JP4957193B2 - Thermocompression bonding apparatus and thermocompression bonding method - Google Patents

Thermocompression bonding apparatus and thermocompression bonding method Download PDF

Info

Publication number
JP4957193B2
JP4957193B2 JP2006301183A JP2006301183A JP4957193B2 JP 4957193 B2 JP4957193 B2 JP 4957193B2 JP 2006301183 A JP2006301183 A JP 2006301183A JP 2006301183 A JP2006301183 A JP 2006301183A JP 4957193 B2 JP4957193 B2 JP 4957193B2
Authority
JP
Japan
Prior art keywords
thermocompression bonding
displacement
electronic component
load
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006301183A
Other languages
Japanese (ja)
Other versions
JP2008117993A (en
Inventor
智昭 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2006301183A priority Critical patent/JP4957193B2/en
Publication of JP2008117993A publication Critical patent/JP2008117993A/en
Application granted granted Critical
Publication of JP4957193B2 publication Critical patent/JP4957193B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hot press bonding equipment which controls a variation of a press load in melting of a solder bump, and to provide its hot press bonding method. <P>SOLUTION: The time when the solder bump 10a starts to melt is detected by a displacement of a head 7 in the pressing direction, the pressing load w is constantly kept by performing load control using a load cell 4 till the solder starts to melt, and after the solder bump 10a starts to melt, the height of mounting is constantly kept by making position control using a linear scale 5. Thereby, the variation of the press load in melting of the solder bump 10a is controlled, and the state that an excess load acts on an electronic component 10 and substrate 11 can be prevented. Moreover, the height of mounting reduced in melting of the solder bump 10a is corrected by the position control using the linear scale 5, thereby, the optimum height of mounting for design can be retained, and the quality of mounting can be held. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

本発明は、熱圧着装置および熱圧着方法に関するものである。   The present invention relates to a thermocompression bonding apparatus and a thermocompression bonding method.

半田バンプが形成されたフリップチップの実装に際しては、基板に対するフリップチップの実装高さを調整してフリップチップと基板との間に適切なクリアランスを形成することで、ブリッジやオープン等の半田接合不良を回避することが重要な課題である。従来の実装装置では、熱圧着ツールに保持したフリップチップを加熱しながら基板に対して押圧し、溶融した半田でフリップチップと基板を接合させる方法が広く用いられている。実装装置には半田バンプにかかる荷重を検出する荷重検出手段が設けられ、荷重の急激な減少により半田バンプが溶融したことを検出すると、熱圧着ツールを上昇させた後に加熱を中断し、半田が自然冷却されて徐々に固化する過程で熱圧着ツールの高さを調節し、ヘッド７に吸着された電子部品１０の実装高さを調整する（特許文献１参照）。
特開平１１−１４５１９７号公報 When mounting a flip chip with solder bumps formed on it, the mounting height of the flip chip relative to the substrate is adjusted to form an appropriate clearance between the flip chip and the substrate, resulting in poor solder joints such as bridges and opens. This is an important issue. In a conventional mounting apparatus, a method is widely used in which a flip chip held by a thermocompression bonding tool is pressed against a substrate while being heated, and the flip chip and the substrate are joined with molten solder. The mounting device is provided with a load detection means for detecting the load applied to the solder bump. When it is detected that the solder bump has melted due to a sudden decrease in the load, the heating is stopped after raising the thermocompression bonding tool. In the process of being naturally cooled and gradually solidified, the height of the thermocompression bonding tool is adjusted to adjust the mounting height of the electronic component 10 attracted to the head 7 (see Patent Document 1).
JP-A-11-145197

半田バンプを溶融させる過程では、熱圧着ツールによりフリップチップが加熱されるが、同時に熱圧着ツール自体にも伝熱するため、微小ではあるが押圧方向に熱変形による伸びが生ずることがある。フリップチップを加熱する際に熱圧着ツールが伸びると、実装高さが低下し、半田バンプにかかる荷重が増加することなる。近年、フリップチップはますます小型化、高密度化しており、半田バンプにかかる荷重の変動が接合品質に与える影響は無視できないものになってきている。   In the process of melting the solder bumps, the flip chip is heated by the thermocompression bonding tool, but at the same time heat is transferred to the thermocompression bonding tool itself. If the thermocompression bonding tool is extended when the flip chip is heated, the mounting height is lowered, and the load applied to the solder bump is increased. In recent years, flip chips have become increasingly smaller and higher in density, and the influence of load fluctuations on solder bumps on bonding quality is not negligible.

