JP4371939B2 - Board loading apparatus, component mounting apparatus, and board loading method - Google Patents

Description

  The present invention relates to a substrate carry-in device for carrying a flexible substrate from a supply position to a stage.

  Various component mounting apparatuses for mounting a plurality of components on a substrate are known. Generally, this component mounting device is equipped with a loader for supplying a substrate from outside the device to the inside of the device, an unloader for discharging the substrate on which the components are mounted from the inside of the device to the outside, and holding the mounted substrate by vacuum suction. Bonding stage, substrate loading device for loading the substrate from the loader onto the bonding stage, mounting head for mounting the component on the substrate held on the bonding stage, and substrate unloading for unloading the component-mounted substrate from the bonding stage to the unloader Equipment. For example, Patent Document 1 discloses this type of component mounting apparatus.

  As the substrate, there is a flexible substrate such as an FPC substrate (flexible substrate) in addition to a relatively hard normal substrate made of an epoxy resin or the like. In some cases, a flexible substrate is held on a relatively high-rigidity transport carrier and transported. A flexible substrate is more likely to bend and warp than a normal substrate. If the flexible substrate carried into the bonding stage by the substrate carry-in device is sucked and held on the bonding stage in a state where it is not flat due to bending or warping, the mounting position of the component may be shifted during mounting by the mounting head. Cause mounting failure.

  As a countermeasure against bending and warping of the flexible substrate, if the vacuum degree of vacuum suction by the bonding stage is simply increased, the flexible substrate locally becomes depressed at the vacuum suction hole, and the flexible substrate Flatness decreases.

  Patent Document 2 discloses a technique for correcting the warp of a normal substrate by adjusting the heights of a plurality of support pins that support the substrate from the lower surface according to the warp. However, this technique cannot be applied to a flexible substrate that is significantly more flexible than a normal substrate.

JP 2004-186182 A JP-A-6-196847

  An object of the present invention is to arrange a flexible substrate on a stage in a flat state without bending or warping, and to ensure that the flexible substrate is in close contact with the stage.

According to a first aspect of the present invention, a flexible substrate held by a conveying jig is carried from a supply position of the flexible substrate to a stage on which the flexible substrate is placed and held. A carrying-in apparatus, comprising: a holding mechanism that releasably holds the conveying jig; a first elastic member that elastically biases the holding body downward; and the holding mechanism. The holding mechanism moving unit that moves the moving body in the loading direction of the flexible substrate from the supply position toward the stage and moves it up and down, and the holding mechanism that holds the conveyance jig at the supply position include the stage. A second height at which the flexible substrate is placed on the stage from a first height position that moves upward in the carry-in direction and has a gap between the flexible substrate and the stage. The holding mechanism is lowered so that the holding mechanism is lowered to the vertical position. A control unit for controlling the mechanism and the holding mechanism moving unit, is provided on the movable body, when the conveying jig the holding mechanism holding the drops to the second height position relative to the stage, the accepted Provided is a substrate carry-in device comprising a pressing mechanism that presses a flexible substrate against the stage.

  When the pressing mechanism presses the flexible substrate against the stage, the flexible substrate can be placed on the stage in a flat state without bending or warping, and can be brought into close contact with the stage. Further, when the holding mechanism is lowered to the second height position where the flexible substrate is placed on the stage, the pressing mechanism presses the flexible substrate against the stage, so that the stage holds the substrate. The flexible substrate can be held on the stage in a flat state while suppressing the degree of vacuum (in the case of vacuum suction) to a necessary minimum. Furthermore, since the moving body is provided with the pressing mechanism, it is not necessary to provide a dedicated moving mechanism for moving the pressing mechanism in the horizontal direction and for raising and lowering separately from the holding mechanism moving portion.

Coercive bearing member holds the conveying jig for example by vacuum suction.

  As one embodiment, the holding body and the first elastic member constitute the pressing mechanism, and the holding mechanism holding the conveying jig is lowered to the second height position with respect to the stage. Then, the holding body is displaced upward against the urging force of the first elastic member, and the holding body urges the conveying jig downward by the first elastic member. A flexible substrate is pressed against the stage.

  Since the holding body of the holding mechanism and the first elastic member also function as a pressing mechanism, the flexible substrate can be brought into close contact with the stage without complicating the structure of the substrate carrying-in device and increasing the number of parts. .

As an alternative, the pressing mechanism is attached to the first fixed portion fixed to the movable body and the first fixed portion so as to be movable up and down, and a tip thereof corresponds to the flexible member. And a first pressing body biased downward by its own weight, and when the holding mechanism is at the first height position, the tip of the first pressing body is When the holding mechanism is positioned above the tip of the holding body and the holding mechanism is lowered to the second height position, the holding body is displaced upward against the biasing force of the first elastic member, and The first pressing body contacts the flexible substrate and is displaced upward with respect to the first fixing portion, and the first pressing body urges the flexible substrate downward by its own weight. Thus, the flexible substrate is pressed against the stage.

  Since the first pressing body presses the flexible substrate to the stage by its own weight, the flexible substrate can be brought into close contact with the stage with a relatively simple configuration. Further, since the flexible substrate is pressed by the weight of the first pressing body, even if the second height position changes to some extent, the urging force acting on the flexible substrate is kept constant.

  The first pressing body includes a first shaft extending in a vertical direction that is mounted to be movable up and down with respect to the first fixing portion, and a tip portion provided at a tip of the first shaft, When the holding mechanism is lowered to the second height position, the tip portion comes into contact with the flexible substrate.

  Since the tip part contacts the flexible substrate in a point contact manner, there is no problem even if an ACF tape, electrode, mounted component, etc. on the flexible substrate do not exist, that is, other members contact. The flexible substrate can be pressed against the stage in a region that is not present. The contact position of the tip with the flexible substrate is preferably set in a region where warping or bending is likely to occur and no ACF tape or the like is present. In general, bending and warping are likely to occur in a region where the cross-sectional area is suddenly changed (a portion where the shape in plan view is suddenly changed when the thickness is constant). The tip is preferably made of a material having releasability and heat resistance such as fluororesin.

  The tip is preferably detachably attached to the first shaft. By exchanging the tip portion, the material, size, shape, etc. of the tip portion can be easily changed in accordance with changes in the material, size, shape, etc. of the flexible substrate.

  An elastic member such as a spring may be provided in order to increase the biasing force with which the first pressing body biases the flexible substrate downward. The elastic biasing force of the elastic member is preferably adjustable.

As an alternative, the pressing mechanism is attached to the second fixing portion fixed to the movable body and the second fixing portion so as to be movable up and down, and the tip thereof is located at a position corresponding to the conveying jig. And a second pressing body biased downward by the second elastic member, and when the holding mechanism is at the first height position, the tip of the second pressing body is When the holding mechanism is positioned above the tip of the holding body and the holding mechanism is lowered to the second height position, the holding body is displaced upward against the biasing force of the first elastic member, and The tip of the second pressing body comes into contact with the conveying jig and is displaced upward with respect to the second fixing portion against the urging force of the second elastic member, and is moved by the second elastic member. by the second pressing body is urged downward the conveying jig, the flexible Press the plate to the stage

  The second pressing member urges the conveyance jig downward by the second elastic member, thereby pressing the flexible substrate against the stage. Therefore, the flexible substrate can be brought into close contact with the stage without directly contacting the flexible substrate.

  The second pressing body is preferably arranged so that the flexible substrate held by the conveying jig is uniformly pressed against the stage.

  The pressing mechanism preferably includes an adjustment mechanism that adjusts the urging force of the second elastic member.

  By providing this adjusting mechanism, the second elastic member is attached so that the flexible substrate can be uniformly pressed against the stage according to the material, dimensions, shape, etc. of the transport jig and the flexible substrate. The power can be adjusted.

Specifically, the second pressing body includes a second shaft that is attached to the second fixing portion so as to be movable up and down and that extends in the vertical direction, and a pad attached to the tip of the second shaft. And
When the holding mechanism is lowered to the second height position, the pad comes into contact with the transport jig.

  The material of the pad is preferably made of a material having elasticity and heat resistance such as heat-resistant rubber and silicon.

  It is preferable that the pad is detachably attached to the second shaft. By exchanging the pad, it is possible to easily change the material, size, shape, etc. of the pad according to changes in the material, size, shape, etc. of the flexible substrate and the conveying jig.

  The second pressing body is separate from the holding body and elastically biases the transport jig. Accordingly, the pressing mechanism including the second pressing body includes an upper conveyance plate and a lower conveyance plate that are detachably overlapped with each other, and holds the flexible substrate between the upper and lower conveyance plates. This is suitable when using a transport jig. In this case, the holding body holds the lower transport plate, while the second pressing body contacts the upper transport plate.

  The stage holds the flexible substrate by, for example, vacuum suction. In this case, a substrate suction hole is formed in the stage, and the flexible substrate is sucked and held on the stage by a suction force acting through the substrate suction hole from a vacuum suction portion.

In one embodiment, when the holding mechanism releases the holding jig and the stage starts holding the flexible substrate, the control unit causes the holding mechanism to move to the second height. The holding mechanism is raised again from the first height position to the second height position while maintaining the state in which the holding with respect to the conveying jig is released after rising from the position to the first height position. The holding mechanism and the holding mechanism moving unit are controlled so that the holding mechanism moves down and the pressing mechanism presses the flexible substrate against the stage again.

When the holding mechanism is first lowered to the second height position, the flexible substrate is held on the stage. The holding mechanism once rises to the first height position, and then descends again from the first height position to the second height position while maintaining the state where the holding of the conveying jig is released. During the second descent, the flexible substrate is pressed against the stage by the pressing mechanism.

  Preferably, the control unit further includes a sensor that detects whether the flexible substrate is held in an appropriate state or in an inappropriate state on the stage, and the control unit has the holding mechanism in the first state. The sensor detects that the flexible substrate is held in an appropriate state on the stage during a predetermined monitoring period after it is lowered again from the first height position to the second height position. Then, the holding mechanism and the holding mechanism moving unit are controlled so that the holding mechanism rises again from the second height position to the first height position.

  As an alternative, the sensor further includes a sensor for detecting whether the flexible substrate is held in an appropriate state or in an inappropriate state on the stage, and the control unit includes the second high-level sensor. When the holding mechanism releases the holding of the flexible substrate in the vertical position and the stage starts to hold the flexible substrate, the holding mechanism moves from the second height position to the first height. The flexible substrate is held in an inappropriate state on the stage during a predetermined first monitoring period after the stage starts to hold the flexible substrate. Is detected by the sensor, the holding mechanism is lowered again from the first height position to the second height position while maintaining the state where the holding on the flexible substrate is released. The holding mechanism is As it pressed sexual substrate on the stage, and controls the holding mechanism moving portion and the holding mechanism.

When the holding mechanism is first lowered to the second height position, the flexible substrate is held on the stage. Once the holding mechanism has been raised to the first height position, if the sensor detects that the flexible substrate is held in an inappropriate state on the stage, the holding state for the transfer jig is released. However, the holding mechanism descends again from the first height position to the second height position . Only when the flexible substrate is not held flat on the stage, the flexible substrate is pressed against the stage by the pressing mechanism. Therefore, the flexible substrate can be brought into close contact with the stage in a flat state without reducing the efficiency of carrying the flexible substrate from the supply position to the stage.

