KR20120100956A - Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device - Google Patents
Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device Download PDFInfo
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- KR20120100956A KR20120100956A KR1020127010991A KR20127010991A KR20120100956A KR 20120100956 A KR20120100956 A KR 20120100956A KR 1020127010991 A KR1020127010991 A KR 1020127010991A KR 20127010991 A KR20127010991 A KR 20127010991A KR 20120100956 A KR20120100956 A KR 20120100956A
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- substrate
- board
- tray
- conveyance
- support member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
According to the present invention, the substrate conveying apparatus 7 which conveys the substrate P disposed on the substrate supporting member T together with the substrate supporting member, comprising: an excitation portion V which vibrates the substrate supporting member on which the substrate is disposed; The board | substrate conveying apparatus provided with the conveyance part 4 which hold | maintains and moves a board | substrate support member.
Description
The present invention relates to a substrate transfer device, an exposure apparatus, a substrate support apparatus, and a device manufacturing method.
This application claims priority based on US Provisional Application No. 61 / 272,745, filed October 28, 2009, and uses the content therein.
In the manufacturing process of electronic devices, such as a flat panel display, the processing apparatus of large board | substrates, such as an exposure apparatus and an inspection apparatus, is used. In the exposure process and test | inspection process using these processing apparatuses, the conveying apparatus disclosed by the following patent document which conveys a large substrate (for example, glass substrate) to a processing apparatus is used.
By the way, in the conveyance apparatus of the large sized board | substrate mentioned above, when transferring the board | substrate hold | maintained at the carrying-in / out part to a board | substrate support apparatus, a board | substrate and a board | substrate support apparatus are separately supported. For this reason, the board | substrate may bend downward by self weight by the support method of a board | substrate. When the board | substrate of the state which was pinched by self weight was transmitted to the board | substrate support apparatus, the part which bent below the board | substrate contacts a board | substrate support apparatus, and the board | substrate is hold | maintained on the board | substrate support apparatus by the friction of the contacted part.
For example, in the exposure apparatus, when the substrate in the 휜 state is transferred in this way, there is a problem of poor exposure such as being unable to perform a predetermined exposure at an appropriate position on the substrate. Moreover, when warpage arises in the board | substrate arrange | positioned at a board | substrate support apparatus, a problem arises that processing of a board | substrate is delayed by performing transfer again to solve this problem.
The aspect of this invention aims at providing the board | substrate conveying apparatus, the exposure apparatus, the board | substrate support apparatus, and the device manufacturing method which can eliminate the curvature of a board | substrate at the time of delivery of a board | substrate.
According to a first aspect of the present invention, there is provided a substrate conveying apparatus for conveying a substrate disposed on a substrate support member together with the substrate support member, comprising: an excitation portion for vibrating the substrate support member on which the substrate is disposed; There is provided a substrate conveying apparatus having a conveying portion for holding and moving.
According to the 2nd aspect of this invention, the exposure apparatus which exposes a board | substrate by irradiating an exposure light to the board | substrate hold | maintained by a board | substrate is provided, The exposure apparatus provided with the said board | substrate conveying apparatus which conveys the said board | substrate to the said board | substrate holder is provided. do.
According to the third aspect of the present invention, there is provided a substrate support apparatus for supporting a substrate, wherein the substrate support apparatus includes a disposition portion on which the substrate is disposed and a vibration generating portion provided on the disposition portion and vibrating the disposition portion.
According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising exposing the substrate using the exposure apparatus and processing the exposed substrate based on an exposure result.
According to the aspect of this invention, the curvature of the board | substrate which arises at the time of board | substrate delivery can be eliminated.
1 is a cross-sectional plan view schematically showing the entire exposure apparatus.
2 is an external perspective view of the transfer robot.
3 is a perspective view for explaining the operation of the transfer robot.
4 is a side view illustrating a schematic configuration of an import / export unit.
Fig. 5 is a plan view showing the planar structure of the tray.
6 is a partial side cross-sectional view showing a state where the tray is accommodated in the groove portion of the substrate holder.
It is sectional drawing which shows schematic structure of the tray and a conveyance hand of 1st Embodiment.
