JP2005333005A - Small part laminating device and laminating method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small part laminating device and laminating method, which laminate at a high reliability without breaking a small part or an incomplete lamination. <P>SOLUTION: Prior to laminating a first small part 11 and a second small part 12 via a joining member 13, the cured state of the joining member 13 at lamination is predicted from the temperature of the first small part 11 measured by a temperature probe 21. And, a temperature controller 22 controls a temperature of a heater 3 at actual lamination according to this predicted result. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a microcomponent laminating apparatus and a microcomponent laminating method for mounting with a predetermined interval between two microcomponents.

For example, Japanese Patent Application Laid-Open No. H10-228667 proposes a microcomponent bonding apparatus that mounts two microcomponents while maintaining a predetermined interval between them. In Patent Document 1, the holder support means is provided with a height detection means for detecting a change in the height position of the tool holder that holds the chip with respect to the holder support means. That is, by feeding back the change in the height position of the tool holder with respect to the holder support means to the drive control of the Z-axis feed device that moves the tool holder up and down, the Z-axis feed device is thermally expanded under the influence of the environmental temperature. However, it is possible to mount the bump while maintaining a predetermined shape.
JP 2000-353725 A

  In the technique of Patent Document 1, a change in the height position of the tool holder with respect to the holder support means can be detected by the height detection means, but since the actual part temperature cannot be known, the thermal expansion of the parts before and after heating is possible. In addition, the influence of the curing shrinkage of the bonding member and the cured state of the bonding member cannot be considered. Therefore, there is a possibility that the micro parts are damaged by an unexpected load or heating. In addition, the bonding of the minute parts may be incomplete due to insufficient heating or excessive heating, and the bonding position may be shifted or peeled off, so that the minute parts cannot be bonded with high reliability.

  The present invention has been made based on such circumstances, and a micro component bonding apparatus capable of bonding with high reliability without damaging or incomplete bonding of the micro components. And it aims at providing the bonding method.

  In order to achieve the above-described object, the microcomponent bonding apparatus according to the first aspect of the present invention is configured so that the mounting portion for mounting the first microcomponent and the first microcomponent are opposed to each other. A holding part for holding the second micro part to be arranged, and at least one of the above-mentioned mounting part or the holding part is moved to join the first micro part and the second micro part to each other. A drive unit that is contacted via the drive unit, a drive control unit that controls a movement amount and a movement speed when moving at least one of the placement unit or the holding unit by the drive unit, and for curing the joining member A heat energy supply unit that provides the heat energy of the heat generating member and a cured state of the bonding member when the bonding member is cured, and based on the prediction result, the first micro component and the second micro component are actually Bonding when bonding parts Characterized by comprising a bonding condition setting unit sets a condition.

  In order to achieve the above object, the method for bonding microcomponents according to the second aspect of the present invention includes a load setting step for setting a load applied when the first microcomponent and the second microcomponent are joined, Prediction of the cured state of the bonding member when bonding the first micro component and the second micro component through the bonding member, and bonding when actually bonding based on the prediction result A bonding condition setting step for setting a bonding condition, and a bonding step for bonding the first microcomponent and the second microcomponent based on the bonding condition set in the bonding condition setting step. It is characterized by having.

  According to these first and second aspects, the cured state of the joining member can be predicted prior to bonding the first minute component and the second minute component via the joining member. Bonding can be performed with high reliability without damaging minute parts or incomplete bonding.

  ADVANTAGE OF THE INVENTION According to this invention, the micro component bonding apparatus and bonding method which can be bonded with high reliability, without damaging a micro component or becoming incomplete bonding can be provided. .

[First Embodiment]
FIG. 1 shows the configuration of a microcomponent bonding apparatus according to the first embodiment of the present invention. FIG. 1 is a left side view of the microcomponent bonding apparatus according to the first embodiment. In FIG. 1, only the periphery of the mounting block is shown in cross section.

  In FIG. 1, a first micro component 11 is placed on a placement plate 2 and fixed to the placement plate 2 by a technique such as vacuum suction. Further, the second micro component 12 is arranged so as to face the first micro component 11 and is held by the holding tool 14 by a technique such as vacuum suction. The first microcomponent 11 and the second microcomponent 12 are bonded and fixed by the microcomponent bonding apparatus via the joining member 13. Here, as the joining member 13, a so-called thermosetting joining member that joins and fixes the adherend by heat softening and hardening, such as solder, Au, or resin, is used.

