JP2012054350A5 - - Google Patents
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- JP2012054350A5 JP2012054350A5 JP2010194696A JP2010194696A JP2012054350A5 JP 2012054350 A5 JP2012054350 A5 JP 2012054350A5 JP 2010194696 A JP2010194696 A JP 2010194696A JP 2010194696 A JP2010194696 A JP 2010194696A JP 2012054350 A5 JP2012054350 A5 JP 2012054350A5
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- electronic component
- tool
- conductive member
- anisotropic conductive
- pitch
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Description
この発明は、第１のリードが設けられた基板の側辺部の上面に粘着性を有する異方性導電部材によって仮圧着された第１のリードのピッチより狭いピッチの第２のリードが設けられた電子部品の一端部を、加圧加熱して上記異方性導電部材を溶融硬化させて本圧着する電子部品の実装装置であって、
上記基板の上記電子部品の一端部が接続された側辺部の下面を支持するバックアップツールと、
上記基板の側辺部の上面に仮圧着された上記電子部品の一端部を加圧加熱して上記異方性導電部材を溶融硬化させて本圧着するヒータを備えた加圧ツールと、
この加圧ツールによって上記電子部品の一端部が加圧加熱されて上記異方性導電部材が溶融硬化する温度になる前に、上記電子部品の第２のリードのピッチが上記基板の第１のリードのピッチと同じになるよう上記電子部品を加熱して熱膨張させる加熱制御手段とを有し、
上記加熱制御手段は、上記加圧ツールを下降させて上記電子部品の一端部に接触する前に上記加圧ツールの下降を停止させて上記電子部品を上記加圧ツールの熱によって加熱膨張させてから、上記加圧ツールを下降させるよう上記加圧ツールの下降を制御する
ことを特徴とする電子部品の実装装置にある。
According to the present invention, a second lead having a pitch narrower than the pitch of the first lead temporarily bonded by an anisotropic conductive member having adhesiveness is provided on the upper surface of the side portion of the substrate on which the first lead is provided. An electronic component mounting apparatus that pressurizes and heats the one end portion of the obtained electronic component to melt and cure the anisotropic conductive member to perform final compression bonding.
A backup tool for supporting the lower surface of the side portion to which one end of the electronic component of the substrate is connected;
A pressure tool provided with a heater that pressurizes and heats one end portion of the electronic component temporarily bonded to the upper surface of the side portion of the substrate to melt and cure the anisotropic conductive member, and
Before the one end of the electronic component is pressurized and heated by the pressing tool to a temperature at which the anisotropic conductive member is melt-cured, the pitch of the second leads of the electronic component is changed to the first of the substrate. Heating control means for heating and thermal expansion of the electronic component to be the same as the pitch of the leads ,
The heating control means lowers the pressure tool and stops the pressure tool from falling before contacting the one end of the electronic component, and heats and expands the electronic component by the heat of the pressure tool. In the electronic component mounting apparatus, the lowering of the pressing tool is controlled to lower the pressing tool .
この発明は、第１のリードが設けられた基板の側辺部の上面に粘着性を有する異方性導電部材によって仮圧着された第１のリードのピッチより狭いピッチの第２のリードが設けられた電子部品の一端部を、加圧加熱して上記異方性導電部材を溶融硬化させて本圧着する電子部品の実装方法であって、
上記基板の上記電子部品の一端部が仮圧着された側辺部の下面をバックアップツールによって支持する工程と、
上記基板の側辺部の上面に接続された上記電子部品の一端部をヒータを備えた加圧ツールによって加圧加熱して上記異方性導電部材を溶融硬化させて本圧着する工程と、
上記加圧ツールによって上記電子部品の一端部が加圧加熱されて上記異方性導電部材が溶融硬化する温度になる前に、上記電子部品の第２のリードのピッチが上記基板の第１のリードのピッチと同じになるよう上記電子部品を加熱して熱膨張させる工程とを有し、
上記熱膨張させる工程では、上記加圧ツールを下降させて上記電子部品の一端部に接触する前に上記加圧ツールの下降を停止させることを特徴とする電子部品の実装方法。
According to the present invention, a second lead having a pitch narrower than the pitch of the first lead temporarily bonded by an anisotropic conductive member having adhesiveness is provided on the upper surface of the side portion of the substrate on which the first lead is provided. A method for mounting an electronic component, in which one end of the obtained electronic component is pressurized and heated to melt and cure the anisotropic conductive member, and is finally crimped,
A step of supporting the lower surface of the side portion where the one end portion of the electronic component of the substrate is temporarily bonded by a backup tool;
A step of press-heating one end of the electronic component connected to the upper surface of the side portion of the substrate with a pressurizing tool equipped with a heater to melt and cure the anisotropic conductive member, and then press-bonding;
Before the one end portion of the electronic component is pressurized and heated by the pressing tool to a temperature at which the anisotropic conductive member is melt-cured, the pitch of the second leads of the electronic component is the first pitch of the substrate. and a step of thermal expansion by heating the electronic component to be the same as the lead of the pitch,
In the thermal expansion step, the electronic tool mounting method is characterized in that the pressurization tool is lowered before the pressurization tool is lowered to contact one end of the electronic component.
実装時間ｔ２でＴＣＰ６を加圧加熱したならば、加圧ツール１５は実装位置ｃからｄで示す上昇位置まで速度Ｖ３で上昇した後、この速度Ｖ３よりも速い速度Ｖ４で上昇待機位置ａまで上昇する。なお、図６（ｂ）では上昇時の速度Ｖ３、Ｖ４を下降時とは逆向きに示している。
If the TCP 6 is pressurized and heated at the mounting time t2, the pressurizing tool 15 rises at the speed V3 from the mounting position c to the ascending position indicated by d, and then rises to the ascending standby position a at a speed V4 faster than the speed V3. To do. Also shows in the opposite direction to that during lowering the speed V3, V4 of ascent in FIG 6 (b).