It is sectional drawing which shows schematic structure of the tray and a conveyance hand of 1st Embodiment.
It is sectional drawing which shows schematic structure of the tray and the carry-in / out part of 1st Embodiment.
8B is a cross-sectional view illustrating a schematic configuration of a tray and a carry-in / out section of the first embodiment.
It is a top view which shows the curvature of a board | substrate in light and shade of color.
It is a schematic diagram explaining the board | substrate transfer process of the conventional exposure apparatus.
It is a schematic diagram explaining the board | substrate transfer process of the conventional exposure apparatus.
It is a schematic diagram explaining the board | substrate delivery process of the exposure apparatus of this embodiment.
It is a schematic diagram explaining the board | substrate delivery process of the exposure apparatus of this embodiment.
It is sectional drawing which shows schematic structure of the tray and a conveyance hand of 2nd Embodiment.
It is sectional drawing which shows schematic structure of the tray and the carry-in / out part of 2nd Embodiment.
It is sectional drawing which shows schematic structure of the tray and a conveyance hand of 3rd Embodiment.
It is sectional drawing which shows schematic structure of the tray and a conveyance hand of 3rd Embodiment.
It is sectional drawing which shows schematic structure of the tray and the carry-in / out part of 3rd Embodiment.
It is sectional drawing which shows schematic structure of the tray and the carry-in / out part of 3rd Embodiment.
18 is a flowchart for explaining a device manufacturing method of the present embodiment.
EMBODIMENT OF THE INVENTION The 1st Embodiment of this invention is described, referring drawings. In addition, this invention is not limited to this. Hereinafter, the exposure apparatus provided with the board | substrate conveying apparatus which concerns on this invention, and performing the exposure process which exposes the pattern for liquid crystal display devices with respect to the board | substrate which apply | coated the photosensitizer is demonstrated, The board | substrate support apparatus and device manufacture which concern on this invention are demonstrated. An embodiment of the method is also described.
1 is a cross-sectional plan view illustrating a schematic configuration of an exposure apparatus of the present embodiment. The
FIG. 2: is an external perspective view of the exposure apparatus
In the following description, two-dimensional movement of the
The
The movement mechanism
The
In the
After the end of the scanning exposure of this one exposure area, a stepping operation is performed in which the
As shown in FIG. 2, the
The
3 is a perspective view for explaining the operation of the
In addition, although this
4 is a side view illustrating a schematic configuration of the carry-in / out
In each of the substrate support pins 51b, the lower end portion is fixed to the first support portion 51a, and the upper end portion (upper end surface) is provided to support the substrate P. As shown in FIG. A suction hole connected to a vacuum pump (not shown) is formed in the upper end surface of the
The board |
The
In each of the tray support pins 52b, the lower end part is fixed to the
The
Moreover, the
Next, the structure of the tray T will be described in detail. 5 is a plan view showing the planar structure of the tray T. FIG. As shown in FIG. 5, the tray T is provided with the arrangement | positioning
The board | substrate P is arrange | positioned so that a long side may become parallel to the both
The tray T is such that the lower surface of the
As the material for forming the tray T, it is preferable to use a material capable of suppressing warping due to the weight of the substrate P when the tray T supports the substrate P, for example, various synthetic resins, or Metals can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, stainless steel, etc. are mentioned. Examples of the fiber-reinforced plastics include GFRP (Glass Fiber Reinforced Plastic) and / or Carbon Fiber Reinforced Plastic (CFRP). In addition, the
Here, as shown in FIG. 2, the
The upper surface of the holding
FIG. 6 is a partial side cross-sectional view showing a state where the tray T is accommodated in the
EMBODIMENT OF THE INVENTION Hereinafter, the excitation part, the vibration generating part, and the power supply part of the board |
FIG. 7: A and 7B are the figures explaining the schematic structure of the
