated.

  FIG. 4 schematically shows an example in which a surface mounting system is configured using the component supply device of the present embodiment as a component supply unit of the surface mounting device 60. In the example of FIG. 4, the electronic component 30 whose upper surface side is the circuit component 32 is picked up from the transport jig 20 by the pickup unit 13 and transported onto the circuit board 61 on the surface mounting device 60. The electronic component 30 conveyed on the circuit board 61 is mounted on the circuit board 61.

  FIG. 5 shows an operation flow when the electronic component 30 is aligned with the conveyance jig 20, the conveyance jig 20 is conveyed to the component supply device, and the electronic component 30 is mounted on the circuit board 61. It is. When the operation of transporting the electronic component 30 is started, first, the plurality of electronic components 30 are arranged and placed on the transport jig 20 (step 101). The electronic component 30 is fixed to the magnetic material transport jig 20 by a magnet 31 on the bottom surface side. When the electronic component 30 is fixed, the conveyance jig 20 is conveyed to the component supply device (step 102). When the conveyance jig 20 to which the electronic component 30 is fixed is conveyed to the component supply device, the conveyance jig 20 is set on the heating unit 12 provided in the supply stage 11 (step 103).

  When the conveyance jig 20 is set on the heating unit 12 of the supply stage 11, the heater of the heating unit 12 is turned on. When the heater is turned on, the temperature of the electronic component 30 increases and the magnetic force of the magnet 31 decreases. When the magnetic force of the magnet 31 is reduced, the electronic component 30 is not fixed to the conveying jig 20 and can be picked up.

  When the electronic component 30 can be picked up, the pickup unit 13 picks up the electronic component 30 from the transport jig 20 and transports it onto the circuit board 61 set in the surface mounting device 60 (step 104). When the electronic component 30 is transferred onto the circuit board 61, the electronic component 30 and the circuit board 61 are joined, and the electronic component 30 is mounted on the circuit board 61 (step 105). When there are other components to be mounted, the operation from the pickup is repeated.

  In the component supply apparatus of the present embodiment, a magnetic material transport jig 20 that holds an electronic component 30 fixed by the magnetic force of a magnet 31 on its upper surface is set on a heating unit 12 provided on a supply stage 11. The Since the conveying jig 20 is set in a state where the electronic component 30 is fixed by a magnetic force, the electronic component 30 is not misaligned during conveyance or setting. In addition, in a state where the magnet 31 is heated by the heating unit 12 and the magnetic force is reduced, the electronic component 30 is picked up by the pickup unit 13 and reacted to the apparatus in the next process. Since the pickup is performed in a state where the magnetic force is reduced, the electronic component 30 is easily peeled off from the conveying jig 20. For this reason, since a large force is not required at the time of picking up, it is possible to prevent positional deviation at the time of picking up. As a result, the component supply apparatus of the present embodiment can easily convey an electronic component having a magnetic force without causing a positional shift or the like from the conveyance jig.

(Third embodiment)
A third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 6 shows an outline of the configuration of the component supply apparatus of the present embodiment.

  The component supply apparatus of this embodiment includes a supply stage 11, a heating unit 12, and a pickup unit 13. In addition, when the component supply apparatus operates, a conveying jig 40 is set on the upper portion of the heating unit 12. The conveying jig 40 has a magnet 41. In addition, the electronic components 50 are respectively placed at positions corresponding to the magnets 41 of the conveying jig 40.

  The component supply apparatus according to the second embodiment picks up the electronic component 30 from the conveyance jig 20 to which the electronic component 30 is fixed by a combination of the magnetic conveyance jig 20 and the electronic component 30 having the magnet 31. It was. Instead of such a configuration, the component supply apparatus according to the present embodiment has an electronic component from the conveyance jig 40 in which the electronic component 50 is fixed by a combination of the conveyance jig 40 having the magnet 41 and the magnetic electronic component 50. The part 50 is picked up.

  The component supply apparatus of this embodiment is used as an apparatus for supplying a magnetic electronic component 50 used for mounting on a circuit board in a surface mounting apparatus to the surface mounting apparatus, for example. A conveyance jig 40 that fixes an electronic component 50 to be supplied to the surface mounting device on the upper surface is set in the component supply device of the present embodiment, and the electronic component 50 is conveyed by the pickup unit 13, whereby the electronic component 50 is transferred to the surface mounting device. Is supplied.

