JP2002329733A - Part mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a part mounting machine constituted such that it mounts a subject on a stage provided with a heater and mounts parts held by a head and carried above the subject on the heated subject, in which the unit time is shortened by rationally performing exchange of trays in a part mounting area. SOLUTION: The part mounting machine is equipped with a plurality of stages 3, where the stages 3 are constituted in a relatively movable manner in a horizontal direction for a head 8, and one of a plurality of the stages 3 is constituted so as to position at a mounting area for the head 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting an electronic component such as a chip component on an object to be mounted such as a heated substrate or a package.

[0002]

2. Description of the Related Art FIG. 10 shows an example of a conventional example of such a component mounting apparatus. The component mounting apparatus includes a tray 32 in which a plurality of mounting targets 31 are placed and accommodated,
Is mounted on a mounting stage 34 provided with
3, the mounting object 31 on the tray 32 is heated, and the components 36 conveyed by the mounting head 35 are sequentially mounted on the heated mounting object 31. Also, while the component mounting is being performed, another tray 32 in which a group of mounting objects 31 to be mounted next is placed and housed.
Is mounted on a preheating stage 37 in which a heater 38 is incorporated, and preheating is performed. And mounting stage 3
4 is completed, the tray 32 holding the mounting target 31 on which the components have been mounted is placed on the mounting stage 34.
And the tray 32 on the preliminary heating stage 37 is carried into the mounting stage 34, and the temperature of the mounting object 31 lowered during this carrying-in operation is reheated to a predetermined temperature, and then the component mounting process is executed. Is done.

[0003]

However, in the above-described conventional apparatus in which the pre-heating stage 37 preheats the next mounting object 31, the tray 32 is moved to the mounting stage 34.
Since the temperature of the mounting object 31 decreases while replacing the
The mounting stage 34 before actually shifting to the component mounting process
The time required for reheating above is required, and the time required for reheating is required in addition to the time for replacing the tray, resulting in a longer tact time.

The present invention has been made in view of such a point, and an object of the present invention is to shorten a tact time by rationally replacing a tray with a component mounting area. .

[0005]

In order to achieve the above object, the present invention has the following configuration.

That is, according to the first aspect of the present invention, there is provided a component mounting apparatus in which a mounting target is mounted on a mounting stage provided with a heater, and is transported above the mounting target while being held by a mounting head. In a component mounting apparatus configured to sequentially mount the heated mounting target group, a plurality of the mounting stages are provided, and the mounting stages are configured to be relatively movable in the horizontal direction with respect to the mounting head, It is characterized in that one of the plurality of mounting stages is positioned in a mounting area for the mounting head.

According to a second aspect of the present invention, in the component mounting apparatus according to the first aspect of the present invention, the plurality of mounting stages are each configured to be independently movable horizontally, and the mounting head is configured to be movable only in the vertical direction. I have. [Operation] According to the configuration of the first aspect of the present invention, only one mounting stage is in the component mounting area, and while the component mounting is being performed, the other mounting stage heats the mounting target. Will be When the component mounting on the mounting stage in the component mounting area is completed, this mounting stage is carried out of the component mounting area, and the other mounting stages that have been waiting while performing the heating process are replaced with the component mounting area. Then, component mounting is started immediately. In the mounting stage carried out from the component mounting area, the mounting target on which the component is mounted is taken out, and a new mounting target is loaded and subjected to a heating process.
It should be noted that the present invention is not limited to one in which one mounting object is arranged on one mounting stage.
What is arranged on a mounting stage of a stand may be used.

According to the configuration of the second aspect of the present invention, the mounting stage in the component mounting area can move independently to perform positioning with respect to the mounting head.
Other mounting stages during the heat treatment can be fixed at predetermined positions.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention, and FIG. 2 is a front view showing the schematic configuration. On the upper surface of the device frame 1 of this component mounting apparatus, two mounting stages 3 for mounting and supporting a package 2 which is an example of a mounting target, and a component supply unit 5 in which components 4 such as chip components are aligned and stored. Are mounted above the apparatus frame 1, a component transport stage 6 as component transport means, a component supply unit 7 for supplying the component 4 taken out from the component supply unit 5 to the component transport stage 6, and a component transport stage 6. A mounting head 8 for receiving the component 4 supplied to the mounting stage 3 and mounting the component 4 on the mounting stage 3, an imaging mechanism 9 for capturing positional information (position, posture, shape, etc.) of the component 4 and the package 2 before mounting, And the like are arranged. The detailed configuration and function of each unit will be described below.

