JP4465914B2 - Electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for mounting an electronic component such as a chip component on a mounting object such as a heated substrate or package.
[0002]
[Prior art]
FIG. 11 shows an example of a conventional example of this type of component mounting apparatus. In this component mounting apparatus, a tray 32 on which a plurality of mounting objects 31 are placed and stored is mounted on a mounting stage 34 provided with a heater 33, and the mounting object 31 on the tray 32 is heated by the heater 33. The component 36 conveyed by the mounting head 35 is mounted on the heated mounting object 31. In this case, the tray 32 may be warped due to heating, and when the warp occurs, the tray 32 is locally lifted from the mounting stage 34, and heat from the mounting stage 34 is not efficiently and uniformly transmitted to the tray 32. As a result, uneven heating of the mounting object 31 occurs. Therefore, conventionally, a tray pressing member 37 made of a stainless steel plate or the like is provided on the upper surface of the tray 32 so that the tray 32 is pressed against the mounting stage 34.
[0003]
[Problems to be solved by the invention]
However, in the above conventional apparatus, the tray pressing member 37 is brought into surface contact with the tray 32 to suppress warpage. Therefore, when the tray pressing member 37 itself warps due to thermal strain, the tray 32 is attached to the mounting stage 34. It was impossible to hold down the entire surface, and the intended function could not be fully exhibited.
[0004]
In order to hold the tray with high flatness without warping, it is conceivable to increase the thickness of the tray pressing member. Since the mounting head has to wait at a high position so as not to interfere with the presser member, there is a possibility that the tact time of the mounting operation may be delayed by increasing the working distance of the mounting head.
[0005]
The present invention has been made paying attention to such points, and by improving the tray pressing member, the tray can be brought into contact with the mounting stage without warping, and the mounting object group on the tray can be made uniform. The purpose is to be able to heat.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is configured as follows.
[0007]
That is, the electronic component mounting apparatus according to the first aspect of the present invention mounts a tray on which a plurality of mounting objects are placed and accommodated on a mounting stage provided with a heater, and heats the mounting object on the tray by the heater. In the electronic component mounting apparatus configured to mount the electronic component conveyed by the mounting head on the heated mounting target, a tray pressing member that presses the tray against the mounting stage is provided, and the tray A plurality of protrusions that are point- contact pressed against the tray are provided on the lower surface of the pressing member.
[0009]
According to a second aspect of the present invention, there is provided the electronic component mounting apparatus according to the first aspect of the invention, wherein the protrusion is supported on the tray pressing member so as to be elastically retractable.
[Action]
According to the configuration of the invention according to claim 1, the contact area between the tray and the tray pressing member is small, the heat transfer from the tray to the tray pressing member is small, and the thermal strain of the tray pressing member itself is small. Become.
[0011]
According to the configuration of the invention according to claim 2 , even if the tray pressing member is somewhat deformed, the pressing of the tray by the elastically retractable protrusion can be stably maintained.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0013]
FIG. 1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus according to the present invention, and FIG. 2 is a front view showing the schematic configuration. On the upper surface of the apparatus frame 1 in this electronic component mounting apparatus, a component supply unit that accommodates and accommodates two mounting stages 3 for mounting and supporting a package 2 that is an example of a mounting target, and components 4 such as chip components. 5, and a component conveying stage 6 as a component conveying unit, a component supply unit 7 for supplying the component 4 taken out from the component supply unit 5 to the component conveying stage 6, and a component conveying stage. 6, the mounting head 8 that receives the component 4 supplied to the mounting stage 3 and mounts it on the package 2 on the mounting stage 3, and the imaging mechanism 9 for taking in the positional information (position, posture, shape, etc.) of the component 4 and the package 2 before mounting. , Etc. are arranged, and the detailed configuration and function of each part will be described below.
[0014]
A tray 10 in which the packages 2 are aligned and loaded is detachably mounted on each of the two mounting stages 3, and a heater 11 is built in the tray mounting portion. To be heated.
[0015]
Each mounting stage 3 is connected to a driving means (not shown) that operates according to a command from the control device 30 and is movable left and right across a mounting area below the mounting head 8 and a standby position that is shifted to the left and right. And it is comprised so that a movement in the front-back direction is also possible.
