KR20120091103A - Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method - Google Patents

Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method Download PDF

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Publication number
KR20120091103A
KR20120091103A KR1020127010331A KR20127010331A KR20120091103A KR 20120091103 A KR20120091103 A KR 20120091103A KR 1020127010331 A KR1020127010331 A KR 1020127010331A KR 20127010331 A KR20127010331 A KR 20127010331A KR 20120091103 A KR20120091103 A KR 20120091103A
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South Korea
Prior art keywords
substrate
board
support
tray
conveyance
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KR1020127010331A
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Korean (ko)
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KR101925151B1 (en
Inventor
구니히로 가와에
다다시 세키
무네야스 요코타
기요시 고구레
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가부시키가이샤 니콘
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

The present invention provides a substrate support device (T) for supporting a substrate (P), the placement portion 20 on which the substrate is disposed, and at least one support portion protruding from the placement portion to support a portion of the substrate disposed on the placement portion. (TM), wherein the support portion has a base portion 22 fixed to the placement portion and a contact portion 23 provided to be movable relative to the base portion and in contact with the substrate disposed on the placement portion. Provide a device.

Description

Substrate support apparatus, substrate support member, substrate conveyance apparatus, exposure apparatus, and device manufacturing method {SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE SUPPORTING MEMBER, SUBSTRATE TRANSFER APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD}

TECHNICAL FIELD This invention relates to a board | substrate support apparatus, a board | substrate support member, a board | substrate conveying apparatus, the exposure apparatus, and a device manufacturing method.

This application claims priority based on US Provisional Application No. 61 / 272,677, filed October 20, 2009, and Japanese Patent Application No. 2010-002005, filed January 7, 2010, the contents of which are herein incorporated by reference. Use it.

In the manufacturing process of electronic devices, such as a flat panel display, the processing apparatus of large board | substrates, such as an exposure apparatus and an inspection apparatus, is used. In the exposure process and test | inspection process using these processing apparatuses, the conveying apparatus disclosed by the following patent document which conveys a large substrate (for example, glass substrate) to a processing apparatus is used.

Japanese Patent Laid-Open No. 2001-100169 Japanese Patent Laid-Open No. 2004-273702

For example, in the conveyance apparatus of the large sized substrate of patent document 1, when transferring the board | substrate hold | maintained at the carrying-in / out part to a board | substrate support member (substrate support apparatus), a board | substrate and a board | substrate support member are supported separately. For this reason, depending on the support method of a board | substrate, a board | substrate may bend downward by self weight. When the board | substrate of the state which was pinched by self weight was transmitted to the board | substrate support member, the part which bent below the board | substrate contacts a board | substrate support member, and the board | substrate is hold | maintained on the board | substrate support member by the friction of the contacted part.

For example, in the exposure apparatus, when the substrate in the distorted state is transferred to the exposure substrate holder, there is a problem of exposure failure such as being unable to perform a predetermined exposure at an appropriate position on the substrate. Moreover, when warpage arises in the board | substrate arrange | positioned at a board | substrate support apparatus, a problem arises that processing of a board | substrate is delayed by performing transfer again to solve this problem.

The aspect of this invention aims at providing the board | substrate support member, the board | substrate conveying apparatus, the exposure apparatus, and the device manufacturing method which can eliminate the curvature of the board | substrate which arises at the time of delivery of a board | substrate.

According to a first aspect of the present invention, there is provided a substrate support apparatus for supporting a substrate, comprising: a disposition portion on which the substrate is disposed; and at least one support portion protruding from the disposition portion and supporting a portion of the substrate disposed on the disposition portion. And the support portion has a base fixed to the placement portion and a contact portion provided to be movable relative to the base portion, the contact portion being in contact with the substrate disposed on the placement portion. do.

According to the 2nd aspect of this invention, the board | substrate conveying apparatus which carries the board | substrate is provided with the said board | substrate support apparatus which supports the said board | substrate, and the conveyance part which hold | maintains and moves the said board | substrate support apparatus.

According to the 3rd aspect of this invention, the exposure apparatus which exposes a board | substrate by irradiating exposure light to the board | substrate which a board | substrate holder hold | maintains, The exposure apparatus provided with the said board | substrate conveying apparatus which conveys the said board | substrate to the said board | substrate holder is Is provided.

According to a fourth aspect of the present invention, there is provided a device manufacturing method comprising exposing the substrate using the above exposure apparatus and processing the exposed substrate based on an exposure result.

According to a fifth aspect of the present invention, there is provided a substrate support member for supporting a substrate, comprising: a disposition portion on which both sides are supported while the substrate is disposed, and a part of the substrate protruding from the disposition portion and disposed on the disposition portion; The board | substrate support member provided with the some support part which supports | supports, and the installation density of the said support part in the outer edge side of the said mounting part is higher than the installation density of the said support part in the center side of the said mounting part.

According to the 6th aspect of this invention, the board | substrate conveying apparatus provided with the said board | substrate supporting member which supports the said board | substrate, and the conveyance part which hold | maintains and moves the said board | substrate supporting member is provided as a board | substrate conveying apparatus which conveys a board | substrate.

According to a seventh aspect of the present invention, there is provided an exposure apparatus that exposes a substrate by irradiating exposure light to a substrate held by a substrate holder, wherein the exposure apparatus includes the substrate transfer apparatus that transfers the substrate to the substrate holder. Is provided.

According to an eighth aspect of the present invention, there is provided a device manufacturing method comprising exposing the substrate using the above exposure apparatus and processing the exposed substrate based on the exposure result.

According to the aspect of this invention, the curvature of the board | substrate which arises at the time of board | substrate delivery can be eliminated.

1 is a cross-sectional plan view schematically showing the entire exposure apparatus.
2 is an external perspective view of the transfer robot.
3 is a perspective view for explaining the operation of the transfer robot.
4 is a side view illustrating a schematic configuration of an import / export unit.
Fig. 5 is a plan view showing the planar structure of the tray.
6 is a partial side cross-sectional view showing a state where the tray is accommodated in the groove portion of the substrate holder.
7 is an enlarged side cross-sectional view of the support movable portion.
8 is a plan view of a tray showing the arrangement of the support movable members.
It is a top view which shows the curvature of a board | substrate in light and shade of color.
It is a schematic diagram explaining the board | substrate transfer process of the conventional exposure apparatus.
It is a schematic diagram explaining the board | substrate transfer process of the conventional exposure apparatus.
It is a schematic diagram explaining the board | substrate delivery process of the exposure apparatus of this embodiment.
It is a schematic diagram explaining the board | substrate delivery process of the exposure apparatus of this embodiment.
It is sectional drawing which shows the modification of a support movable part.
It is sectional drawing which shows the modification of a support movable part.
It is sectional drawing which shows the modification of a support movable part.
It is sectional drawing which shows the modification of a support movable part.
It is a top view which shows the modification of a support movable part.
It is sectional drawing which shows the modification of a support movable part.
It is sectional drawing which shows the modification of a support movable part.
It is a top view which shows the planar structure of a tray.
17A is an enlarged plan view of the lower surface support.
FIG. 17B is a sectional view seen from the arrow direction taken along the line BB ′ of FIG. 17A.
FIG. 17C is a cross-sectional view taken from the arrow direction taken along the line C-C 'in FIG. 17A.
18A is an enlarged side view of the outer edge support.
FIG. 18B is a plan view seen from a direction B of FIG. 18A.
FIG. 18C is a cross-sectional view taken from the arrow direction taken along the line C-C 'of FIG. 18A.
19 is a partial side cross-sectional view showing a state where the tray is accommodated in the groove portion of the substrate holder.
It is a schematic diagram explaining the board | substrate delivery process of the exposure apparatus of this embodiment.
FIG. 21: is a schematic diagram explaining the board | substrate delivery process of the exposure apparatus of this embodiment.
22 is a flowchart for explaining a device manufacturing method according to the embodiment of the present invention.

Embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited to this. Hereinafter, the exposure apparatus provided with the board | substrate conveying apparatus which concerns on this invention, and performing the exposure process which exposes the pattern for liquid crystal display devices with respect to the board | substrate which apply | coated the photosensitizer is demonstrated, The board | substrate support apparatus (substrate support) which concerns on this invention Member) and a device manufacturing method are also described.

1 is a cross-sectional plan view illustrating a schematic configuration of an exposure apparatus of the present embodiment. The exposure apparatus 1 has the exposure apparatus main body 3 which exposes the pattern for liquid crystal display devices to a board | substrate, the carrier robot (carrying part) 4, the carry-out / out part (carrying part) 5, and a tray (substrate support). The substrate conveying apparatus 7 which has an apparatus and a board | substrate support member is provided, and these are accommodated in the chamber 2 adjusted to predetermined | prescribed temperature, being highly cleaned. In this embodiment, the board | substrate is a large glass plate and the size of the one side is 500 mm or more, for example.

FIG. 2: is an external perspective view of the exposure apparatus main body 3 and the conveyance robot 4 which conveys the board | substrate P to this exposure apparatus main body 3. As shown in FIG. The exposure apparatus main body 3 includes an illumination system not shown, which illuminates the mask M with the exposure light IL, a mask stage not shown, which holds the mask M on which a pattern for a liquid crystal display device is formed, and this mask. A projection holder 9 disposed below the stage, a substrate holder 9 provided in a two-dimensionally movable manner on a base 8 disposed below the projection optical system PL, and a substrate holder 9 And a moving mechanism 33 for holding and moving the substrate holder 9. That is, the exposure apparatus main body 3 is provided with a stage apparatus provided with the substrate holder 9 and the movement mechanism 33.

In addition, in the following description, two-dimensional movement of the board | substrate holder 9 with respect to the base 8 is performed in a horizontal plane, and X-axis and Y-axis are set in the direction orthogonal to each other in this horizontal plane. The holding surface of the substrate holder 9 with respect to the board | substrate P becomes parallel to a horizontal plane in a reference state (for example, the state at the time of conveying the board | substrate P). Moreover, the Z axis is set in the direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. In addition, each direction around an X-axis, a Y-axis, and a Z-axis is called θX direction, θY direction, and θZ direction, respectively.

The moving mechanism 33 has a moving mechanism main body 35 and a plate table 34 disposed on the moving mechanism main body 35 to hold the substrate holder 9. The movement mechanism main body 35 is supported non-contacted by the guide surface 8a (upper surface of the base 8) by a body bearing, and can move the guide surface 8a on XY direction. The exposure apparatus main body 3 can move in the predetermined area | region of the guide surface 8a in the light emission side (image surface side of projection optical system PL) in the state which hold | maintained the board | substrate P. As shown in FIG.

The movement mechanism main body 35 can move in an XY plane on the guide surface 8a by operation | movement of the coarse motion system (moving mechanism) containing actuators, such as a linear motor, for example. The plate table 34 is movable with respect to the movement mechanism main body 35 in the Z-axis, (theta) X, (theta) Y direction by operation | movement of the micro motion system containing actuators, such as a voice coil motor, for example. The plate table 34 is in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions with the substrate P held by the operation of the substrate stage drive system including the coarse motion system and the fine motion system. It can move in six directions.

The transfer robot 4 is for carrying the board | substrate P with respect to the exposure apparatus main body 3 and the carry-in / out part 5. The transfer robot 4 holds the both sides 18 and 18 of the tray (substrate support device) T, and moves the substrate P disposed on the tray T together with the tray T to form a substrate ( P is conveyed and the board | substrate P is delivered to the exposure apparatus main body 3 and the carry-in / out part 5.

As shown in FIG. 1, the exposure apparatus 1 performs exposure of a step-and-scan system in the state in which the rectangular substrate P was arrange | positioned on the said substrate holder 9, and the mask shown in FIG. The pattern formed in (M) is sequentially transferred to a plurality of, for example, four exposure regions (pattern transfer regions) on the substrate P. FIG. That is, in this exposure apparatus 1, through the drive system which is not shown by the controller which is not shown in figure in the state in which the slit-type illumination area | region on the mask M was illuminated by exposure light IL from the illumination system, By moving the mask stage holding the mask M and the substrate holder 9 holding the substrate P in a predetermined scanning direction (here, in the Y-axis direction), one of the substrates on the substrate P is moved. The pattern of the mask M is transferred to the exposure area, that is, scanning exposure is performed. Moreover, the exposure apparatus 1 which concerns on this embodiment is what is called a multi-lens type in which the projection optical system PL has several projection optical modules, and the said illumination system contains the several illumination module corresponding to the several projection optical modules. It constitutes a scan exposure apparatus.

After the end of the scanning exposure of this one exposure area, a stepping operation is performed in which the substrate holder 9 is moved in the predetermined amount X direction to the scanning start position of the next exposure area. In the exposure apparatus main body 3, by repeating such scanning exposure and stepping operations, the pattern of the mask M is sequentially transferred to four exposure regions.

As shown in FIG. 2, the transfer robot 4 has a horizontal articulated structure, for example, and includes an arm portion 10 composed of a plurality of parts connected via a vertical articulation axis, and a tip of the arm portion 10. The conveyance hand 12 and the drive device 13 which are connected are provided. The arm part 10 is movable by the drive device 13 in an up-down direction (Z-axis direction), for example. The drive of the drive apparatus 13 is controlled by the control apparatus which is not shown in figure. The conveyance hand 12 is provided in the substantially U shape with the front-end part open | released, and both side parts (the long side direction of the board | substrate P) of the tray T in which the board | substrate P was arrange | positioned (p The substrate P can be held through the tray T by supporting the holding portions 18 and 18 in a supporting direction parallel to the long side of the tray T.

3 is a perspective view for explaining the operation of the transfer robot 4. As shown to FIG. 2 and FIG. 3, the conveyance robot 4 carries out the long longitudinal direction (long side direction of the board | substrate P) of the conveyance hand 12, the board | substrate holder 9 of the exposure apparatus main body 3. As shown in FIG. It is possible to change the direction of the conveyance hand 12 to face the side. As a result, the transfer robot 4 transfers the substrate P to the substrate holder 9.

In addition, although this conveyance robot 4 is not shown in FIG. 2 and FIG. 3 for convenience, the conveyance hand which is provided below the conveyance hand 12, has the same mechanism as this conveyance hand 12, and can be driven independently. It has a double arm structure provided with. In addition, the conveying robot 4 is not limited to the robot of a horizontal articulated structure, It can implement | achieve by employ | adopting or combining a well-known robot suitably (generally a conveyance mechanism) suitably.

