JP4935856B2 - Mounting method of bumped electronic parts - Google Patents

Description

  The present invention relates to a bumped electronic component mounting method for sequentially mounting bumped electronic components at a plurality of component mounting positions on a semiconductor wafer.

  In recent years, with the progress of miniaturization and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. As a form of an electronic component for dealing with such high-density mounting, a so-called stack mounting type semiconductor device in which a plurality of semiconductor chips are stacked and mounted is adopted. In such stack mounting, a so-called chip-on-wafer method may be used in which semiconductor chips are directly stacked by bonding bumps of upper flip chips to electrodes formed on a semiconductor chip in a wafer state.

  When mounting electronic components with bumps such as flip chips, it is required to crimp all of the bumps evenly to the electrodes as much as possible. Therefore, the height and level of the mounting surface on which the electrodes are provided is ensured with high accuracy. There is a need. As described above, as a countermeasure method when the accuracy of the mounted surface is required, a method of correcting the mounting operation in the component mounting operation by detecting the height and warpage deformation state of the mounted surface such as the substrate conventionally. It is known (see Patent Document 1). In the prior art shown in this patent document example, the warp deformation is detected by measuring the height of the surface of the substrate as the mounting surface with a laser displacement meter.

JP 2000-299597 A

  However, in the above-described prior art, since the measurement target is an individual board, the measurement work must be repeatedly performed on all the boards to be mounted, and productivity due to a delay in work tact time. There is a drawback that the decline of the inevitable. In the above-mentioned prior art, it is effective when it has a certain degree of rigidity like a normal resin substrate and maintains its inherent warp deformation state, but the substrate to be mounted is like a semiconductor wafer. In the case where the substrate is thin and easily bent, a method in which such a substrate is directly measured is not applicable. That is, a substrate that is extremely flexible, such as a semiconductor wafer, does not have an inherent deformation state, and has a characteristic of following the deformation state of a stage that holds the semiconductor wafer. As described above, in the conventional technology, it is difficult to perform effective correction with high accuracy when it is required to ensure the height and level of the mounting surface such as flip chip with high accuracy, and a new measure is desired. It was.

  Accordingly, the present invention provides a mounting method for a bumped component that can ensure high-precision mounting quality in mounting of a bumped electronic component that is required to ensure the height and level of the mounted surface with high accuracy. The purpose is to do.

The bumped electronic component mounting method according to the present invention is a bumped electronic component mounting method in which a bumped electronic component is sequentially mounted at a plurality of component mounting positions on a semiconductor wafer by an electronic component mounting apparatus. Includes a mounting head for holding and transferring the electronic components with bumps, a wafer holding stage provided with a mounting surface for sucking and holding the semiconductor wafer from the lower surface, and a plurality of the wafer holding stages in the same plane. Stage height adjusting means for three-dimensionally adjusting the height position of the mounting surface by raising and lowering the position individually, and height measuring means for measuring the height of the height measuring point of the mounting surface, A height measurement step of measuring the height of the plurality of height measurement points set in advance on the placement surface by the height measurement means, and the height measurement step. A height data storage step for storing in the storage means height data associating measurement results with the plurality of height measurement points as specific data of the wafer holding stage; and a mounting surface of the wafer holding stage. And holding the bumps of the electronic components with bumps held by the mounting head to the electrodes respectively formed at the plurality of component mounting positions, and attaching the electronic components with bumps to the component mounting positions. A component mounting step of repeatedly executing individual component mounting operations to be mounted on all component mounting positions by driving the stage height adjusting means based on the height data in the component mounting step. The height and level of the mounting surface at the component mounting position are determined for each individual component mounting operation. To integer.

  According to the present invention, the height measurement unit measures the heights of a plurality of height measurement points set in advance on the mounting surface for attracting and holding the semiconductor wafer from the lower surface, and the measured height data is obtained. In the component mounting step of repeatedly executing the individual component mounting operation for storing the bumped electronic component at the component mounting position, the stage is based on the stored height data. By driving the height adjustment means and adjusting the height and level of the mounting surface at the component mounting position for each individual component mounting operation, the height and level of the mounted surface can be ensured with high accuracy. In mounting required electronic components with bumps, high-accuracy mounting quality can be ensured.