  According to a second aspect of the present invention, there is provided a component mounting apparatus including at least the substrate carry-in device and a mounting head unit for mounting components on the flexible substrate held on the stage.

According to a third aspect of the present invention, there is provided a substrate for carrying a flexible substrate held by a conveying jig from a supply position of the flexible substrate to a stage on which the flexible substrate is placed and held. A carrying-in method, comprising: a holding mechanism including a holding body that releasably holds the transfer jig; and a first elastic member that elastically biases the holding body downward, and at the supply position, The conveyance jig is held by the holding body of the holding mechanism, the holding mechanism is moved from the supply position to above the stage, and the holding mechanism has an interval between the flexible substrate and the stage. The holding body is lowered from the first height position to a second height position on which the flexible substrate is placed on the stage, and the holding body is directed upward against the biasing force of the first elastic member. The holding body is displaced by the first elastic member. Characterized in that pressing the said flexible substrate on the stage by biasing the conveying jig downward, to provide a substrate carrying method.

In one embodiment, the first fixing portion fixed to the moving body holding the holding mechanism, and the first fixing portion is attached to the first fixing portion so as to be movable up and down, and the tip thereof is attached to the flexible substrate. A first pressing body disposed at a corresponding position and biased downward by its own weight, and the holding mechanism is moved from the first height position to the second height position on the stage. The holding body is displaced upward against the urging force of the first elastic member, and the first pressing body comes into contact with the flexible substrate and moves to the first fixing portion. The first pressing body urges the flexible substrate downward by its own weight to press the flexible substrate against the stage.

As an alternative, a second fixing portion fixed to the moving body holding the holding mechanism, and a position that is attached to the second fixing portion so as to be movable up and down, and a tip of the second fixing portion corresponds to the conveying jig. And a second pressing member biased downward by a second elastic member, and the holding mechanism is lowered from the first height position to the second height position on the stage. Then, the holding body is displaced upward against the urging force of the first elastic member, and the tip of the second pressing body comes into contact with the conveying jig to attach the second elastic member. The flexible member is displaced upward with respect to the second fixing portion, and the second pressing member urges the conveying jig downward by the second elastic member. Press the substrate against the stage.

A first aspect of the substrate carry-in device of the present invention, the component mounting apparatus of the second aspect, and according to the substrate carrying the method of the third aspect, the holding mechanism provided in the mobile unit with a holding mechanism flexible substrate By pressing the stage against the stage, the force with which the stage holds the substrate (the degree of vacuum in the case of vacuum suction) is suppressed to the minimum necessary, and the flexible substrate is bent and warped with a relatively simple configuration. It can be placed on the stage in a flat state and can be in close contact with the stage.

  In the substrate carrying-in method according to the third aspect of the present invention, the flexible substrate is pressed against the stage by a pressing mechanism, so that the flexible substrate is brought into close contact with the stage in a flat state without bending or warping. it can.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the figure, an X-axis direction (+ X, −X) and a Y-axis direction (+ Y, −Y) orthogonal to the X-axis direction are directions or horizontal directions along the surface of the substrate 5. The + X direction is the same as the conveyance direction of the substrate 5 described later. In the figure, the Z-axis direction (+ Z, −Z) is a direction perpendicular to the surface of the substrate 5 or a vertical direction perpendicular to the X-axis direction and the Y-axis direction.

(First embodiment)

  FIG. 1 shows an electronic component mounting apparatus 1 which is an example of a component mounting apparatus including a board carry-in device 27 according to an embodiment of the present invention. The electronic component mounting apparatus 1 performs a mounting operation for mounting electronic components such as chip components and bare IC chips, which are examples of components, on a substrate.

  In addition to a relatively hard ordinary substrate (not shown) made of epoxy resin or the like, the substrate on which the electronic component is mounted by the electronic component mounting apparatus 1 includes one transport jig 2 as shown in FIG. There are a plurality of FPC substrates (flexible substrates) 3 held on the substrate. In the present embodiment, the transport jig 2 is composed of a single transport plate 4 that is rectangular in plan view. The conveying jig 2 is made of an invar material having a high heat insulating effect in order to prevent warping due to heat. The transport plate 4 is provided with a pair of openings 4a and 4b extending in the long side direction and parallel to each other. Referring to FIGS. 7 and 8 together, in this embodiment, the FPC board 3 is a relatively elongated rectangle in plan view. Each FPC board 3 has a base end side fixed to the transport plate 4 in the vicinity of the openings 4a and 4b, and a front end side facing the openings 4a and 4b. As shown in FIG. 8, a region (mounting region) 3 a where electronic components are mounted is set at a portion facing the openings 4 a and 4 b at the tip of each FPC board 3. An anisotropic conductive film (ACF) tape is attached in advance to the mounting region 3a. In the following description, both the normal substrate and the combination of the transfer jig 2 and the FPC substrate 3 are collectively referred to simply as the substrate 5.

  Referring to FIG. 1, an electronic component mounting apparatus 1 is roughly divided into a component supply unit 7 that accommodates a plurality of electronic components in a supplyable manner, and a mounting operation for mounting electronic components supplied from the component supply unit 7 on a substrate 5. A mounting unit 8 for performing the above operation, a loader 10 for supplying the substrate 5 from outside the device to the inside of the device, an unloader 11 for discharging the substrate 5 on which components have been mounted from the inside of the device to the outside of the device, A substrate transport unit 9 for carrying out the substrate 5 from the unit 8 is provided on the machine base 6. In addition, the electronic component mounting apparatus 1 includes a control unit or a controller 12 that controls operations of the component supply unit 7, the mounting unit 8, the loader 10, the unloader 11, and the board transfer unit 9.

  The component supply unit 7 will be described with reference to FIG. The component supply unit 7 includes a lifter 14, a supply component placement device 15, and a reversing head device 16.

  In the lifter 14, a semiconductor wafer on which a large number of electronic components are formed and a component tray in which a large number of electronic components are arranged and accommodated on a lattice are accommodated so as to be selectively supplied. A semiconductor wafer and a component tray are supplied from the lifter 14 to the supply component placement device 15 by a moving device (not shown) that can reciprocate in the Y-axis direction. The supply component placement device 15 is movable in the Y-axis direction. In addition, the supply component placement device 15 can perform an expanding operation on the semiconductor wafer. The reversing head device 16 is movable in the X-axis direction, and sucks and holds electronic components individually from the semiconductor wafer or component tray of the supply component arranging device 15 and moves toward the mounting unit 5. Further, the reversing head device 16 can reverse the sucked and held electronic component in the vertical direction. The reversing head device 16 is positioned with respect to the electronic components of the semiconductor wafer and the component tray based on the recognition result of the recognition camera 17 and the reversing head device 16 is moved in the X-axis direction and the supply component arranging device 15 is moved in the Y-axis direction. It is done by the combination of.

  The mounting unit 8 will be described with reference to FIG. The mounting unit 8 includes a mounting head device 18, a bonding stage 20, and a substrate regulating device 21.

  The mounting head device 18 can suck and hold the electronic component delivered from the reversing head device 16 at its lower end. The mounting head device 18 can move linearly along the X-axis direction, move up and down, and rotate around its own axis. Further, the mounting head device 18 can apply bonding energy such as pressing energy, ultrasonic vibration energy, and thermal energy to the substrate 5 through the electronic components held by suction, thereby mounting the electronic components on the substrate 5. it can.

  The substrate 5 is placed and held on the bonding stage 20. The bonding stage 20 is mounted on the XY table 22. The XY table 22 is driven independently by, for example, a servo motor in the X-axis direction and the Y-axis direction, and can be positioned by full-closed control using a linear scale. The XY table 22 moves the bonding stage 20 in the X-axis and Y-axis directions, thereby positioning the mounting position on the substrate 5 with respect to the mounting head device 18. The bonding stage 20 is made of ceramics, for example. If the bonding stage 20 is made of a metal with low heat insulation, the heat of the heating head of the mounting head device 18 escapes to the bonding stage 20 through the FPC board 3, so the heating head needs to be set to a higher temperature. However, when the bonding stage 20 is made of ceramics having a high heat insulating effect, the heating head can be set at a low temperature, and as a result, damage to the FPC board due to heat is reduced.

  Referring to FIGS. 6 to 8, a plurality of (10 in the present embodiment) base portions 20 a, which have a rectangular parallelepiped shape for mounting the FPC board 3, protrude upward on the upper surface of the bonding stage 20. Is provided. Each of the five base portions 20 a corresponds to one of the openings 4 a and 4 b of the transport jig 2, and each base portion 20 a corresponds to one FPC board 3. Further, short columnar support portions 20b are provided so as to protrude upward at positions of four corners in plan view of the bonding stage 20. As shown in FIG. 7, the lower surface of the conveyance jig 2 (in this embodiment, the lower surface of the conveyance plate 4) is supported by these support portions 20b. Further, as shown in FIG. 6, a heater 26 is built in the bonding stage 20. The bonding stage 20 is heated to, for example, 150 ° C. by the heater 26. If the entire lower surface of the conveying jig 2 comes into contact with the bonding stage 20, the conveying jig 2 is also heated, warps, and adversely affects the FPC board 3. However, since the conveyance jig 2 is supported at four points by the cylindrical portion 20b, an air layer functioning as a heat insulating layer is formed between the bonding stage 20 and the conveyance jig 2, and the conveyance jig 2 is warped by heat. Can be prevented.

  As shown in FIGS. 7 and 8, a plurality (three in the present embodiment) of substrate suction holes 20c are provided on the upper surface of each base 20a. These substrate suction holes 20c are connected to a vacuum suction device 24 equipped with a vacuum pump or the like via a common flow path 20d formed in the bonding stage 20 and a conduit 23 outside the bonding stage 20 shown schematically. Yes. The FPC board 3 is sucked and held on the upper surface of the pedestal portion 20a by the suction force acting from the vacuum suction device 24 via the pipe line 23 and the flow path 20d through the substrate suction hole 20c.

  As shown only in FIG. 7, a substrate suction sensor 25 is interposed in the conduit 23. The substrate suction sensor 25 holds the FPC board 3 in a flat state (appropriate state) free from bending or warping on the base 20a based on the degree of vacuum of the pipe line 23, the flow path 20d, and the substrate suction hole 20c. It is detected whether it is held in an inappropriate state with bending or warping. For example, when the degree of vacuum rises above a predetermined upper threshold value, the substrate suction sensor 25 detects that the FPC board 3 is held in an appropriate state on the base 20a, and the degree of vacuum is lower than the predetermined level. If it falls below the side threshold value, it is detected that the FPC board 3 is held in an inappropriate state on the base 20a. In the present embodiment, the substrate suction sensor 25 is turned on when the FPC board 3 is properly held, and is turned off when the FPC board 3 is held in an inappropriate state.