  A heat energy supply unit including a heater 3 and a temperature control device 22 is provided below the mounting plate 2. The heater 3 heats the mounting plate 2 to give thermal energy to the joining member 13. A heat insulating material 4 is provided around the heater 3, and is connected to the temperature control device 22 through the heat insulating material 4. The temperature control device 22 controls the heating amount of the mounting plate 2 by the heater 3. Further, the heater 3 is fixed to the mounting block 5 via a heat insulating material 4. The heat insulating material 4 efficiently transmits the heat of the heater 3 to the mounting plate 2 and prevents unnecessary heat transmission to the mounting block 5.

  In addition, three distance sensors 6 are installed at equal intervals on both the left and right sides of the mounting plate 2, and each distance sensor 6 is connected to an interval control device 9 as a drive control unit. . The distance sensor 6 uses the position of the surface of the mounting plate 2 on the side on which the first microcomponent 11 is mounted as a reference, and holds the second microcomponent 12 of the holding tool 14 facing it. The distance to the side surface is measured and output to the interval control device 9. The distance control device 9 calculates the distance and inclination between the opposed surfaces of the first microcomponent 11 and the second microcomponent 12 from the output of the distance sensor 6.

  The interval control device 9 is connected to a first Z moving mechanism 103 serving as a driving unit and a voice coil motor (VCM) 102 serving as a load setting unit, and includes a first micro component 11 and a second micro component. A movement amount instruction and a movement speed instruction to the first Z movement mechanism 103 and a drive current instruction to the VCM 102 are performed so that the distance and the inclination between the facing surfaces of the component 12 have desired values. Here, the VCM 102 changes the magnitude and direction of a current that flows in a coil (not shown) inside, so that the holding tool 14 can be used to join the first microcomponent 11, the second microcomponent 12, and the joining member 13 when joining the components. The load applied to is changed.

  Further, the holding tool 14 is supported by a linear motion gas bearing 101 so as to be movable in the vertical direction of the drawing (direction facing the mounting plate 2). The surface of the holding tool 14 opposite to the surface on which the first microcomponent 11 is held is fixed to the VCM 102. Further, the linear motion gas bearing 101 and the VCM 102 are fixed to a first Z movement table 1031 provided in the first Z movement mechanism 103. The first Z moving mechanism 103 is configured to be able to move the first Z moving table 1031 in the vertical direction of the drawing (opposite direction of the holding tool 14 and the mounting plate 2) by a motor and a ball screw (not shown). ing.

  The mounting block 5 is fixed on the tilt mechanism 201. The tilt mechanism 201 is fixed on the first XY moving mechanism 202, and the first XY moving mechanism 202 is fixed on the rotating mechanism 203. The tilt mechanism 201 changes the tilt of the mounting block 5 with respect to the holding tool 14 by a motor and a feed screw (not shown). The first XY moving mechanism 202 changes the horizontal position of the mounting block 5 with respect to the holding tool 14 by a motor and a ball screw (not shown). The rotation mechanism 203 changes a position in the rotation direction around the vertical axis with respect to the holding tool 14 of the mounting block 5 (hereinafter referred to as a rotation direction position) by a motor and a gear (not shown).

  In addition, the probe exit which is composed of the second XY movement mechanism 211, the second XY movement table 2111, the second Z movement mechanism 212, and the second Z movement table 2121 so as to be adjacent to the rotation mechanism 203. A mechanism is provided. That is, in this probe withdrawal mechanism, the second Z moving mechanism 212 is fixed on the second XY moving table 2111 provided in the second XY moving mechanism 211. Further, the temperature probe 21 is fixed to the second Z movement table 2121 provided in the second Z movement mechanism 212. The second XY moving mechanism 211 changes the horizontal position of the temperature probe 21 with respect to the mounting plate 2 by a motor and a ball screw (not shown). The second Z moving mechanism 212 changes the vertical position of the temperature probe 21 with respect to the mounting plate 2 by a motor and a ball screw (not shown). This temperature probe 21 is connected to a temperature control device 22. The temperature control device 22 sends a temperature amount instruction to the heater 3 based on the temperature measured by the temperature probe 21, and the heater 3 performs heating at the instructed temperature. Thereby, the function of the bonding condition setting unit is realized.