そこで本発明は、半田バンプの溶融時における押圧荷重の変動を抑制した熱圧着装置および熱圧着方法を提供することを目的とする。   Then, an object of this invention is to provide the thermocompression bonding apparatus and the thermocompression-bonding method which suppressed the fluctuation | variation of the press load at the time of the melting of a solder bump.

請求項１記載の熱圧着装置は、半田バンプが形成された電子部品を加熱しながら基板に対して押圧する熱圧着ツールと、前記熱圧着ツールによる押圧荷重を検出する荷重検出手段と、前記熱圧着ツールの押圧方向における変位を検出する変位検出手段と、基板に対する電子部品の実装高さを管理する制御手段と、を備えた熱圧着装置であって、前記制御手段が、加熱開始後に前記変位検出手段により検出された変位が所定の閾値を超えるまでは前記荷重検出手段により検出された荷重の変化に基づいた制御を行い、所定の閾値を超えてからは前記変位検出手段により検出された変位に基づいた制御を行う。   The thermocompression bonding apparatus according to claim 1 is a thermocompression bonding tool that presses an electronic component on which a solder bump is formed against a substrate while heating the load, a load detection unit that detects a pressing load by the thermocompression bonding tool, and the heat A thermocompression bonding apparatus comprising: a displacement detection unit that detects a displacement in a pressing direction of the crimping tool; and a control unit that manages a mounting height of the electronic component on the substrate. Control is performed based on the change in the load detected by the load detection means until the displacement detected by the detection means exceeds a predetermined threshold, and the displacement detected by the displacement detection means after the predetermined threshold is exceeded. Control based on

請求項２記載の熱圧着装置は、請求項１に記載の熱圧着装置であって、加熱開始後に前記変位検出手段により検出された変位が所定の閾値を超えたときに電子部品の加熱を停止する。   The thermocompression bonding apparatus according to claim 2 is the thermocompression bonding apparatus according to claim 1, wherein heating of the electronic component is stopped when the displacement detected by the displacement detection means exceeds a predetermined threshold after heating is started. To do.

請求項３記載の熱圧着装置は、請求項１または２に記載の熱圧着装置であって、前記制御手段が、加熱開始後に前記変位検出手段により前記熱圧着ツールの押圧方向における変位が検出されると、電子部品の実装高さを前記半田バンプが溶融する以前の実装高さに補正する制御を行う。   The thermocompression bonding apparatus according to claim 3 is the thermocompression bonding apparatus according to claim 1 or 2, wherein the control means detects the displacement in the pressing direction of the thermocompression bonding tool by the displacement detection means after the start of heating. Then, control is performed to correct the mounting height of the electronic component to the mounting height before the solder bump melts.

請求項４記載の熱圧着方法は、半田バンプが形成された電子部品を熱圧着ツールで加熱しながら押圧して基板に熱圧着する熱圧着方法であって、加熱開始後に前記熱圧着ツール
の押圧方向における変位が所定の閾値を超えるまでは前記熱圧着ツールによる押圧荷重の変化に基づいて基板に対する電子部品の実装高さを管理し、所定の閾値を超えてからは前記熱圧着ツールの押圧方向における変位に基づいて基板に対する電子部品の実装高さを管理する。 The thermocompression bonding method according to claim 4 is a thermocompression bonding method in which an electronic component on which a solder bump is formed is pressed while being heated with a thermocompression bonding tool and is thermocompression bonded to the substrate, and the thermocompression bonding tool is pressed after heating is started. Until the displacement in the direction exceeds a predetermined threshold, the mounting height of the electronic component on the board is managed based on the change in the pressing load by the thermocompression bonding tool, and after the predetermined threshold is exceeded, the pressing direction of the thermocompression bonding tool The mounting height of the electronic component on the board is managed based on the displacement at.

