JP2005327970A - Part push-up apparatus and method, and part mounting unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for delaminating a semiconductor chip from a wafer sheet in a reliable way without faulty delamination or damage. <P>SOLUTION: The part push-up unit 20 has a plurality of push-up pins 56 whose base sides are fixed to a common pin fixing section 87, and the pins 56 include at least one set different from the rest in terms of the tip position H in the vertical direction. It also has an elevating mechanism 95 for raising and lowering the pin fixing section 87. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component push-up device for pushing up and peeling a component, which is a semiconductor chip obtained by dicing a wafer attached to a wafer sheet, from the lower surface of the wafer sheet, a component mounting device including such a component push-up device, and a component It is related to the push-up method.

  This type of component pushing-up device is disclosed in, for example, Patent Document 1. With reference to FIG. 37 (A) to FIG. 37 (C), a conventional component lifting device will be described. The wafer 2 adhered to the wafer sheet 1 is divided into individual semiconductor chips or electronic components 3 by dicing, and bumps 4 are formed on the mounting side surface 3 a of the hand electronic components 3. The wafer sheet 1 is expanded radially by lowering the lower surface while abutting against the tip of the expand ring 5, whereby adjacent electronic components 3 are separated from each other. The tip of the holder 7 of the component pushing-up device 6 is in contact with the lower surface of the wafer sheet 1. The holder 7 is provided with a plurality of pin storages 7a, and vertical push-up pins 8 are provided corresponding to the pin storage holes 7a. As shown in FIG. 37 (A), the tip of each push-up pin 8 is stored before the push-up operation is started. The base end of the push-up pin 8 is fixed to the pin fixing member 9, and the vertical position H or the vertical position H of the tip is the same. As shown in FIG. 37 (B), each push-up pin 8 protrudes from each pin storage hole 7a due to the rise of the pin fixing member 9, and resists the adhesive force of the adhesive layer interposed between the wafer sheet 1 and the electronic component 3. Then, the lower surface of the electronic component 3 is pushed up. As a result, the electronic component 3 is peeled from the wafer sheet 1 as shown in FIG. The electronic component 3 peeled from the wafer sheet 1 is held by the suction nozzle 10.

  However, since the vertical positions H of the plurality of push-up pins 8 are the same, and these push-up pins 8 push up the lower surface of the electronic component 3 substantially simultaneously, excessive stress acts on the electronic component 3 at the time of peeling. . For this reason, there may be a case where a peeling failure such as an adhesive layer remaining on the lower surface of the electronic component 3 or damage to the electronic component 3 occurs.

Japanese Patent Laid-Open No. 8-37395

  The present invention relates to a component push-up device that can reliably peel a component that is a semiconductor chip from a wafer sheet without causing defective peeling or damage, a component push-up device and a component mounting device including such a component push-up device, It is another object of the present invention to provide a component pushing-up method.

  According to a first aspect of the present invention, a part, which is a semiconductor chip formed by dividing a wafer by dicing and attached to the upper surface of the wafer sheet, is pushed up from the lower surface side of the wafer sheet and peeled off from the wafer sheet. A plurality of push-up pins including at least one set of push-up devices arranged below the wafer sheet, the base end side being fixed to a common pin fixing portion, and the positions of the tips in the vertical direction being different from each other; A first position where tips of the plurality of push-up pins are separated from the wafer sheet; and a second position where tips of the plurality of push-up pins push up the component from the lower surface of the wafer sheet. A component push-up device is provided that includes a lift drive mechanism that moves up and down.

  The plurality of push-up pins include at least one set whose tips have different vertical positions. Therefore, when the elevating drive mechanism raises the pin fixing portion from the first position toward the second position, the tips of all the push-up pins do not push up the components substantially simultaneously, but first the vertical direction of the tips The tip of the push-up pin having the highest position, that is, the tip of the push-up pin closest to the lower surface of the wafer sheet in the first position pushes up the component. Then, as the pin fixing portion rises, the push-up pin pushes up the components in order from the highest vertical position of the tip. Therefore, the force to peel off the wafer sheet from the wafer sheet does not act on the entire lower surface of the component at the same time, but initially the force to peel off the wafer sheet acts on a part of the lower surface of the component. As the push-up pin rises together with the pin fixing portion, the region where the force to be peeled from the wafer sheet acts gradually expands. Therefore, excessive stress does not act on the component at the time of peeling from the wafer sheet, and it is possible to prevent peeling failure such as residual adhesive layer on the lower surface of the component and damage to the component.

  Specifically, the plurality of push-up pins are arranged such that the vertical position of the tip gradually decreases from the highest to the lowest vertical position of the tip.

  More specifically, the vertical position of the tip of the push-up pin decreases from one end to the other end of the diagonal line of the component.

  As an alternative, the position of the tip of the push-up pin in the vertical direction may become lower from one side to the other side of the two parts facing each other.

  Further, the vertical position of the tip of the push-up pin may be lowered from the edge of the component toward the center.

  Further, the vertical position of the tip of the push-up pin may become lower from the center of the component toward the edge.

  The component thrusting device according to the first aspect of the present invention includes the support mechanism that supports one end side of the pin fixing portion so as to be rotatable about a horizontal axis, and the plurality of thrusting mechanisms by the lifting drive mechanism. A rotation drive mechanism for rotating the pin fixing portion around the axis so that the other end side of the pin fixing portion rises when the pin fixing portion rises to a position where at least one of the pins pushes up the component; You may prepare.

  The component lifting device according to the first aspect of the present invention includes a support mechanism that supports one end side of the pin fixing portion so as to be rotatable around a horizontal axis, and the pin fixing portion around the axis. An adjustment mechanism may be further provided that changes the posture of the pin fixing portion by rotating and thereby adjusts the vertical height of the plurality of push-up pins.

  By providing this support mechanism and adjustment mechanism, the dimensions and materials including the thickness of the component (semiconductor chip), the thickness and material of the wafer sheet, and the material of the adhesive layer interposed between the component and the wafer sheet, etc. It is possible to adjust the vertical position of the tip of the push pin accordingly, and even if these conditions change, it is possible to peel the component from the wafer sheet without causing defective peeling or component damage it can.