  Next, a method for bonding microcomponents according to the first embodiment will be described with reference to FIG. First, the interval control device 9 sets a load at the time of contact between the first microcomponent 11 and the second microcomponent 12 (step S1). In step S1, the interval control device 9 instructs the current value and current direction of the drive current of the VCM 102 based on a load detected by a load detection element (for example, a load cell) (not shown). That is, the weight of the holding tool 14 is reduced by causing the VCM 102 to generate a thrust that is slightly smaller than the weight of the holding tool 14 and pulls up the holding tool 14 (upward).

  Next, the thickness of the first micropart 11 is measured (step S2). For this purpose, the first microcomponent 11 is held by the holding tool 14 using a technique such as vacuum suction. Then, driving of the first Z moving mechanism 103 is started, and the first micro component 11 is lowered to a predetermined position where the first micro component 11 comes into contact with the mounting plate 2. The distance to the holding tool 14 at this time is measured by the distance sensor 6, and the output value is stored as a thickness value of the first microcomponent 11 in a memory (not shown) of the interval control device 9. Here, it is assumed that the output of the distance sensor 6 is corrected in advance so as to be zero when the mounting plate 2 and the holding tool 14 come in contact with each other in parallel. The zero point correction of the distance sensor 6 may be performed each time before supplying the first microcomponent 11 to the mounting plate 2 as necessary.

  Next, a temperature correction coefficient ΔT for calculating a temperature instructed from the temperature control device 22 to the heater 3 is calculated so that the first microcomponent 11 can be heated at a desired temperature (step S3). In step S <b> 3, first, suction holding of the first microcomponent 11 by the holding tool 14 is released, and the first microcomponent 11 is placed and fixed on the placement plate 2. Next, the holding tool 14 is lifted and retracted, and the second micro component 12 is held by vacuum holding on the holding tool 14.

  Next, the temperature probe 21 is brought into contact with the surface on which the first microcomponent 11 is bonded (hereinafter referred to as a bonding surface) by the second XY moving mechanism 211 and the second Z moving mechanism 212. . Thereafter, the temperature control device 22 sends an instruction to the heater 3 to raise the temperature to a temperature Tch that is lower than the bonding temperature Ts necessary and sufficient to cure the bonding member 13. Next, the temperature controller 22 heats the first micro component 11 at the joining temperature Ts from the temperature difference between the heater temperature Tch and the component temperature Tcw of the first micro component 11 measured by the temperature probe 21. In addition, a temperature correction coefficient ΔT for calculating the temperature Tsh to be instructed to the heater 3 is calculated. Then, the temperature control device 22 stores the calculated temperature correction coefficient ΔT in a memory (not shown) of the temperature control device 22. That is, it can be considered that the component temperature Tcw of the first microcomponent 11 is substantially equal to the temperature of the bonding member 13, and thus the cured state of the bonding member 13 can be predicted from the component temperature Tcw.

  Here, the component temperature Tcw of the first microcomponent 11 is usually lower than the heater temperature Tch due to the effects of heat conduction, heat dissipation, etc., but by calculating the temperature correction coefficient ΔT, the bonding temperature Ts can be calculated. It is possible to calculate the temperature Tsh (= Ts + ΔT) of the heater 3 necessary for obtaining.

  Further, since the heater temperature Tch is lower than the bonding temperature Ts of the bonding member 13, the first micro component 11 and the bonding member 13 are not adversely affected or adversely affected by heat.

  The method for calculating the temperature correction coefficient ΔT is not limited to the method described above. For example, a function of the heater temperature Tch and the component temperature Tcw may be calculated from the result of temperature measurement a plurality of times, and ΔT may be obtained from this function. Further, the relationship between the heater temperature Tch and the component temperature Tcw may be stored in advance in a memory (not shown) of the temperature control device 22 for each component, and ΔT may be obtained from this table.