請求項５記載の熱圧着方法は、請求項４に記載の熱圧着方法であって、加熱開始後に前記熱圧着ツールの押圧方向における変位が所定の閾値を超えたときに電子部品の加熱を停止する。   The thermocompression bonding method according to claim 5 is the thermocompression bonding method according to claim 4, wherein the heating of the electronic component is stopped when the displacement in the pressing direction of the thermocompression bonding tool exceeds a predetermined threshold after the start of heating. To do.

請求項６記載の熱圧着方法は、請求項４または５に記載の熱圧着方法であって、加熱開始後に前記変位検出手段により前記熱圧着ツールの押圧方向における変位が検出されると、電子部品の実装高さを前記半田バンプが溶融する以前の実装高さに補正する。   The thermocompression bonding method according to claim 6 is the thermocompression bonding method according to claim 4 or 5, wherein when a displacement in the pressing direction of the thermocompression bonding tool is detected by the displacement detection means after the start of heating, an electronic component is provided. The mounting height is corrected to the mounting height before the solder bump is melted.

本発明によれば、半田が溶融を開始した時点をヘッドの押圧方向における変位で検出し、半田が溶融を開始するまではロードセルを用いた荷重制御を行い、押圧荷重を一定に維持するとともに、半田が溶融を開始した後は、リニアスケールを用いた位置制御を行い、実装高さを一定に維持する。これにより、半田バンプの溶融における押圧荷重の変動を抑制し、電子部品や基板に過度の荷重が作用する事態を回避することができる。   According to the present invention, the time when the solder starts to melt is detected by the displacement in the pressing direction of the head, the load control is performed using the load cell until the solder starts to melt, and the pressing load is kept constant. After the solder starts to melt, position control using a linear scale is performed to keep the mounting height constant. Thereby, the fluctuation | variation of the press load in melting of a solder bump can be suppressed, and the situation where an excessive load acts on an electronic component or a board | substrate can be avoided.

本発明の実施の形態について図面を参照して説明する。図１は本発明の実施の形態の熱圧着装置の側面図、図２は熱圧着装置における熱圧着動作を時系列で示したグラフである。   Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a thermocompression bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a graph showing the thermocompression bonding operation in the thermocompression bonding apparatus in time series.

最初に熱圧着装置について説明する。図１において、熱圧着装置１は、熱圧着ツール２と、昇降装置３と、ロードセル４と、リニアスケール５と、演算処理装置６とで構成されている。熱圧着ツール２は、ヘッド７の下端に吸着した電子部品１０を加熱しながら基板１１に対して押圧する機能を有する。ヘッド７には、吸着した電子部品１０の半田バンプ１０ａを加熱して溶融させるセラミックヒータ８が設けられており、溶融した半田により電子部品１０と基板１１が接合される。   First, the thermocompression bonding apparatus will be described. In FIG. 1, the thermocompression bonding apparatus 1 includes a thermocompression bonding tool 2, an elevating device 3, a load cell 4, a linear scale 5, and an arithmetic processing device 6. The thermocompression bonding tool 2 has a function of pressing the electronic component 10 adsorbed on the lower end of the head 7 against the substrate 11 while heating. The head 7 is provided with a ceramic heater 8 that heats and melts the solder bumps 10a of the adsorbed electronic component 10, and the electronic component 10 and the substrate 11 are joined by the melted solder.

昇降装置３は、熱圧着ツール２を昇降させ、ヘッド７に吸着された電子部品１０の実装高さを調整する機能を有する。電子部品１０の半田バンプ１０ａを基板１１に当接させた状態で熱圧着ツール２をさらに下降させることで、電子部品１０を基板１１に対して押圧する。昇降装置３としては様々な構成のものが採用できるが、ここでは送りねじ機構が用いられており、送り方向を鉛直方向に設定したボールねじ１２と螺合するナット１３を熱圧着ツール２のブラケット１５に設け、モータ１４によりボールねじ１２を正逆回転させることで熱圧着ツール２を昇降させている。   The elevating device 3 has a function of elevating the thermocompression bonding tool 2 and adjusting the mounting height of the electronic component 10 adsorbed by the head 7. By further lowering the thermocompression bonding tool 2 with the solder bumps 10a of the electronic component 10 in contact with the substrate 11, the electronic component 10 is pressed against the substrate 11. Although various structures can be adopted as the lifting device 3, a feed screw mechanism is used here, and a nut 13 that engages with a ball screw 12 whose feed direction is set to a vertical direction is used as a bracket of the thermocompression bonding tool 2. The thermocompression bonding tool 2 is moved up and down by rotating the ball screw 12 forward and backward by a motor 14.