  According to a second aspect of the present invention, there is provided the component push-up device according to the first aspect, and the reversing head that holds the component separated from the wafer sheet by the component push-up device and reverses the orientation of the mounting side surface. There is provided a component mounting apparatus including an apparatus and a mounting head apparatus that mounts the component delivered from the reversing head device on a substrate.

  According to a third aspect of the present invention, the lower surface of a component, which is a semiconductor chip formed by dividing a wafer by dicing and is attached to the upper surface of the wafer sheet, is pushed up from the lower surface side of the wafer sheet by a push-up pin. A component push-up method for peeling from a wafer sheet, wherein the component is pushed up by the push-up pin in a first region that is a part of the lower surface of the component, and pushed up by the push-up pin on the lower surface of the component. There is provided a component pushing-up method for gradually increasing push-up pins that push up the lower surface of the component so that the region gradually expands from the first region to the entire lower surface of the component.

  According to the component pushing-up device and the component pushing-up method of the present invention, a force for peeling from the wafer sheet is not applied to the entire lower surface of the component at the same time. A force to be peeled from the wafer sheet acts on the region, and this region gradually expands. Therefore, excessive stress does not act on the component at the time of peeling from the wafer sheet, and it is possible to prevent peeling failure such as residual adhesive layer on the lower surface of the component and damage to the component.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the figure, the X-axis direction and the Y-axis direction are directions or horizontal directions along the surface of the substrate 13, and the Y-axis direction is a direction perpendicular to the surface of the substrate 13 or a vertical direction.

(First embodiment)
FIGS. 1 to 3 show an electronic component mounting apparatus 11 that is an example of a component mounting apparatus including a component lifting apparatus according to the first embodiment of the present invention.

  First, the overall configuration and operation of the electronic component mounting apparatus 11 will be described. The electronic component mounting apparatus 11 is an apparatus that performs a mounting operation for mounting an electronic component 12 such as a chip component or a bare IC chip, which is an example of a component, on a substrate 13. The electronic component mounting device 11 can be roughly divided to supply a plurality of electronic components 12. A component supply unit 14, which is an example of a component supply device to be accommodated, and a mounting unit 15 that performs a mounting operation for mounting each electronic component 12 supplied from the component supply unit 14 on the substrate 13 are provided. The electronic component mounting apparatus 11 includes a control unit or a controller 16 for controlling operations of the component supply unit 14 and the mounting unit 15.

  Referring also to FIG. 4, the component supply unit 14 includes a lifter 17, a plate moving device 18, a plate placement device 19, a component push-up device 20, a recognition camera 21, and a reversing head device (component supply head device) 22. On the other hand, the mounting unit 15 includes a mounting head device 24, an XY table 25, and a two-field system recognition camera 26.

  First, the component supply unit 14 will be described. Referring to FIG. 4, the lifter 17 of the component supply unit 14 includes a magazine 28 that can be raised and lowered, and a wafer supply plate 29 for supplying the electronic component 12 to the magazine 28 in the form of a wafer, and the electronic component 12. A tray supply plate 30 for storing and supplying in the tray 31 is stored so as to be selectively supplied. As shown in FIG. 5, the wafer supply plate 29 has a substantially disk shape, and a wafer sheet 34 which is a stretchable sheet having a dicing wafer 32 attached to the upper surface thereof; A wafer ring 35 for holding the wafer sheet 34 in the vicinity of the outer peripheral end thereof is provided. Since the wafer supply plate 29 is formed in this way, by extending the wafer sheet 8 radially, the arrangement positions of the respective electronic components 12 arranged in a lattice shape can also be extended radially. It is possible to perform so-called expansion. On the other hand, as shown in FIG. 6, the tray supply plate 30 is an annular plate having an outer diameter similar to that of the tray supply plate 30 and the wafer supply plate 29 and having a substantially square inner peripheral hole portion. A tray ring 36, a tray mounting portion 37 attached to the inner peripheral hole portion of the tray ring 36, and a plurality of component supply trays 31 detachably mounted on the tray mounting portion 37 are provided. As shown in an enlarged view in FIG. 7, the component supply tray 31 is formed with a recess 31 a for accommodating the electronic component 12.

  The plate moving device 18 shown only in FIG. 4 is movable in the Y-axis direction, and conveys the wafer supply plate 29 or the tray supply plate 30 taken out from the magazine 28 of the lifter 17 to the plate placement device 19. Both the wafer supply plate 29 and the tray supply plate 30 are held by the plate placement device 19 in such a posture that the mounting side surface 12a of the electronic component 12 on which the bumps 39 are formed on the substrate 13 is directed upward in the vertical direction. .

  2, 4, 8, and 9, the plate placement device 19 includes a plate support pin 41 that supports the lower surfaces of the wafer supply plate 29 and the tray supply plate 30, and the upper surface side of these plates. A plate pressing body 42 is provided. The plate support pin 41 is supported so as to be movable in the vertical direction with respect to the attachment member 43 having a ring shape in plan view. A coil spring 44 is mounted on the plate support pin 41, and the plate support pin 41 is elastically biased upward in the vertical direction by the coil spring 44. On the other hand, the plate pressing body 42 is driven up and down by a cylinder 45. Further, a cylindrical expanding member 46 is disposed inside the attachment member 43, and the tip thereof is in contact with the lower surface of the wafer sheet 34. As shown in FIG. 8, the wafer supply plate 29 is sandwiched between the tip portions of the plate support pins 41 and the plate pressing body 42. When the plate pressing body 42 is lowered from the position shown in FIG. 8 by the cylinder 45, the wafer sheet 34 extends radially with the tip of the expanding member 46 as a fulcrum as shown in FIG. This so-called expand increases the interval between adjacent electronic components 12. The tray supply plate 30 is also held by the plate arranging device 19 in the same manner. As clearly shown in FIG. 2, the plate placement device 19 can be moved in the Y-axis direction by a Y-axis robot 48 having a driving motor 47.