  After the process in step S3, the first microcomponent 11 and the second microcomponent 12 are aligned in the horizontal direction in the drawing (step S4). In step S <b> 4, first, the temperature probe 21 is retracted from the bonding surface of the first microcomponent 11 by the second XY moving mechanism 211 and the second Z moving mechanism 212. Next, the mounting block 5 is moved by the first XY movement mechanism 202 and the rotation mechanism 203, and the horizontal position and the rotation direction position of the first microcomponent 11 and the second microcomponent 12 are set to predetermined positions. Match.

  Next, the first Z moving mechanism 103 is driven to move the first Z moving table 1031 so that the interval between the first micro component 11 and the second micro component 12 becomes a desired interval (step). S5). In step S5, the interval is controlled with reference to the thickness value of the first microcomponent 11 stored in a memory (not shown) of the interval control device 9.

  At this time, the distance sensor 6 always measures the distance between the opposing surfaces of the mounting plate 2 and the holding tool 14, and the distance control device 9 determines the first microcomponent based on the output of the distance sensor 6. 11 and the distance between the bonding surfaces of the second microcomponent 12 are calculated. Here, when the distance and the inclination of the first microcomponent 11 and the second microcomponent 12 are different from the desired values, the distance control device 9 moves the first Z movement mechanism 103 and the inclination mechanism 201 to the movement amount. Is adjusted so that the distance and the inclination between the first microcomponent 11 and the second microcomponent 12 become desired values.

  Next, the mounting plate 2 is heated by the heater 3 and necessary and sufficient thermal energy is applied to the bonding member 13 to bond the first micro component 11 and the second micro component 12 ( Step S6). In step S6 as well, the distance sensor 6 always measures the distance between the opposing surfaces of the mounting plate 2 and the holding tool 14, and the distance control device 9 uses the first micro-part 11 and the second micro-component 11. The distance between the bonding surfaces of the microcomponents 12 is calculated. Here, if the distance and inclination between the first microcomponent 11 and the second microcomponent 12 are different from the desired values, a command for the amount of movement is sent to the first Z movement mechanism 103 and the inclination mechanism 201, and Adjustment is made so that the distance and the inclination between the first microcomponent 11 and the second microcomponent 12 become desired values.

  Further, at this time, the temperature control device 22 sets the temperature instruction amount to the heater 3 to Tsh (= Ts + ΔT) determined based on the temperature correction coefficient ΔT calculated in step S3. Thereby, heat energy necessary and sufficient for joining of the joining member 13 can be given accurately. Therefore, the first microcomponent 11 and the second microcomponent 12 can be bonded with high reliability.

  In the first embodiment, the heater temperature is controlled at the time of bonding in step S6. However, thermal expansion and bonding of the first microcomponent 11 and the second microcomponent 12 during heating by the heater 3 are performed. Even if the drive control of the first Z moving mechanism 103 and the VCM 102 is performed in consideration of the hardening shrinkage of the member 13, the first micro component 11 and the second micro component 12 are bonded with high reliability. be able to. In this case, a table capable of obtaining the linear expansion coefficient and the amount of cure shrinkage from the material measured by the temperature probe 21 and the material of the component or the joining member is stored in a memory (not shown) of the temperature controller 22. In addition, the moving amount and moving speed of the first Z moving mechanism 103 and the current instruction amount of the VCM 102 at the time of component bonding may be corrected in accordance with the linear expansion coefficient and the hardening shrinkage obtained from this table. . For example, when the first micro component 11 and the second micro component are expanded by heat, the first Z moving mechanism 103 is raised by the expansion amount, or the load generated by the VCM 102 is reduced. You just have to do it.

  Further, in FIG. 1, the temperature control device 22 and the interval control device 9 are provided separately, but it goes without saying that they may be constituted by one device.

  In the first embodiment, the temperature of the first microcomponent 11 is measured. However, the temperature of the second microcomponent 12 or the joining member 13 may be measured. You may make it measure the temperature of both the micro component 11 and the 2nd micro component 12. FIG.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. FIG. 3 is a left side view of the periphery of the mounting block which is the main part of the microcomponent bonding apparatus according to the second embodiment. In FIG. 3, only the mounting block is shown in cross section.