ロードセル４は、ヘッド７にかかる荷重を検出する機能を有し、熱圧着ツール２に対するヘッド７の押圧方向における変位と相関する荷重の変化を検出する荷重検出手段としての機能を有する。ヘッド７はロードセル４により熱圧着ツール２に垂下された状態で支持されているため、ヘッド７に吸着した電子部品１０が基板１１に当接していない状態では、ロードセル４はヘッド７と電子部品１０の重量を合計した荷重Ｗを検出する。電子部品１０の半田バンプ１０ａを基板１１に当接させた状態で熱圧着ツール２をさらに下降させると、電子部品１０が基板１１に対して押圧されるが、この押圧荷重ｗと等しい反力が基板１１から半田バンプ１０ａに向けて作用する。そのため、ロードセル４により検出される荷重は、荷重Ｗから反力分だけ減少した荷重となる。従って、ロードセル４により検出される荷重を荷重Ｗから減算することで、電子部品１０の基板１１に対する押圧荷重ｗが
算出される。 The load cell 4 has a function of detecting a load applied to the head 7, and has a function as a load detection unit that detects a change in load that correlates with a displacement in the pressing direction of the head 7 with respect to the thermocompression bonding tool 2. Since the head 7 is supported by the load cell 4 while being suspended from the thermocompression bonding tool 2, when the electronic component 10 attracted to the head 7 is not in contact with the substrate 11, the load cell 4 has the head 7 and the electronic component 10. A load W is added to the total weight of the two. When the thermocompression bonding tool 2 is further lowered while the solder bump 10a of the electronic component 10 is in contact with the substrate 11, the electronic component 10 is pressed against the substrate 11, but a reaction force equal to the pressing load w is applied. It acts toward the solder bump 10a from the substrate 11. Therefore, the load detected by the load cell 4 is a load reduced from the load W by the reaction force. Therefore, by subtracting the load detected by the load cell 4 from the load W, the pressing load w on the substrate 11 of the electronic component 10 is calculated.

リニアスケール５は、ヘッド７の押圧方向である鉛直方向における変位を検出する変位検出手段としての機能を有する。リニアスケール５はブラケット１５とヘッド７の対向する箇所に設けられ、両者の鉛直方向における相対的な変位をヘッド７の押圧方向における変位として検出する。   The linear scale 5 has a function as a displacement detection unit that detects a displacement in a vertical direction that is a pressing direction of the head 7. The linear scale 5 is provided at a position where the bracket 15 and the head 7 are opposed to each other, and detects the relative displacement between the two in the vertical direction as the displacement in the pressing direction of the head 7.

演算処理装置６は、電子部品１０の実装高さを管理する制御手段としての機能を有する。演算処理装置６は、ロードセル４で検出された荷重データを電気信号として受信し、押圧荷重の変化を監視するとともに、リニアスケール５で検出されたブラケット１５とヘッド７との相対的な変位データを電気信号として受信し、ヘッド７の押圧方向における変位を監視する。さらに、モータ１４に内蔵されたエンコーダから発信された電気信号を受信し、ヘッド７に吸着された電子部品１０の実装高さを監視するとともに、モータ１４の回転量を制御して実装高さを調整する。演算処理装置６は、ロードセル４およびリニアスケール５で検出されるデータに基づいて電子部品１０の実装高さ管理を行い、電子部品１０の加熱開始後にリニアスケール５で検出された変位が予め設定した閾値を超えるまではロードセル４で検出された荷重の変化に基づいて実装高さを調整し、閾値を超えてからはリニアスケール５で検出された変位に基づいて実装高さの調整を行う。   The arithmetic processing unit 6 has a function as a control unit that manages the mounting height of the electronic component 10. The arithmetic processing unit 6 receives the load data detected by the load cell 4 as an electrical signal, monitors the change of the pressing load, and calculates the relative displacement data of the bracket 15 and the head 7 detected by the linear scale 5. Received as an electrical signal, the displacement of the head 7 in the pressing direction is monitored. Furthermore, the electrical signal transmitted from the encoder built in the motor 14 is received, the mounting height of the electronic component 10 attracted by the head 7 is monitored, and the mounting height is controlled by controlling the rotation amount of the motor 14. adjust. The arithmetic processing unit 6 manages the mounting height of the electronic component 10 based on the data detected by the load cell 4 and the linear scale 5, and the displacement detected by the linear scale 5 is preset after the heating of the electronic component 10 is started. Until the threshold value is exceeded, the mounting height is adjusted based on the change in the load detected by the load cell 4, and after the threshold value is exceeded, the mounting height is adjusted based on the displacement detected by the linear scale 5.