4 is a side view illustrating a schematic configuration of the carry-in / out section 5. The carry-in / out part 5 is made to transmit the board | substrate P which the photosensitive agent was apply | coated and conveyed by the coater developer (not shown) arrange | positioned adjacent to the exposure apparatus 1, and is conveyed. The carry-in / out part 5 is equipped with the board | substrate support part 51 which supports the board | substrate P, and the tray support part 52 which supports the tray T. As shown in FIG. The board | substrate support part 51 stands on the flat plate-shaped 1st support part 51a and this 1st support part 51a, and several board | substrate support pins (support pins) which respectively support different points of the lower surface of the board | substrate P are supported. 51b). In this embodiment, 30 board | substrate support pins 51b are provided, for example, so that the board | substrate P may be supported in the state substantially along a horizontal plane. Here, the state along the substantially horizontal plane has neglected the bending of the board | substrate P by the support of the board | substrate support pin 51b, the positioning error of the board | substrate support pin 51b, the tolerance of the board | substrate P, etc., for example. In this case, the substrate surface of the substrate P is substantially parallel to the horizontal surface.

In each of the substrate support pins 51b, the lower end portion is fixed to the first support portion 51a, and the upper end portion (upper end surface) is provided to support the substrate P. A suction hole connected to a vacuum pump (not shown) is formed in the upper end surface of the substrate support pin 51b, so that the substrate P can be adsorbed and held. Moreover, the board | substrate detection part which is not shown in figure which detects whether the board | substrate P is arrange | positioned at the board | substrate support pin 51b is provided in the upper end part of the board | substrate support pin 51b.

The board | substrate support part 51 is connected to the drive part 54 via the connection member 53. As shown in FIG. The drive part 54 is movable to the XY plane and (theta) Z direction on the base part 55 by operation of the drive system containing a coarse motion system and a fine motion system, for example. Thereby, the carry-in / out part 5 can correct | amend the position of the X direction and the Y direction of the board | substrate P supported by the board | substrate support pin 51b, or can rotate the board | substrate P 90 degrees in the (theta) Z direction. It is supposed to be.

The tray support part 52 stands on the frame-shaped 2nd support part 52a and this 2nd support part 52a, and the some tray support pin (2nd) which respectively supports the different points of the lower surface of the tray T (2nd) Support pins) 52b. In each of the tray support pins 52b, the lower end part is fixed to the second support part 52a, and the upper end part (upper end surface) is provided so that the tray T can be supported. The tray support pin 52b is disposed outside the first support portion 51a of the substrate support portion 51. Moreover, the tray detection part which is not shown in figure which detects whether the tray T is arrange | positioned at the tray support pin 52b is provided in the upper end part of the tray support pin 52b.

The tray support part 52 is provided so that the tray support part 52 can move to Z-axis direction along the guide part 56 by operation | movement of the drive part which is not shown in figure. The guide portion 56 is provided outside the drive portion 54 and the base portion 55 of the substrate support portion 51. Moreover, the 1st support part 51a, the connection member 53, and the drive part 54 of the board | substrate support part 51 are arrange | positioned inside the frame-shaped 2nd support part 52a. The tray support part 52, the guide part 56, and the drive part not shown are comprised by the tray support part 52, and the support mechanism which supports the tray T and moves the tray T relatively with respect to the board | substrate P is comprised. The tray support part 52 can move to a Z-axis direction, without interfering with the 1st support part 51a of the board | substrate support part 51, the connection member 53, and the drive part 54. As shown in FIG. Moreover, the tray support part 52 raises the tray T supported by the tray support pin 52b in the Z-axis forward direction by raising it to the Z-axis forward direction, and on the board | substrate support pin 51b of the board | substrate support part 51. The board | substrate P supported by this is arrange | positioned in the tray T. Moreover, the tray support part 52 is made to transmit the tray T supported by the tray support pin 52b to the conveyance hand 12 of the conveyance robot 4.

Next, the structure of the tray T will be described in detail. 5 is a plan view showing the planar structure of the tray T. FIG. As shown in FIG. 5, the tray T is provided with the arrangement | positioning part 20 formed in the grid | lattice form by the linear member 19 of the several line unfolded by predetermined space | interval vertically and horizontally. That is, the part in which the linear member 19 is not arrange | positioned in the arrangement | positioning part 20 becomes the rectangular opening 21. As shown in FIG. The placement unit 20 is configured to arrange the substrate P at a predetermined position between the two side portions 18 and 18. In addition, the shape of the tray T is not limited to the shape shown in FIG. 5, For example, the frame-shaped single frame which supports only the periphery of the board | substrate P in which only one opening part 21 was formed may be sufficient.

The board | substrate P is arrange | positioned so that a long side may become parallel to the both side parts 18 of the mounting part 20. The arrangement | positioning part 20 is so that both side parts 18 and 18 are supported from the lower side by the conveyance hand 12 of the conveyance robot 4 in the state which arrange | positioned the board | substrate P (FIGS. 2 and 3). Reference). That is, the conveyance robot 4 in this embodiment supports the board | substrate P through the tray T, and conveys the board | substrate P to a predetermined position.

The tray T is such that the lower surface of the placement section 20 is supported by a plurality of tray support pins 52b of the tray support section 52 of the carry-in / out section 5 shown in FIG. 4. In addition, as shown in FIG. 4, the tray T is provided with the plurality of substrate support pins 51b of the substrate support part 51 in a state where the lower surface of the placement unit 20 is supported by the tray support pins 52b. 5 is inserted into the plurality of openings 21 shown in FIG. 5.

As the material for forming the tray T, it is preferable to use a material capable of suppressing warping due to the weight of the substrate P when the tray T supports the substrate P, for example, various synthetic resins, or Metals can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, stainless steel, etc. are mentioned. Examples of the fiber-reinforced plastics include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic). In addition, the linear member 19 unfolded in a lattice form may be formed using a member having excellent flexibility such as wire.

Here, as shown in FIG. 2, the groove portion 30 holding the tray T is formed on the upper surface of the substrate holder 9. The groove portion 30 is formed in a lattice shape corresponding to the frame structure of the tray T. Moreover, since the groove part 30 is formed in the upper surface of the board | substrate holder 9, the holding part (holder part) 31 of the board | substrate P is provided in multiple island shape. The holding | maintenance part 31 has the magnitude | size corresponding to the opening part 21 of the tray T.

The upper surface of the holding part 31 is finished so that the substantially holding surface of the board | substrate holder 9 with respect to the board | substrate P may have a favorable top view. In addition, a plurality of suction holes K are formed on the upper surface of the holding part 31 so that the substrate P is brought into close contact with this surface (see FIG. 2). Each suction hole K is connected to the vacuum pump which is not shown in figure.

FIG. 6 is a partial side cross-sectional view showing a state where the tray T is accommodated in the groove portion 30 of the substrate holder 9. As shown in FIG. 6, the thickness of the tray T is smaller than the depth of the groove portion 30. As a result, the tray T is inserted into the groove portion 30 and sinks, whereby the holding portion 31 protrudes from the opening portion 21, and the substrate P disposed on the tray T. Bay is to be transmitted to the holding part 31.

Conical recesses 41 are formed in the four corners on the lower surface side of the placement section 20 of the tray T, and the recesses 41 are located at positions corresponding to the recesses 41 in the grooves 30. ) Is provided with a spherical convex portion 42 that engages. In the tray T, when the placement portion 20 is inserted into the groove portion 30, the convex portion 42 of the substrate holder 9 engages in the recess portion 41 of the placement portion 20, thereby providing the groove portion 30. The position shift of the tray T accommodated in) is prevented.

7 is an enlarged side cross-sectional view of the support movable portion (support portion) TM included in the tray T. FIG. As shown in FIG. 7, the support movable part (support part, protrusion part, auxiliary part) TM is attached to the upper surface (substrate arrangement surface) 20a which arrange | positions the board | substrate P of the mounting part 20 of the tray T. It protrudes (not shown in FIG. 5). The support movable part TM is mainly comprised by the base part 22, the contact part 23 arrange | positioned facing the base part 22, and the connection part 24 arrange | positioned between the base part 22 and the contact part 23, and is comprised. have.