On each of the two mounting stages 3, a tray 10 on which the packages 2 are aligned and loaded is detachably mounted, and a heater 11 is built in the tray mounting portion. 2 is moderately heated.

Each mounting stage 3 includes a control device 3
0, which is connected to a driving means (not shown) that operates in accordance with a command from the mounting head 8 so that it can move left and right over a mounting area below the mounting head 8 and a standby position deviated left and right from the mounting area, and can also move in the front-back direction It is configured.
Note that the standby position may be set at a position deviated forward and backward with respect to the mounting area below the mounting head 8.

As shown in FIG. 2, the tray 10 is pressed against the mounting stage 3 with an appropriate load by a tray pressing member 12 provided on the upper surface of the tray 10 so as not to be warped by heating. The tray holding member 12 is made of a stainless steel plate, has an opening 13 for exposing the package 2, and is provided with a number of protrusions 14 at appropriate positions on the lower surface of the tray holding member 12. Is pressed. By pressing the tray 10 in a point contact state as described above, the tray pressing member 12 itself is prevented from being warped and deformed by heating, and thus the tray 10 is completely adhered to the mounting stage 3 and Is efficiently transmitted to the tray 10 so that each package 2 is uniformly heated.

The component supply unit 7 can be moved up and down and horizontally by driving means (not shown) connected to the control device 30, and the suction nozzles 15 hold the components 4 arranged and accommodated in the component supply unit 5 one by one. Then, it is configured to be unloaded and supplied to the upper surface of the component transfer stage 6.

The component transport stage 6 is also connected to drive means (not shown) which operates according to a command from the control device 30.
Is carried in the vertical movement locus of the mounting head 8 and is movable up and down and left and right so as to be delivered to the mounting head 8. A reflection member 16 (a prism, a reflection mirror, a half mirror, or the like) that constitutes a part of the imaging mechanism 9 is provided on a side portion of the component transport stage 6.

The mounting head 8 includes a component transfer stage 6
And a component holding unit 17 such as a suction nozzle for receiving the component 4 carried in the vertical movement locus. The component holding unit 17 is configured to be vertically movable between an upper standby position and a lower mounting position. The component holder 17 is configured to be able to control the rotation about the vertical axis in order to change.

The imaging mechanism 9 includes the component 4 held by the component holding portion 17 of the mounting head 8 and the package 2 on the tray 10 by using the reflecting member 16 provided on the component transport stage 6 and the reflecting member 18 having a fixed position. It is composed of a camera 19 for a component to be imaged through the camera and a camera 20 for a package.

The basic structure of the component mounting apparatus according to the present invention is as described above. Next, the component mounting operation will be described in the order of steps with reference to FIGS.

(1) As shown in FIG. 4, when it is confirmed that the mounting of the component 4 on the package 2 has been completed, the mounting head 8 starts to rise as indicated by a virtual line in FIG. At the same time, the component transfer stage 6 advances toward the moving path of the mounting head 8.

(2) As shown in FIG. 5, when the mounting head 8 is lifted, the mounting stage 3 moves in the horizontal direction at a pitch, and sets the next package 2 to be mounted at a position immediately below the mounting head 8.

(3) When the mounting head 8 rises to a certain height, the component transport stage 6 which has held the component 4 and has moved in the horizontal direction moves upward just below the rising mounting head 8.

(4) Here, the control device 30 is operated to perform at least one of deceleration control of the ascending speed of the mounting head 8 and increasing control of the ascending speed of the component transfer stage 6. The ascending speed difference between the mounting head 8 and the component transfer stage 6 is gradually reduced, and as shown in FIG. It is delivered to the component holder 17 of the mounting head 8. After this delivery,
The component transfer stage 6 starts lowering.

(5) As shown in FIG. 7, while the parts are delivered and the mounting head 8 reaches the upper standby position,
The component transport stage 6 moves laterally while descending, and the reflecting member 16 is positioned between the component 4 held by the mounting head 8 and the package 2 located immediately below the component 4. The component 4 and the package 2 are respectively imaged.

In this case, it is desirable to take an image at a position where the optical path length from the component 4 to the component camera 19 is equal to the optical path length from the package 2 to the package camera 20.

Also, during this imaging step, the transparent plate 21 normally retracted moves forward and horizontally to cover the package 4 from above, and the imaging error due to the fluctuation of air heated by the heat for heating the package. Suppress. In addition, by blowing the air from the blower 22 above the transparent plate 21 covering the package 2 to remove the fluctuation of the air above the transparent plate 21, the imaging error can be further reduced. In this case, since the wind from the blower 22 is blocked by the transparent plate 21 and is not directly blown onto the package 2, the temperature of the package 2 does not decrease.