次に熱圧着方法について説明する。図２において、時間ｔ０で熱圧着動作が開始すると、ヘッド７の下端に吸着された電子部品１０が基板１１に対し所定の押圧荷重ｗで押圧される。時間ｔ１の時点でセラミックヒータ８への通電をＯＮにして電子部品１０の加熱を開始する。このとき、セラミックヒータ８からヘッド７に伝熱するため、ヘッド７には微小ではあるが押圧方向に伸びが生じる。ヘッド７が押圧方向に伸びると、ヘッド７の実装高さが低下し、下端に吸着された電子部品１０が基板１１に接近して押圧荷重が増加するという不具合が生じてしまう。そのため、演算処理手段６は、ロードセル４により検出される荷重の変化を監視しながらモータ１４の回転量を調整し、電子部品１０の実装高さを一定に維持した管理を行うことで、電子部品１０の基板１１に対する押圧荷重を一定の押圧荷重ｗに維持する制御を行う。   Next, the thermocompression bonding method will be described. In FIG. 2, when the thermocompression bonding operation starts at time t <b> 0, the electronic component 10 attracted to the lower end of the head 7 is pressed against the substrate 11 with a predetermined pressing load w. At time t1, energization of the ceramic heater 8 is turned on and heating of the electronic component 10 is started. At this time, since heat is transferred from the ceramic heater 8 to the head 7, the head 7 is elongated in the pressing direction although it is minute. When the head 7 extends in the pressing direction, the mounting height of the head 7 decreases, and the electronic component 10 adsorbed on the lower end approaches the substrate 11 and a pressing load increases. Therefore, the arithmetic processing unit 6 adjusts the rotation amount of the motor 14 while monitoring the change in the load detected by the load cell 4 and performs management while maintaining the mounting height of the electronic component 10 constant. Control is performed to maintain the pressing load on the ten substrates 11 at a constant pressing load w.

時間ｔ２の時点でヘッド温度が半田融点Ｔまで上昇すると、半田の溶融が開始する。溶融により半田バンプ１０ａが固体から液体に相転移すると、基板１１から半田バンプ１０ａに向けて作用していた反力が一気に開放され、押圧荷重が急激に減少する。同時に、ヘッド７が半田バンプ１０ａによる支持を失って下降し、実装高さが低下する。この実装高さの低下は、リニアスケール５によりヘッド７の押圧方向における変位として検出される。閾値は半田溶融時におけるヘッド７のブラケット１５に対する変位より小さい値となるように予め設定されており、演算処理手段６は、リニアスケール５で検出された変位がこの閾値を超えたときからリニアスケール５で検出された変位に基づいて実装高さの調整を行う。演算処理手段６は、リニアスケール５により検出されるヘッド７の押圧方向における変位を監視しながらモータ１４の回転量を調整し、リニアスケール５で検出された変位に相当する量だけヘッド７を上昇させ、電子部品１０の実装高さを半田バンプ１０ａが溶融する以前の実装高さに補正する制御を行う。また、リニアスケール５で検出された変位が閾値を超えた時点でセラミックヒータ８への通電をＯＦＦにして電子部品１０の加熱を停止する。   When the head temperature rises to the solder melting point T at time t2, melting of the solder starts. When the solder bump 10a undergoes a phase transition from solid to liquid due to melting, the reaction force acting from the substrate 11 toward the solder bump 10a is released at once, and the pressing load is rapidly reduced. At the same time, the head 7 loses support by the solder bumps 10a and descends, and the mounting height decreases. This reduction in mounting height is detected by the linear scale 5 as a displacement in the pressing direction of the head 7. The threshold value is set in advance so as to be smaller than the displacement of the head 7 with respect to the bracket 15 when the solder is melted. The mounting height is adjusted based on the displacement detected in 5. The arithmetic processing means 6 adjusts the rotation amount of the motor 14 while monitoring the displacement in the pressing direction of the head 7 detected by the linear scale 5, and raises the head 7 by an amount corresponding to the displacement detected by the linear scale 5. The mounting height of the electronic component 10 is corrected to the mounting height before the solder bump 10a is melted. Further, when the displacement detected by the linear scale 5 exceeds the threshold value, the energization to the ceramic heater 8 is turned off and the heating of the electronic component 10 is stopped.