  A substrate restricting device 21 schematically shown only in FIG. 6 restricts the substrate 5 to a regular position on the bonding stage 20. The substrate regulating device 21 in the present embodiment presses the reference portion 21a corresponding to one corner of the substrate 5 and the substrate 5 disposed on the bonding stage 20 against the reference portion 21a to the bonding stage 20. It includes movable members 21b, 21c, and 21d that can move forward and backward for positioning.

  As shown in FIG. 1, the loader 10 includes a pair of transport rails 10a extending in the X-axis direction from the outside of the apparatus into the apparatus. Referring also to FIG. 9, the end 10b (substrate supply position P1) of the transport rail 10a is located in the vicinity of a substrate loading position P2 described later. The substrate 5 is transported in the substrate transport direction indicated by the arrow A with both ends supported by the transport rail 10a, and is held in a state where it can be taken out at the end portion 10b of the transport rail 10a.

  As shown in FIGS. 1 and 9, the unloader 11 includes a pair of transport rails 11 a that extend in the substrate transport direction A (X-axis direction), like the loader 10. The end 11b of the transport rail 11a is located in the vicinity of a substrate carry-out position P3 described later. The substrate 5 supplied to the end portion 11b is transported in the substrate transport direction A while being supported at both ends by the transport rail 11a, and is transported out of the apparatus.

  The substrate transport unit 9 shown in FIGS. 1 to 4 includes a substrate carry-in device 27 that carries the substrate 5 from the loader 10 to the mounting unit 8, and a substrate carry-out device that carries the substrate 5 from the mount unit 8 to the unloader 11. 127.

  Referring to FIG. 3, the substrate transport unit 9 includes a linear motion guide 30 that extends in the X-axis direction (substrate transport direction A). This linear motion guide 30 is shared by the substrate carry-in device 27 and the substrate carry-out device 127. The linear motion guide 30 includes a guide rail 30a extending in the substrate transport direction A, and a slider 30b slidably mounted on the guide rail 30a. A nut 31 is fixed to the slider 30b, and a ball screw shaft 32 extending in the substrate transport direction is screwed to the nut 31. The ball screw shaft 32 is driven to rotate forward and backward by a motor 13 which is a stepping motor, for example. Depending on the rotation direction of the motor 13, the slider 30b moves straight on the guide rail 30a in the + X direction or the -X direction.

  The substrate carry-in device 27 includes a linear motion guide 33 that is attached to a slider 30b that moves in the X-axis direction and extends in the vertical direction or the vertical direction (Z-axis direction). The linear guide 33 includes a guide rail 33a that is fixed to the slider 30b and extends in the vertical direction, and a slider 33b that is slidably mounted on the guide rail 33a.

  The substrate carry-in device 27 includes a pair of cylinders 34 and 35 having different stroke lengths for moving the slider 33b up and down. The cylinder 34 arranged on the upper side is a short stroke cylinder, and in this embodiment, the stroke length is 20 mm. On the other hand, the cylinder 35 arranged on the lower side is a long stroke cylinder, and in this embodiment, the stroke length is 82 mm. One cylinder 34 is fixed to the slider 33b via a cylinder bracket 37 in such a posture that its rod is directed downward in the vertical direction. The other cylinder 35 is fixed to the slider 30b via the cylinder bracket 38 in such a posture that the rod is directed upward in the vertical direction. The rods of the first and second cylinders 34 and 35 are positioned so that their axes are coaxial, and are connected to each other by a shaft 39. Each of the cylinders 34 and 35 is connected to a compressed air supply device (not shown) via a pressure air pipe, and the rod can be set at either a protruding position or a retracted position by supplying compressed air and exhausting it. As will be described in detail later, the slider 33b can be moved in the vertical direction by a combination of the protruding states of the rods of the cylinders 34 and 35.

  A loading arm 41 is fixed to the slider 33b via an arm bracket 40. The carry-in arm 41 includes a first beam 41a extending in the Y-axis direction and having a base end fixed to the arm bracket 40, and parallel to each other fixed to the base end side and the tip end side of the first beam 41a. The second and third beams 41b and 41c extending in the X-axis direction are provided and have an H shape in plan view. One substrate suction mechanism (holding mechanism) 42 is attached to both ends of the second and third beams 41 b and 41 c, and the carry-in arm 41 includes a total of four substrate suction mechanisms 42. These substrate suction mechanisms 42 are provided corresponding to the positions of the four corners of the conveying jig 2 (reference numeral 43 in FIG. 6).

  Referring to FIGS. 3, 5, and 10, each substrate suction mechanism 42 includes a suction nozzle 44 having a proximal end connected to a vacuum suction device 43. The suction nozzle 44 includes a hollow cylindrical portion 45 that can be raised and lowered on the lower end side. A suction pad 46 having a suction port 46 a is attached to the lower end of the hollow cylinder portion 45. Further, the suction nozzle 44 includes a spring 47 (illustrated schematically only in FIG. 10) that elastically biases the hollow cylindrical portion 45 downward in the vertical direction as indicated by an arrow B in FIG. As will be described in detail later, the hollow cylindrical portion 45 of the suction nozzle 44 can be displaced upward in the vertical direction against the urging force of the spring 47. The suction pad 46 is made of a material having elasticity and heat resistance such as heat-resistant rubber and silicon.

The structure of the substrate carry-out device 127 is the same as that of the substrate carry-in device 27. 2 and 3, the substrate carry-out device 127 includes a vertical linear motion guide 133 (guide rail 133a and slider 133b) attached to the slider 30b, and a short stroke cylinder 134 (for moving the slider 133b up and down). In this embodiment, the stroke length is 20 mm) and a long stroke cylinder 135 (in this embodiment, the stroke length is 82 mm). The cylinder 134 is fixed to the slider 133b via a cylinder bracket 137, and the cylinder 135 is fixed to the slider 30b via a cylinder bracket 38 common to the substrate carry-in device 27. An unloading arm 141 is fixed to the slider 133b via an arm bracket 140. The carry-out arm 141 has a beam 141a extending in the Y-axis direction and having a base end fixed to the arm bracket 140, and a pair extending in the parallel X-axis direction fixed to the base end side and the distal end side of the beam 141a. Beam 141b, 141c, and has an H shape in plan view. One substrate suction mechanism 142 is attached to each end of the beams 141b and 141c. The arrangement and structure of the substrate suction mechanism 142 are the same as those of the substrate suction mechanism 42 of the substrate carry-in device 27 (see FIG. 5), and electronic components can be sucked and held by the vacuum suction device 143.

  Next, with reference to FIG. 9, horizontal positions and movements of the substrate 5, the bonding stage 20 of the mounting unit 8, and the substrate transport unit 9 (the substrate carry-in device 27 and the substrate carry-out device 127) will be described. In FIG. 9, symbols P <b> 1 and P <b> 2 indicate positions of the substrate 5 in the loader 10 and the unloader 11, respectively. The position P1 indicates the end portion 10b of the loader 10 conveyance rail 10a, that is, the supply position of the substrate 5 before component mounting. The substrate 5 on the loader 10 is held by the substrate carry-in device 27 at the substrate supply position P1. On the other hand, the board discharge position P4 indicates the arrangement position of the end 11b of the transport rail 11a of the unloader 11, that is, the board 5 on which components are mounted. At this position P4, the substrate carry-out device 127 discharges the substrate 5 to the unloader 11. In FIG. 9, symbols P2, P3, and P0 indicate movement of the bonding stage 20 that holds the substrate 5 by suction. The substrate loading position P2 is adjacent to the substrate supply position P1, and the substrate 5 held by the substrate carry-in device 27 is placed on the bonding stage 20 at this position P2. The substrate carry-out position P3 is adjacent to the substrate discharge position P4, and the substrate 5 on the bonding stage 20 is held by the substrate carry-out device 127 at the substrate carry-out position P3. The mounting position P0 is at a position deviated from the substrate transport path by the loader 10 and the unloader 11, and an electronic component is mounted on the substrate 5 (FPC substrate 3) held on the bonding stage 20 at the mounting position P0.

As described above, since the substrate carry-in device 27 and the substrate carry-out device 127 of the substrate transfer unit 9 are attached to the common linear motion guide 30, the distance between the two in the substrate transfer direction A is always constant. As shown by a two-dot chain line in FIG. When the substrate transport unit 9 is located at the position P11, the substrate carry-in device 27 is located above the position P1, and the substrate carry-out device 127 is located above the position P2. Accordingly, the substrate 5 can be picked up from the loader 10 by the substrate carry-in device 27 at the position P11. Further, when the substrate conveying unit 9 is located at the position P12, the substrate carry-in device 27 is positioned above the position P2, the substrate carry-out device 1 27 is positioned above the position P3. Therefore, at the position P12, the substrate 5 can be carried into the bonding stage 20 from the substrate carry-in device 27, and the substrate 5 can be picked up from the bonding stage 20 by the substrate carry-out device 127. Further, at the position P13, the substrate carry-in device 27 is located above the position P3, and the substrate carry-out device 127 is located above the position P4. Accordingly, the substrate 5 can be unloaded from the substrate unloading device 127 to the unloader 11 at the position P13.

  Next, a change in the height of the carry-in arm 41 of the substrate carry-in device 27 will be described with reference to FIG. In FIG. 4, the position of the lower end of the substrate suction mechanism 42 (suction pad 46) at each height H <b> 0 to H <b> 3 is illustrated assuming that there is no vertical displacement with respect to the loading arm 41.

  As described above, the substrate carry-in device 27 includes the cylinder 34 for raising and lowering the carry-in arm 41 and the cylinder 34 that is directed downward with a short stroke and the cylinder 35 that is directed upward with a long stroke. The rod of the short stroke cylinder 34 is in the retracted position when not operated (off) and is in the protruding position when activated (on). On the other hand, the rod of the long stroke cylinder 35 is in the protruding position when it is inactive (off) and in the retracted position when it is activated (on). The height position H0 when both the cylinders 34 and 35 are in the off state is a reference for the height of the substrate carry-in device 27.

  First, when the short stroke cylinder 34 is turned on and the long stroke cylinder 35 is turned off, the carry-in arm 41 is lowered to the height position H1. The descending amount D1 of the carry-in arm 41 at the height position H1 is equal to the stroke length of the short-stroke cylinder 34 (20 mm in this embodiment).

  Next, when the long stroke cylinder 35 is turned on and the short stroke cylinder 34 is turned off, the carry-in arm 41 is lowered to the height position H2. The descending amount D2 of the loading arm 41 at the height position H2 is equal to the stroke length of the long stroke cylinder 35 (82 mm in this embodiment).

  Further, when both the first and second cylinders 34 and 35 are turned on, the carry-in arm 41 is lowered to the height position H3. The descending amount D3 of the carry-in arm 41 at the height position H3 is equal to the sum of the cylinder stroke lengths of the two first and second cylinders 34 and 35 (102 mm in this embodiment).

  Next, the relationship between the height positions H0 to H3 of the carry-in arm 41 of the substrate carry-in device 27 and the vertical upward displacement amount (push amount) ΔL of the substrate suction mechanism 42 will be described with reference to FIG. Note that the height position of the transport rail 10 a of the loader 10 is higher than that of the bonding stage 20.