As shown to FIG. 7A and 7B, the board |
The vibration actuator VA is embedded in the
The vibration actuator VA is not limited to the vibration motor and / or the ultrasonic motor as long as it can be fixed to the
The vibration actuator VA is driven by applying a predetermined voltage to the terminal portion VAT, and causes the
The hand side power supply unit EH includes a power supply unit (not shown) provided in the
The hand
Moreover, the hand
The tray side feed part ET is provided with the
The
The tray
Moreover, the tray side
By the above structure, the other end of the hand-
Moreover, the some
As shown to FIG. 8A and FIG. 8B, the support part side power supply part EP is a power supply part (not shown) provided in the carrying-in / out
The support part
In addition, the support part
By the above structure, the support part side power supply part EP is a power supply part which is not shown connected to the other end of the support
Moreover, the some
FIG. 9: is a top view which shows the curvature of the board | substrate P supported by the board |
Next, the operation of the
The board | substrate P to which the photosensitive agent was apply | coated is conveyed from the coater developer to the carry-in / out
When the substrate P is adsorbed and held on the upper surface of the
At this time, in the conventional exposure apparatus, when arrange | positioning the board | substrate of an X state to a tray, there existed the following problems. (A)-(c) is a schematic diagram explaining the process of transferring the board | substrate P0 from the carry-in / out
As shown in FIG. 10A, the portion of the substrate P0 supported by the plurality of substrate support pins 510b is not supported by the substrate support pins 510b so as to be bent downward. have. In this state, the
Then, as shown in FIG. 10B, the substrate P0 is disposed on the tray T0, and the substrate P0 is disposed on the tray T0 from the
Then, as shown to 10 (c), the both sides of the tray T0 are hold | maintained by the
Then, the
FIG. 11: is a schematic diagram explaining the process of transferring the board | substrate P0 from the conventional tray T0 to the board |
As shown to Fig.11 (a), after conveying the board | substrate P0 to the board |
As shown in FIG. 11C, when the
On the other hand, the
(A)-(c) is a schematic diagram explaining the process of delivering the board | substrate P to the tray T from the carry-in / out
As shown to Fig.12 (a), the board | substrate P supported by the some board |
In addition, the tray T is supported by the
Then, as shown in FIG. 12B, the substrate P is disposed on the tray T, and the substrate P is placed on the tray T from the
Here, the frequency of the vibration of the vibration actuator VA is set according to the frequency of the vibration of the mounting
Thereby, the stress of the board | substrate P arrange | positioned at the arrangement | positioning
At this time, as shown to FIG. 8A and FIG. 8B, the
Next, after adjusting the board | substrate P to the temperature which an exposure process is performed, the
Then, as shown in (c) of FIG. 12, both
At this time, as shown to FIG. 7A and 7B, the hand
Therefore, when the
Here, the frequency of the vibration of the vibration actuator VA is set according to the frequency of the vibration of the mounting
Thereby, as shown in FIG.12 (c), the lower surface of the board | substrate P and the
Subsequently, as shown in FIG. 3, the
Moreover, the
FIG. 13: is a schematic diagram explaining the process of transferring the board | substrate P from the tray T to the board |
As shown in FIG. 13A, the
Here, the
When the
When transfer of the board | substrate P to the board |
After the board | substrate P is arrange | positioned at the board |
In the
Next, the carrying out operation | movement of the board | substrate P from the board |
When the exposure process is finished, the
Next, when the
At the time when the tray T is lifted up to the position where the
Next, the second embodiment of the present invention will be described with reference to Figs. 1 to 13 and with reference to Figs. 14 and 15. The board |
FIG. 14: is a schematic cross section which shows schematic structure of the tray T1 and the
As shown in FIG. 14, since the tray T1 of this embodiment is not provided with the vibration actuator VA and tray side feed part ET shown to FIG. 7A and FIG. 7B, 1st Embodiment Unlike the tray T described in the above, other points are provided in the same manner as the tray T.