このように、本実施の形態の熱圧着装置によれば、半田が溶融を開始した時点をヘッド７の押圧方向における変位で検出し、半田が溶融を開始するまではロードセル４を用いた荷重制御を行い、押圧荷重ｗを一定に維持するとともに、半田が溶融を開始した後は、リニアスケール５を用いた位置制御を行い、実装高さを一定に維持する。これにより、半田バンプ１０ａの溶融における押圧荷重の変動を抑制し、電子部品１０や基板１１に過度の
荷重が作用する事態を回避することができる。また、半田バンプ１０ａの溶融時に低下した実装高さをリニアスケール５を用いた位置制御により補正することで、設計上の最適な実装高さを維持し、実装品質を確保することができる。 As described above, according to the thermocompression bonding apparatus of the present embodiment, the load control using the load cell 4 is detected until the time when the solder starts to melt is detected by the displacement in the pressing direction of the head 7 and the solder starts to melt. The pressing load w is kept constant, and after the solder starts to melt, position control using the linear scale 5 is performed to keep the mounting height constant. Thereby, the fluctuation | variation of the press load in melting of the solder bump 10a can be suppressed, and the situation where an excessive load acts on the electronic component 10 or the board | substrate 11 can be avoided. Further, by correcting the mounting height that is lowered when the solder bump 10a is melted by position control using the linear scale 5, it is possible to maintain the optimum mounting height in terms of design and to ensure mounting quality.

本発明によれば、半田バンプの溶融における押圧荷重の変動を抑制し、電子部品や基板に過度の荷重が作用する事態を回避することができるという利点を有し、フリップチップ等の半田バンプ付き電子部品の実装分野において特に有用である。   According to the present invention, there is an advantage that it is possible to suppress a change in pressing load during melting of a solder bump and to avoid a situation in which an excessive load acts on an electronic component or a substrate, and with a solder bump such as a flip chip This is particularly useful in the field of mounting electronic components.

本発明の実施の形態の熱圧着装置の側面図The side view of the thermocompression bonding apparatus of embodiment of this invention 熱圧着装置における熱圧着動作を時系列で示したグラフGraph showing thermocompression operation in thermocompression bonding equipment in time series

符号の説明Explanation of symbols

１ 熱圧着装置
２ 熱圧着ツール
３ 昇降装置
４ ロードセル
５ リニアスケール
６ 演算処理装置
１０ 電子部品
１０ａ 半田バンプ
１１ 基板 DESCRIPTION OF SYMBOLS 1 Thermocompression bonding apparatus 2 Thermocompression bonding tool 3 Lifting apparatus 4 Load cell 5 Linear scale 6 Arithmetic processing apparatus 10 Electronic component 10a Solder bump 11 Substrate

Claims (6)