  The second embodiment is different from the first embodiment in that the temperature is measured by bringing the temperature probe 21 into contact with the side surface of the first microcomponent 11. Since the other configuration is the same as that of the first embodiment, the description thereof is omitted.

  Next, a micropart bonding method according to the second embodiment will be described with reference to FIG. Steps S21 and S22 are the same as steps S1 and S2 in FIG.

  After step S22, the first microcomponent 11 and the second microcomponent 12 are aligned in the horizontal direction in the drawing (step S23). In this step S23, the mounting block 5 is moved by the first XY movement mechanism 202 and the rotation mechanism 203, and the horizontal position and the rotation direction position of the first micro component 11 and the second micro component 12 are determined in advance. Adjust to the position of.

  Next, the temperature probe 21 is brought into contact with the side surface of the first microcomponent 11 by the second XY moving mechanism 211 and the second Z moving mechanism 212 (step S24).

  Next, the first Z moving mechanism 103 is driven and stored in a memory (not shown) of the interval control device 9 so that the interval between the first minute component 11 and the second minute component 12 becomes a desired interval. The first Z movement table 1031 is moved while referring to the thickness value of the first micropart 11 (step S25).

  At this time, the distance sensor 6 always measures the distance between the opposing surfaces of the mounting plate 2 and the holding tool 14, and the distance control device 9 determines the first microcomponent based on the output of the distance sensor 6. 11 and the distance between the bonding surfaces of the second microcomponent 12 are calculated. Here, when the distance and the inclination of the first microcomponent 11 and the second microcomponent 12 are different from the desired values, the distance control device 9 moves the first Z movement mechanism 103 and the inclination mechanism 201 to the movement amount. Is adjusted so that the distance and the inclination between the first microcomponent 11 and the second microcomponent 12 become desired values.

  Next, the mounting plate 2 is heated by the heater 3 and necessary and sufficient thermal energy is applied to the bonding member 13 to bond the first micro component 11 and the second micro component 12 ( Step S26). In step S26 as well, the distance sensor 6 always measures the distance between the opposing surfaces of the mounting plate 2 and the holding tool 14, and the distance control device 9 uses the first micropart 11 and the second micro-component 11. The distance between the bonding surfaces of the microcomponents 12 is calculated. Here, if the distance and inclination between the first microcomponent 11 and the second microcomponent 12 are different from the desired values, a command for the amount of movement is sent to the first Z movement mechanism 103 and the inclination mechanism 201, and Adjustment is made so that the distance and the inclination between the first microcomponent 11 and the second microcomponent 12 become desired values.

  Further, at this time, the temperature control device 22 sets the first micro component 11 to a desired temperature on the basis of the instruction temperature Tsh to the heater 3 and the actual temperature Tsw of the first micro component 11 measured by the temperature probe 21. The instruction temperature amount to the heater 3 is corrected so that it can be heated at Ts. Note that the correction coefficient may be calculated in the same manner as in the first embodiment.

  Thus, the instruction temperature Tsh of the temperature control device 22 to the heater 3 is corrected based on the actual temperature Tsw of the first microcomponent 11 measured by the temperature probe 21, so that the joining member 13 is always cured. Necessary and sufficient heat energy can be applied accurately, and the first microcomponent 11 and the second microcomponent 12 can be bonded with high reliability.

  Moreover, in 2nd Embodiment, the temperature control of the heater 3 can be performed based on the actual component temperature in bonding, and heat energy sufficient for hardening of the joining member 13 can be given more correctly. Furthermore, it is not necessary to retreat the temperature probe 21, and calculation of a correction coefficient for correcting the heater temperature can be performed simultaneously with the bonding of the components, so that it is possible to save time and labor when changing the components.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. FIG. 5 is a left side view of the periphery of the mounting block, which is the main part of the microcomponent bonding apparatus according to the third embodiment. In FIG. 5, only the mounting block is shown in cross section.

  The third embodiment is different from the first and second embodiments in that the temperature probe is a non-contact type temperature probe (non-contact temperature probe 213). Since the other configuration is the same as that of the first embodiment, the description thereof is omitted.