The base 22 and the contact portion 23 are formed of the same material as the placement portion 20, for example. As the connecting portion 24, for example, a viscoelastic material, such as sorbosein (registered trademark) or αGEL (registered trademark), which has viscosity and elasticity and is deformable by applying an external force and can be restored to its initial shape by removing the external force, can be used. . As for the base 22, the lower surface is fixed to the upper surface 20a of the arrangement | positioning part 20 by the adhesive agent etc., and the upper surface is fixed to the lower surface of the connection part 24. As shown in FIG.

As for the contact part 23, the lower surface is fixed to the upper surface of the connection part 24 by adhesive etc., for example, and is connected to the base 22 through the connection part 24 interposed. In addition, the upper surface of the contact portion 23 is in contact with a portion (sebum surface) of the substrate P disposed on the upper surface 20a of the placement portion 20 so as to support the lower surface of the substrate P. The height from the upper surface 20a of the mounting portion 20 to the upper surface of the contact portion 23 is, for example, about 1.0 mm to 1.5 mm.

When external force is applied to the contact part 23, the support movable part TM deform | transforms the connection part 24 in the direction of an external force, and the contact part 23 moves relative with respect to the base 22. As shown in FIG. Specifically, the contact portion 23 is provided to move along the direction when an external force is applied in the direction along the upper surface 20a of the placement portion 20. Moreover, the contact part 23 is provided so that it may move to the upper surface 20a and the direction, when an external force is applied in the direction which intersects the upper surface 20a. That is, the connection part 24 connects the base 22 and the contact part 23 so that relative movement is mutually possible.

Here, the direction along the upper surface 20a means the direction parallel to the upper surface 20a (direction in XY plane) or the direction along the surface of the board | substrate P arrange | positioned at the upper surface 20a of the mounting part 20. Include. In addition, the direction which crosses the upper surface 20a is a direction perpendicular | vertical to the upper surface 20a (Z direction), the direction which intersects with the surface of the board | substrate P arrange | positioned at the upper surface 20a of the mounting part 20, and It includes a vertical direction.

In addition, when the external force applied to the contact part 23 is removed, the support movable part TM will restore the shape of the connection part 24, and the contact part 23 will return to the position before external force was applied. Moreover, the connection part 24 supports the contact part 23 so that a movement is possible in the predetermined range, for example in the range of the elastic deformation. In addition, the connection part 24 of the support movable part TM may be a structure provided with the restriction | limiting parts, such as the stopper, which limits the movable range of the contact part 23 with respect to the base 22 in a predetermined range.

FIG. 8: is a top view of the tray T which shows arrangement | positioning of the support movable part TM. In FIG. 8, the oblique line part which overlapped with the mounting part 20 has shown the position of the support movable part TM. In addition, the magnitude | size of an oblique line part does not correspond to the magnitude | size of the support movable part TM. As shown in FIG. 8, the some support movable part TM is arrange | positioned in the area | region where the board | substrate P of the upper surface 20a of the mounting part 20 is arrange | positioned. In addition, if the contact part 23 can contact a part of board | substrate P arrange | positioned on the mounting part 20, the support movable part TM may be the outer side member of the area | region where the board | substrate P is arrange | positioned, or the mounting part 20 It may be fixed to a member other than).

The support movable part TM is not arrange | positioned at the center part of the mounting part 20, and the contact area | region CA for making the upper surface 20a directly contact the board | substrate P is formed. The contact area CA is a direction parallel to the supporting direction (long side direction of the board | substrate P) of the both side parts 18 and 18 of the mounting part 20 by the conveyance hand 12 shown in FIG. It is formed as an extended substantially rectangular area. The contact area CA is an area for actively contacting the arranged substrate P, and the upper surface 20a of the mounting portion 20 is in contact with the substrate P even in a region other than the contact area CA. have.

In addition, as shown in FIG. 8, in the support movable part TM, the contact area CA side of the center part of the mounting part 20 is coarse, and the outer edge side of the mounting part 20 is densely arrange | positioned. In other words, the space | interval of support movable parts TM arrange | positioned at the center side of the mounting part 20 becomes wider than the space | interval of support movable parts TM arrange | positioned at the outer edge side of the mounting part 20.

In addition, in the arrangement | positioning part 20, several support movable part TM is arrange | positioned in frame shape so that along the short side and the long side of the board | substrate P arrange | positioned in the area | region where the board | substrate P is arrange | positioned. In addition, inside the plurality of support movable parts TM arranged in a frame shape, a plurality of support movable parts arranged in a line along the support direction of the mounting unit 20 along both sides 18 and 18 of the mounting unit 20. A plurality of rows of (TM) are provided. In the row of these support movable parts TM, the space | interval of the columns arrange | positioned at the center side of the mounting part 20 becomes wider than the space | interval of the columns arrange | positioned at the outer edge side of the mounting part 20. Arrangement of such support movable part TM is determined according to the bending shape of the board | substrate P supported by the board | substrate support pin 51b of the carrying-in / out part 5 shown in FIG. 4, for example.

FIG. 9 is a plan view showing the warpage of the substrate P supported by the substrate support pin 51b shown in FIG. 4 in light and shades of color. In the figure, the lighter the color, the lower the substrate P is bent downward (in the Z-axis direction in Fig. 4). As shown in FIG. 9, the lower surface side of the board | substrate P is supported by the 30 board | substrate support pin 51b arranged in the matrix form of 5x6. For this reason, the center part and the outer edge part of the board | substrate P which were separated from the board | substrate support pin 51b will be in the state folded downward by the weight of the board | substrate P. As shown in FIG. Moreover, the part along the long side of the board | substrate P turns to the lowest state, and the part along the short side and the center part parallel to a short side turn to the downward state. The support movable part TM is arrange | positioned centrally in the position corresponding to the part along the long side and the part along the short side of the board | substrate P with the big curvature of the board | substrate P along the bending shape of this board | substrate.

In addition, the elasticity modulus of the connection part 24 shown in FIG. 7 is adjusted with each position of the support movable part TM according to the position on the mounting part 20, As shown in FIG. When () contacts, it is provided so that a movement is possible so that the stress of the board | substrate P may be released. For example, the elasticity modulus of the connection part 24 is a placement part, when the board | substrate P of the state which came to be in contact with the arrangement | positioning part 20 of the state in which the support movable part TM is not provided, as shown in FIG. It can set based on the frictional force acting between the upper surface 20a of 20 and the board | substrate P. As shown in FIG.

That is, the elasticity modulus of the connection part 24 is set so that the elastic force in the direction along the upper surface 20a of the arrangement | positioning part 20 which acts on the board | substrate P from the contact part 23 may become smaller than the frictional force used as said reference | standard. Can be. In this case, the elasticity of the connection part 24 becomes smaller in the support movable part TM arrange | positioned densely than the support movable part TM arrange | positioned coarsely. In addition, although the some support movable part TM is used in this embodiment, one support movable part TM is used depending on the magnitude | size of the board | substrate P, the shape at the time of bending, the size of the support movable part TM, etc. The structure may be sufficient.

Next, the operation of the exposure apparatus 1 will be described. Specifically, about the method (substrate conveying apparatus) which carries in and carries out the board | substrate P by conveying the board | substrate P arrange | positioned to the tray T with the tray T by the conveyance robot 4. Explain. Here, the procedure which arrange | positions the board | substrate P to the tray T, and loads and unloads the board | substrate P arrange | positioned at this tray T with respect to the exposure apparatus main body 3 is demonstrated.