半田バンプが形成された電子部品を加熱しながら基板に対して押圧する熱圧着ツールと、前記熱圧着ツールによる押圧荷重を検出する荷重検出手段と、前記熱圧着ツールの押圧方向における変位を検出する変位検出手段と、基板に対する電子部品の実装高さを管理する制御手段と、を備えた熱圧着装置であって、
前記制御手段が、加熱開始後に前記変位検出手段により検出された変位が所定の閾値を超えるまでは前記荷重検出手段により検出された荷重の変化に基づいた制御を行い、所定の閾値を超えてからは前記変位検出手段により検出された変位に基づいた制御を行う熱圧着装置。 A thermocompression tool that presses the electronic component on which the solder bumps are formed against the substrate while heating; a load detection means that detects a press load by the thermocompression tool; and a displacement in the pressing direction of the thermocompression tool. A thermocompression bonding apparatus comprising a displacement detection means and a control means for managing the mounting height of the electronic component on the substrate,
The control means performs control based on a change in the load detected by the load detection means until the displacement detected by the displacement detection means exceeds a predetermined threshold after the start of heating, and after the predetermined threshold is exceeded. Is a thermocompression bonding apparatus that performs control based on the displacement detected by the displacement detection means. 加熱開始後に前記変位検出手段により検出された変位が所定の閾値を超えたときに電子部品の加熱を停止する請求項１に記載の熱圧着装置。   The thermocompression bonding apparatus according to claim 1, wherein heating of the electronic component is stopped when the displacement detected by the displacement detection unit exceeds a predetermined threshold after the heating is started. 前記制御手段が、加熱開始後に前記変位検出手段により前記熱圧着ツールの押圧方向における変位が検出されると、電子部品の実装高さを前記半田バンプが溶融する以前の実装高さに補正する制御を行う請求項１または２に記載の熱圧着装置。   When the displacement is detected in the pressing direction of the thermocompression bonding tool by the displacement detection unit after the heating is started, the control unit corrects the mounting height of the electronic component to the mounting height before the solder bump is melted. The thermocompression bonding apparatus according to claim 1 or 2, wherein: 半田バンプが形成された電子部品を熱圧着ツールで加熱しながら押圧して基板に熱圧着する熱圧着方法であって、
加熱開始後に前記熱圧着ツールの押圧方向における変位が所定の閾値を超えるまでは前記熱圧着ツールによる押圧荷重の変化に基づいて基板に対する電子部品の実装高さを管理し、所定の閾値を超えてからは前記熱圧着ツールの押圧方向における変位に基づいて基板に対する電子部品の実装高さを管理する熱圧着方法。 It is a thermocompression bonding method in which an electronic component on which a solder bump is formed is pressed with a thermocompression bonding tool and is thermocompression bonded to a substrate,
After the start of heating, until the displacement in the pressing direction of the thermocompression bonding tool exceeds a predetermined threshold value, the mounting height of the electronic component on the board is managed based on the change of the pressing load by the thermocompression bonding tool, and exceeds the predetermined threshold value. Is a thermocompression bonding method for managing the mounting height of the electronic component on the substrate based on the displacement in the pressing direction of the thermocompression bonding tool. 加熱開始後に前記熱圧着ツールの押圧方向における変位が所定の閾値を超えたときに電子部品の加熱を停止する請求項４に記載の熱圧着方法。   The thermocompression bonding method according to claim 4, wherein heating of the electronic component is stopped when the displacement in the pressing direction of the thermocompression bonding tool exceeds a predetermined threshold after the start of heating. 加熱開始後に前記変位検出手段により前記熱圧着ツールの押圧方向における変位が検出されると、電子部品の実装高さを前記半田バンプが溶融する以前の実装高さに補正する請求項４または５に記載の熱圧着方法。   6. The electronic component mounting height is corrected to a mounting height before the solder bump melts when the displacement detecting unit detects a displacement in the pressing direction of the thermocompression bonding tool after the start of heating. The thermocompression bonding method described.
JP2006301183A 2006-11-07 2006-11-07 Thermocompression bonding apparatus and thermocompression bonding method Active JP4957193B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006301183A JP4957193B2 (en) 2006-11-07 2006-11-07 Thermocompression bonding apparatus and thermocompression bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006301183A JP4957193B2 (en) 2006-11-07 2006-11-07 Thermocompression bonding apparatus and thermocompression bonding method

Publications (2)

Publication Number Publication Date
JP2008117993A JP2008117993A (en) 2008-05-22
JP4957193B2 true JP4957193B2 (en) 2012-06-20

Family

ID=39503688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006301183A Active JP4957193B2 (en) 2006-11-07 2006-11-07 Thermocompression bonding apparatus and thermocompression bonding method

Country Status (1)