  State 1 in FIG. 10 shows a state in which the substrate suction mechanism 42 does not hold the substrate 5 and is positioned above the transport rail 10 a of the loader 10. In this state 1, both the first and second cylinders 34 and 35 (see FIG. 3) are in the off state (the descending amount is 0), and the carry-in arm 41 is at the reference height position H0. The length from the carry-in arm 41 in this state 1 to the lower end of the substrate suction mechanism 42 is set as a reference length L.

  State 2 in FIG. 10 shows a state in which the carry-in arm 41 is lowered toward the transfer rail 10a in order to take out the substrate 5. In this state 2, the cylinder 34 is turned on, the cylinder 35 is turned off, and the descending amount D1 (see FIG. 4) is the stroke length of the cylinder 34 (20 mm in this embodiment). Due to the lowering of the carry-in arm 41, the substrate suction mechanism 42 is not only contacted with the substrate 5 at the lower end (specifically, the lower end of the suction pad 46 shown in FIG. 5) but is pushed upward. That is, the substrate suction mechanism 42 (specifically, the hollow cylindrical portion 45 having the suction pad 46 at the tip shown in FIG. 5) resists the urging force of the spring 47 (see arrow B in FIG. 5), and the pushing amount ΔL1. It is displaced upward (2 mm in this embodiment). In the state 2, the length from the loading arm 41 to the lower end of the substrate suction mechanism 42 is L−ΔL1.

  State 3 in FIG. 10 shows a state in which the substrate 5 held by the substrate suction mechanism 42 is transported in the air above the transport rail 10 a of the loader 10. In this state 3, both the first and second cylinders 34 and 35 are off (the amount of descending is 0), and the carry-in arm 41 is at the reference height position H0. Since the substrate 5 held by the substrate suction mechanism 42 is not in contact with the transport rail 10a (the pushing amount is 0), the length from the carry-in arm 41 to the lower end of the substrate suction mechanism 42 is substantially the standard length L. It is.

  A state 4 in FIG. 10 shows a state in which the carry-in arm 41 is lowered so that the substrate 5 held by the substrate suction mechanism 42 is positioned immediately above the bonding stage 20. In this state 4, the cylinder 34 is off, the cylinder 35 is on, and the lowering amount D2 (see FIG. 4) is the stroke length of the cylinder 35 (82 mm in this embodiment). The carry-in arm 41 is at a height position H2 that is lower than the height position H0 by a lowering amount D2, and a gap 48 exists between the lower end of the substrate suction mechanism 42 and the bonding stage 20. Since the substrate 5 held by the substrate suction mechanism 42 is not in contact with the bonding stage 20 (the pushing amount is 0), the length from the carry-in arm 41 to the lower end of the substrate suction mechanism 42 is substantially the standard length L. It is.

  A state 5 in FIG. 10 shows a state in which the substrate 5 held by the substrate suction mechanism 42 is placed on the bonding stage 20. Further, in this state 5, as will be described in detail later, when the substrate 5 is a combination of the transfer jig 2 and the FPC substrate 3, the carry-in arm 41 is lowered to press the FPC substrate 3 against the bonding stage 20. It also corresponds to the state. In this state 5, both the first and second cylinders 34 and 35 are on, and the lowering amount D3 (see FIG. 4) is the sum of the stroke lengths of the first and second cylinders 34 and 35 (this embodiment). Is 102 mm). In this state 5, the substrate suction mechanism 42 is pushed upward. That is, the substrate suction mechanism 42 is displaced upward by a pushing amount ΔL2 (2 mm in this embodiment) against the urging force of the spring 47, and the length from the loading arm 41 to the lower end of the substrate suction mechanism 42 is L. −ΔL2.

  When the substrate 5 is a combination of the transfer jig 2 and the FPC substrate 3, each FPC substrate 3 is pressed against the corresponding base portion 20 a of the bonding stage 20 in the state 5. First, in the state 5, the substrate suction mechanism 42 is displaced upward by the pushing amount ΔL2 against the urging force of the plate 47 as described above. In other words, the spring 47 is shorter than the natural length (the length of the spring 47 in the state 1) by a length corresponding to the pushing amount ΔL2. As a result, a downward elastic biasing force is applied from the spring 47 to the hollow cylinder portion 45 of the substrate adsorption mechanism 42 (see arrow B in FIG. 5), and the adsorption pad 46 at the lower end of the hollow cylinder portion 45 attaches the substrate 5 to the bonding stage. Energize downwards toward 20. When the substrate 5 is a combination of the transport jig 2 and the FPC board 3, the suction pad 46 contacts the four corners of the transport jig 2 as indicated by reference numeral 43 in FIG. It urges downward toward the bonding stage 20. Thus, the FPC board 3 is pressed against the base 20 a of the bonding stage 20 by urging the conveying jig 2 against the bonding stage 20. In the present embodiment, the substrate suction mechanism 42 also functions as a pressing mechanism for the FPC board.

Since the substrate carry-out device 127 as described above is the same structure as the substrate loading device 27, the height position of the arm 1 41 out transportable can be set to one of the H0, H1, H2, H3. The same as the amount of pushing change the substrate carry-in device 27 of the substrate suction mechanism 1 42 at each height position H0 to H3 (see FIG. 10).

  The controller 12 schematically shown only in FIG. 1 and FIG. 3 is based on inputs from various sensors including the substrate suction sensor 25 and various cameras including the recognition camera 17 according to a program stored in advance. The operations of the mounting unit 8, the loader 10, the unloader 11, and the substrate transfer unit 9 are controlled. In particular, the controller 12 is based on inputs from various sensors including the substrate suction sensor 25, that is, various elements included in the substrate transport unit 9, that is, the motor 13, the vacuum suction devices 43 and 143, and the cylinders 34, 35, 134, and 135. And the operations of the XY table 22, the vacuum suction device 24, and the substrate regulating device 21 of the mounting unit 8 are controlled in conjunction with these operations.

  Next, the operation of the substrate transport unit 9 (the substrate carry-in device 27 and the substrate carry-out device 127) will be described with reference to the flowcharts of FIGS. 11A and 11B and FIGS.

  First, in step S <b> 11-1, the carry-in arm 41 sucks and holds a new substrate 5 before mounting the electronic component. More specifically, first, as shown in FIG. 12A, the substrate transport unit 9 moves to the position P11 in a state where both the substrate carry-in device 27 and the substrate carry-out device 127 are at the height position H0, and the carry-in arm 41 is moved. Located above the substrate 5 at the substrate supply position P1. Next, as shown in FIG. 12B, the carry-in arm 41 descends from the height position H0 to the height position H1, and the suction pad 46 at the tip of the substrate suction mechanism 42 contacts the substrate 5. Further, the suction of the substrate 5 by the vacuum suction device 43 is started. Subsequently, as shown in FIG. 12C, the carry-in arm 41 that holds the substrate 5 by suction rises from the height position H1 to the height position H0.

  In step S11-2, the bonding stage 20 holding the mounted substrate 5 moves from the mounting position P0 to the substrate carry-out position P3 (see the arrow in FIG. 12B).

  In step S <b> 11-3, the carry-out arm 141 is lowered to the bonding stage 20. More specifically, as shown in FIG. 12D, first, the substrate transfer unit 9 moves from the position P11 to the position P12, and the carry-in arm 141 is positioned above the substrate 5 on the bonding stage 20. Subsequently, the carry-out arm 141 descends from the height position H0 to the height position H3, and the suction pad 146 at the lower end of the substrate suction mechanism 142 contacts the substrate 5. The carry-in arm 41 also descends from the height position H0 to the height position H2.

  Next, in step S11-4, the vacuum suction device 143 is operated, and the carry-out arm 141 starts sucking the substrate 5 on which the electronic components on the bonding stage 20 are mounted. Following this, in step S11-5, the vacuum suction device 24 is stopped, and the adsorption of the substrate 5 by the bonding stage 20 is released.

  Next, in step S11-6, as shown in FIG. 12E, the carry-out arm 141 rises from the height position H3 to the height position H2. As a result, the mounted substrate 5 is taken out from the bonding stage 20 by the carry-out arm 141.

  In step S11-7, the bonding stage 20 moves from the substrate carry-out position P3 to the substrate loading position P2. As shown in FIG. 12E, since the carry-in arm 41 is at the height position H2, there is a gap between the substrate 5 before component mounting held by the carry-in arm 41 and the bonding stage 20 at the board loading position P2. There is a gap 48 (see FIG. 10).

In step S11-8, loading arm 4 1 drops bonding stage 20. Specifically, as shown in FIG. 13 (A), carrying arm 4 1 drops from the height position H2 to the height position H3. As a result, the substrate 5 held by the loading arm 4 1 is placed on the bonding stage 20. Referring to FIG. 6, when the substrate 5 is a combination of the transport jig 2 and the FPC board 3, the bottom surfaces of the four corners of the transport jig 2 (transport plate 4) are supported by the support portions 20 b, and the mounting area of each FPC board 3 is The part including 3a, that is, the part facing the openings 4a and 4b of the transport plate 4 is placed on the upper surface of the corresponding base part 20a. In this state, the hollow cylindrical portion 45 of the substrate suction mechanism 42 is displaced upward by the pushing amount ΔL2 against the urging force of the spring 47.

  Next, in step S <b> 11-9, the carry-in arm 41 releases the suction of the substrate 5 before component mounting on the bonding stage 20. Specifically, the vacuum suction device 43 stops. Subsequently, in step S11-10, as shown in FIG. 13B, the carry-in arm 41 rises from the height position H3 to the height position H2. Since the carry-in arm 41 releases the adsorption of the substrate 5, the substrate 5 remains on the bonding stage 20.

  In step S11-11, the substrate regulating device 21 starts regulating the substrate 5 of the bonding stage 20. Specifically, the movable members 21b to 21d protrude to press the substrate 5 on the bonding stage 20 against the reference portion 21a, thereby positioning the substrate 5 with respect to the bonding stage 20 (see FIG. 6).

  Next, in step S11-12, the vacuum suction device 24 is activated, and the bonding stage 20 starts to hold the substrate 5 by suction. When the substrate 5 is a combination of the transfer jig 2 and the FPC substrate 3, as shown in FIG. 8, the suction force acting from the three substrate suction holes 20c arranged around the mounting area 3a of the FPC substrate 3 is used. The FPC board 3 is held on the platform 20a.

  When the bonding stage 20 starts to hold the substrate 5 by suction, the substrate restriction device 21 releases the restriction of the substrate 5 in step S11-13. Specifically, the reference portion 21a and the movable members 21b to 21d are retracted from the bonding stage 20 (see FIG. 6).

  In step S11-14, it is determined whether the carrier transport mode is set. Specifically, the carrier transport mode is when the substrate 5 is a combination of the transport jig 2 and the FPC substrate 3, and the carrier transport mode when the substrate 5 is a relatively hard normal substrate made of epoxy resin or the like. is not.

If not carrier transport mode in step S11- 1 4, mounting operation for the substrate 5 on the bonding stage 20 is started in step S11-20.