The transfer robot (transfer section) 4a includes a
The
The
The linear
The linear
The
The frequency of the vibration of the lifting
On the upper surface of the
FIG. 15: is a schematic cross section which shows schematic structure of the
As shown in FIG. 15, the
The
In this embodiment, the above-mentioned
Moreover, the some
As shown in Figs. 12A to 12B, when the substrate P supported by the
Subsequently, when arrange | positioning the board | substrate P supported by the board |
When the
In addition, as shown in FIG. 12C, when the tray T is held and lifted by the
Then, the vibrations of the elevating
Then, similarly to the first embodiment shown in FIG. 12C, the lower surface of the substrate P and the
As described above, according to the present embodiment, not only the same effect as in the first embodiment is obtained, but also the vibration actuator VA and / or the tray side feed part ET do not need to be provided in the tray T. The structure of the conveying
Next, the third embodiment of the present invention will be described with reference to Figs. 1 to 13 and using Figs. 16A, 16B, 17A, and 17B. The board |
16A and 16B are diagrams illustrating a schematic configuration of the
As shown to FIG. 16A and FIG. 16B, since the tray T2 of this embodiment is not provided with the vibration actuator VA and tray side feed part ET shown to FIG. 7A and FIG. It differs from the tray T demonstrated by 1 Embodiment, and the other point is provided similarly to the tray T. FIG.
As shown to FIG. 16A and FIG. 16B, the board |
As shown to FIG. 16A and FIG. 16B, the same thing as the vibration actuator VA of 1st Embodiment is used for the vibration actuator VA1, it is embedded in the
The hand side power supply unit EH2 includes a power supply unit (not shown) provided in the transfer robot 4B, and a hand side wiring 14B. One end of the hand-side wiring 14B is connected to the terminal portion VAT1 of the vibration actuator VA1, and the other end is connected to a power supply portion (not shown) of the transfer robot 4B, whereby the terminal portion VAT1 of the vibration actuator VA1. ) And the power supply are electrically connected.
Moreover, the
As shown to FIG. 17A and FIG. 17B, the same thing as the vibration actuator VA of 1st Embodiment is used for the vibration actuator VA2, and is embedded in the
Moreover, the
In this embodiment, as shown to FIG. 12 (a)-FIG. 12 (b), the board | substrate P supported by the board |
When the
Here, in this embodiment, the vibration actuator VA2 is provided in the vicinity of the
As shown in FIG. 12C, when the tray T is held and lifted by the
Then, similarly to the first embodiment shown in FIG. 12C, the lower surface of the substrate P and the
Here, in this embodiment, as shown to FIG. 16A and FIG. 16B, the vibration actuator VA1 is provided in the vicinity of the
As described above, according to the present embodiment, not only the same effect as in the first embodiment can be obtained, but also the vibration actuator VA and / or the tray side feed part ET need not be provided in the tray T. The structure of the board |
In addition, in this embodiment, although the structure provided with two or more vibration actuators VA1 and VA2 was demonstrated, these may be provided in the
In addition, as the board | substrate P of embodiment mentioned above, not only the glass substrate for display devices but the semiconductor wafer for semiconductor device manufacture, the ceramic wafer for thin-film magnetic heads, or the original plate of the mask or reticle used in an exposure apparatus (synthetic quartz, Silicon wafer) and the like.
Moreover, as an exposure apparatus, the scanning exposure apparatus of the step-and-scan system which scan-exposes the board | substrate P with exposure light IL through the pattern of the mask M by moving the mask M and the board | substrate P synchronously. In addition to the scanning stepper, a step-and-repeat projection exposure apparatus (stepper) which collectively exposes the pattern of the mask M in a state where the mask M and the substrate P are stopped, and sequentially moves the substrate P in steps. Can also be applied.
The present invention is also applicable to a twin stage type exposure apparatus having a plurality of substrate stages, which is disclosed in the specifications of US Pat. No. 634,1007, US Pat. No. 6,264,073, US Pat.
In addition, the present invention discloses a substrate stage for holding a substrate, a reference member on which a reference mark is formed without holding the substrate, and / or various materials disclosed in the specifications of US Pat. No. 6,977,963, European Patent Application Publication No. 1713113, and the like. It is applicable also to the exposure apparatus provided with the measurement stage in which the photoelectric sensor was mounted. Moreover, the exposure apparatus provided with the some board | substrate stage and the measurement stage can be employ | adopted.