  Referring to FIGS. 2 and 10, the component pushing-up device 20 can be moved in the X-axis direction by an X-axis robot 52 including a driving motor 51. Further, the component thrusting device 20 includes a thrusting head 54 at the tip of the arm 53. In the holder 55 of the push-up head 54, a push-up needle or a push-up pin 56 is accommodated so as to be movable up and down. The electronic component 12 is peeled from the wafer sheet 34 by pushing up the electronic component 12 attached to the wafer sheet 34 from the lower surface by the push-up pins 56. The push-up head 54 can rotate around the Z axis. The configuration and operation of the component lifting device 20 will be described in detail later.

  Referring to FIGS. 1, 2, and 4, the recognition camera 21 is mounted on an X-axis robot 59 having a driving motor 58 and is movable in the X-axis direction. The recognition camera 21 optically recognizes the position of the electronic member on the wafer supply plate 29 and the tray supply plate 30 held by the plate placement device 19.

  Referring to FIGS. 2 and 22, the reversing head device 22 is movable in the X-axis direction by an X-axis robot 62 including a driving motor 61. The reversing head device 22 includes a suction nozzle 65 for sucking and holding the electronic component 12 so as to be released by the suction force of the vacuum pump 63. The suction nozzle 65 can move up and down and can rotate about the Z axis. Further, the suction nozzle 65 can reverse the vertical direction. The configuration and operation of the reversing head device 22 will be described in detail later.

  Next, the mounting unit 15 will be described with reference to FIGS. 1 and 2. The mounting head device 24 can be moved forward and backward along the X-axis direction by an X-axis robot 67 operated by a motor 66. The mounting head device 24 can be driven up and down by a voice coil motor 68 and includes a holding portion 70 that can be rotated around its own axis by a motor 69. The holding unit 70 is configured so that bonding energy such as pressing energy, ultrasonic vibration energy, and thermal energy can be applied to the bonding portion of the substrate 13 through the electronic component 12 held by suction.

  On the upper surface of the XY table 25, a substrate holding base 72 for holding and fixing the substrate 13 in a releasable manner is installed. The substrate holding table 72 holds the substrate 13 supplied by the substrate transfer device 73 that transfers the substrate 13 leftward in the X-axis direction. The XY table 25 includes motors 74 and 75 for driving in the X-axis and Y-axis directions, and moves the substrate 13 held on the substrate holding base 72 in the X-axis direction and the Y-axis direction. By this movement, the position where the electronic component 12 is mounted on the substrate 13 with respect to the mounting head device 24 is positioned.

  The two-view system recognition camera 26 optically recognizes both the electronic component 12 and the substrate 13 held by the mounting head device 24.

  The overall operation of the component supply unit 14 and the mounting unit 15 will be outlined. The plate moving device 18 takes out the wafer supply plate 29 from the magazine 28 of the lifter 17, moves it in the Y-axis direction, and supplies it to the plate arranging device 19. After the holding of the wafer supply plate 29 by the plate placement device 19 (FIG. 8) and the expansion operation (FIG. 9) are completed, the Y-axis robot 48 moves the plate placement device 19 in the Y-axis direction and the X-axis robot 52 projects the parts. As the lifting device 20 moves in the X-axis direction, the push-up head 54 is positioned with respect to any electronic component 12 based on the recognition result of the recognition camera 21. Further, the reversing head device 22 is positioned with respect to the electronic component 12 by the movement of the reversing head device 22 in the X-axis direction by the X-axis robot 62. In synchronization with the suction operation of the suction nozzle 65 of the reversing head device 22, the electronic component 12 is pushed up from the lower surface side of the wafer sheet 34 by the push-up pin 56 of the reversing head device 22, so that the electronic component 12 is removed from the wafer sheet 34. It peels and is held by the suction nozzle 65. The reversing head device 22 moves to the delivery position P2 of the electronic component 12 (see FIG. 24) in the X-axis direction and reverses the direction of the suction nozzle 65. The mounting head device 24 is also moved in the X-axis direction by the X-axis robot 67 to the delivery position P2. After the electronic component 12 is held by the holding unit 70 of the mounting head device 24, the suction by the suction nozzle 65 is released and the electronic component 12 is transferred from the reversing head device to the mounting head device 24. The mounting head device 24 to which the electronic component 12 has been transferred moves above the substrate 13 on the XY table 25. As the substrate 13 is moved in the X-axis direction and the Y-axis direction by the XY table 25, an appropriate position of the substrate 13 is positioned with respect to the mounting head device 24 based on the recognition result of the two-field recognition camera 26. . After this positioning, the mounting head device 24 mounts the electronic component 12 on the substrate 13. A similar operation is also performed on the tray supply plate 30.

  Next, the component lifting device 20 will be described in detail with reference to FIGS. 1, 2, and 10 to 17. As shown in FIGS. 2, 10, and 11, the component pushing-up device 20 includes a base 80 mounted on an X-axis robot 52 including a driving motor 51. A base end side of an arm 53 extending in the Y axis direction is attached to the base portion 80. The base end side of the arm 53 is attached to the base portion 80 via an LM guide or linear guide 81 extending in the Z-axis direction, and the entire arm 53 is moved up and down by a cylinder 82 supported by the base portion 80.

  As shown in FIGS. 12 to 15, the arm 53 includes a push-up head 54 at the tip thereof. As shown most clearly in FIGS. 16 and 17, the push-up head 54 is disposed below the wafer supply plate 29 held by the plate placement device 19. The thrust head 54 includes a casing 83 fixed to the tip of the arm 53. A ball spline 84 is attached to the casing 83 such that the spline shaft 85 extends in the vertical direction, and a pin fixing member 87 is attached to the tip end side of the spline shaft 85 to fix the base end sides of the plurality of push-up pins 56. It has been. The rotation operation portion 86 of the ball spline 84 is rotatably attached to the casing 83, and a pulley 89 is fixed to the outer periphery thereof. As shown in FIGS. 2 and 11, a drive belt 93 is stretched between the pulley 89 and a pulley 92 fixed to the output shaft of the motor 91 disposed on the base end side of the arm 53. . Therefore, the rotation of the motor 91 is converted into rotation around the Z axis of the spline shaft 85 via the pulleys 89 and 92, the drive belt 93, and the rotation operation unit 86. The spline shaft 85 can be moved up and down by a cam type lifting drive mechanism 95. Specifically, a cam follower 98 that is in contact with a cam 97 fixed to the output shaft of the motor 96 is attached to the upper end of the lever 99, and this lever 99 goes straight in the vertical direction by the straight guide 100 supported by the casing 83. It is possible. Further, the protrusion 101 provided at the L-shaped lower end of the lever 99 is in contact with the lower end of the spline shaft 85. Further, a coil spring 102 is mounted on the spline shaft 85, and the spline shaft 85 is elastically biased downward in the vertical direction by the coil spring 102. Therefore, the lower end of the spline shaft 85 is always in contact with the protrusion 101. The rotation of the motor 96 is converted into linear motion by the cam 97 and the cam follower 98, and this linear motion is transmitted to the spline shaft 85 by the lever 99.