[0016]
As shown in FIG. 2, the tray 10 is pressed against the mounting stage 3 with an appropriate load by a tray pressing member 12 provided on the upper surface of the tray 10 so as not to be warped by heating. The tray pressing member 12 is made of a stainless steel plate, and an opening 13 for exposing the package 2 is formed. A number of protrusions 14 are provided at appropriate positions on the lower surface of the tray pressing member 12, and the tray 10 is in a point contact state at a plurality of locations. It is pressed with. By pressing the tray 10 in a point contact state in this way, the tray pressing member 12 itself is prevented from warping and deforming due to heating, and thus the tray 10 is brought into close contact with the mounting stage 3 from the heater 11. Is efficiently transmitted to the tray 10 so that each package 2 is uniformly heated.
[0017]
The component supply unit 7 can be moved up and down and horizontally by a driving means (not shown) connected to the control device 30, and the components 4 aligned and accommodated in the component supply unit 5 are sucked and held one by one by the suction nozzle 15. However, it is configured to be supplied to the upper surface of the component transport stage 6.
[0018]
The component transport stage 6 is also connected to a driving means (not shown) that operates according to a command from the control device 30, and the component 4 supplied by the component supply unit 7 is carried into the vertical movement locus of the mounting head 8 and mounted. It is configured to be movable up and down and left and right so as to be transferred to the head 8. Further, a reflection member 16 (prism, reflection mirror, half mirror, etc.) that constitutes a part of the imaging mechanism 9 is provided on the side of the component transport stage 6.
[0019]
The mounting head 8 includes a component holding unit 17 such as a suction nozzle that receives the component 4 carried in the vertical movement locus by the component transport stage 6 and is configured to be vertically movable between an upper standby position and a lower mounting position. In addition, in order to change the angle of the held component 4, the component holding portion 17 is configured to be capable of rotation control around the vertical axis.
[0020]
The imaging mechanism 9 images the component 4 held by the component holding unit 17 of the mounting head 8 and the package 2 on the tray 10 via the reflection member 16 provided on the component conveyance stage 6 and the reflection member 18 having a fixed position. A component camera 19 and a package camera 20 are provided.
[0021]
The basic configuration of the electronic component mounting apparatus according to the present invention is as described above. Next, the component mounting operation will be described in the order of steps based on FIGS.
[0022]
(1) As shown in FIG. 4, when it is confirmed that the mounting of the component 4 to the package 2 is completed, the mounting head 8 starts to rise as shown by the phantom line in FIG. The transfer stage 6 advances toward the moving path of the mounting head 8.
[0023]
(2) As shown in FIG. 5, when the mounting head 8 moves up, the mounting stage 3 moves in the horizontal direction and the package 2 to be mounted next is set at a position directly below the mounting head 8.
[0024]
(3) When the mounting head 8 rises to a certain height, the component transport stage 6 that has moved in the horizontal direction while holding the component 4 moves upward while being pulled directly under the mounting head 8 that is being lifted.
[0025]
(4) Here, the control device 30 is operated to perform at least one of the deceleration control of the ascending speed of the mounting head 8 and the acceleration control of the ascending speed of the component transport stage 6, thereby performing the mounting head 8. As shown in FIG. 6, the difference in the ascending speed between the mounting head 8 and the component transport stage 6 is gradually reduced. To the component holding unit 17. After the delivery is completed, the component transport stage 6 starts a lowering operation.
[0026]
(5) As shown in FIG. 7, the parts are delivered and the mounting head 8 reaches the upper standby position, while the parts transport stage 6 moves sideways while descending, and the parts 4 held by the mounting head 8 Then, the reflecting member 16 is positioned between the package 2 and the package 2 located immediately below, and the component 4 and the package 2 are respectively imaged by the component camera 19 and the package camera 20.
[0027]
In this case, it is desirable to capture an image at a position where the length of the optical path from the component 4 to the component camera 19 is equal to the length of the optical path from the package 2 to the package camera 20.
[0028]
Further, when entering the imaging process, the transparent plate 21 that has been normally retracted is moved horizontally to cover the package 4 from above, and an imaging error due to fluctuation of air heated by the heat for heating the package is suppressed. . Further, by blowing the wind from the blower 22 above the transparent plate 21 covering the package 2 and removing the fluctuation of the air above the transparent plate 21, the imaging error can be further reduced. In this case, since the wind from the blower 22 is not blocked by the transparent plate 21 and is not directly blown onto the package 2, the temperature of the package 2 does not decrease.
[0029]
The imaging is performed a plurality of times, and the imaging data is averaged according to a predetermined procedure stored and set in the control device 30, thereby further improving the accuracy of the position information.