On the other hand, in the case of carrier transfer mode in step S11- 1 4, in step S11-15, loading arm 41 as shown in FIG. 13 (C) falls again to the bonding stage 20. Specifically, the carry-in arm 41 descends from the height position H2 to the height position H3. At this time, the vacuum suction device 24 is stopped, and the substrate suction mechanism 42 of the carry-in arm 41 maintains a state in which the holding of the substrate 5 is released.

Referring to FIG. 6, the re-lowering of the loading arm 41 (step S11- 15), the suction pads 46 of the substrate suction mechanism 42 comes into contact with the four corners the upper surface of the conveying jig 2 indicated by reference numeral 43. As shown in state 5 in FIG. 10, when the loading arm 41 is lowered to the height position H3, the hollow cylinder portion 45 of the substrate suction mechanism 42 is displaced upward by the pushing amount ΔL2 against the urging force of the spring 47. To do. As a result, a downward elastic biasing force is applied from the spring 47 to the hollow cylindrical portion 45 of the substrate suction mechanism 42 (see arrow B in FIG. 5), and the suction pad 46 at the lower end of the hollow cylindrical portion 45 holds the transport jig 2. It urges downward toward the bonding stage 20. Further, when the conveying jig 2 is biased downward, the FPC board 3 is pressed against the base 20a. Since the bonding stage 20 is sucking the FPC board 3, the mounting area 3 a of the FPC board 3 can be brought into close contact with the base portion 20 a of the bonding stage 20 in a flat state without bending or warping.

  In step S11-16, it is confirmed whether or not the substrate suction sensor 25 is in the ON state, and the confirmation of the substrate suction sensor 25 is continued until the monitoring time Tm predetermined in step S11-17 has elapsed. The monitoring time Tm is measured from the time when the bonding stage 20 starts to adsorb the substrate 5 (step S11-12).

If it is detected that the substrate adsorption sensor 25 is turned off during the monitoring time Tm, the FPC board 3 is not suitable to be bent or warped with respect to the base portion 20a despite being pressed. It is held in the correct state. In this case, in step S11- 22, it is determined that an error, the operation of the electronic component mounting apparatus 1 is stopped.

  On the other hand, when the substrate suction sensor 25 is kept on during the monitoring time Tm, the FPC board 3 is held in a flat state with no bending or warping with respect to the base 20a. In this case, until the predetermined waiting time Tw elapses in step S11-18, the state of FIG. 13C (the FPC board 3 is sucked to the base 20a and the spring 47 of the board suction mechanism 42 is The state of being pressed against the base 20a by the urging force). When the standby time Tw elapses, in step S11-19, the carry-in arm 41 rises again from the height position H3 to the height position H0, and the pressing of the FPC board 3 against the base portion 20a is completed. By providing the waiting time Tw, it is possible to prevent the FPC board 3 from being lifted from the base portion 20a by the reaction force when the carry-in arm 41 is raised again to the height position H2. The carry-out arm 141 is also raised to the height position H0.

  Next, in step S11-20, mounting of electronic components on the substrate 5 held on the bonding stage 20 is started. Specifically, as shown in FIG. 13D, the bonding stage 20 holding the substrate 5 moves to the mounting position P0, and an electronic component is mounted on the substrate 5 by the mounting head device 19 of the mounting unit 8. . Even when the substrate 5 is a combination of the transport jig 2 and the FPC substrate 3, the FPC substrate 3 warps against the base portion 20a of the bonding stage 20 by the pressing operation by the substrate suction mechanism 42 in steps S11-15 to S11-19. It is held in a flat state without bending. Therefore, electronic components can be mounted on the FPC board 3 without causing errors such as misalignment.

  In step S <b> 11-21, the component-mounted board 5 held by the carry-out arm 141 is carried out to the unloader 11. Specifically, as shown in FIG. 13E, after the substrate transport unit 9 moves to the position P13, the carry-out arm 141 descends to the height position H2. At this time, the vacuum suction device 143 stops, the suction of the substrate 5 by the carry-in arm 141 is released, and the component-mounted 5 substrate 5 is placed at the end 11b (substrate discharge position P4) of the loader 11a.

  FIG. 14 is an example of the operation of the substrate transfer unit 9 of the first embodiment, and shows a case where the substrate 5 is a combination of the transfer jig 2 and the FPC substrate 3. In FIG. 14, in order to place the substrate 5 on the bonding stage 20 from time T8 to time T10, the carry-in arm 41 performs the first descent (step S11-8), and the FPC from time T11 to time T12. In order to press the substrate 3 against the platform 20a, the carry-in arm 41 performs the second descent (step S11-15).

(Second Embodiment)
The electronic component mounting apparatus according to the second embodiment of the present invention includes a substrate transfer unit 9 (see FIG. 3) executed by a controller 12 (see FIGS. 1 and 3) and a bonding stage 20 (see FIG. 6) related thereto. Is different from the first embodiment. The mechanical structure of the second embodiment is the same as the mechanical structure of the first embodiment described with reference to FIGS.

  The operation of the substrate transport unit 9 (the substrate carry-in device 27 and the substrate carry-out device 127) will be described with reference to the flowcharts of FIGS. 15A and 15B and FIGS. 16 to 18.

  The operations of the substrate carry-in device 27, the substrate carry-out device 127, and the bonding stage 20 in steps S15-1 to S15-3 (FIGS. 16A to 17B) are the same as those in the first embodiment. The carry-in arm 41 that holds the substrate 5 before component mounting descends to the bonding stage 20 (step S15-8, FIG. 17A), and lifts to the height position H0 after releasing the suction of the substrate 5 (step S15). -9 and S15-10, FIG. 17 (B)). Further, suction of the substrate 5 is executed by the substrate restriction and its release and the bonding stage 20 (steps S15-10 to S15-13).

  Next, in step S15-14, the component-mounted board 5 held by the carry-out arm 141 is carried out to the unloader 11. More specifically, as shown in FIG. 17C, the substrate transport unit 13 moves to the position 13, and the carry-in arm 141 moves down from the height position H0 to the height position H1. As a result, the component-mounted substrate 5 is placed on the end 11a (substrate discharge position P4) of the unloader 11. Further, as shown in FIG. 17D, after the suction of the substrate 5 is released, the carry-out arm 141 rises to the height position H0.

  Next, in step S15-15, it is determined whether or not the carrier transport mode is set. When the carrier transport mode is not set (when the substrate 5 on the bonding stage 20 is a normal substrate), the mounting operation on the substrate 5 on the bonding stage 20 is started in step S15-23.

  On the other hand, when the carrier transport mode is set in step S15-15 (when the substrate 5 on the bonding stage 20 is a combination of the transport jig 2 and the FPC substrate 3), the substrate suction sensor 25 is set in step S15-16. Whether or not it is in the on state is confirmed, and the confirmation of the substrate adsorption sensor 25 is continued until the first monitoring time Tm1 that is predetermined in step S15-17 has elapsed. The monitoring time Tm1 is measured from the time when the bonding stage 20 starts to attract the substrate 5 (step S15-12).

  When the substrate suction sensor 25 is kept on during the first monitoring time Tm1, the FPC board 3 is held in a flat state with no bending or warping with respect to the platform 20a. In this case, the process proceeds to step S15-23 to start the mounting operation.

  On the other hand, when it is detected that the substrate adsorption sensor 25 is turned off during the first monitoring time Tm1, the FPC board 3 is not bent or deformed with respect to the base portion 20a despite the pressing. It is held in an inappropriate state with warping. In this case, in step S15-18, the carry-in arm 41 descends again to the bonding stage 20 in order to press the FPC board 3 against the platform 20a. Specifically, as shown in FIG. 17E, the substrate transport unit 9 moves from position P13 to position P12. Subsequently, the carry-in arm 41 descends from the height position H0 to the height position H3. At this time, the vacuum suction device 24 is stopped, and the substrate suction mechanism 42 of the carry-in arm 41 maintains a state in which the holding of the substrate 5 is released.

  Referring to FIG. 6, the suction pad 46 of the substrate suction mechanism 42 comes into contact with the upper surfaces of the four corners of the transport jig 2 indicated by reference numeral 43 by the re-lowering of the carry-in arm 41 (step S15-18). As a result, the hollow cylindrical portion 45 of the substrate suction mechanism 42 is displaced upward by the pushing amount ΔL2 against the urging force of the spring 47, and the suction pad 46 at the lower end of the hollow cylindrical portion 45 attaches the conveying jig 2 to the bonding stage 20. Energize downward toward. When the conveyance jig 2 is biased downward, the FPC board 3 is pressed against the base portion 20a. Since the bonding stage 20 is sucking the FPC board 3, the mounting area 3 a of the FPC board 3 can be brought into close contact with the base portion 20 a of the bonding stage 20 in a flat state without bending or warping.

  In step S15-19, it is confirmed whether or not the substrate suction sensor 25 is in an ON state, and the confirmation of the substrate suction sensor 25 is continued until a second monitoring time Tm2 predetermined in step S11-20 has elapsed. The The timing of the second monitoring time Tm2 is started when the carry-in arm 41 is lowered again to the bonding stage 20 (step S15-18).

  If it is detected that the substrate suction sensor 25 is in the OFF state during the second monitoring time Tm2, the FPC board 3 is not bent or warped with respect to the base portion 20a despite being pressed. It is held in some inappropriate state. In this case, an error is determined in step S15-24, and the operation of the electronic component mounting apparatus 1 is stopped.

  On the other hand, when the substrate suction sensor 25 is kept on during the second monitoring time Tm, the FPC board 3 is held in a flat state with no bending or warping with respect to the base 20a. In this case, the state shown in FIG. 17E (the FPC board 3 is adsorbed to the base 20a and the spring 47 of the board adsorbing mechanism 42 is moved until the standby time Tw predetermined in step S15-21 elapses. The state of being pressed against the base 20a by the urging force is maintained. When the standby time Tw elapses, in step S15-21, the carry-in arm 41 rises again from the height position H3 to the height position H0 as shown in FIG. 18, and the pressing of the FPC board 3 against the base portion 20a is completed. . By providing the waiting time Tw, it is possible to prevent the FPC board 3 from being lifted from the base portion 20a by the reaction force when the carry-in arm 41 is raised again to the height position H2. Thereafter, the mounting operation is started in step S15-23.

  FIG. 19 is an example of the operation of the substrate transport unit 9 of the second embodiment, and shows a case where the substrate 5 is a combination of the transport jig 2 and the FPC substrate 3. In FIG. 19, in order to place the substrate 5 on the bonding stage 20 from time T9 'to time T10', the carry-in arm 41 performs the first lowering (step S15-8). After unloading the substrate 5 held by the unloading arm 141 from time T11 ′ to time T14 ′ (step S15-14), the FPC substrate 3 is pressed against the base 20a from time T15 ′ to time T16 ′. The carry-in arm 41 performs the second descent (step S15-18).

  In the present embodiment, only when the FPC board 3 is held on the base 20a of the bonding stage 20 in an inappropriate state, the carry-in arm 41 descends to the bonding stage 20 and the FPC board 3 is placed on the base 20a. I'm holding it down. Therefore, the FPC board 3 can be brought into close contact with the base 20a in a flat state without bending or warping without reducing the efficiency of carrying the board 5 from the loader 10 to the bonding stage 20.