The perspective view which shows the structure of the electronic component mounting apparatus of one embodiment of this invention The perspective view of the stage height adjustment means in the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the stage mounting plate in the electronic component mounting apparatus of one embodiment of this invention Mechanism explanatory drawing of the stage height adjustment means in the electronic component mounting apparatus of one embodiment of the present invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of stage height adjustment in the electronic component mounting apparatus of one embodiment of this invention The flowchart of the mounting method of the electronic component with a bump of one embodiment of the present invention Process explanatory drawing of the mounting method of the electronic component with bump of one embodiment of the present invention Process explanatory drawing of the mounting method of the electronic component with bump of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the overall configuration of the electronic component mounting apparatus 1 will be described with reference to FIG. The electronic component mounting apparatus 1 is used in the process of manufacturing a semiconductor device in a stack mounting form by mounting a semiconductor chip in a wafer state on the lower semiconductor chip and mounting an upper semiconductor chip on the lower semiconductor chip. In other words, in the present embodiment, a semiconductor wafer in which a plurality of lower semiconductor chips are formed is targeted, and each upper semiconductor chip, which is a plurality of component mounting positions on the semiconductor wafer, is connected to an upper electronic bump component. The semiconductor chips are sequentially mounted.

In FIG. 1, an electronic component mounting apparatus 1 is mainly composed of a wafer holder 2, a wafer supply means 3, a chip supply means 4, and a mounting head 5. The wafer holding unit 2 holds a semiconductor wafer 6 on which a plurality of lower semiconductor chips 7 are formed. On the upper surface of the semiconductor chip 7, as shown in FIG. 9C, an electrode 7a for connecting the upper semiconductor chip is provided. The wafer supply means 3 supplies the semiconductor wafer 6 to the wafer holder 2. The chip supply means 4 has a function of supplying an upper semiconductor chip 9 mounted on the semiconductor chip 7 in the form of a semiconductor wafer 8. The upper surface of the semiconductor chip 9 is connected to the lower semiconductor chip 9. Bumps 9a for connection are formed (see FIG. 9C). The semiconductor chip 9 is held and taken out by a chip take-out mechanism (not shown) provided in the chip supply means 4, the bump 9 a is reversed so as to face the semiconductor wafer 8, and the semiconductor chip 9 is delivered to the mounting head 5. The wafer 6 is transferred and mounted.

  The wafer supply means 3 stores the semiconductor wafers 6 in a stacked state in the magazine 3a. A semiconductor wafer 6 to be mounted is taken out of the magazine 3a by a wafer transfer mechanism (not shown) and supplied to the wafer holder 2. The chip supply means 4 has a configuration in which the semiconductor wafer 8 is placed on the holding table 4a, and the mounting head 5 that takes out the semiconductor chip 9 from the semiconductor wafer 8 is mounted on the wafer holding unit 2 by a head moving mechanism (not shown). Move up. The mounting head 5 and the head moving mechanism constitute a chip mounting means 53 that takes out the semiconductor chip 9 from the chip supply means 4 and mounts it on the semiconductor wafer 6 (see FIG. 5).

  The wafer holding unit 2 holds the stage mounting plate 12 via three height adjusting mechanisms 11A, 11B, and 11C disposed on the upper surface of the base plate 10, and the wafer holding stage 13 is mounted on the upper surface of the stage mounting plate 12. It is the structure which mounted. A mounting surface 13a is provided on the upper surface of the wafer holding stage 13, and the mounting surface 13a sucks and holds the semiconductor wafer 6 supplied from the wafer supply means 3 from the lower surface. Recognizing means 25 is arranged above the wafer holding unit 2 with the imaging surface facing downward. The semiconductor wafer 6 held on the wafer holding stage 13 is imaged by the recognition means 25, and the image data is recognized to recognize the position of each semiconductor chip 7 on the semiconductor wafer 6, that is, the component mounting position.

  The mounting head 5 has a configuration in which an elevating plate 21 is held at a lower portion of a rectangular block-shaped head main body portion 20 driven by a head moving mechanism via four adjustment bolts 22 provided at each corner portion. A mounting tool 23 is attached to the lower surface of the elevating plate 21 for attracting and holding the semiconductor chip 9 to be mounted. By adjusting the adjustment bolt 22 of each corner, the height of each corner of the adjustment bolt 22 can be adjusted, whereby the level of the mounting tool 23 can be adjusted.