  The upper end side of the spline shaft 85 is inserted into a hollow holder 55 fixed to the casing 83. As shown in FIGS. 16 and 17, the front end surface of the holder 55 is brought into contact with the lower surface of the wafer sheet 34. Further, a plurality of sheet suction holes 55a (shown only in FIG. 15A) are provided on the front end surface of the holder 55, and the vacuum pump 103 that operates through these sheet suction holes 55a (only in FIG. 16). The lower surface of the wafer sheet 34 is sucked and held on the front end surface 55b of the holder 55 by the suction force shown in FIG.

  A pin fixing member 87 is fixed to the upper end of the spline shaft 85 located in the holder 55. Referring also to FIG. 21A, a plurality of (12 in this embodiment) push-up pins 56 are fixed to the pin fixing member 87. As shown in FIGS. 16 and 20A, the tip of each push-up pin 56 is stored in a pin storage hole 55 c formed in the tip surface of the holder 55 before the push-up operation is started. The vertical position H of the tip of the push-up pin 56 is varied. Specifically, the tip of the push-up pin 56 is located on the same temporary dressing plane PL (shown only in FIG. 16), and the temporary mounting plane PL is inclined with respect to the horizontal plane. In other words, the push-up pin 56 is arranged such that the vertical height H of the tip gradually decreases from the highest height H to the lowest height of the tip. More specifically, as indicated by an arrow A1 in FIG. 21A, the vertical position of the push-up pin 56 decreases from one end of the diagonal line of the electronic component 12 to the other end.

  Next, the operation of the component lifting device 20 will be described. Referring to FIG. 18, first, in step S <b> 18-1, as already described with reference to FIGS. 8 and 9, the expanding operation of the wafer sheet 34 by the plate arranging device 19 is executed. Next, in step S18-2, the front end surface of the holder 55 is brought into contact with the lower surface of the wafer sheet 34 by the raising of the arm 53, and then the vacuum pump 63 is operated to suck the lower surface of the wafer sheet 34 into the sheet suction hole 55a. The When there is a change in the type of the electronic component 12, etc., the angular position around the Z axis of the pin fixing member 87 is adjusted by rotating the spline shaft 85 by the motor 91, and accordingly, according to the electronic component 12 The arrangement positions of the plurality of push-up pins 56 in plan view can be adjusted. Next, in step S18-3, the recognition camera 21 recognizes the position of the electronic component 12 to be pushed up. In step S18-4, after the reversing head device 22 moves based on the recognition result of the recognition camera 21, the suction nozzle 65 descends to start sucking the electronic component 12. In step S18-5, the electronic component 12 is pushed up by the push-up pin 56 in synchronization with the raising operation of the suction nozzle 65. Finally, in step S18-6, the suction nozzle 65 that sucks and holds the electronic component 12 separated from the wafer sheet 34 by the push-up operation is raised.

  The push-up operation in step S18-5 in FIG. 18 will be described in detail. First, referring to FIG. 19, in the push-up operation, the whole push-up pin rises (step S19-1), and thereby the electronic component 12 is peeled off from the wafer sheet 34 "obliquely" (step S19-2). 20A to 20C, the tip of the push-up pin 56 is stored in the pin storage hole 55c before the start of the push-up operation (FIG. 20A). Next, the elevating drive mechanism 95 starts to raise the spline shaft 85 and the pin fixing member 87 at the tip thereof in the holder 55. In order to maintain the rotational angle position around the Z axis of the pin fixing member 87, the rotation operation portion 86 of the ball spline 84 is rotated by the motor 91 in synchronization with the rise of the spline shaft 85. When the pin fixing member 87 is raised, the tips of all the push-up pins 56 do not push up the electronic component 12 substantially simultaneously, but the tip of the push-up pin 56 having the highest vertical position H in the tip first. Pushes up the electronic component 12. Then, as the pin fixing member 87 is further raised, the electronic component 12 is pushed up in order from the highest vertical position H of the tip (see FIGS. 20B and 21A), and finally the wafer. The electronic component 12 is peeled from the sheet 34 (see FIG. 20C). Accordingly, the force to be peeled off from the wafer sheet 34 substantially simultaneously does not act on the entire lower surface of the electronic component 12, but at first it is attempted to peel off from the wafer sheet in the vicinity of one corner of the electronic component 12. As the push pin 56 rises together with the pin fixing member 87, the region where the force to be peeled off from the wafer sheet 34 is gradually expanded in the diagonal direction. Therefore, excessive stress does not act on the electronic component 12 during peeling from the wafer sheet 34, and it is possible to prevent peeling failure such as residual adhesive layer on the lower surface of the electronic component 12 and damage to the electronic component 12. In order to finely adjust the posture (peeling angle) of the push-up pin 56 and improve the peelability, the spline is driven by the motor 91 while the pin fixing member 87 is raised toward the wafer sheet 34 by the lifting drive mechanism 95. The shaft 85 may be moved, whereby the pin fixing member 87 may be rotated around the Z axis or may be swung around the Z axis.

  As shown in FIG. 21B, the number of push-up pins 56 may be reduced (9 in this example). However, if the pitch of the push-up pins 56 is excessively narrowed, the electronic component 12 moves upward while the entire bottom surface thereof is in close contact with the wafer sheet 34 by the tips of the push-up pins 56 that are densely arranged. Become. For this reason, the electronic component 12 is not peeled off from the wafer sheet 34, and there is a risk of causing a peeling failure. On the contrary, if the pitch of the push-up pins 56 is excessively widened, stress concentration may occur in the portion pushed up by the push-up pins 56 on the lower surface of the electronic component 12 and the electronic component 12 may be damaged. Therefore, the number of push-up pins 56 needs to be set in consideration of these points.