(Third embodiment)
The electronic component mounting apparatus according to the third embodiment of the present invention is provided with a direct pressing mechanism 50 (see FIG. 20) that contacts the FPC board 3 and directly presses against the base 20a of the bonding stage 20. Different from the embodiment. Further, as shown in FIG. 21, the transport plate 4 of the transport jig 2 has one opening 4c, and eight FPC boards 3 are attached so that the mounting region 3a (see FIG. 26) faces the opening 4c. It has been. Therefore, the bonding stage 20 is provided with eight base portions 20a as an example. Other mechanical structures of the present embodiment are the same as those of the first embodiment described with reference to FIGS.

  Referring to FIGS. 20 to 24, the direct mold pressing mechanism 50 is attached to the carry-in arm 41 so as to be detachable, a block 52 fixed to the mounting bracket 51, and the block 52 is mounted to be movable up and down. Eight pressing bodies 53 are provided.

  The mounting bracket 51 includes a pair of arm portions 54 that extend in the vertical direction and face in the horizontal direction, and a connecting portion 55 that connects the upper end sides of the arm portions 54. A pair of through holes 54 a is provided at the upper end of each arm portion 54. The connecting portion 55 is provided with a pair of elongated holes 55a elongated in the horizontal direction.

  As shown in FIGS. 22 and 24, bolts 56 are passed through the pair of through holes 41 d provided in the beam 41 a of the carry-in arm 41 and the long holes 55 a of the connecting portion 55 of the mounting bracket 51 from above. The lower end is screwed into a female screw hole formed in the fixing bracket 57. The upper end side of the mounting bracket 51 is fixed to the beam 41a by tightening the beam 41a from above and below with the bolt 56 and the fixing bracket 57. The mounting bracket 51 can be fixed to various beams 41a having different heights by fixing with the bolt 56 and the fixing bracket 57. In addition, a bolt 58 horizontally penetrated through the through hole 54a of the arm portion 54 is screwed into a nut 59 disposed outside the arm portion 54, and the tip of the bolt 58 is pressed against the side portion of the beam 41a. The fixing of the bracket 51 to the beam 41a is reinforced. By the reinforcement by the bolt 58 and the nut 59, the mounting bracket 51 can be securely fixed to various beams 41a having different widths.

  A tab-like portion 54b is formed by bending the lower end side of each arm portion 54 in the horizontal direction. As shown in FIG. 22, the tab-like portion 54b is formed with a long hole 54c extending in the vertical direction. Further, a receiving portion 54d is formed by partially bending the lower edge of each tab-like portion 54b in the vertical direction.

  The block 52 has a rectangular parallelepiped shape elongated in the horizontal direction as a whole, and has eight bearing holes 52a extending in the vertical direction and penetrating from the upper surface to the lower surface. A pair of female screw holes 52b extending in the horizontal direction are formed on the back surface of the block 52. Further, the block 52 is formed with a pair of through holes 52c extending in the vertical direction and penetrating from the lower surface to the upper surface.

  The back surface of the block 52 is brought into contact with the tab-shaped portion 54 b of the mounting bracket 51, and the bolt 61 inserted through the long hole 54 c of the tab-shaped portion 54 b is screwed into the female screw hole 52 b of the block 52, thereby On the other hand, the block 52 is fixed. As shown in FIG. 20, the block 52 is fixed to the carry-in arm 41 in a posture extending horizontally in the X-axis direction (substrate carrying direction A). A bolt 62 inserted through the through hole 52c and brought into contact with the receiving portion 54d is screwed into a nut disposed on the upper surface of the block 52, whereby the vertical position of the block 52 relative to the mounting bracket 51 can be adjusted. It is like that.

  As most clearly shown in FIG. 23, the pressing body 53 includes a shaft 63, a collar 64 fixed to the upper end of the shaft 63, and a tip member 65 fixed to the lower end of the shaft 63.

  The shaft 63 is slidably inserted into the bearing hole 52 a of the block 52. The size of the collar 64 is larger than the hole diameter of the bearing hole 52 a, and the collar 64 has a function of preventing the pressing body 53 from falling off from the block 52, or a function of defining the limit of the downward movement of the pressing body 53 relative to the block 52. Have A large diameter portion 63 a is provided at the lower end of the shaft 63. The size of the large diameter portion 63 a is larger than the hole diameter of the bearing hole 52 a, and the large diameter portion 63 a has a function of defining the limit of the upward movement of the pressing body 53 relative to the block 52.

  The shaft 63 is formed with an insertion hole 63b extending from the lower end surface of the large diameter portion 63a. The tip member 65 is made of a material having release properties and heat resistance, such as a fluororesin, and has a main body 65a that is a downwardly-facing conical shape with a flat front end surface, and a cylindrical plug that protrudes from the upper portion of the main body 65a. A portion 65b is provided. An engaging groove 65c is formed on the peripheral surface of the insertion portion 65b. By inserting the insertion portion 65b into the insertion hole 63b and engaging the tip of the screw element 66 screwed into the female screw hole 63c formed in the large diameter portion 63a with the engagement groove 65c, the tip member 65 is moved to the shaft 63. It is fixed against. Therefore, the tip member 65 can be attached to and detached from the shaft 63. Various tip members 65 having different materials, dimensions, shapes, and the like are prepared, and the tip members 65 can be exchanged according to changes in the material, size, shape, etc. of the FPC board 3. The shape of the main body 65a of the tip member 65 is not limited to a conical shape, and may be other shapes such as a pyramid shape, a cylindrical shape, and a prism shape.

  Referring to FIGS. 21, 25, and 26, the position of the tip member 65 of the pressing body 53 is set to correspond to the position indicated by the reference numeral 67 of the FPC board 3. The position indicated by reference numeral 67 is set in an area that is likely to be bent or warped and is out of the mounting area 3a where the ACF tape is present.

  Referring to FIG. 27, in state 1 (the state in which the substrate suction mechanism 42 does not hold the substrate 5 and is located above the transport rail 10 a of the loader 10), the lower end of the tip member 65 of the direct mold pressing mechanism 50. Is positioned above the lower end of the suction pad 46 of the substrate suction mechanism 42 by a distance α (1 mm in this embodiment). Referring to FIGS. 21 to 24 together, as shown by an arrow C, the pressing body 53 is urged downward by its own weight, and the vertical position is maintained by the collar 64 being locked to the block 52. ing.

  Next, in state 2 (in which the carry-in arm 41 is lowered toward the transfer rail 10 a to take out the substrate 5), the hollow cylinder portion 45 of the substrate suction mechanism 42 resists the biasing force of the spring 47. The lower end of the tip member 65 comes into contact with the substrate 5 by raising the push amount ΔL1 (2 mm in this embodiment).

  State 3 (state in which the substrate 5 held by the substrate suction mechanism 42 is transported in the air above the transport rail 10a of the loader 10) and state 4 (the substrate 5 held by the substrate suction mechanism 42 is directly above the bonding stage 20) Since the substrate 5 held by the substrate suction mechanism 42 is not in contact with the transport rail 10a and the bonding stage 20 (the pushing amount is 0) in the state where the carry-in arm 41 is lowered so as to be positioned at the position of The lower end of the member 65 is positioned above the lower end of the suction pad 46 of the substrate suction mechanism 42 by a distance α (1 mm in this embodiment).

  In state 5 (the state in which the substrate 5 held by the substrate suction mechanism 42 is placed on the bonding stage 20), the substrate suction mechanism 42 resists the urging force of the spring 47, and the pushing amount ΔL2 (2 mm in this embodiment). Therefore, the lower end of the tip member 65 comes into contact with the substrate 5.

  Referring to FIGS. 25 and 26 together, the tip member 65 is pushed upward against its own weight by the FPC board 3 placed on the bonding stage 20. Therefore, at a position 67 where warping or bending is likely to occur, the pressing body 53 urges the FPC board 3 downward by its own weight and presses it against the base 20a. As a result, the FPC board 3 can be arranged on the base 20a in a flat state without bending or warping, and can be brought into close contact with the base 20a. The pushing amount of the tip member 65 is a difference (1 mm) obtained by subtracting the distance α (1 mm) from the pushing amount ΔL2 (2 mm) of the substrate suction mechanism 42.

  In this embodiment, since the pressing body 53 presses the FPC board 3 by its own weight, the FPC board 3 can be brought into close contact with the stage with a relatively simple configuration. In addition, since the FPC board 3 is pressed by the weight of the pressing body 53, even if the height position H3 changes to some extent, the urging force acting on the FPC board 3 is kept constant.

  Either the operation of the first embodiment or the operation of the second embodiment may be adopted as the operation of the board transport unit 9 in the electronic component mounting apparatus of the third embodiment. That is, as described with reference to FIGS. 11A and 11B, when the substrate 5 is transferred from the loading position P1 to the bonding stage 20, the lowering of the loading arm 41 for pressing the FPC substrate 3 against the base 20a is always performed. It may be executed (steps S11-14 to S11-19). Further, as described with reference to FIGS. 15A and 15B, when the substrate 5 is transported from the loading position P1 to the bonding stage 20, only when the FPC substrate 3 is not properly sucked and held on the base 20a. The carry-in arm 41 may be lowered to press the FPC board 3 against the platform 20a (steps S15-14 to S15-22).

  As shown in FIG. 28, a pair of guide shafts 68 may be attached to the block 52 so as to be movable up and down, and the tip member 65 may be detachably attached to a common attachment portion 69 fixed to the lower ends of these guide shafts 68.

  Further, as described above, the position 67 where the tip member 65 comes into contact with the FPC board 3 needs to be set in a region where warping or bending is likely to occur and no ACF tape or the like exists. In general, the FPC board is likely to bend or warp in a region where the cross-sectional area is abruptly changed (a portion where the shape in plan view is abruptly changed when the thickness is constant). For example, in the case of the FPC board 3 shown in FIGS. 29 (A) and 29 (B), the tip member 65 may be brought into contact with a position 67 in a region where the shape in plan view changes suddenly and the ACF tape 90 or the like does not exist. preferable.

(Fourth embodiment)
The electronic component mounting apparatus according to the fourth embodiment of the present invention is not in contact with the FPC board 3 but in contact with the conveying jig 2 and biased downward, thereby indirectly mounting the FPC board 3 on the base 20a of the bonding stage 20. The second embodiment is different from the first embodiment in that an indirect type pressing mechanism 70 (see FIG. 30) is pressed against the first embodiment. Further, as shown in FIGS. 34 to 36, the transport jig 2 includes an upper transport plate 71 and a lower transport plate 72 that are detachably overlapped with each other, and these upper and lower transport plates 71, 72 are provided. Ten FPC boards 3 are sandwiched and held therebetween. The upper transport plate 71 is provided with two openings 71a and 71b, and the mounting area 3a of the FPC board 3 faces the openings 71a and 71b. A pin 20 e is projected on the upper surface of the bonding stage 20, and when the transport jig 2 is placed on the bonding stage 20, the pin 20 e passes through holes provided in the upper and lower transport plates 72. The substrate suction mechanism 42 is disposed on the carry-in arm 41 so that the suction pad 46 of the suction nozzle 44 sucks the four corners of the lower transport plate 72 as indicated by reference numeral 43 in FIG.