The board | substrate P to which the photosensitive agent was apply | coated is conveyed from the coater developer to the carry-in / out part 5 shown in FIG. 1, and the predetermined position on the board | substrate support pin 51b of the board | substrate support part 51 shown in FIG. It is positioned and positioned in the upper surface of the substrate support pin 51b, and is held by suction. Thus, as shown in FIG. 9, in the board | substrate P supported by the some board | substrate support pin 51b, the part which is not supported by the board | substrate support pin 51b is bent downward. .

When the substrate P is adsorbed and held on the upper surface of the substrate support pin 51b, the substrate support part 51 holds the drive unit 54 in a state in which the substrate P is adsorbed and held on the upper surface of the substrate support pin 51b. By operating, the substrate P is aligned with respect to the tray T. When the alignment of the substrate P and the tray T is completed, the carry-in / out part 5 raises the tray support part 52 along the guide part 56, and the tray T on the tray support pin 52b. To increase. Thereby, the board | substrate P is arrange | positioned on the mounting part 20 of the tray T in the positioned state.

At this time, in the conventional exposure apparatus, when arrange | positioning the board | substrate of an X state to a tray, there existed the following problems. (A), (b), and (c) in FIG. 10 are schematic diagrams illustrating a step of transferring the substrate P0 from the carry-in / out unit 500 of the conventional exposure apparatus to the conventional tray T0. .

As shown in part (a) of FIG. 10, the substrate P0 supported by the plurality of substrate support pins 510b is placed in a state where the portion not supported by the substrate support pins 510b is bent downward. It is. In this state, the tray support part 520 is raised to raise the tray T0 supported by the tray support pin 520b.

Then, as shown in FIG. 10B, the substrate P0 is disposed on the tray T0, and the substrate P0 is disposed on the tray T0 from the substrate support pin 510b of the carry-in / out unit 500. P0) is passed. At this time, the board | substrate P0 contacts the tray T0 from the downwardly-folded part, and the board | substrate P cannot be unfolded on the tray T0 by the friction of this part and the tray T0, and wave-like The state is maintained. Next, the conveyance hand 1200 of the conveyance robot 400 arrange | positioned under the tray T0 is raised.

Then, as shown to 10 (c), the both sides of the tray T0 are hold | maintained by the conveyance hand 1200, and the tray support pin 520b with the tray T0 arrange | positioning the board | substrate P0. Is lifted upwards. Since both sides of the tray T0 are supported, the intermediate portions of both sides supported by the conveyance hand 1200 are bent downward by the weights of the substrate P0 and the tray T0. Then, the board | substrate P0 will be in a state where it centered so that a center part may become convex, and the stress which compresses toward a center part acts, and the planar area of the board | substrate P0 seen from the top becomes small.

Then, the conveyance hand 1200 is moved and the tray T0 which arrange | positioned the board | substrate P0 is conveyed toward the upper side of the substrate holder 900 shown in FIG.

FIG. 11: is a schematic diagram explaining the process of transferring the board | substrate P0 from the conventional tray T0 to the board | substrate holder 900 of the conventional exposure apparatus.

As shown to (a) part of FIG. 11, after conveying the board | substrate P0 to the board | substrate holder 900 by the conveyance hand 1200, the conveyance hand 1200 is lowered. Then, as shown to part (b) of FIG. 11, the tray T0 is accommodated in the groove part 300 of the substrate holder 900, and the board | substrate P0 is arrange | positioned on the substrate holder 900. FIG. At this time, the substrate P0 contacts the substrate holder 900 from the bottommost portion.

As shown in part (c) of FIG. 11, when the transport hand 1200 is further lowered, the substrate P0 is placed on the substrate holder 900, and the substrate P0 is removed from the tray T0. 900). In addition, the tray T0 contacts the bottom of the groove 300 of the substrate holder 900 so that the tray T0 is transferred from the transfer hand 1200 to the groove 300 of the substrate holder 900. At this time, due to the friction between the substrate holder 900 and the substrate P0, the shape of the substrate P0 is not completely returned to its original state, and the planar area of the substrate P0 is reduced rather than completely flat. Throw it away. Thus, in the conventional exposure apparatus, the board | substrate P0 may be in the state which hung on the board | substrate holder 900, and the problem of exposure defect, such as being unable to perform predetermined | prescribed exposure in the appropriate position on a board | substrate, may arise.

On the other hand, the exposure apparatus 1 of this embodiment uses the said tray T in order to solve the problem of this conventional exposure apparatus. Hereinafter, the operation of the tray T of the present embodiment will be described along with the operation of the exposure apparatus 1.

(A), (b), and (c) of FIG. 12 describe a process of transferring the substrate P from the carry-in / out portion 5 of the exposure apparatus 1 of the present embodiment to the tray T. It is a schematic diagram.

As shown in part (a) of FIG. 12, the portion of the substrate P supported by the plurality of substrate support pins 51b is not supported by the substrate support pins 51b so as to be folded downward. It is. In this state, the tray support part 52 is raised, and the tray T supported by the tray support pin 52b is raised.

Then, as shown in part (b) of FIG. 12, the substrate P is disposed on the tray T, and the substrate P is placed on the tray T from the substrate support pin 51b of the carry-in / out part 5. P) is delivered. At this time, in the contact area CA in which the support movable part TM of the center part of the tray T is not arrange | positioned, the center part of the board | substrate P rolled down contacts the tray T. As shown in FIG. Moreover, the outer edge part of the board | substrate P rolled down contacts the support movable part TM provided in the tray T. As shown in FIG. Here, as shown in FIG. 7, the contact part 23 of the support movable part TM is provided so that a movement is possible in the direction which cross | intersects the upper surface 20a of the arrangement | positioning part 20 of the tray T, and is a board | substrate. It moves to the arrangement | positioning part 20 side at the time of contact with (P), and the impact at the time of contact with the board | substrate P can be alleviated.

Moreover, the contact part 23 of the support movable part TM is provided so that a movement along the upper surface 20a of the mounting part 20 of the tray T is possible is possible. The center portion of the substrate P is in contact with the upper surface 20a of the placement portion 20 in the contact region CA. For this reason, as shown to FIG. 12 (b), the center part of the board | substrate P is located with respect to the tray T by the friction of the upper surface 20a of the mounting part 20, and the board | substrate P. FIG. The outer edge part of the board | substrate P which contacted the support movable part TM does not shift | deviate, and it moves so that it may spread outward from the center part.

Here, in this embodiment, the elasticity modulus of the connection part 24 is adjusted along the position on the mounting part 20, and when the board | substrate P of a state of contact contacts, it can move so that the stress of the board | substrate P may be released. Since it is provided so that the curvature of the board | substrate P can be eliminated and the board | substrate P can be made more flat. Here, the board | substrate P is adjusted to the temperature at which an exposure process is performed. Next, the conveyance hand 12 of the conveyance robot 4 arrange | positioned under the tray T is raised.

Then, as shown in (c) of 12, both side parts 18 and 18 (refer FIG. 2 and FIG. 5) of the tray T are hold | maintained by the conveyance hand 12, and the tray T is a board | substrate. It raises to the upper side of the tray support pin 52b with (P) arrange | positioned. As the tray T is supported by both side portions 18 and 18, the gap between the side portions 18 and 18 supported by the transfer hand 12 is lowered due to the weight of the substrate P and the tray T. 휜 state becomes.