  Next, the reversing head device 22 will be described in detail. Referring to FIGS. 2 and 22, the reversing head device 22 includes a suction nozzle 65 that is an example of a holding unit that sucks and holds the electronic component 2 so as to be releasable, and a rotation driving device that rotates the suction nozzle 65 around the Z axis. The reversing head 103 is provided. The reversing head device 22 moves the reversing head 103 up and down to support the head lifting device 104 that raises and lowers the suction nozzle 65 and the reversing head 103 so that the reversing head 103 can move up and down. A head reversing device 105 that rotates the head 103 to reverse the vertical direction of the suction nozzle 65 is provided. Further, the reversing head device 22 includes a head frame 106 that supports the head lifting device 104 and the head reversing device 105. The head frame 106 is mounted on an X-axis robot 62 having a driving motor 61. Accordingly, the reversing head 103 moves back and forth in the X-axis direction between the take-out position P1 of the electronic component 12 (see FIG. 24A) and the delivery position P2 of the electronic component 12 (see FIG. 24B).

  Referring to FIGS. 23 (A) to 23 (B), the suction nozzle 65 includes a suction hole 65b opened in the flat tip surface 65a, and a suction flow path 65c having one end communicating with the suction hole 65b. A vacuum pump 63 is connected to the other end of the adsorption channel 65c. The suction hole 65b includes a central portion 65d communicating with the suction flow path 65c and a plurality of branch portions 65e extending radially from the central portion 65d. In the present embodiment, four branch portions 65e arranged at an angular interval of 90 degrees in plan view or bottom view are provided. The shape and dimensions of the suction hole 65b and the tip surface 65a are such that the outer portion of the tip surface 65a than the suction hole 65b contacts the bump 39 of the electronic component 12, while the suction hole 65b has the bump 39 on the mounting side surface 12a. It is set so as to be opposed to the part not to be opened with a gap. Therefore, the suction operation of the vacuum pump 63 generates an air flow that flows into the suction flow path 65c through the suction hole 65b from the gap between the tip surface 65a of the suction nozzle 65 and the mounting side surface 12a, and the negative pressure generated by this air flow. Thus, the electronic component 12 is held on the tip surface 65a. In other words, the suction nozzle 65 of the reversing head device 22 sucks and holds the electronic component 12 in a state in which the tip surface 65a thereof is not in contact with the mounting side surface 12a. Therefore, the suction force acts uniformly on the entire mounting surface 12a, and the electronic component 12 can be held on the suction nozzle 65 with high accuracy without causing deformation such as bending due to excessive suction force.

  The outer dimension of the front end surface 65a of the suction nozzle 65 is such that the outer peripheral edge of the front end surface 65a is located, for example, about 25 to 50 μm inside the end edge of the electronic component 12 as indicated by reference numeral t1 in FIG. Is set to Therefore, as shown in FIG. 23B, even when the electronic component 12 accommodated in the recess 31a of the tray 31 is in contact with the wall surface constituting the recess 31a, the tip surface 65a of the suction nozzle 65 and the recess 31a A clearance of about 25 to 50 μm, for example, indicated by reference numeral t2 is secured between the wall surface and the suction nozzle 65 can be prevented from interfering with the wall surface of the recess 31a. The outer dimension of the tip surface 65 a of the suction nozzle 65 is set so that the outer peripheral edge of the tip surface 65 a is positioned outside the bump 39. Accordingly, the bumps reliably come into contact with the tip surface 65a outside the suction hole 65b, so that the electronic component 12 is reliably attached to the suction nozzle 65 by the negative pressure generated in the gap between the suction hole 65a and the mounting side surface 12a. Retained.

  With reference to FIG. 24A to FIG. 24D, the operation from when the electronic component 12 is taken out of the plate placement device 19 by the reversing head device 22 and mounted on the substrate 13 by the mounting head device 24 will be described. First, as shown in FIG. 24A, at the supply position P1 of the electronic component 12 corresponding to the plate placement device 19, the suction nozzle 65 of the reversing head device 22 is moved from the wafer supply plate 29 or the tray supply plate 30 to the electron. The component 12 is sucked. At this time, the suction nozzle 65 holds the mounting surface 12a of the electronic component 12 facing upward in the vertical direction. Next, as shown in FIG. 24B, the suction nozzle 65 moves up and the mounting head device 24 moves to the delivery position P2. Next, the reversing head device 22 holding the electronic component 12 on the suction nozzle 65 moves to the delivery position P <b> 2 and is disposed below the mounting head device 24. Subsequently, the direction of the reversing head 103 is reversed, and as a result, the surface of the electronic component 12 opposite to the mounting side surface 12a is directed upward in the vertical direction. Then, as shown in FIG. 24C, the holding unit 70 of the mounting head device 24 descends to hold the electronic component 12. The electronic component 12 is held by the holding unit 70 in a posture in which the mounting side surface 12a is vertically downward. Next, as shown in FIG. 24D, after the mounting head device 24 is moved above a predetermined position of the substrate 13, the holding unit 70 is lowered, and the electronic component 12 is mounted at the predetermined position.

  The shape of the suction hole 65b of the suction nozzle 65 is not limited to that shown in FIGS. 23 (A) to 23 (C). For example, as shown in FIGS. 25 (A) to 25 (C), eight branch portions 65e arranged at an angle interval of 45 degrees in a plan view or a bottom view may be provided.

(Second Embodiment)
The second embodiment differs from the first embodiment in the arrangement of the tip of the push-up pin 56 of the component push-up device 20. Referring to FIGS. 26A and 27A, the vertical position H of the tips of the 12 push-up pins 56 decreases from the edge of the electronic component 12 toward the center. In other words, the tip of the push-up pin 56 is located on the concave virtual curved surface.