In addition, in the above-mentioned embodiment, although the light transmissive mask which formed the predetermined light-shielding pattern (or phase pattern-photosensitive pattern) was used on the light transmissive board | substrate, it is disclosed instead of this mask, for example in US Patent No. 6778257 specification. As described above, a variable shaping mask (also referred to as an electronic mask, an active mask, or an image generator) that forms a transmission pattern or a reflection pattern or a light emission pattern based on the electronic data of the pattern to be exposed may be used. In addition, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-light-emitting image display element.
The exposure apparatus of the above-mentioned embodiment is manufactured by assembling the various subsystems containing each component so that predetermined mechanical precision, electrical precision, and optical precision may be maintained. In order to secure these various accuracy, before and after this assembly, adjustment for achieving optical precision for various optical systems, adjustment for achieving mechanical precision for various mechanical systems, and electrical precision for various electrical systems are performed. Adjustments are made to achieve.
The assembling process from various sub-systems to the exposure apparatus includes mechanical connection of various sub-systems, wiring connection of electric circuits, piping connection of air pressure circuits, and the like. It goes without saying that there is an assembling step for each of the subsystems before the assembling step from these various subsystems to the exposure apparatus. When the assembly process to the exposure apparatus of various subsystems is complete | finished, comprehensive adjustment is performed and the various precision as the whole exposure apparatus is ensured. In addition, it is preferable to manufacture an exposure apparatus in the clean room in which temperature, a clean degree, etc. were managed.
As shown in Fig. 18, a microdevice such as a semiconductor device manufactures a substrate which is a substrate of the device, in
In addition, the requirement of embodiment mentioned above can be combined suitably. In addition, some components may not be used. In addition, as long as it is permitted by law, all the publications concerning the exposure apparatus etc. which were quoted by the above-mentioned embodiment, and the indication of a US patent are used as a part of this description.
1: exposure apparatus 3: exposure apparatus main body
4, 4a, 4b: Carrying robot (carrying part) 5, 5a, 5b: Carrying-out carrying part (port part)
7, 7a, 7b: board | substrate conveying apparatus 9: board | substrate holder
12: return
18: side 20: placement
20a: upper surface (substrate support surface) 30: groove portion
31: Retention part (holder part) 52b: Tray support pin (support part)
52c, 52e: contact
61: hand actuator (actuator, vibration generator)
62: hand control unit (control unit, vibration generating unit)
71: support actuator (actuator, vibration generating section)
72: support part control unit (control unit, vibration generating unit)
EH, EH2: Hand side feed part (feed part) EP, EP2: Support part feed part (feed part)
ET: Tray Side Feed Part (Feed Part) IL: Exposure Light
P: Substrate
T, T1, T2: trays (substrate support member, substrate support device)
V, V1, V2: excitation part
VA, VA1, VA2: Vibration Actuator (Vibration Generator)
Claims (21)
A vibrator for vibrating the substrate support member on which the substrate is disposed;
Carrier to hold and move the substrate support member
Substrate conveyance apparatus provided with.
The excitation unit includes a power supply unit for supplying power to the vibration generating unit, at least a part of the power supply unit is provided in the port unit,
The said conveyance part is a board | substrate conveying apparatus which hold | maintains and moves the said board | substrate support member supported by the said port part.
The said plurality of support parts are arrange | positioned in the position which does not overlap with the said vibration generating part in planar view on the said board | substrate support member which the said some support part supports.
The said vibration generating part is a board | substrate conveying apparatus which has a control part which controls the said actuator so that the said conveyance hand may vibrate.
The said vibration generating part is provided in the said conveyance hand, and has a at least 1 vibration actuator which vibrates the said conveyance hand.
The said vibration actuator is a board | substrate conveying apparatus arranged in the vicinity of the said contact part.
And the excitation unit includes at least one vibration generating unit provided in the port unit and generating vibration in the port unit based on supply power.
The said vibration generating part is a board | substrate conveying apparatus provided in the said support part, and has at least 1 vibration actuator which vibrates the said support part.
The said vibration generating part is a board | substrate conveying apparatus which has a control part which controls the said actuator so that the said support part may vibrate.
The exposure apparatus provided with the board | substrate conveying apparatus in any one of Claims 1-18 which conveys the said board | substrate to the said board | substrate holder.