[0030]
(6) The obtained position information is calculated and analyzed in the control device 30, and the positional deviation between the component 4 and the package 2 is determined. Based on the deviation amount, the positional deviation is corrected by the rotation of the component holding unit 17 in the mounting head 8 and the two-dimensional movement of the mounting stage 3 in the horizontal direction.
[0031]
(7) When the position correction is completed, as shown in FIG. 8, the component transport stage 6 moves horizontally back to the standby position for receiving the component supply, and the mounting head 8 moves down to the heated package 2. The component 4 is press-fitted.
[0032]
(8) One part mounting process is completed as described above, and the above operation is repeated thereafter.
[0033]
(9) While the component mounting process on one mounting stage 3 is being performed, preheating of the package 2 to be processed next is performed on the other mounting stage 3.
[0034]
(10) When the component mounting process on one mounting stage 3 is completed, the mounting stage 3 moves to a standby position outside the mounting area below the mounting head as shown in FIG. The other mounting stage 3 that has been waiting while performing is moved to the mounting area, and the component mounting process to the package group mounted on the other mounting stage 3 is performed according to the above procedure.
[0035]
(11) Then, in the mounting stage 3 that has been retreated from the mounting area to the standby position, the tray 10 that has undergone the component mounting process is unloaded and the tray 10 on which the new package 2 is mounted is loaded.
[0036]
[Other Embodiments]
The present invention can also be implemented in the following forms.
[0037]
(1) As shown in FIG. 10, the protrusion 14 provided on the lower surface of the tray pressing member 12 can be moved up and down and attached by protruding downward and biased by a spring 23 to elastically press the tray 10. According to this, even if the tray pressing member 12 is slightly deformed, the tray 10 can be reliably pressed by the group of protrusions 14 that can be elastically retracted.
[0038]
(2) The protrusion provided on the lower surface of the tray pressing member may be an elastic body such as a leaf spring or a compression coil spring, a heat-resistant elastic resin, or the like.
[0039]
(3) The protrusion provided on the lower surface of the tray pressing member can be formed in a streak shape with a sharp tip. In this case, it is possible to expect the protrusion group to function as a reinforcing rib that increases the rigidity of the tray pressing member by arranging the line-like protrusions vertically and horizontally.
[0040]
(4) If the protrusion provided on the lower surface of the tray pressing member is made of a highly heat-insulating material, heat transfer from the tray to the tray pressing member can be more effectively suppressed.
[0041]
【The invention's effect】
As is clear from the above description, the following effects can be expected according to the present invention.
[0042]
According to the electronic component mounting apparatus of the first aspect of the present invention, since heat transfer from the tray to the tray pressing member is suppressed, the occurrence of warping of the tray pressing member itself is reduced, and the tray is brought into contact with the mounting stage without warping. As a result, the mounting object group on the tray can be heated evenly. In addition, since the thermal strain can be reduced, the thickness of the tray pressing member can be relatively reduced, its height can be reduced, and the mounting head can be mounted in a state where interference between the mounting head and the tray pressing member can be easily avoided. Since it can be performed, the tact time of the mounting operation can be increased.
[0044]
According to the electronic component mounting apparatus of the second aspect of the present invention, the tray can be reliably pressed by the protrusions regardless of the deformation of the tray pressing member, and the effect of preventing the tray from warping can be surely exhibited.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating a schematic configuration of an electronic component mounting apparatus according to the present invention. FIG. 2 is a front view illustrating a schematic configuration of an electronic component mounting apparatus according to the present invention. FIG. 4 is a front view showing a component mounting process. FIG. 5 is a front view showing a component mounting process. FIG. 7 is a front view showing a component mounting process. FIG. 9 is a front view showing a component mounting process. FIG. 10 is a longitudinal sectional view showing a main part of a tray pressing member in another embodiment. FIG. 11 shows a schematic configuration of a conventional example. Front view [Explanation of symbols]
2 Installation object (package)
3 Mounting Stage 4 Parts 8 Mounting Head 10 Tray 11 Heater 12 Tray Pressing Member 14 Protrusion

Claims (2)

A tray on which a plurality of mounting objects are placed and accommodated is mounted on a mounting stage equipped with a heater, and the mounting target object on the tray is heated by the heater, and the electronic component conveyed by the mounting head In an electronic component mounting apparatus configured to be mounted on a heated mounting object,
An electronic component mounting apparatus comprising: a tray pressing member that presses the tray against the mounting stage; and a plurality of protrusions that are point- contact pressed against the tray on the lower surface of the tray pressing member. Electronic component mounting apparatus according to claim 1, wherein on a support the projections on the elastic retraction displaceable manner tray pressing member.

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