At this time, since the contact part 23 of the support movable part TM is provided so that relative movement with respect to the base 22 fixed to the mounting part 20 is possible, the stress of the board | substrate P is opened and the board | substrate is opened as mentioned above. It is prevented that (P) is bent and waved. Moreover, the stress which compresses the board | substrate P toward a center part is relaxed.

Subsequently, as shown in FIG. 3, the conveyance robot 4 carries out the long longitudinal direction (long side direction of the board | substrate P) of the conveyance hand 12, the board | substrate holder 9 of the exposure apparatus main body 3. As shown in FIG. The direction of the conveyance hand 12 is changed so that it may face the side. Then, the conveyance hand 12 is moved and the tray T which arrange | positioned the board | substrate P is conveyed toward the board | substrate holder 9 upper part shown in FIG.

Moreover, the conveyance hand 12 conveys the board | substrate P so that the surface of the board | substrate P and the holding | maintenance part 31 of the board | substrate holder 9 may become substantially parallel. Here, substantially parallel means the state which is parallel or near parallel, when the warpage of the board | substrate P by self weight is excluded. Specifically, the conveyance hand 12 conveys the board | substrate P so that the to-be-held part of the board | substrate P by the conveyance hand 12 and the board | substrate arrangement surface of the holding | maintenance part 31 may become substantially parallel.

FIG. 13: is a schematic diagram explaining the process of transferring the board | substrate P from the tray T of this embodiment to the board | substrate holder 9 of the exposure apparatus 1. FIG.

The transport robot 4 conveys the board | substrate P to the upper side of the board | substrate holder 9 by the conveyance hand 12, as shown to part (a) of FIG. 13, and the tray T and the groove part ( After the 30 is aligned, the drive device 13 shown in FIG. 2 is driven to lower the conveyance hand 12. Then, as shown in part (b) of FIG. 13, the tray T is accommodated in the groove portion 30 of the substrate holder 9, and the substrate P is disposed on the substrate holder 9. At this time, the board | substrate P contacts the holding part 31 (refer FIG. 3) of the board | substrate holder 9 from the lowest part. Moreover, when the contact area of the holding | maintenance part 31 of the board | substrate P and the board | substrate holder 9 increases, the contact part 23 (refer FIG. 7) of the support movable part TM of the tray T becomes a board | substrate ( It moves in the direction of opening the stress of P).

As shown in part (c) of FIG. 13, when the transfer hand 12 is further lowered, the substrate P0 is disposed on the holding part 31 of the substrate holder 9, and the substrate P is placed in the tray ( From T) to the substrate holder 9. In addition, the tray T is in contact with the bottom of the groove 300 of the substrate holder 900, so that the tray T is transferred from the transfer hand 12 to the groove 30 of the substrate holder 9. At this time, since the contact part 23 (refer FIG. 7) of the support movable part TM of the tray T moves to the direction which releases the stress of the board | substrate P, the board | substrate holder 9 with the board | substrate P removed. Arrangement is prevented. Thus, in the exposure apparatus 1 of this embodiment, the board | substrate P will be in the flat state on the board | substrate holder 9, and predetermined exposure can be performed favorably at the suitable position on the board | substrate P. As shown in FIG.

When transfer of the board | substrate P to the board | substrate holder 9 is completed, the conveyance robot 4 will retract the conveyance hand 12 on the board | substrate holder 9. As shown in FIG.

After the board | substrate P is arrange | positioned at the board | substrate holder 9, the mask M shown in FIG. 2 is illuminated by exposure light IL with the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P disposed on the substrate holder 9 via the projection optical system PL.

In the exposure apparatus 1, since the board | substrate P can be arrange | positioned favorably on the board | substrate holder 9 as mentioned above, predetermined exposure can be performed at a suitable position on the board | substrate P with high precision, and reliability is possible. This high exposure process can be realized. In the exposure apparatus 1, as described above, since the substrate P can be smoothly transferred to the tray T and the substrate holder 9, the exposure processing to the substrate P can be performed without delay. Can be.

Next, the carrying out operation | movement of the board | substrate P from the board | substrate holder 9 after completion | finish of an exposure process is demonstrated. In addition, although the following description demonstrates that the conveyance hand 12 carries out the board | substrate P, you may make it carry out the other conveyance hand of a double hand structure.

When the exposure process is finished, the transfer robot 4 drives the transfer hand 12 to transfer the transfer hands to both sides of the X-axis direction of the substrate holder 9 from below the tray T disposed on the substrate holder 9. Insert (12) from the -Y direction side. At the same time, suction by the vacuum pump is released by a control device (not shown), and suction of the substrate P by the substrate holder 9 is released.

Next, when the conveyance hand 12 is driven upward by a predetermined amount by the drive device 13, the conveyance hand 12 is connected to the lower surface of both side portions 18, 18 of the placement portion 20 of the tray T. Each contact. When the conveyance hand 12 is driven further upward, the substrate P disposed on the holding portion 31 of the substrate holder 9 is transferred to the tray T. At this time, according to this embodiment, since the warpage of the board | substrate P is prevented as mentioned above, when the tray T is moved upward, the board | substrate P is placed on the mounting part 20 of the tray T. It can arrange | position in a state flatter than conventional. When the transfer hand 12 is driven upward, the tray T supporting the substrate P is lifted upward of the substrate holder 9 so that the placement portion 20 is spaced apart from the substrate holder 9. .

At the time when the tray T is lifted up to the position where the placement portion 20 and the substrate holder 9 are separated, the tray T holding the substrate P is moved by the transfer hand 12. (9) Retreat from the phase. In this way, the carrying out operation | movement of the board | substrate P with respect to the exposure apparatus main body 3 is completed.

In addition, the support movable part TM is not limited to what was demonstrated in embodiment mentioned above, What is necessary is just to protrude with respect to the mounting part 20, and to support a part of board | substrate P0 arrange | positioned at the mounting part 20. Hereinafter, a modification of the tray T will be described with reference to FIGS. 14A, 14B, 14C, 15A, 15B, 15C, and 15C.

The tray T1 in the first modification illustrated in FIG. 14A differs in the arrangement of the tray T and the support movable part TM described in the above-described embodiment. In this modification, the support movable part TM is accommodated in the recessed part 20b formed in the upper surface 20a of the mounting part 20. According to this modification, in addition to the effect similar to the above-mentioned embodiment, it becomes easy to lower the height from the upper surface 20a to the upper surface of the contact part 23. Moreover, the recessed part 20b can also function as a restriction | limiting part which regulates the movable range of the contact part 23. As shown in FIG.

The tray T2 in the second modification shown in FIG. 14B differs in the configuration of the tray T of the above-described embodiment, the base 25 and the connecting portion 26 of the support movable part TM2. The connection part 26 of the support movable part TM2 in a 2nd modification is comprised by the some spring which supports the contact part 23 in the state spaced apart from the upper surface 20a of the mounting part 20. As shown in FIG. Moreover, the base 25 is arrange | positioned from the contact part 23 in the position shifted in parallel with the upper surface 20a of the mounting part 20. As shown in FIG. The base 25 may be ring-shaped or may be divided into a plurality. According to this modification, not only the same effect as the above embodiment can be obtained, but also the elastic modulus of the connecting portion 26 can be adjusted more easily.