  The configurations and functions of the supply stage 11, the heating unit 12, and the pickup unit 13 of the present embodiment are the same as those of the second embodiment.

  The conveyance jig 40 has a function as a conveyance pallet that conveys a plurality of electronic components 50 placed on the upper surface. The conveying jig 40 may be any material that conducts heat to the magnet 41, and is formed of a non-magnetic metal material such as aluminum, an inorganic material, a resin material, or a composite material thereof. In addition, magnets 41 are formed at positions where the electronic component 50 of the conveying jig 40 is placed.

  The magnet 41 is formed on the upper surface side of the transport jig 40. The magnet 41 loses its magnetic force when the temperature rises due to the heating of the heating unit 12, and recovers when the temperature falls due to cooling.

  The electronic component 50 is a member having a magnetic body. The electronic component 50 has a horizontal portion on the bottom surface.

  The operation of the component supply apparatus of this embodiment will be described. First, the electronic components 50 are arranged and placed at positions corresponding to the magnets 41 of the conveying jig 40. FIG. 7 shows a state in which the electronic component 50 is placed in alignment on the transport jig 40. Since the electronic component 50 is formed of a magnetic material, the electronic component 50 is fixed to the surface of the conveyance jig 40 by the magnetic force of the magnet 41 of the conveyance jig 40. Therefore, even when the transport jig 40 is transported, the positional deviation of the electronic component 50 placed on the upper surface does not occur.

  When the electronic component 50 is fixed to the conveyance jig 40, the conveyance jig 40 is set on the heating unit 12 of the supply stage 11. The transport jig 40 is transported by, for example, a transport arm and set on the heating unit 12.

  When the conveying jig 40 is set on the heating unit 12, the heating unit 12 turns on the heater and heats the conveying jig 40. The heater of the heating unit 12 may be always on. When the heater of the heating unit 12 is turned on, the bottom surface of the conveying jig 40 is heated. Further, when the bottom surface is heated, the temperature of the magnet 41 of the conveying jig 40 increases.

  When the temperature of the magnet 41 of the conveying jig 40 increases, the magnetic force of the magnet 41 decreases. When the magnetic force of the magnet 41 is reduced, the pickup unit 13 picks up the electronic component 50 and conveys it onto the substrate on which the mounting is performed.

  The time from when the conveying jig 40 is set on the heating unit 12 to when the pickup unit 13 starts the pickup operation is set in advance based on information about the temperature and the time until the magnetic force of the magnet 31 decreases. ing. A temperature sensor that measures the temperature of the conveying jig 40 may be attached, and the pickup unit 13 may start the pickup operation when the measured temperature becomes equal to or higher than the reference temperature.

  The electronic component 50 conveyed by the pickup unit 13 is mounted on the substrate. The pickup unit 13 repeats the pickup of the electronic component 50 and the conveyance onto the substrate until the electronic component 50 on the conveyance jig 40 runs out or the mounting process is completed.

  When the pickup and transport of the electronic component 50 are all completed, the heating unit 12 turns off the heater. When the heater of the heating unit 12 is always on, the heating unit 12 does not perform an operation of turning off the heater.

  When the operation of picking up the electronic component 50 is completed, the conveying jig 40 is removed from the heating unit 12. When removed from the heating unit 12, the magnet 41 of the conveying jig 40 recovers the magnetic force because the temperature decreases. When there is a transport jig 40 on which the electronic component 50 to be operated next is placed, the transport jig 40 to be operated next is set on the heating unit 12 and the above operation is repeated.

  In the component supply apparatus according to the present embodiment, the magnetic material transport jig 40 holding the electronic component 50 fixed by the magnet 41 of the transport jig 40 on the upper surface is provided on the heating unit 12 provided on the supply stage 11. Set to Since the conveyance jig 40 is set in a state where the electronic component 50 is fixed by a magnetic force, the electronic component 50 is not displaced during conveyance or setting. In addition, in a state where the magnet 41 is heated by the heating unit 12 and the magnetic force is reduced, the electronic component 50 is picked up by the pickup unit 13 and conveyed to an apparatus or the like for the next process. Since the pickup is performed in a state where the magnetic force is reduced, the electronic component 50 is easily peeled off from the conveying jig 40. For this reason, since a large force is not required at the time of picking up, it is possible to prevent positional deviation at the time of picking up. As a result, the component supply apparatus of the present embodiment can easily convey the magnetic electronic component without causing a positional shift from the conveying jig.