Country Link
JP (1) JP4957193B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108598014A (en) * 2018-05-30 2018-09-28 英特尔产品（成都）有限公司 Method and apparatus for failure type identification

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008061308A1 (en) * 2008-12-11 2010-07-22 Heuberger, Martin, Dr.-Ing. About the production of metal-ceramic compounds
JP2011211073A (en) * 2010-03-30 2011-10-20 Fujitsu Ltd Repairing device for electronic component, repairing method, and heat transfer cap member for use in repair
DE102010047678A1 (en) * 2010-10-06 2012-04-12 Atn Automatisierungstechnik Niemeier Gmbh Contacting solar module, comprises detecting a resulting relative movement between the joining partners, and evaluating a setting path and temperature profile
JP5847390B2 (en) * 2010-10-28 2016-01-20 東レエンジニアリング株式会社 Mounting apparatus and mounting method
JP5877645B2 (en) * 2011-02-15 2016-03-08 東レエンジニアリング株式会社 Mounting method and mounting apparatus
CH707378A1 (en) * 2012-12-21 2014-06-30 Besi Switzerland Ag Thermocompression method and apparatus for mounting semiconductor chips on a substrate.
CN108296589A (en) * 2017-10-26 2018-07-20 江苏诺森特电子科技有限公司 A kind of hot-pressing welding head hoisting type tin soldering equipment and its soldering tin technique again
CN108296590A (en) * 2017-10-26 2018-07-20 江苏诺森特电子科技有限公司 A kind of hot-pressing welding head is slow to press tin soldering equipment and its soldering tin technique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109840A (en) * 1991-10-18 1993-04-30 Toshiba Corp Inner lead bonding device
JPH09199545A (en) * 1996-01-23 1997-07-31 Nec Corp Part mounting apparatus and method thereof
JP3561089B2 (en) * 1996-07-15 2004-09-02 株式会社東芝 Semiconductor chip mounting method and device
JP3399324B2 (en) * 1997-11-10 2003-04-21 松下電器産業株式会社 Thermocompression bonding method for electronic components with solder bumps
JP4445163B2 (en) * 2001-07-13 2010-04-07 パナソニック株式会社 Electronic component mounting equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108598014A (en) * 2018-05-30 2018-09-28 英特尔产品（成都）有限公司 Method and apparatus for failure type identification

Also Published As

Publication number Publication date
JP2008117993A (en) 2008-05-22

Similar Documents

Publication Publication Date Title
JP4957193B2 (en) Thermocompression bonding apparatus and thermocompression bonding method
JP4880055B2 (en) Electronic component mounting apparatus and method
JP5014151B2 (en) Chip mounting apparatus and chip mounting method
US20070181644A1 (en) Component mounting method and component mounting apparatus
TWI376754B (en) Automatic level adjustment for die bonder
US10896892B2 (en) Wire bonding apparatus
KR101006632B1 (en) Decompressing type heater, its heating method, and electronic product manufacturing method
CN102151976A (en) Bonding apparatus
JP3399324B2 (en) Thermocompression bonding method for electronic components with solder bumps
JP2007294770A (en) Method and device for soldering electronic part
CN101311868B (en) Tip-off thermostatic control device and its control method
JP5533480B2 (en) Electronic component mounting apparatus and mounting method
JP6057685B2 (en) Pulse heat type soldering management method and management apparatus
JP7108489B2 (en) soldering equipment
KR20130141461A (en) Mounting device and mounting method
WO2010013764A1 (en) Chip mounting apparatus
JP4993765B2 (en) Method and apparatus for soldering coated wire
JP5191000B2 (en) Soldering method for inserted parts
JP3365275B2 (en) Work thermocompression bonding
JP2014143442A (en) Chip mounting device
JP2007053268A (en) Manufacturing method of bonding structure, solder bonding method and solder bonding device
TWI793766B (en) Manufacturing apparatus and manufacturing method of semiconductor device
JP7145555B2 (en) Semiconductor device manufacturing apparatus and manufacturing method
US20230230853A1 (en) Manufacturing apparatus and manufacturing method of semiconductor device
JP6345819B2 (en) Chip mounting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091007

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20091112

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100402

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120221

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120305

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150330

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 4957193

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151