  In FIG. 5, the non-contact temperature probe 213 is fixed to the second Z movement table 2121 of the second Z movement mechanism 212. This non-contact temperature probe 213 projects measurement condensed light such as infrared light onto a measurement object, and measures the temperature of a minute area from the reflected light. The non-contact temperature probe 213 is connected to the temperature control device 22, and the temperature control device 22 sends an operation command to the heater 3 based on the temperature measured by the non-contact temperature probe 213.

  Next, a micropart bonding method according to the third embodiment will be described with reference to FIG. Steps S31 to S33 are the same as steps S21 to S23 in FIG.

  After step S33, the non-contact temperature probe so that the measurement light of the non-contact temperature probe 213 is condensed on the side surface of the first microcomponent 11 by the second XY movement mechanism 211 and the second Z movement mechanism 212. The position of 213 is determined (step S34).

  Next, the same gap control bonding process as step S25 of FIG. 2 is performed (step S35).

  Next, the mounting plate 2 is heated by the heater 3 and necessary and sufficient thermal energy is applied to the bonding member 13 to bond the first micro component 11 and the second micro component 12 ( Step S36). In step S <b> 36, the temperature control device 22 determines the first micro component 11 as a desired value based on the instruction temperature Tsh to the heater 3 and the actual temperature Tsw of the first micro component 11 measured by the non-contact temperature probe 213. The temperature instruction amount to the heater 3 is corrected so that it can be heated at the temperature Ts. Note that the correction coefficient may be calculated in the same manner as in the first embodiment.

  Thus, in the third embodiment, the instruction temperature Tsh of the temperature control device 22 to the heater 3 is determined based on the actual temperature Tsw of the first micropart 11 measured by the non-contact temperature probe 213. Therefore, heat energy necessary and sufficient for joining of the joining member 13 can be given accurately, and the first microcomponent 11 and the second microcomponent 12 can be bonded with high reliability.

  In the third embodiment, the temperature of the heater 3 is controlled by measuring the actual component temperature during bonding in a non-contact manner, so that the component is placed on the placement plate 2 of the first microcomponent 11. This is also effective when the fixing cannot be performed firmly, or when the first micro component 11 has a shape that makes it difficult to contact the temperature probe, and the first micro component 11 and the second micro component 12 are effective. The bonding position of can be made more accurate.

  Furthermore, if it is a non-contact type, since the temperature of the joining member 13 can also be measured, the thermal energy necessary and sufficient for hardening of the joining member 13 can be given more correctly.

  Although the present invention has been described based on the above embodiments, the present invention is not limited to the above-described embodiments, and various modifications and applications are naturally possible within the scope of the gist of the present invention.

  Further, the above-described embodiments include various stages of the invention, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the column of the effect of the invention Can be extracted as an invention.

It is a block diagram of the micro component bonding apparatus which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the procedure of the micro component bonding method which concerns on the 1st Embodiment of this invention. It is a block diagram of the micro component bonding apparatus which concerns on the 2nd Embodiment of this invention. It is a flowchart which shows the procedure of the micro component bonding method which concerns on 2nd Embodiment of this invention. It is a block diagram of the micro component bonding apparatus which concerns on the 3rd Embodiment of this invention. It is a flowchart which shows the procedure of the micro component bonding method which concerns on the 3rd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Mounting plate, 3 ... Heater, 4 ... Heat insulating material, 5 ... Mounting block, 6 ... Distance sensor, 9 ... Space | interval control apparatus, 11 ... 1st micro component, 12 ... 2nd micro component, 13 ... Joining member, 14 ... holding tool, 21 ... temperature probe, 22 ... temperature control device, 101 ... linear motion gas bearing, 102 ... voice coil motor (VCM), 103 ... first Z moving mechanism, 201 ... tilting mechanism, 202 DESCRIPTION OF SYMBOLS 1st XY movement mechanism, 203 ... Rotation mechanism, 211 ... 2nd XY movement mechanism, 212 ... 2nd Z movement mechanism, 213 ... Non-contact temperature probe, 1031 ... 1st Z movement table, 2111 ... 1st 2 XY movement tables, 2121... 2nd Z movement table

Claims (11)