  In 2nd and 3rd embodiment, although the conveyance jig was heated with the heater from the lower surface side, another heating system may be sufficient. For example, the temperature of the magnet may be increased by heating by a non-contact heating method such as an infrared heating method. Moreover, when performing such heating, you may heat from the upper surface side of a conveyance jig.

  In each figure of the second and third embodiments, an example is shown in which three electronic components are fixed to a conveying jig on a straight line, but the number of electronic components may be other than three. A plurality of electronic components may be arranged in a plurality of rows. Further, a plurality of types of electronic components may be fixed on one transport jig.

  In the second and third embodiments, only one conveyance jig is set in the component supply device. However, the component supply device may be configured such that a plurality of conveyance jigs can be set simultaneously. In addition, the component supply device may have a configuration in which the conveyance jig of the second embodiment and the conveyance jig of the third embodiment can be set at the same time, or a configuration in which another type of conveyance jig can be set at the same time. There may be.

DESCRIPTION OF SYMBOLS 1 Holding means 2 Heating means 3 Conveying means 4 Electronic component 5 Conveying jig 11 Supply stage 12 Heating part 13 Pickup part 20 Conveying jig 30 Electronic component 31 Magnet 32 Circuit component 33 Bonding material 40 Conveying jig 41 Magnet 50 Electronic component 60 Surface mount equipment 61 Circuit board

Claims (10)

Holding means for holding a conveying jig in which an electronic component is fixed to the upper surface by magnetic force; and heating means for heating at least one of the conveying jig or the electronic component;
A conveying means for conveying the electronic component from the upper surface of the conveying jig to the next process apparatus when heated by the heating means to a temperature at which the magnetic force is reduced;
A component supply apparatus comprising: The holding means holds the conveyance jig of a magnetic body in which the electronic component is fixed on an upper surface by the magnetic force generated from the electronic component,
2. The component supply apparatus according to claim 1, wherein the transport unit transports the electronic component when the magnetic force generated from the electronic component is weakened when the electronic component is heated. The holding means holds the transport jig in which the electronic component of the magnetic body is fixed on the upper surface by the magnetic force generated from the transport jig,
2. The component supply apparatus according to claim 1, wherein when the conveyance jig is heated, the conveyance unit conveys the electronic component when the magnetic force generated from the conveyance jig is weakened. 3.   The holding means holds the transport jig in which the magnetic electronic parts are fixed to the upper surface of each magnet by the magnetic force generated from the magnet provided on the upper surface side of the transport jig. The component supply device according to claim 3.   5. The component supply device according to claim 1, wherein the heating unit performs heating in a temperature range in which the magnetic force is restored when the temperature is lowered after the magnetic force is reduced by heating. The component supply apparatus according to any one of claims 1 to 5,
A surface mounting device for surface mounting electronic components on a circuit board;
With
The surface mounting apparatus is characterized in that the electronic component conveyed by the conveying means from the upper surface of the conveying jig is surface-mounted on the circuit board. Hold the transport jig with electronic parts fixed on the top surface by magnetic force,
Heating at least one of the conveying jig or the electronic component;
When heated to a temperature at which the magnetic force decreases, the electronic component is transported from the upper surface of the transport jig to an apparatus for the next process. Holding the transfer jig of the magnetic body with the electronic component fixed on the upper surface by the magnetic force generated from the electronic component;
The component supply method according to claim 7, wherein the electronic component is transported when the magnetic force generated from the electronic component is weakened when the electronic component is heated. Holding the transport jig in which the magnetic electronic component is fixed to the upper surface by the magnetic force generated from the transport jig,
The component supply method according to claim 7, wherein the electronic component is transported when the magnetic force generated from the transport jig is weakened when the transport jig is heated.   The said magnetic jig | tool hold | maintains the said conveyance jig by which the said electronic component of the magnetic body was fixed to the upper surface for every said magnet with the said magnetic force produced from the magnet with which the upper surface side of the said conveyance jig | tool was equipped. The component supply method described in 1.

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