Claims (4)
上記基板の上記電子部品の一端部が接続された側辺部の下面を支持するバックアップツールと、
上記基板の側辺部の上面に仮圧着された上記電子部品の一端部を加圧加熱して上記異方性導電部材を溶融硬化させて本圧着するヒータを備えた加圧ツールと、
この加圧ツールによって上記電子部品の一端部が加圧加熱されて上記異方性導電部材が溶融硬化する温度になる前に、上記電子部品の第２のリードのピッチが上記基板の第１のリードのピッチと同じになるよう上記電子部品を加熱して熱膨張させる加熱制御手段とを有し、
上記加熱制御手段は、上記加圧ツールを下降させて上記電子部品の一端部に接触する前に上記加圧ツールの下降を停止させて上記電子部品を上記加圧ツールの熱によって加熱膨張させてから、上記加圧ツールを下降させるよう上記加圧ツールの下降を制御する
ことを特徴とする電子部品の実装装置。 An electronic component in which second leads having a pitch narrower than the pitch of the first leads temporarily bonded by an anisotropic conductive member having adhesiveness are provided on the upper surface of the side portion of the substrate provided with the first leads. An electronic component mounting apparatus that heat-presses and heat-fixes one end of the anisotropic conductive member to perform final compression bonding
A backup tool for supporting the lower surface of the side portion to which one end of the electronic component of the substrate is connected;
A pressure tool provided with a heater that pressurizes and heats one end portion of the electronic component temporarily bonded to the upper surface of the side portion of the substrate to melt and cure the anisotropic conductive member, and
Before the one end of the electronic component is pressurized and heated by the pressing tool to a temperature at which the anisotropic conductive member is melt-cured, the pitch of the second leads of the electronic component is changed to the first of the substrate. Heating control means for heating and thermal expansion of the electronic component to be the same as the pitch of the leads ,
The heating control means lowers the pressure tool and stops the pressure tool from falling before contacting the one end of the electronic component, and heats and expands the electronic component by the heat of the pressure tool. The electronic tool mounting apparatus is configured to control the lowering of the pressing tool so as to lower the pressing tool .
上記基板の上記電子部品の一端部が仮圧着された側辺部の下面をバックアップツールによって支持する工程と、 A step of supporting the lower surface of the side portion where the one end portion of the electronic component of the substrate is temporarily bonded by a backup tool;
上記基板の側辺部の上面に接続された上記電子部品の一端部をヒータを備えた加圧ツールによって加圧加熱して上記異方性導電部材を溶融硬化させて本圧着する工程と、 A step of press-heating one end of the electronic component connected to the upper surface of the side portion of the substrate with a pressurizing tool equipped with a heater to melt and cure the anisotropic conductive member, and then press-bonding;
上記加圧ツールによって上記電子部品の一端部が加圧加熱されて上記異方性導電部材が溶融硬化する温度になる前に、上記電子部品の第２のリードのピッチが上記基板の第１のリードのピッチと同じになるよう上記電子部品を加熱して熱膨張させる工程とを有し、 Before the one end portion of the electronic component is pressurized and heated by the pressing tool to a temperature at which the anisotropic conductive member is melt-cured, the pitch of the second leads of the electronic component is the first pitch of the substrate. Heating and thermally expanding the electronic component to be the same as the lead pitch,
上記熱膨張させる工程では、上記加圧ツールを下降させて上記電子部品の一端部に接触する前に上記加圧ツールの下降を停止させることを特徴とする電子部品の実装方法。 In the thermal expansion step, the electronic tool mounting method is characterized in that the pressurization tool is lowered before the pressurization tool is lowered to contact one end of the electronic component.
この熱膨張させる工程の後で上記本圧着する工程では上記加圧ツールの温度を異方性導電部材を溶融硬化させる温度に上昇させることを特徴とする電子部品の実装方法。 A method for mounting an electronic component, characterized in that, in the step of performing the final pressure bonding after the step of thermally expanding, the temperature of the pressing tool is raised to a temperature at which the anisotropic conductive member is melt-cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010194696A JP2012054350A (en) | 2010-08-31 | 2010-08-31 | Mounting device and mounting method of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010194696A JP2012054350A (en) | 2010-08-31 | 2010-08-31 | Mounting device and mounting method of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012054350A JP2012054350A (en) | 2012-03-15 |
| JP2012054350A5 true JP2012054350A5 (en) | 2013-10-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010194696A Pending JP2012054350A (en) | 2010-08-31 | 2010-08-31 | Mounting device and mounting method of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012054350A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014003192A (en) * | 2012-06-20 | 2014-01-09 | Fujikura Ltd | Cooling device for semiconductor chip bonder |
| JP7394314B2 (en) * | 2019-08-08 | 2023-12-08 | パナソニックＩｐマネジメント株式会社 | Component mounting equipment and component mounting method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004096046A (en) * | 2002-09-04 | 2004-03-25 | Seiko Epson Corp | Method and structure for mounting ic chip, thermocompression bonding device, method of manufacturing electrooptical device, electrooptical device and electronic equipment |
| JP4821551B2 (en) * | 2006-10-05 | 2011-11-24 | パナソニック株式会社 | Electronic component crimping method and apparatus |
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2010
- 2010-08-31 JP JP2010194696A patent/JP2012054350A/en active Pending
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