The tray T3 in the 3rd modification shown in FIG. 14C differs in the structure of the tray T2 in the above-mentioned 2nd modification, and the contact part 23 of the support movable part TM3. In the support movable part TM3 in the third modification, the sliding part 27 having a relatively small friction coefficient is fixed to the lower surface of the contact part 23. The contact part 23 can be slid with respect to the upper surface 20a of the mounting part 20 by sliding the sliding surface 27a of the sliding part 27 with respect to the upper surface 20a of the mounting part 20. It is prepared. As the sliding part 27, the low friction material whose friction coefficient of the sliding surface 27a is about 0.1-0.2 can be used, for example. According to this modification, not only the same effect as the above-described embodiment can be obtained, but also movement of the contact portion 23 in the direction intersecting with the upper surface 20a of the placement portion 20 of the contact portion 23 is reduced. It is possible to smoothly move in a direction parallel to the upper surface (20a) of the mounting portion 20.

The tray T4 in the 4th modification shown to FIG. 15A-FIG. 15C differs in the structure of the tray T in embodiment mentioned above, and the support movable part TM4. The support movable part TM4 in a 4th modification is provided with the pair of magnetic members M1 and M2 which the base 61 and the contact part 63 mutually exert magnetic force, respectively. As the magnetic members M1 and M2, for example, a ferrite magnet or the like can be used, and the magnetic members M1 and M2 are disposed so as to face the same electrode so as to repel each other. The magnetic members M1 and M2 may be formed in a ring shape as shown in Fig. 15B or may be divided into a plurality of parts.

As shown to FIG. 15A, in the support movable part TM4 in a 4th modification, the locking part 62 fixed to the contact part 63 in the center part of the base 61 fixed to the upper surface of the mounting part 20. FIG. The holding part 61a which accommodates a part of the lower side is formed. The inner wall of the holding portion 61a is formed in a tapered shape, the upper side of which is narrower than the lower side, and the outer wall 62a of the locking portion 62 is formed in a tapered shape corresponding to the inner wall of the holding portion 61a. .

The locking portion 62 is pressed in the direction away from the placement portion 20 by the repulsive force between the magnetic members M1 and M2 in a state in which no external force acts on the contact portion 63 to rise from the upper surface 20a. It is in a state. The locking portion 62 is prevented from coming off the base 61 by the outer wall 62a coming into contact with the inner wall of the holding portion 61a, and arranged at a predetermined position.

That is, in the support movable part TM4 of this modification, the magnetic member group and the locking part 62 which contain a pair of magnetic members M1 and M2 which mutually exert magnetic force mutually connect the base 61 and the contact part 63 with each other. It is functioning as a connection part which connects so that relative movement is possible. Here, the magnetic force of the magnetic members M1 and M2 is such that the repulsive force acting therebetween is greater than the external force acting on the contact portion 63 in contact with the substrate P disposed on the placement portion 20 of the tray T4. It is set to be small.

The lower surface of the locking portion 62 is provided with a conical protrusion 62b having a sharp tip. The projection part 62b is spaced apart from the upper surface 20a of the placement part 20 in a state where no external force acts on the contact part 63. Further, when an external force greater than the repulsive force between the magnetic members M1 and M2 is applied to the contact portion 63 in the direction toward the placement portion 20 perpendicular to the upper surface 20a of the placement portion 20, the contact portion ( 63 and the locking portion 62 move in the external force direction so that the tip of the projection 62b is in contact with the placement portion 20.

In this state, when an external force in the direction along the upper surface 20a of the placement portion 20 acts on the contact portion 63, the contact portion 63 swings using the tip of the projection 62b as a supporting point. At this time, the range in which the contact portion 63 can swing is limited by the holding portion 61a of the base 61. That is, the holding part 61a of the base 61 functions as a restriction | limiting part which limits the moving range of the contact part 63. As shown in FIG. Moreover, the center part of the upper surface of the contact part 63 is processed into spherical shape.

As shown to FIG. 15C, when the board | substrate P is arrange | positioned at the mounting part 20 of the tray T4 of this modification, and a part of board | substrate P contacts the support movable part TM4, the contact part 63 will be carried out. An external force in a direction substantially perpendicular to the upper surface 20a of the placement portion 20 acts on the contact portion, and the contact portion 63 and the locking portion 62 move toward the placement portion 20 side. Thereby, the impact at the time of contact of the board | substrate P and the contact part 63 is alleviated. Further, by moving the contact portion 63 and the locking portion 62 toward the placement portion 20 side, the outer wall 62a of the locking portion 62 and the inner wall of the holding portion 61a are spaced apart, and the protrusion 62b is moved. In contact with the upper surface 20a of the mounting portion 20.

At this time, the magnetic force of the magnetic members M1 and M2 is set such that the repulsive force therebetween is smaller than the external force acting on the contact portion 63 from the substrate P disposed on the placement portion 20 of the tray T4. . For this reason, as described in the above-described embodiment, when the substrate P in the insulated state is going to be unfolded, the contact portion 63 swings at the tip of the projection 62b as a supporting point, thereby releasing the stress of the substrate P. . Moreover, the board | substrate P can move smoothly on the contact part 63 by the process of the center part of the upper surface of the contact part 63 being spherical. Thereby, the effect similar to embodiment mentioned above can be acquired. Moreover, when the board | substrate P is transmitted to another member from the tray T4, the contact part 63 will return to the original state shown in FIG. 15A by the repulsive force between magnetic members M1 and M2.

In the tray T5 according to the fifth modification shown in FIG. 15D, the base 64 and the contact portion 65 of the support movable portion TM5 each have a pair of magnetic members M3 and M4 that exert magnetic force on each other. Although it is common with the tray T4 of the above-mentioned 4th modification in the point provided, the structure of the base 64 and the contact part 65, and arrangement | positioning of the magnetic members M3 and M4 differ. The support movable part TM5 in a 5th modification is provided with magnetic members M3 and M4 like the magnetic members M1 and M2 of the modification 4. As shown in FIG. The magnetic member M3 and the magnetic member M4 are arranged to face each other so as to attract each other.

As shown to FIG. 15D, in the support movable part TM5 in a 5th modification, the magnetic member M3 is arrange | positioned in the lower surface side center part of the base 64 fixed to the upper surface 20a of the mounting part 20. FIG. It is. The lower surface 65b of the contact portion 65 is in sliding contact with the upper surface 64c of the base 64. The side wall part 64a protrudes in the peripheral part of the upper surface 64c of the base 64. As shown in FIG. An upper portion of the side wall portion 64a is provided with a sunshade restriction portion 64b extending inwardly in substantially parallel with the upper surface 20a of the placement portion 20. The limiting portion 64b is configured to limit the movement range of the contact portion 65 to a predetermined range by contacting the contact portion 65 which slides with respect to the upper surface 64c of the base 64.

The contact part 65 is formed in the side surface with the recessed part 65a corresponding to the limiting part 64b of the base 64. As shown in FIG. Moreover, the magnetic member M4 is arrange | positioned at the center part of the lower surface 65b of the contact part 65. FIG. The magnetic member M4 is disposed to face the magnetic member M3 provided on the base 64, and a suction force acts between the magnetic member M3. The contact portion 65 is formed of, for example, a low friction material, and the friction coefficient of the lower surface 65b is, for example, about 0.1 to 0.2. Here, the magnetic force of the magnetic members M3 and M4 is such that the suction force acting therebetween is greater than the external force acting on the contact portion 65 in contact with the substrate P disposed on the placement portion 20 of the tray T5. It is set to be small.

According to the tray T5 of this modification, the board | substrate P is arrange | positioned at the mounting part 20, and is in the direction parallel to the upper surface 20a of the mounting part 20 in the contact part 65 of the support movable part TM5. When an external force is applied, the contact portion 65 moves in the direction of the external force. Therefore, when the board | substrate P of an extended state is going to spread, the stress of the board | substrate P can be released. Moreover, when the board | substrate P is transmitted to another member from the tray T5, the contact part 65 will return to the original state shown in FIG. 15D by the suction force between magnetic members M3 and M4. Therefore, according to the tray T5 of this modification, the effect similar to embodiment mentioned above can be acquired.