A placement portion for placing the first microcomponent;
A holding unit for holding the second microcomponent arranged to face the first microcomponent;
A drive unit that moves at least one of the placement unit or the holding unit to bring the first microcomponent and the second microcomponent into contact with each other via a bonding member;
A drive control unit that controls a movement amount and a movement speed when moving at least one of the placement unit or the holding unit by the drive unit;
A thermal energy supply section for applying thermal energy for curing the joining member;
Predicting the cured state of the bonding member when curing the bonding member, and based on the prediction result, the bonding conditions for actually bonding the first micro component and the second micro component are determined. A pasting condition setting section to be set;
An apparatus for laminating a micro component, comprising: The thermal energy supply unit is
A heater for heating the joining member;
A temperature control unit for controlling the temperature of the heater;
Consisting of
The bonding condition setting part
A temperature measuring unit that measures the temperature of at least one of the first microcomponent, the second microcomponent, and the joining member;
To correct the movement amount controlled by the drive control unit and the correction amount for correcting the movement speed and the temperature of the heater controlled by the temperature control unit from the temperature measured by the temperature measurement unit. A correction amount calculation unit for calculating at least one of the correction amounts of
The apparatus for laminating microcomponents according to claim 1, comprising: The temperature measuring unit includes a temperature probe,
A probe retracting mechanism for retracting the temperature probe from the temperature measurement site of the first microcomponent, the second microcomponent, and the joining member;
The microcomponent bonding apparatus according to claim 2, comprising: The correction amount calculating unit stores a relationship between the temperature of the heater and the actual component temperature when the component is heated at this temperature, for each component,
A thermal property table section for referring to thermal property data including at least linear expansion coefficient data and cure shrinkage amount data from the material of the component;
The apparatus for laminating a micro component according to claim 2, comprising: A load setting unit for setting a load when the first micro component and the second micro component are brought into contact with each other via the joining member by the driving unit;
The correction amount calculation unit further calculates a correction amount for correcting the load set by the load setting unit from the temperature measured by the temperature measurement unit. Micropart bonding equipment. An interval detection unit for detecting a relative distance between the placement unit and the holding unit;
Based on the detection result of the interval detection unit, an inter-surface distance calculation unit that calculates a distance between opposing surfaces of the first micro component and the second micro component;
The above-described device, which is controlled by the drive control unit so that a distance between opposing surfaces of the first microcomponent and the second microcomponent calculated by the inter-surface distance calculation unit becomes a desired value. A drive calculation unit that calculates a correction amount when controlling at least one of the movement amount and the movement speed of at least one of the unit and the holding unit;
The microcomponent bonding apparatus according to claim 1, further comprising: A load setting step for setting a load applied at the time of joining the first micro component and the second micro component;
Prediction of the cured state of the bonding member when bonding the first micro component and the second micro component through the bonding member, and bonding when actually bonding based on the prediction result A pasting condition setting step for setting a matching condition;
Based on the bonding conditions set in the bonding condition setting step, a bonding step of bonding the first microcomponent and the second microcomponent;
A method for laminating a micro component, comprising:   In the bonding condition setting step, the temperature of at least one of the first microcomponent, the second microcomponent, and the bonding member is measured, and correction in the bonding step is performed based on the measured temperature. The method of claim 7, further comprising a temperature correction coefficient calculation step for calculating the amount.   The correction amount is a correction amount for correcting the load set in the load setting step, and the first micro component when the first micro component and the second micro component are bonded together via the joining member. 9. The correction amount for correcting at least one movement amount of the second minute component and at least one of a correction amount for correcting a temperature at which the joining member is cured is according to claim 8. The micropart bonding method as described.   The method for bonding microcomponents according to claim 7, wherein the bonding condition setting step and the bonding step are performed simultaneously. The joining prediction step
A component thickness measuring step of measuring a thickness of at least one of the first microcomponent and the second microcomponent;
The bonding process is
A horizontal alignment step of performing horizontal alignment of the first microcomponent and the second microcomponent;
An interval at which the first microcomponent and the second microcomponent are brought into contact with each other via the joining member such that a distance between the first microcomponent and the second microcomponent is a desired interval. A control bonding process;
A bonding material curing step of curing the bonding member and bonding the first microcomponent and the second microcomponent;
The method for bonding microcomponents according to claim 7, comprising:

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