  Height measuring means 24 is mounted on the side surface of the head body 20 with the measurement surface facing vertically downward. The height measuring means 24 has a function of measuring the height position of the lower measurement point by irradiating the laser beam and receiving the reflected light. By horizontally moving the head main body 20, the height measuring means 24 moves above an arbitrary position in the placement surface 13a. Then, by operating the height measuring means 24 in this state, it is possible to acquire height data indicating the height position of the height measurement point (see FIG. 6A) set on the placement surface 13a. .

  Next, the configuration of the stage height adjusting means provided in the wafer holding unit 2 will be described with reference to FIGS. As shown in FIG. 2, height adjustment mechanisms 11 </ b> A, 11 </ b> B, and 11 </ b> C having the same configuration are arranged on the upper surface of the base plate 10 in an array positioned at each vertex of an isosceles triangle. The height adjustment mechanisms 11A, 11B, and 11C are configured to finely adjust the heights of the contact blocks 33a, 33b, and 33c by the motors 32a, 32b, and 32c, respectively. The motors 32a, 32b, and 32c are arranged on the stage. It is driven by the height adjustment motor drive unit 34.

  3A is a bottom view of the stage mounting plate 12 shown in FIG. 1, and the lower surface of the stage mounting plate 12 corresponds to the arrangement of the height adjusting mechanisms 11A, 11B, and 11C in the base plate 10. FIG. , Roller support portions A, B, and C are provided. The roller support portions A, B, and C are configured to accommodate the roller member 30 that is pivotally supported by the shaft member 31 in the recesses 12a, 12b, and 12c formed on the lower surface of the stage mounting plate 12. As shown in FIG. 3B, the lower end portion of the roller member 30 protrudes downward from the lower surface 12 d of the stage mounting plate 12. In a state where the stage mounting plate 12 is stacked above the base plate 10, as shown in FIG. 4, in the roller support portions A, B, and C, the lower end portion of the roller member 30 is placed on the upper surfaces of the contact blocks 33a, 33b, and 33c. Abut.

  The structure of the height adjustment mechanisms 11A, 11B, and 11C will be described. As shown in FIG. 4, a taper-shaped base block 35 is fixed to the upper surface of the base plate 10, and a slider 37 is provided on the guide rail 36 disposed along the inclined direction on the inclined surface 35 a of the base block 35. Is slidably mounted. Abutting blocks 33a, 33b, and 33c, through which nut members 38 are inserted, are fixed to the upper surface of the slider 37. A feed screw 39 pivotally supported at both ends by support brackets 40 and 41 is screwed onto the nut member 38, and the feed screw 39 is coupled to a coupling 42 by motors 32 a, 32 b and 32 c held by the support bracket 43. It is rotationally driven through.

  When the motors 32a, 32b, and 32c are individually forward / reversely driven by the stage height adjusting motor drive unit 34, the contact blocks 33a, 33b, and 33c reciprocate along the inclined surface 35a (arrow a). As a result, the heights ha, hb, hc from the upper surface 10a of the base plate 10 to the upper surfaces of the contact blocks 33a, 33b, 33c are individually changed, and the roller members are in contact with the upper surfaces of the contact blocks 33a, 33b, 33c. Through 30, the height positions of the roller support portions A, B, and C of the stage mounting plate 12 change individually. Thus, by changing the height of the three points (roller support portions A, B, and C) in the same plane of the stage mounting plate 12, the height of the stage mounting plate 12 and the inclination in the X direction and the Y direction are determined. The state can be changed, and the height position of the mounting surface 13a of the wafer holding stage 13 mounted on the stage mounting plate 12 can be adjusted three-dimensionally.