  Referring to FIGS. 26 (A) to 26 (C), the tip of the push-up pin 56 is stored in the pin storage hole 55c before the start of the push-up operation (FIG. 26 (A)). Next, when the pin fixing member 87 is raised in the holder 55, the tips of all the push-up pins 56 do not push up the electronic component 12 substantially simultaneously, but the vertical position H of the tips of the push-up pins 56. With the highest value pushes up the electronic component 12 first. Then, as the pin fixing member 87 is further raised, the electronic component 12 is pushed up in order from the highest vertical position H of the tip (see FIGS. 26B and 27A), and finally the wafer. The electronic component 12 is peeled from the sheet 34 (see FIG. 26C). Accordingly, the force to be peeled off from the wafer sheet 34 substantially simultaneously does not act on the entire lower surface of the electronic component 12, but at first it is attempted to peel off from the wafer sheet 34 in a region near the edge of the electronic component 12. As the force to act and the push pin 56 rises together with the pin fixing member 87, the region where the force to be peeled off from the wafer sheet 34 acts increases toward the center of the electronic component. Therefore, excessive stress does not act on the electronic component 12 during peeling from the wafer sheet 34, and it is possible to prevent peeling failure such as residual adhesive layer on the lower surface of the electronic component 12 and damage to the electronic component 12.

  As shown in FIG. 27B, the number of push-up pins 56 may be reduced (9 in this example). Other configurations and operations of the second embodiment are the same as those of the first embodiment.

(Third embodiment)
The third embodiment is different from the first embodiment in the arrangement of the tip of the push-up pin 56 of the component push-up device 20. Referring to FIGS. 28A and 29A, the vertical position H of the tips of the twelve push-up pins 56 decreases from the center of the electronic component 12 toward the edge. In other words, the tip of the push-up pin 56 is located on the convex virtual curved surface.

  Referring to FIGS. 28A to 28C, the tip of the push-up pin 56 is stored in the pin storage hole 55c before the start of the push-up operation (FIG. 28A). Next, when the pin fixing member 87 is raised in the holder 55, the tips of all the push-up pins 56 do not push up the electronic component 12 substantially simultaneously, but the vertical position H of the tips of the push-up pins 56. With the highest value pushes up the electronic component 12 first. Then, as the pin fixing member 87 is further raised, the electronic component 12 is pushed up in order from the highest vertical position H of the tip (see FIGS. 28B and 29A), and finally the wafer. The electronic component 12 is peeled from the sheet 34 (see FIG. 28C). Therefore, the force to be peeled off from the wafer sheet 34 substantially simultaneously does not act on the entire lower surface of the electronic component 12, but first, it is attempted to peel off from the wafer sheet 34 in a region near the center of the electronic component 12. As the pushing force 56 is raised together with the pin fixing member 87, the region where the force to be peeled off from the wafer sheet 34 acts is expanded toward the edge of the electronic component 12. Therefore, excessive stress does not act on the electronic component 12 during peeling from the wafer sheet 34, and it is possible to prevent peeling failure such as residual adhesive layer on the lower surface of the electronic component 12 and damage to the electronic component 12.

  As shown in FIG. 29B, the number of push-up pins 56 may be reduced (9 in this example). Other configurations and operations of the third embodiment are the same as those of the first embodiment.

(Fourth embodiment)
The fourth embodiment differs from the first embodiment in that the pin fixing member 87 of the component pushing-up device 20 rotates and the arrangement of the tip of the pushing-up pin 56.

  30 to 32, one end side of the pin fixing member 87 is rotatably supported by the support mechanism 110. Specifically, a pair of opposite support shafts 111 are fixed to one end side of the pin fixing member 87, and the support shafts 111 are rotatably supported on the spline shaft 85 side. Further, the component pushing-up device 20 includes a rotation drive mechanism 112 that rotates the pin fixing member 87 around the axis L of the support shaft 111. Specifically, the rotation drive mechanism 112 includes a push rod having an upper end that abuts on the other end side of the pin fixing member 87 and a cam roller 113 on the lower end side. The push rod 114 is supported so as to be movable back and forth in the vertical direction. The rotational drive mechanism 112 includes a cylinder 117 to which a cam 116 that contacts the cam roller 113 is fixed at the tip of the plunger 155. The plunger 115 extends in the horizontal direction. When the plunger 115 of the cylinder 117 protrudes from the possible position to the protruding position, the push rod 114 moves upward in the vertical direction via the cam row 113, and as a result, the pin fixing member 87 rotates upward around the axis L of the support shaft 111. To do.

  Referring also to FIG. 35A, the vertical position H of the tips of the twelve push-up pins 56 decreases from one side to the other side of the two opposite sides of the electronic component 12. .

  A push-up operation of the electronic component 12 by the push-up pin 56 in this embodiment (corresponding to step S18-5 in FIG. 18) will be described. Referring to FIG. 33, first, the entire push-up pin 56 is raised by the cam-type lifting drive mechanism 95 (step S33-1). Next, when the pin fixing member 87 rises to a position where the push-up pin 56 on the support shaft pushes up the electronic component 12, the pin fixing member 87 is rotated around the support shaft 111 by the rotation drive mechanism 112. The push-up pin 56 on the other end side of 87 (the side opposite to the support shaft 111) rises (step S33-2). The electronic component 12 is peeled off from the wafer sheet 34 "obliquely" by these two-stage operations. Referring to FIGS. 34 (A) to 34 (C), the tip of the push-up pin 56 is stored in the pin storage hole 55c before the start of the push-up operation (FIG. 34 (A)). Next, when the pin fixing member 87 is lifted together with the spline shaft 85 by the lifting drive mechanism 95, the tips of all the push-up pins 56 do not push up the electronic component 12 substantially at the same time, but the vertical position H of the tips is changed. The push-up pin 56 on one end side (support shaft 111 side) of the high pin fixing member 87 protrudes from the pin storage hole 55c and pushes up the electronic component 12. Next, the pin fixing member 87 is rotated by the rotation driving mechanism 112. As a result, the push-up pin 56 on the other end side (the side opposite to the support shaft 111) of the pin fixing member 87 protrudes from the pin storage hole 55c. The electronic component 12 is pushed up (see FIGS. 34B and 35A). Finally, the electronic component 12 is peeled from the wafer sheet 34 (see FIG. 34C). Accordingly, the force to peel off the wafer sheet 34 from the wafer sheet 34 substantially simultaneously does not act on the entire lower surface of the electronic component 12, but at first, from the wafer sheet near one of the two opposite sides of the electronic component 12. A force to be peeled acts, and a region where a force to peel from the wafer sheet 34 acts gradually expands toward the other side as the push-up pins 56 rise together with the pin fixing members 87. To do. Therefore, excessive stress does not act on the electronic component 12 during peeling from the wafer sheet 34, and it is possible to prevent peeling failure such as residual adhesive layer on the lower surface of the electronic component 12 and damage to the electronic component 12. In order to finely adjust the posture (peeling angle) of the push-up pin 56 to improve the peelability, the pin fixing member 87 is being lifted toward the wafer sheet 34 by the lift drive mechanism 95, or a rotation drive mechanism During the rotation by 112, the spline shaft 85 may be moved by the motor 91, whereby the pin fixing member 87 may be rotated around the Z axis or may be swung around the Z axis.