  Referring to FIGS. 30 and 31, a total of 11 indirect pressing mechanisms 70 are attached to the carry-in arm 41. An auxiliary beam 73 extending in the X-axis direction (substrate transport direction A) is detachably attached to the central portion of the beam 41c of the carry-in arm 41 by a bolt 74, and one side surface of this auxiliary beam 73 (on the front side in the figure). Three indirect pressing mechanisms 70 are attached to the side surface via support members 75 extending in the horizontal direction. In addition, two indirect pressing mechanisms 70 are attached to the other side surface (the back side surface in the drawing) via a support member 75. Further, auxiliary beams 76 extending in the X-axis direction are detachably attached to the proximal end side and the distal end side of the beam 41c by bolts 77, respectively, and these auxiliary beams 76 are connected through a support member 75 extending horizontally. Indirect type pressing mechanisms 70 are attached. Referring also to FIG. 34, the eleven indirect presser mechanisms 70 are arranged such that positions where a press pad 77 described later contacts the upper transport plate 71 are uniformly distributed as indicated by reference numeral 88. However, the number and arrangement of the indirect mold pressing mechanisms 70 are not limited to this, and the FPC board 3 is surely attached to the base portion 20a according to the material, size, shape, and the like of the transport jig 2 and the FPC board 3. What is necessary is just to arrange | position so that it may hold down. Other mechanical structures of the present embodiment are the same as those of the first embodiment described with reference to FIGS.

  Referring to FIGS. 31 and 32, the indirect type pressing mechanism 70 includes a housing 79 having a threaded portion 79a formed on the outer periphery. The housing 79 is fixed to the support member 75 by inserting the housing 79 into the through hole 75a provided in the support member 75 and tightening the support member 75 from the upper surface and the lower surface with nuts 80 and 81 screwed into the threaded portion 79a. Yes.

  The housing 79 is formed with a guide hole 79c extending in the vertical direction and penetrating from the upper surface to the lower surface. The upper end side of the shaft 82 is slidably accommodated in the guide hole 79c. A female screw hole 82 a is formed at the lower end of the shaft 82. A threaded portion 83a of a replacement member 83 having a short cylindrical pressing pad 77 attached to the lower end is screwed into the female screw hole 82a. On the other hand, a collar portion 82 b is provided on the upper end side of the shaft 82. The collar portion 82b is locked to a stepped portion 79d formed in the guide hole 79c, whereby the downward movement of the shaft 82 in the vertical direction is restricted. The shaft 82, the replacement member 83, and the pressing pad 77 constitute a second pressing body of the present invention.

  The pressing pad 77 is made of a material having elasticity and heat resistance such as heat-resistant rubber and silicon. The pressing pad 77 can be removed from the shaft 82 together with the replacement member 83. Accordingly, the pressure pads 77 of different materials, dimensions, shapes, etc. are mounted to prepare various replacement members 83, and the pressure pads 77 are replaced according to the materials, dimensions, shapes, etc. of the conveying jig 2 and the FPC board 3. be able to. For example, a relatively small-diameter truncated cone-shaped press pad 77 as shown in FIG. 33A or a relatively large-diameter truncated cone-shaped press pad 77 as shown in FIG. 33B may be used. Good.

  A female threaded portion 79e is provided in the upper portion of the guide hole 79c of the housing 79, and a threaded portion 85a on the outer periphery of the adjusting member 85 is screwed into the female threaded portion 79e. A spring 86 is disposed in a compressed state between a recess 85 a formed on the lower surface of the adjustment member 85 and the collar portion of the shaft 82. The spring 86 elastically biases the shaft 82 as indicated by an arrow D. The urging force by the spring 86 is adjusted according to the material, size, shape, and the like of the transport jig 2 and the FPC board 3 by rotating the adjusting member 85 to change the amount of insertion into the guide hole 79c. be able to.

  Referring to FIG. 37, in state 1, the lower end of the pressing pad 77 of the indirect mold pressing mechanism 70 is positioned above the lower end of the suction pad 46 of the substrate suction mechanism 42 by a distance β (1 mm in this embodiment). Referring also to FIG. 32, the shaft 82 is urged downward by a spring 86 as indicated by an arrow D, and the collar portion 82b is locked to the stepped portion 79d to maintain the vertical position. ing.

  Next, in the state 2, the hollow cylinder portion 45 of the substrate suction mechanism 42 rises by the pushing amount ΔL1 (2 mm in this embodiment) against the urging force of the spring 47, whereby the pressing pad of the indirect mold pressing mechanism 70 is reached. 77 contacts the substrate 5.

  In states 3 and 4, since the substrate 5 held by the substrate suction mechanism 42 is not in contact with the transport rail 10a and the bonding stage 20 (the pushing amount is 0), the lower end of the pressing pad 77 is the substrate suction mechanism. It is located above the lower end of 42 suction pads 46 by a distance β.

  In state 5 (the state in which the substrate 5 held by the substrate suction mechanism 42 is placed on the bonding stage 20), the substrate suction mechanism 42 resists the urging force of the spring 47, and the pushing amount ΔL2 (2 mm in this embodiment). Therefore, the lower end of the pressing pad 77 comes into contact with the substrate 5.

  Referring to FIGS. 32, 35, and 35 together, the pressing pad 77 is pushed upward against the elastic biasing force of the spring 86 by the FPC board 3 placed on the bonding stage 20. 34, the pressing pad 77 urges the upper transport plate 71 downward by the urging force of the spring 86. Then, the upper conveyance plate 71 is urged downward, whereby the FPC board 3 is pressed against the upper surface of the base portion 20a. As a result, the FPC board 3 can be arranged on the base 20a in a flat state without bending or warping, and can be brought into close contact with the base 20a. The pressing amount of the pressing pad 77 is a difference (1 mm) obtained by subtracting the distance β (1 mm) from the pressing amount ΔL2 (2 mm) of the substrate suction mechanism 42.

  Since the pressing pad 77 of the indirect pressing mechanism 70 contacts the upper transport plate 71 instead of the FPC board 3, damage to the FPC board 3 and adhesion of the ACF tape on the FPC board 3 do not occur.

  Either the operation of the first embodiment or the operation of the second embodiment may be adopted as the operation of the board transport unit 9 in the electronic component mounting apparatus of the fourth embodiment. That is, as described with reference to FIGS. 11A and 11B, when the substrate 5 is transferred from the loading position P1 to the bonding stage 20, the lowering of the loading arm 41 for pressing the FPC substrate 3 against the base 20a is always performed. It may be executed (steps S11-14 to S11-19). Further, as described with reference to FIGS. 15A and 15B, when the substrate 5 is transported from the loading position P1 to the bonding stage 20, only when the FPC substrate 3 is not properly sucked and held on the base 20a. The carry-in arm 41 may be lowered to press the FPC board 3 against the platform 20a (steps S15-14 to S15-22).

  The present invention is not limited to the above embodiment, and various modifications are possible. For example, the direct mold pressing mechanism 50 and the indirect mold pressing mechanism 70 may be used in combination. Further, the FPC board may be transported without using a transport jig. The subject of the present invention is not limited to an FPC board, but may be a flexible board. Further, the substrate carry-in device 27 and the substrate carry-out device 127 may be movable independently of each other in the X-axis direction. The FPC board 3 may be pressed against the base part 20a two or more times. Furthermore, in the case of the direct mold pressing mechanism 50, the pressing body 53 may be biased by a spring. In the case of the fourth embodiment (indirect pressing type mechanism), the conveying jig 2 may be composed of a single conveying plate 4. Conversely, in the case of the third embodiment (direct mold pressing mechanism), the transport jig 2 may be composed of upper and lower transport plates 71 and 72.

The perspective view which shows the electronic component mounting apparatus which concerns on 1st Embodiment of this invention. The perspective view in the + Y direction of FIG. 1 which shows a board | substrate conveyance apparatus. The perspective view in the -Y direction of FIG. 1 which shows a board | substrate conveyance apparatus. Sectional drawing in the IV-IV line of FIG. The partial expansion perspective view which shows a holding nozzle. The perspective view which shows a board | substrate and a bonding stage. The schematic sectional drawing which shows the bonding stage in which the board | substrate was mounted. FIG. 8 is a partial plan view of FIG. 7. The schematic plan view for demonstrating the position to which a board | substrate, a bonding stage, and a board | substrate conveyance apparatus move. The schematic front view for demonstrating the change of the height position of a board | substrate carrying-in apparatus. The flowchart for demonstrating operation | movement of the board | substrate conveyance apparatus in 1st Embodiment. The flowchart for demonstrating operation | movement of the board | substrate conveyance apparatus in 1st Embodiment. (A)-(E) are model explanatory drawings which show the supply and discharge operation | movement of the board | substrate by a board | substrate conveyance apparatus. (A)-(E) are model explanatory drawings which show the supply and discharge operation | movement of the board | substrate by a board | substrate conveyance apparatus. 6 is a timing chart of substrate supply and discharge operations by the substrate transfer apparatus. The flowchart for demonstrating operation | movement of the board | substrate conveyance apparatus in 2nd Embodiment. The flowchart for demonstrating operation | movement of the board | substrate conveyance apparatus in 2nd Embodiment. (A)-(E) are model explanatory drawings which show the supply and discharge | emission operation | movement of the board | substrate by the board | substrate conveyance apparatus in 2nd Embodiment. (A)-(E) are model explanatory drawings which show the supply and discharge | emission operation | movement of the board | substrate by the board | substrate conveyance apparatus in 2nd Embodiment. The model explanatory drawing which shows the supply and discharge | emission operation | movement of the board | substrate by the board | substrate conveyance apparatus in 2nd Embodiment. 6 is a timing chart of substrate supply and discharge operations by the substrate transfer apparatus. The perspective view which shows the board | substrate conveyance apparatus in 3rd Embodiment. The perspective view which shows a direct mold pressing mechanism. The rear view which shows a direct mold pressing mechanism. Sectional drawing in the XXIII-XXIII line of FIG. The side view which shows a direct mold pressing mechanism. The schematic sectional drawing which shows the bonding stage in which the board | substrate was mounted. FIG. 26 is a partial plan view of FIG. 25. The schematic front view for demonstrating the change of the height position of a board | substrate carrying-in apparatus. The rear view which shows the modification of a direct type | mold pressing mechanism. (A) And (B) is a partial top view which shows the other example of an FPC board | substrate. The perspective view which shows the board | substrate conveyance apparatus in 3rd Embodiment. (A) And (B) is a perspective view which shows an indirect type pressing mechanism. FIG. 32 is a cross-sectional view taken along line XXXII-XXXII in FIGS. (A) And (B) is a fragmentary sectional view showing other examples of a pad. The perspective view which shows a board | substrate and a bonding stage. The schematic sectional drawing which shows the bonding stage in which the board | substrate was mounted. FIG. 37 is a partial plan view of FIG. 36. The schematic front view for demonstrating the change of the height position of a board | substrate carrying-in apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveying jig 3 FPC board 3a Mounting area 4 Conveying plate 4a, 4b Opening 5 Substrate 6 Machine stand 7 Component supply part 8 Mounting part 9 Substrate conveying part 10 Loader 10a Conveying rail 10b End part 11 Unloader 11a Conveying Rail 12 Controller 14 Lifter 15 Supply component placement device 16 Reversing head device 17 Recognition camera 19 Mounting head device 20 Bonding stage 20a Base portion 20b Support portion 20c Substrate suction hole 20d Flow path 21 Substrate regulating device 21a Reference portions 21b, 21c, 21d Movable Member 22 XY table 23 Pipe line 24 Vacuum suction device 25 Substrate adsorption sensor 26 Heater 27 Substrate carry-in device 30 Linear motion guide (horizontal)
30a Guide rail 30b Slider 31 Nut 32 Ball screw shaft 33 Linear motion guide 33a Guide rail 33b Slider 34, 35 Cylinder 36
37, 38 Cylinder bracket 39 Shaft 40 Arm bracket 41 Carry-in arm 41a, 41b, 41c Beam 42 Substrate suction mechanism 43 Vacuum suction device 44 Suction nozzle 45 Hollow cylindrical portion 46a Suction port 46 Suction pad 47 Spring 48 Gap 50 Direct mold pressing mechanism 51 Mounting bracket 52 Block 52a Bearing hole 52b Female screw hole 52c Through hole 53 Presser body 54 Arm part 54a Through hole 54b Tab-like part 54c Long hole 54d Receiving part 55 Connection part 55a Long hole 56 Bolt 57 Fixing bracket 58 Bolt 59 Nut 61 Bolt 62 Bolt 63 Shaft 63a Large diameter portion 63b Insertion hole 63c Female screw hole 64 Collar 65 Tip member 65a Main body 65b Insertion portion 65c Engagement groove 66 Screw element 67 Position 68 Guide shaft 69 Mounting portion 70 Indirect presser mechanism 71 Upper transport plate 71a, 71b Opening 72 Lower transport plate 73 Auxiliary beam 74 Bolt 75 Support member 75a Through hole 76 Auxiliary beam 77 Press pad 79 Housing 79a Screw part 79c Guide hole 79d Step part 79e Female thread part 80, 81 Nut 82 Shaft 82a Female screw hole 83 Replacement member 83a Screw part 85 Adjustment member 86 Spring 127 Substrate unloading device