  In the above-described configuration, the height adjustment mechanisms 11A, 11B, and 11C and the roller member 30 mounted on the roller support portions A, B, and C of the stage mounting plate 12 are arranged at a plurality of positions (here, in the same plane of the wafer holding stage 13). Then, the stage height adjusting means 52 (refer to FIG. 5) that adjusts the height position of the mounting surface 13a three-dimensionally by individually moving up and down the roller support portions A, B, and C). Yes.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 5, the control unit 50 controls the wafer supply unit 3 and the chip supply unit 4, whereby the semiconductor wafer 6 is supplied to the mounting surface 13 a and the semiconductor chip 9 is supplied to the mounting head 5. The When the control unit 50 controls the recognition means 25, the semiconductor wafer 6 sucked and held on the mounting surface 13a is imaged, and thereby the position of the mounting point is recognized. The mechanism driving unit 51 drives the stage height adjusting unit 52 and the chip mounting unit 53. When the control unit 50 controls the stage height adjusting unit 52 via the mechanism driving unit 51, the height position of the placement surface 13a can be adjusted three-dimensionally. Further, the control unit 50 controls the chip mounting unit 53 via the mechanism driving unit 51, whereby the semiconductor chip 9 is taken out from the chip supply unit 4 by the mounting head 5 and held on the wafer holding stage 13. A chip mounting operation for sequentially mounting and mounting at the component mounting position is executed. In this chip mounting operation, the control unit 50 controls the chip mounting means 53 based on the result of position recognition of the semiconductor wafer 6 by the recognition means 25.

  When the control unit 50 controls the head moving mechanism and the height measuring unit 24, a height measuring operation for measuring the height of the height measuring point of the mounting surface 13a is executed. The height data acquired by the height measuring unit 24 is stored in the storage unit 54. In the chip mounting operation in which the semiconductor chips 9 are sequentially mounted on the semiconductor wafer 6 held on the wafer holding stage 13, the stage height adjusting means 52 is controlled based on the height data read from the storage means 54. The height and levelness of the mounting surface 13a at the component mounting position are adjusted.

  Here, with reference to FIG. 6, the height measurement of the mounting surface 13a and the adjustment of the height and level of the mounting surface 13a performed when the semiconductor chip 9 is mounted will be described. As shown in FIG. 6A, a plurality of height measurement points H (i, j) are set in a lattice arrangement on the upper surface of the placement surface 13a. Here, the arrangement pitch of the height measurement points H (i, j) is set according to the degree of deformation of the target wafer holding stage 13 and the plane accuracy required for the semiconductor chip 7 and the semiconductor chip 9 to be mounted. Is done. That is, when the processing accuracy in the manufacturing stage of the wafer holding stage 13 is good and the degree of thermal deformation accompanying the temperature rise during the mounting operation is small, the arrangement pitch of the height measurement points H (i, j) is coarse. Also good. On the other hand, when the processing accuracy of the wafer holding stage 13 is difficult and the shape is somewhat curved from the beginning, or when the thermal deformation caused by heating at the time of mounting becomes a size that cannot be ignored. Sets the arrangement pitch of the height measurement points H (i, j) densely according to their degree. The height measurement result of the stage obtained by the height measuring unit 24 for the placement surface 13a is stored in the storage unit 54 as height data associated with a plurality of height measurement points H (i, j). The

  FIG. 6B shows the relationship between the semiconductor chip 7 * to be mounted and the height measurement point H (i, j) in a state where the semiconductor wafer 6 is held on the mounting surface 13a. P (i, j) shown in the figure is a component mounting position indicating the center position of the semiconductor chip 7 *. In the present embodiment, the semiconductor chip 9 * is mounted on the semiconductor chip 7 *. In operation, the height and levelness of the component mounting position P (i, j) are adjusted using the height data of the height measurement point H in the vicinity of the component mounting position P (i, j). .

  That is, as shown in FIG. 6C, the mounting at the component mounting position P (i, j) is performed using a plurality of height measurement points H (i, j) in the vicinity of the component mounting position P (i, j). First, approximate curves Lx and Ly indicating cross-sectional shapes of the placement surface 13a in the X direction and the Y direction are obtained. Then, inclination angles δθx and δθy formed by the tangent lines Tx and Ty at the component mounting position P of the approximate curves Lx and Ly and the horizontal line HL are calculated. The inclination angles δθx and δθy obtained in this way indicate a locally deformed state of the mounting surface 13a which should be a horizontal plane. As described above, in the component mounting operation for the semiconductor chip 7 *, the height adjustment of the height corresponding to the semiconductor chip 7 * on the mounting surface 13a to the regular component mounting height by the mounting head 5 is performed. The stage height adjusting means 52 executes adjustment of the horizontality to make the inclination angles δθx and δθy as small as possible.