  As shown in FIG. 35B, the number of push-up pins 56 may be reduced (9 in this example). Further, as shown in FIGS. 36A to 36C, the pin fixing member 87 may be rotated around the support shaft 111 by a cam 118 that contacts the lower surface of the pin fixing member 87. The setting of the position H in the vertical direction of the tip of the push-up pin 56 of the first to third embodiments (see FIGS. 21, 27, and 29) may be adopted in this embodiment. Conversely, the setting of the vertical position H of the tip of the push-up pin 56 of this embodiment may be employed in the first embodiment. Other configurations and operations of the fourth embodiment are the same as those of the first embodiment.

(Fifth embodiment)
In the fifth embodiment, the pin fixing member 87 is rotated by the rotation driving mechanism 112 after the pin fixing member 87 is raised to some extent by the lifting drive mechanism 95. However, before the pin fixing member 87 is raised by the elevating drive mechanism 95, the rotational angle position around the axis L of the pin fixing member 87 may be adjusted by the rotation driving mechanism 112. The difference in the vertical position H of the tip of the push-up pin 56 can be adjusted by the rotational angle position around the axis L of the pin fixing member 87. In this case, the rotation drive mechanism 112 functions as an adjustment mechanism for the pin fixing member 87. However, it is necessary to set the posture of the pin fixing member 87 so that the vertical position H of the tip of the push-up pin 56 is the same, that is, the tip of the push-up pin 56 is not located on the same horizontal plane. When the pin fixing member 87 is raised while maintaining the rotational angle position around the axis L, the electronic component 12 is pushed up by the push-up pin 56 and peeled off from the wafer sheet 34 as in the first to second embodiments. be able to.

  In the present embodiment, the thickness and material including the thickness of the electronic component 12, the thickness and material of the wafer sheet 34, and the material such as the material of the adhesive layer interposed between the electronic component 12 and the wafer sheet 34 are pushed up. It is possible to adjust the vertical position H of the tip of the pin 56, and even when these conditions change, the electronic component 12 is peeled from the wafer sheet 34 without causing poor peeling or damage to the electronic component 12. Can be made.