The above-described imaging is performed a plurality of times, and the imaging data is averaged by a predetermined procedure stored and set in the control device 30, so that the accuracy of the position information is further improved.

(6) The obtained position information is calculated and analyzed in the control device 30, and the positional deviation between the component 4 and the package 2 is determined. Based on the displacement amount, the mounting head 8
, And the two-dimensional movement of the mounting stage 3 in the horizontal direction.

(7) When the position correction is completed, as shown in FIG. 8, the component transfer stage 6 moves horizontally back to the standby position for receiving the component supply, and the mounting head 8 is moved down to be heated. The component 4 is pressed and mounted on the package 2.

(8) One component mounting process is completed as described above, and the above operation is repeated thereafter.

(9) While the component mounting process is being performed on one mounting stage 3, preheating of the package 2 to be processed next is performed on the other mounting stage 3.

(10) When the component mounting process on one mounting stage 3 is completed, the mounting stage 3 moves to a standby position outside the mounting area below the mounting head 8 as shown in FIG. Then, the other mounting stage 3 that has been waiting while performing the heating process is advanced to the mounting area, and the component mounting process to the package group mounted on the other mounting stage 3 is performed in the above-described procedure.

(11) Then, on the mounting stage 3 retreated from the mounting area to the standby position, the tray 10 on which the component mounting process has been completed is carried out, and the tray 10 on which a new package 2 is mounted is loaded.

[Other Embodiments] The present invention can also be carried out in the following modes.

(1) A plurality of mounting stages 3 may be connected and moved integrally.

(2) A plurality of mounting stages 3 are mounted on a turntable, and the turntable is rotated and stopped, so that only one mounting stage 3 is positioned in the mounting area and mounting processing is performed. It can also be configured as follows.

(3) A plurality of mounting stages 3 may be arranged in parallel at predetermined positions, and the mounting head 8 may be moved onto each mounting stage 3 to mount components.

[0037]

As is clear from the above description, the following effects can be expected according to the present invention.

According to the component mounting apparatus of the present invention, the mounting stage on which the mounting object on which the component mounting is completed is carried out from the component mounting area, and the mounting stage component on which the new mounting object is mounted is mounted. Loading into the mounting area,
The process can be performed with or without a time difference, and the process can be immediately shifted to the component mounting process without the need for waiting time for reheating. As a result, the tact time can be reduced, and the work efficiency can be reduced. Can be improved.

According to the component mounting apparatus of the present invention, the mounting stage in the component mounting area can be arbitrarily moved while fixing the position of the standby mounting stage while heating, thereby mounting the component. Positioning operation can be performed.Compared to the case of connecting multiple mounting stages and performing tact operation integrally to perform positioning, the structure to be operated is lighter, and positioning can be performed with high accuracy and speed. It is effective to let you do it.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention.

FIG. 2 is a front view showing a schematic configuration of a component mounting apparatus according to the present invention.

FIG. 3 is a perspective view of the tray holding member viewed from the back side.

FIG. 4 is a front view showing a component mounting process.

FIG. 5 is a front view showing a component mounting process.

FIG. 6 is a front view showing a component mounting process.

FIG. 7 is a front view showing a component mounting process.

FIG. 8 is a front view showing a component mounting process.

FIG. 9 is a front view showing a component mounting process.

FIG. 10 is a front view showing a schematic configuration of a conventional example.

[Explanation of symbols]

 2 mounting target 3 mounting stage 4 parts 8 mounting head 10 tray 11 heater

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Nobuhiro Hino 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto, Japan Inside Murata Manufacturing Co., Ltd. (72) Shinji Takagura 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto, Japan Stock Company F-term in Murata Manufacturing (reference) 5E313 AA01 AA11 EE38 FF24 FF28 FF29 5F047 AA13 FA01 FA65 FA72 FA79

Claims (2)

[Claims] 1. A mounting object is mounted on a mounting stage provided with a heater, and a component held by a mounting head and conveyed above the mounting object is mounted on a heated mounting object. In the configured component mounting apparatus, a plurality of the mounting stages are provided, and the mounting stages are configured to be relatively movable in a horizontal direction with respect to the mounting head, and one of the plurality of mounting stages is mounted on the mounting head. A component mounting apparatus characterized by being configured to be located in an area. 2. The component mounting apparatus according to claim 1, wherein each of the plurality of mounting stages is configured to be independently movable horizontally, and the mounting head is configured to be able to move only vertically.