  That is, as shown in FIG. 6D, the height adjusting mechanisms 11A, 11B, and 11C provided on the roller support portions A, B, and C in the stage mounting plate 12 are driven, respectively, as shown in FIG. By adjusting the height dimensions ha, hb, and hc by the adjustment amounts Δa, Δb, and Δc, respectively, the height position of the component mounting position corresponding to the semiconductor chip 7 * on the mounting surface 13a is adjusted to the normal height position. At the same time, the inclination angles δθx and δθy can be made substantially zero to keep the semiconductor chip 7 * horizontal. Here, the adjustment amounts Δa, Δb, and Δc are individually calculated by the control unit 50 for each component mounting position P (i, j) based on the height data of the wafer holding stage 13 stored in the storage unit 54. The

The electronic component mounting apparatus 1 is configured as described above. Next, the electronic component mounting apparatus 1 sequentially bumps the semiconductor chips 9 that are electronic components with bumps onto a plurality of component mounting positions P of the semiconductor wafer 6. A method for mounting the attached electronic component will be described along the flow of FIG. 7 with reference to the drawings.

  In FIG. 7, stage height measurement is first performed (ST1). That is, on the mounting surface 13a of the wafer holding stage 13, the heights of a plurality of preset height measurement points H (i, j) (see FIG. 6A) are as shown in FIG. Then, the height is measured by the height measuring means 24 (height measuring step). Next, the measurement result is stored (ST2). That is, the height data in which the measurement result in the height measurement step is associated with a plurality of height measurement points (i, j) is stored in the storage means 54 as the unique data of the wafer holding stage 13 (height data storage Step).

  The height measurement and height data storage shown here are executed only once for the newly assembled electronic component mounting apparatus 1 or the electronic component mounting apparatus 1 in which the wafer holding stage 13 is newly replaced. If it is an operation and the deformation state of the mounting surface 13a may be regarded as not changing, it is not necessary to repeat the operation. If the wafer holding stage 13 is equipped with a heating mechanism for heating the semiconductor wafer 6 and the mounting operation is performed in the heated state, the above-described height measurement step is performed at the temperature of the wafer holding stage 13. Is preferably performed in a state in which the temperature is adjusted to a preset temperature in the equipment operation state.

  Thereafter, actual mounting work is started. First, the semiconductor wafer 6 is mounted on the wafer holding stage 13 (ST3). That is, as shown in FIG. 8B, the semiconductor wafer 6 is lowered with respect to the mounting surface 13a of the wafer holding stage 13 (arrow b) and held by suction of the mounting surface 13a (wafer holding step). At this time, the mounting surface 13a of the wafer holding stage 13 is not in a completely flat state, and the semiconductor wafer 6 to be mounted is thin and has low rigidity. As shown in FIG. 8C, it is held in close contact with the surface shape of the mounting surface 13a.

  Next, the component mounting operation is started. Here, first, the mounting position is read (ST4). Here, which of a plurality of semiconductor chips 7 constituting the semiconductor wafer 6 is identified as a target in the component mounting operation is identified. Then, the stage height around the identified mounting position is read (ST5). That is, among the unique height data of the wafer holding stage 13 stored in (ST2), the height data of a plurality of height measurement points H in the vicinity of the target semiconductor chip 7 in the mounting operation is read.

  Next, the driving amount of the stage height adjusting means 52 is calculated (ST6). That is, based on the read height data, the inclination angles δθx and δθy for the component mounting position P shown in FIG. 6C are calculated, and the height position of the component mounting position P is determined as the normal height position. In addition, adjustment amounts Δa, Δb, Δc for keeping the semiconductor chip 7 * horizontal by setting the tilt angles δθx, δθy to substantially zero are calculated by the control unit 50.

  Thereafter, the control unit 50 controls the stage height adjusting means 52 based on the adjustment amounts Δa, Δb, and Δc, thereby adjusting the stage height (ST7). That is, as shown in FIG. 9A, the mounting target semiconductor chip 7 * positioned at the component mounting position P has the wafer holding stage 13 aligned with the normal height position and the inclination angles δθx, δθy. Is corrected, and the level of the semiconductor chip 7, that is, the degree of parallelism with the semiconductor chip 9 held by the mounting tool 23 of the mounting head 5 is secured.