The perspective view which shows the component mounting apparatus which concerns on 1st Embodiment of this invention. The typical fragmentary perspective view of the component mounting apparatus of FIG. The typical partial front view of the component mounting apparatus of FIG. The semi-transparent perspective view which shows the component supply apparatus with which the partial apparatus of FIG. 1 is provided. The perspective view which shows the plate for wafer supply. The perspective view which shows the plate for tray supply. FIG. 7 is a partially enlarged perspective view of the tray of FIG. 6. The typical sectional view showing the plate arrangement device with which the component mounting device of Drawing 1 is provided. The typical sectional view showing the plate arrangement device with which the component mounting device of Drawing 1 is provided. The perspective view which shows the component pushing-up apparatus with which the component mounting apparatus of FIG. 1 is provided. The disassembled perspective view which shows the component pushing-up apparatus with which the component mounting apparatus of FIG. 1 is provided. FIG. 2 is a partial perspective view showing a push-up head of a component push-up device provided in the component mounting apparatus of FIG. 1. The fragmentary perspective view which shows the internal structure of the thrust head of FIG. FIG. 13 is an exploded perspective view of the push-up head in FIG. 12. The thrust head of FIG. 12 is shown, (A) is a longitudinal cross-sectional view, (B) is a top view, (C) is sectional drawing in the XV-XV line | wire of (A). FIG. 2 is a schematic cross-sectional view showing a plate placement device and a component push-up device provided in the component mounting device of FIG. 1. The typical fragmentary perspective view which shows the positional relationship of a components placement apparatus and a component pushing-up apparatus. The flowchart for demonstrating operation | movement of a component pushing-up apparatus. The flowchart which shows the detail of step S18-5 of FIG. (A), (B), and (C) are typical fragmentary sectional views which show the pushing-up operation | movement in 1st Embodiment. (A) is a typical partial perspective view showing the relationship between the semiconductor chip being peeled and the push-up pins in the first embodiment, and (B) is a semiconductor chip and push-up pins when the number of push-up pins is reduced. The typical fragmentary perspective view which shows the relationship. The perspective view which shows the inversion head apparatus with which the component mounting apparatus of FIG. 1 is provided. 1A is a schematic longitudinal sectional view, FIG. 1B is a bottom view of FIG. 1A, and FIG. 1C is a schematic longitudinal section showing a relationship with a recess of a tray. Plan view. Schematic explanatory drawing which shows the relationship between the component reversal head part at the time of delivery operation | movement, and a mounting head part. 1A and 1B show a modification of the suction nozzle provided in the component reversing device of FIG. 1. FIG. 1A is a schematic longitudinal section, FIG. 1B is a bottom view of FIG. 1A, and FIG. Longitudinal sectional view. (A), (B), and (C) are typical fragmentary sectional views which show the pushing-up operation | movement in 2nd Embodiment. (A) is a typical partial perspective view showing the relationship between a semiconductor chip being peeled and a push-up pin in the second embodiment, and (B) is a semiconductor chip and a push-up pin when the number of push-up pins is reduced. The typical fragmentary perspective view which shows the relationship. (A), (B), and (C) are typical fragmentary sectional views showing pushing up operation in a 3rd embodiment. (A) is a typical partial perspective view showing the relationship between a semiconductor chip being peeled and a push-up pin in the third embodiment, and (B) is a semiconductor chip and a push-up pin when the number of push-up pins is reduced. The typical fragmentary perspective view which shows the relationship. The fragmentary perspective view which shows the thrust head of the component thrust apparatus which concerns on 4th Embodiment. FIG. 27 is a partial perspective view showing the internal structure of the push-up head of FIG. The typical fragmentary sectional view which shows the component pushing-up apparatus which concerns on 4th Embodiment. The flowchart for demonstrating IC chip pushing-up operation | movement in 4th Embodiment. (A), (B), and (C) are typical fragmentary sectional views which show the pushing-up operation | movement in 4th Embodiment. (A) is a typical partial perspective view showing the relationship between the semiconductor chip being peeled and the push-up pins in the fourth embodiment, and (B) is a semiconductor chip and push-up pins when the number of push-up pins is reduced. The typical fragmentary perspective view which shows the relationship. (A), (B), and (C) are typical fragmentary sectional views which show the pushing-up operation | movement in the modification of 4th Embodiment. (A), (B), and (C) are typical sectional drawings which show the conventional component pushing-up apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Electronic component mounting apparatus 12 Electronic component 12a Mounting side surface 13 Board | substrate 14 Component supply part 15 Mounting part 16 Controller 17 Lifter 18 Plate moving apparatus 19 Plate arrangement apparatus 20 Component pushing-up apparatus 21 Recognition camera 22 Reversing head apparatus 24 Mounting head apparatus 25 XY table 26 Two-field optical system recognition camera 28 Magazine 29 Wafer supply plate 30 Tray supply plate 31 Tray 31a Recess 32 Wafer 34 Wafer sheet 35 Wafer ring 36 Traying 37 Tray mounting part 39 Bump 41 Plate support pin 42 Plate pressing Body 43 Mounting member 44 Coil spring 45 Cylinder 46 Expanding member 47 Motor 48 Y-axis robot 51 Motor 52 X-axis robot 53 Arm 54 Push-up head 55 Holder 55a Pin suction hole 55b tip face 55c pin storage hole 56 push-up pin 58 motor 59 X-axis robot 61 motor 62 X-axis robot 63 vacuum pump 65 suction nozzle 65a tip face 65b suction hole 65c suction flow path 65d central part 65e branching part 66 Motor 67 X-axis robot 68 Voice coil motor 69 Motor 70 Holding part 72 Substrate holding stand 73 Substrate transport device 74, 75 Motor 80 Base 81 Linear guide 82 Cylinder 83 Casing 84 Ball spline 85 Spline shaft 86 Rotating operation part 87 Pin fixing member 89 Pulley 91 Motor 92 Pulley 93 Drive belt 95 Elevating drive mechanism 96 Motor 97 Cam 98 Cam follower 99 Lever 100 Straight guide 101 Projection 102 Coil spring 103 Vacuum pump 102 Rotation drive device 10 3 Reversing Head 104 Head Lifting Device 105 Head Reversing Device 106 Head Frame 110 Support Mechanism 111 Supporting Shaft 112 Rotation Drive Mechanism 113 Cam Roller 114 Push Rod 115 Plunger 116 Cam 117 Cylinder 118 Cam

Claims (10)

The component (12), which is a semiconductor chip formed by dividing the wafer (32) by dicing and attached to the upper surface of the wafer sheet (34), is pushed up from the lower surface side of the wafer sheet and peeled off from the wafer sheet. A component push-up device (20),
A plurality of push-up pins (56) including at least one set of pins arranged below the wafer sheet, the base end side being fixed to a common pin fixing portion (87), and the tip vertical position (H) being different from each other. )When,
The pin fixing portion includes a first position where tips of the plurality of push-up pins are separated from the wafer sheet, and a second position where tips of the plurality of push-up pins push up the component from the lower surface of the wafer sheet; And a lift drive mechanism (95) for lifting and lowering between the components.   2. The component according to claim 1, wherein the plurality of push-up pins are arranged such that the vertical position of the tip gradually decreases from the highest to the lowest vertical position of the tip. Pushing device.   The component pushing-up device according to claim 2, wherein the vertical position of the tip of the push-up pin decreases from one end to the other end of the diagonal line of the component.   The component pushing-up device according to claim 2, wherein the vertical position of the tip of the push-up pin is lowered from one side to the other of two sides facing each other.   The component pushing-up device according to claim 2, wherein the vertical position of the tip of the pushing pin is lowered from the edge of the component toward the center.   The component pushing-up device according to claim 2, wherein a vertical position of a tip of the pushing pin is lowered from the center of the component toward an edge. A support mechanism (110) for rotatably supporting one end of the pin fixing portion around a horizontal axis (L);
When the pin fixing part rises to a position where at least one of the plurality of push-up pins pushes up the component by the lifting drive mechanism, the pin fixing part around the axis so that the other end side of the pin fixing part rises. The component pushing-up device according to claim 1, further comprising a rotation drive mechanism (112) for rotating the component. A support mechanism for rotatably supporting one end side of the pin fixing portion around a lateral axis (L);
2. The adjusting mechanism according to claim 1, further comprising an adjustment mechanism for rotating the pin fixing portion around the axis to change the posture of the pin fixing portion, thereby adjusting the vertical height of the plurality of push-up pins. The component lifting device described. A component lifting device (20) according to claim 1,
A reversing head device (22) for holding the component separated from the wafer sheet by the component push-up device and reversing the orientation of the mounting side surface;
A component mounting device comprising: a mounting head device (24) for mounting the component (12) delivered from the reversing head device on a substrate (13). The wafer (32) is divided by dicing, and the lower surface of the component (12), which is a semiconductor chip attached to the upper surface of the wafer sheet (34), is pushed up from the lower surface side of the wafer sheet (56). A component push-up method that pushes up and peels off from the wafer sheet,
In the first region which is a part of the lower surface of the component, the component is pushed up by the push-up pin,
Component push-up method for gradually increasing the push-up pins that push up the lower surface of the component so that the region pushed up by the push-up pin on the lower surface of the component gradually expands from the first region to the entire lower surface of the component .

Images