Claims (17)

The flexible substrate (3) held by the transfer jig (2) is transferred from the supply position (P1) of the flexible substrate to the stage (20) on which the flexible substrate is placed and held. A substrate carrying-in device (27) for carrying in,
A holding mechanism (42) comprising a holding body (45, 46) for releasably holding the conveying jig, and a first elastic member (47) that elastically biases the holding body downward;
A holding mechanism moving section (13, 30, 33, 34, 35) for moving the moving body (41) provided with the holding mechanism in the loading direction of the flexible substrate from the supply position toward the stage and moving up and down. )When,
The holding mechanism that holds the transfer jig at the supply position moves in the carry-in direction to above the stage, and a first height position (H0) where an interval exists between the flexible substrate and the stage. , H2) to control the holding mechanism and the holding mechanism moving unit so that the holding mechanism descends to the second height position (H3) where the flexible substrate is placed on the stage. Part (12);
A holding mechanism (42, 42) that presses the flexible substrate against the stage when the holding mechanism that is provided on the movable body and holds the conveying jig descends to the second height position with respect to the stage. 50, 70) and a board carrying-in apparatus. The holding body and the first elastic member constitute the pressing mechanism,
When the holding mechanism holding the conveying jig is lowered to the second height position with respect to the stage, the holding body is displaced upward against the urging force of the first elastic member, The substrate carrying-in apparatus according to claim 1, wherein the holding body presses the flexible jig downward with the first elastic member, thereby pressing the flexible substrate against the stage. The pressing mechanism (50) is attached to the first fixing portion (52) fixed to the movable body and the first fixing portion so as to be movable up and down, and the tip thereof corresponds to the flexible substrate. A first presser body (53) disposed at a position to be urged downward by its own weight,
When the holding mechanism is in the first height position, the tip of the first pressing body is located above the tip of the holding body,
When the holding mechanism is lowered to the second height position, the holding body is displaced upward against the urging force of the first elastic member, and the first pressing body is moved to the flexible substrate. In contact with the first fixed portion and displaced upward with respect to the first fixing portion, and the first pressing body biases the flexible substrate downward by its own weight, so that the flexible substrate is placed on the stage. The substrate carrying-in apparatus according to claim 1, wherein the substrate carrying-in apparatus is pressed. The first pressing body includes a first shaft (63) extending in the up-down direction and attached to the first fixed portion so as to be movable up and down, and a tip portion (at a tip of the first shaft ( 65)
The substrate carrying-in apparatus according to claim 3, wherein when the holding mechanism is lowered to the second height position, a tip of the tip portion contacts the flexible substrate. The pressing mechanism (70) is attached to the second fixing portion (79) fixed to the movable body and the second fixing portion so as to be movable up and down, and the tip thereof corresponds to the conveying jig. A second pressing body (77, 82, 83) disposed at a position and biased downward by the second elastic member (86),
When the holding mechanism is at the first height position, the tip of the second pressing body is positioned above the tip of the holding body,
When the holding mechanism is lowered to the second height position, the holding body is displaced upward against the urging force of the first elastic member, and the front end of the second pressing body is moved to the conveying jig. The second elastic member is displaced upward against the second fixing portion against the urging force of the second elastic member, and the second pressing member causes the second pressing body to move to the conveying jig. The substrate carrying-in apparatus according to claim 1, wherein the flexible substrate is pressed against the stage by urging the substrate downward.   The substrate carrying-in apparatus according to claim 5, wherein the pressing mechanism includes an adjustment mechanism (85) for adjusting an urging force of the second elastic member. The second pressing body includes a second shaft (82) extending in the up-down direction mounted so as to be movable up and down with respect to the second fixed portion, and a pad (77) attached to the tip of the second shaft. )
The substrate carrying-in apparatus according to claim 5, wherein when the holding mechanism is lowered to the second height position, the pad comes into contact with the transfer jig. The transport jig includes an upper transport plate (71) and a lower transport plate (72) that are detachably overlapped with each other, and sandwich and hold a flexible substrate between the upper and lower transport plates. ,
The substrate carrying-in apparatus according to claim 5, wherein the holding body holds the lower transfer plate while the second pressing body is in contact with the upper transfer plate.   A substrate suction hole (20c) is formed in the stage, and the flexible substrate is sucked and held on the stage by a suction force acting through the substrate suction hole from the vacuum suction part (24). The board | substrate carrying-in apparatus of any one of Claims 1-8.   When the holding mechanism releases the holding of the transport jig and the stage starts to hold the flexible substrate, the control mechanism moves the first holding mechanism from the second height position. The holding mechanism descends again from the first height position to the second height position while maintaining the state where the holding to the conveying jig is released, and the holding mechanism is lowered again. The substrate carry-in apparatus according to claim 1, wherein the holding mechanism and the holding mechanism moving unit are controlled so that the flexible substrate is pressed against the stage again. A sensor (25) for detecting whether the flexible substrate is held in an appropriate state or in an inappropriate state on the stage;
The control unit is configured such that the flexible substrate is in an appropriate state for the stage during a predetermined monitoring period after the holding mechanism is lowered again from the first height position to the second height position. If the sensor detects that the holding mechanism is held at the second height position, the holding mechanism and the holding mechanism moving portion are moved so that the holding mechanism rises again from the second height position to the first height position. The board | substrate carrying-in apparatus of Claim 10 characterized by the above-mentioned. A sensor (25) for detecting whether the flexible substrate is held in an appropriate state or in an inappropriate state on the stage;
The control unit releases the holding of the flexible substrate at the second height position, and when the stage starts to hold the flexible substrate, the holding mechanism is moved to the second height position. The flexible substrate is moved from the height position to the first height position, and the flexible substrate is moved to the stage during a predetermined first monitoring period after the stage starts holding the flexible substrate. If it is detected by the sensor that the substrate is held in an inappropriate state, the holding mechanism is moved from the first height position to the second height while maintaining the state in which the holding on the flexible substrate is released. 2. The holding mechanism and the holding mechanism moving unit are controlled such that the holding mechanism and the holding mechanism moving unit are lowered so that the holding mechanism is lowered again to press the flexible substrate against the stage. Board loading equipment. A substrate suction hole (20c) is formed in the stage, and the flexible substrate is sucked and held on the stage by a suction force acting through the substrate suction hole from the vacuum suction part (34).
The sensor is provided on a path connecting the suction hole and the vacuum suction unit, and whether or not the flexible substrate is held in an appropriate state on the stage based on the degree of vacuum of the path is inappropriate. 13. The substrate carrying-in apparatus according to claim 11 or 12, wherein it is detected whether the substrate is held in a stable state. A substrate carry-in device according to any one of claims 1 to 13,
A component mounting apparatus, comprising: a mounting head portion (19) for mounting components on the flexible substrate held on the stage. The flexible substrate (3) held by the transfer jig (2) is transferred from the supply position (P1) of the flexible substrate to the stage (20) on which the flexible substrate is placed and held. A board carrying-in method for carrying in,
A holding mechanism (42) including a holding body (45, 46) for releasably holding the conveying jig and a first elastic member (47) that elastically biases the holding body downward;
Holding the conveying jig by the holding body of the holding mechanism at the supply position;
Moving the holding mechanism from the supply position (P1) to above the stage;
A second height at which the flexible substrate is placed on the stage from the first height position (H0, H2) where the holding mechanism has a gap between the flexible substrate and the stage. Is lowered to the position (H3), the holding body is displaced upward against the urging force of the first elastic member, and the holding body causes the conveying jig to face downward by the first elastic member. A substrate carrying-in method, wherein the flexible substrate is pressed against the stage by urging. A first fixing portion (52) fixed to the moving body (41) holding the holding mechanism, and a first fixing portion that can be moved up and down, the tip of which is attached to the flexible substrate. A first pressing body (53) arranged at a corresponding position and biased downward by its own weight,
When the holding mechanism is lowered from the first height position to the second height position on the stage, the holding body is displaced upward against the urging force of the first elastic member, and The first pressing body contacts the flexible substrate and is displaced upward with respect to the first fixing portion, and the first pressing body urges the flexible substrate downward by its own weight. The substrate carrying-in method according to claim 15, wherein the flexible substrate is pressed against the stage. A second fixing portion (79) fixed to the movable body (41) holding the holding mechanism, and a second fixing portion (79) that can be moved up and down, the tip of which corresponds to the transport jig And a second pressing body (77, 82, 83) that is disposed at a position that is urged downward by the second elastic member (86),
When the holding mechanism is lowered from the first height position to the second height position on the stage, the holding body is displaced upward against the urging force of the first elastic member, and The tip of the second pressing body comes into contact with the conveying jig and is displaced upward with respect to the second fixing portion against the urging force of the second elastic member, and is moved by the second elastic member. The substrate carrying-in method according to claim 15 , wherein the second pressing body urges the transport jig downward to press the flexible substrate against the stage.

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