Next, chip mounting is performed (ST8). That is, the mounting head 5 that has taken out the semiconductor chip 9 from the chip supply means 4 is moved above the wafer holding unit 2, and the mounting tool 23 holding the semiconductor chip 9 is moved to the component mounting position as shown in FIG. 9B. Align with P and move down (arrow c). Then, a bonding operation of pressing the semiconductor chip 9 against the semiconductor chip 7 * while heating the semiconductor chip 9 by the mounting tool 23 is executed. Thereby, as shown in FIG. 9C, the bump 9 a formed on the lower surface of the semiconductor chip 9 is joined to the electrode 7 a of the semiconductor chip 7. After that, it is determined whether or not the mounting is completed in all mounting locations (ST9). If the mounting is not completed, the processing returns to (ST4) and the same processing operation is repeatedly executed, and the mounting is performed in (ST9). When the completion is confirmed, the component mounting work for the semiconductor wafer 6 is completed.

  That is, in the above (ST4) to (ST9), the bumps 8a of the semiconductor wafer 8 held by the mounting head 5 are bonded to the electrodes 7a formed on the semiconductor chip 7 which is a plurality of component mounting positions, respectively. A component mounting step for repeatedly executing the individual component mounting operation for mounting the wafer 8 on one of the plurality of semiconductor chips 7 at all the component mounting positions is configured. In the present embodiment, in the above-described component mounting step, the stage height adjusting unit 52 is driven based on the height data unique to the wafer holding stage 13 stored in the storage unit 54, thereby the component. The height and the level of the mounting surface 13a at the mounting position are adjusted for each individual component mounting operation.

  By adopting such a method, the height and horizontality of the mounting surface can be improved as in the stack mounting form in which the semiconductor chip 9 is further stacked and mounted on the semiconductor chip 7 in a thin wafer state that is very flexible. In component mounting that is required to ensure high accuracy, even when there is a flatness error on the mounting surface 13a due to manufacturing errors or deformation, high-accuracy mounting quality can be ensured.

  The method for mounting electronic components with bumps according to the present invention can ensure high-precision mounting quality in mounting electronic components with bumps that are required to ensure the height and level of the mounted surface with high accuracy. This is effective and is useful in applications where bumped electronic components are sequentially mounted at a plurality of component mounting positions on a semiconductor wafer.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Wafer holding part 3 Wafer supply means 4 Chip supply means 5 Mounting head 6, 8 Semiconductor wafer 7, 9 Semiconductor chip 11A, 11B, 11C Height adjustment mechanism (stage height adjustment means)
12 stage mounting plate 13 wafer holding stage 13a mounting surface 24 height measuring means 25 recognizing means

Claims (2)

A bumped electronic component mounting method for sequentially mounting bumped electronic components at a plurality of component mounting positions on a semiconductor wafer by an electronic component mounting apparatus,
The electronic component mounting apparatus includes a mounting head that holds and transfers the electronic component with bumps, a wafer holding stage that is provided with a mounting surface that sucks and holds the semiconductor wafer from a lower surface, and a wafer holding stage. Stage height adjusting means for three-dimensionally adjusting the height position of the mounting surface by individually moving up and down a plurality of positions in the same plane, and measuring the height of the height measuring point of the mounting surface. A height measuring means,
A height measurement step for measuring the heights of the plurality of height measurement points set in advance on the placement surface by the height measurement means, and a measurement result in the height measurement step as the plurality of height measurement points. Height data storage step for storing the height data associated with the wafer holding stage as unique data of the wafer holding stage, a wafer holding step for holding the semiconductor wafer on the mounting surface of the wafer holding stage, and the mounting head All the individual component mounting operations for bonding the bumps of the electronic components with bumps held by the electrodes to the electrodes formed at the plurality of component mounting positions and mounting the electronic components with bumps at one of the component mounting positions, respectively. A component mounting step for repeatedly executing the component mounting position of
In the component mounting step, by driving the stage height adjusting means based on the height data, the height and level of the mounting surface at the component mounting position are adjusted for each individual component mounting operation. A method for mounting a bumped electronic component.   2. The method for mounting electronic components with bumps according to claim 1, wherein the height measuring step is executed in a state in which the temperature of the wafer holding stage is adjusted to a preset temperature in the equipment operating state.

Images