An arrangement part on which the substrate is disposed;
Vibration generating unit provided on the placement portion, vibrating the placement portion
Substrate support device having a.
Treating the exposed substrate based on the exposure result
Device manufacturing method comprising a.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27274509P | 2009-10-28 | 2009-10-28 | |
| US61/272,745 | 2009-10-28 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187002892A Division KR101982454B1 (en) | 2009-10-28 | 2010-10-28 | Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120100956A true KR20120100956A (en) | 2012-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187002892A KR101982454B1 (en) | 2009-10-28 | 2010-10-28 | Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device |
| KR1020127010991A KR20120100956A (en) | 2009-10-28 | 2010-10-28 | Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187002892A KR101982454B1 (en) | 2009-10-28 | 2010-10-28 | Substrate conveying apparatus, exposure apparatus, substrate supporting apparatus, and method for manufacturing device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2011052683A1 (en) |
| KR (2) | KR101982454B1 (en) |
| CN (2) | CN109003917A (en) |
| TW (1) | TW201132570A (en) |
| WO (1) | WO2011052683A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101975278B1 (en) * | 2013-10-15 | 2019-05-07 | 주식회사 케이씨텍 | Substrate treating apparatus |
| JP6858071B2 (en) * | 2017-05-09 | 2021-04-14 | キヤノン株式会社 | Manufacturing method for transport equipment, lithography equipment and articles |
| NL2023511A (en) * | 2018-08-23 | 2020-02-27 | Asml Netherlands Bv | Substrate Support, Lithographic Apparatus, Substrate Inspection Apparatus, Device Manufacturing Method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3659520B2 (en) * | 1995-11-07 | 2005-06-15 | 大日本スクリーン製造株式会社 | Substrate transfer device |
| JPH11121580A (en) * | 1997-10-13 | 1999-04-30 | Hitachi Ltd | Supporting method and processing device of plate-like object |
| KR100825691B1 (en) * | 1999-07-26 | 2008-04-29 | 가부시키가이샤 니콘 | Apparatus for supporting substrate and apparatus of processing substrate |
| JP2004273702A (en) * | 2003-03-07 | 2004-09-30 | Nikon Corp | Apparatus and method for transfer, and exposure device |
| TWI447840B (en) * | 2004-11-15 | 2014-08-01 | 尼康股份有限公司 | Substrate transport device, substrate transport method and exposure device |
| JP2007114570A (en) * | 2005-10-21 | 2007-05-10 | Nikon Corp | Substrate holder, exposure device and method for manufacturing device |
| JP2008124347A (en) * | 2006-11-14 | 2008-05-29 | Murata Mach Ltd | Tray for sheet transfer |
| JP2008288506A (en) * | 2007-05-21 | 2008-11-27 | Nikon Corp | Adjusting method, exposure apparatus, and device manufacturing method |
| JP2009147042A (en) * | 2007-12-13 | 2009-07-02 | Sharp Corp | Substrate receiving method and substrate stage device |
-
2010
- 2010-10-27 TW TW099136627A patent/TW201132570A/en unknown
- 2010-10-28 KR KR1020187002892A patent/KR101982454B1/en active IP Right Grant
- 2010-10-28 WO PCT/JP2010/069177 patent/WO2011052683A1/en active Application Filing
- 2010-10-28 JP JP2011538481A patent/JPWO2011052683A1/en active Pending
- 2010-10-28 CN CN201810725930.1A patent/CN109003917A/en active Pending
- 2010-10-28 CN CN201080049093.7A patent/CN104221137B/en active Active
- 2010-10-28 KR KR1020127010991A patent/KR20120100956A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN109003917A (en) | 2018-12-14 |
| CN104221137B (en) | 2018-08-03 |
| JPWO2011052683A1 (en) | 2013-03-21 |
| WO2011052683A1 (en) | 2011-05-05 |
| CN104221137A (en) | 2014-12-17 |
| TW201132570A (en) | 2011-10-01 |
| KR101982454B1 (en) | 2019-05-27 |
| KR20180014244A (en) | 2018-02-07 |
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