Next, the structure of the tray T in another embodiment is explained in full detail. In the following description, about the component which is the same as or equivalent to the said embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted or simplified. FIG. 16 is a plan view showing the planar structure of the tray T. FIG. As shown in FIG. 16, the tray T is equipped with the mounting part 20 in which the board | substrate P is arrange | positioned. The placement unit 20 includes a plurality of first linear members (first members) 19A extending in the first direction along the long side of the substrate P to be disposed, and short sides of the substrate P to be disposed. Therefore, it is provided in a lattice form by the some 2nd linear member (2nd member) extended in the 2nd direction which cross | intersects substantially perpendicularly to a 1st direction.

That is, the part in which the 1st linear member 19A and the 2nd linear member 19B of the arrangement | positioning part 20 are not arrange | positioned becomes the rectangular opening part 21. In addition, the shape of the tray T is not limited to the shape shown in FIG. 16, For example, the frame-shaped single frame which supports only the periphery of the board | substrate P in which only one opening part 21 was formed may be sufficient.

The tray T is a supported portion where both side portions 18 and 18 of the placement portion 20 are supported by the transfer hand 12. Here, both side parts 18 and 18 which are supported parts of the tray T are arrange | positioned at the edge part of the short longitudinal direction of the tray T, and the 1st linear member 19A extended in the long longitudinal direction of the tray T is here. ) Is provided. When the tray T is transported in a state in which the substrate P is disposed at a predetermined position of the placement unit 20, both sides 18 and 18 or its vicinity are supported to support the substrate P from below. It is supposed to.

The lower surface support part (support part, protrusion part) arrange | positioned in the part where the 1st linear member 19A and the 2nd linear member 19B cross | intersect on the mounting surface 20a in which the board | substrate P of the mounting part 20 is arrange | positioned. And an auxiliary portion TM11 and a plurality of outer edge supporting portions (supporting portions, protrusions, and auxiliary portions) TM12 disposed on the outer edge portion of the placing portion 20. The lower surface support part TM11 is in contact with the lower surface of the board | substrate P arrange | positioned at the mounting part 20, and is to support a part of board | substrate P. As shown in FIG. The outer edge supporting portion TM12 is disposed along the outer edge of the placing portion 20 and is in contact with the lower surface of the substrate P disposed on the placing portion 20 to support the outer edge portion of the substrate P. have.

The lower surface support portion TM11 and the outer edge support portion TM12 may be formed of, for example, a low friction material having a lower coefficient of friction than a conventional material, or may have a surface treatment for lowering the coefficient of friction on the surface in contact with the substrate P. Is carried out. Thereby, the friction coefficient of the surface which contacts the board | substrate P of the lower surface support part TM11 and the outer edge support part TM12 is the friction of the mounting surface 20a of the mounting part 20 which contacts the board | substrate P. It is smaller than the coefficient.

As shown in FIG. 16, the installation density of the lower surface support part TM11 and the outer edge support part TM12 in the outer side of the mounting part 20 is lower than the installation density of the lower surface support part TM11 in the center side of the mounting part 20. As shown in FIG. It is high. Here, an installation density means the installation number of the lower surface support part TM11 or the outer edge support part TM12 per unit area in the plane containing the mounting surface 20a of the mounting part 20.

That is, in the plane containing the mounting surface 20a of the mounting part 20, the outer edge side of the mounting part 20 has the number of installation of the lower surface support part TM11 or the outer edge support part TM12 per unit area rather than the center side. There is a lot. For this reason, the space | interval of lower surface support parts TM11 arrange | positioned at the center side of the mounting part 20 is space | interval between lower surface support parts TM11 arrange | positioned at the outer edge side of the mounting part 20, or outer edge support part TM12. ) Wider than the gap between.

In addition, a plurality of rows of support portions including a plurality of lower surface support portions TM11 arranged in a line along both side portions 18 and 18 and the first linear member 19A are arranged on the placement surface 20a of the arrangement portion 20. It is prepared. In the present embodiment, two rows of support portions including, for example, five lower surface support portions TM11 are arranged on the center side of the placement portion 20. Further, from the outer edge portion side of the placement portion 20 to the central portion side, for example, a support column including six lower surface supports TM11 and a support column including seven lower surface supports TM11 are arranged.

Moreover, these support part rows intersect perpendicularly with the extending direction (the 1st direction, ie, the extending direction of the 1st linear member 19A) of the both sides 18 and 18 of the arrangement | positioning part 20 of the tray T, for example perpendicularly. It is arrange | positioned symmetrically with respect to the intermediate part of both side parts 18 and 18 in the direction (the 2nd direction, ie, the extension direction of 2nd linear member 19B). This arrangement corresponds to, for example, the placement portion 20 being symmetrically bent with respect to the intermediate portion of the side portions 18 and 18 when the side portions 18 and 18 of the placement portion 20 are supported.

Here, the space | interval of the support part row | line | column including five lower surface support parts TM11 arrange | positioned at the center side of the mounting part 20, and the support | column part line | column including seven lower surface support parts TM11 arrange | positioned at the outer edge side is a placement part. It is wider than the space | interval of the support part row | line | column including six lower surface support parts TM11 arrange | positioned at the outer edge side of (20), and the support | column part line | wire containing seven lower surface support parts TM11 arrange | positioned at the center side. That is, the space | interval of the support part rows arrange | positioned at the center side of the mounting part 20 becomes wider than the space | interval of the support part rows arrange | positioned at the outer edge side of the mounting part 20.

17A is an enlarged plan view of the lower surface support TM11. FIG. 17B is a sectional view seen from the arrow direction taken along the line BB ′ of FIG. 17A. FIG. 17C is a cross-sectional view taken from the arrow direction taken along the line C-C 'in FIG. 17A. As shown in FIG. 17A, the lower surface support part TM11 is formed by a base 222 of the central portion, a pair of first portions 223 and a pair of second portions 224 provided on the base 222. It is roughly cross-shaped in plan view. As shown to FIG. 17B and FIG. 17C, lower surface support part TM11 is provided so that it may protrude from the mounting surface 20a in which the board | substrate P of the mounting part 20 is arrange | positioned.

The base 222 is disposed at a portion where the first linear member 19A and the second linear member 19B intersect. The first portion 223 is formed to extend on both sides of the base 222 along the first linear member 19A. The second portion 224 is formed to extend on both sides of the base 222 along the second linear member 19B.

The first portion 223 has a first movement restricting portion 223a protruding in the thickness direction of the placing portion 20, and as shown in FIG. 17B, the placing surface 20a of the first linear member 19A. As seen from the cross section joined to the side, it has a substantially co-shaped shape. As shown in FIG. 17C, the first movement restricting portion 223a is a plate-shaped portion formed along the side surface of the first linear member 19A. The first movement restricting portion 223a is configured to restrict movement in the direction along the second linear member 19B of the lower surface support TM11 by contacting the side surface of the first linear member 19A.

The fixing ring 223b is arrange | positioned near the edge part on the opposite side to the base 222 of the 1st part 223. As shown in FIG. The fixing ring 223b includes a strip-shaped member formed in a ring shape, and the flange-shaped portion provided at the end of the strip-shaped member is fastened by the bolt / nut 223c. The fixing ring 223b is disposed around the first linear member 19A and the first portion 223, and the flange portion is fastened by the bolt / nut 223c to thereby connect the first portion 223 to the first linear member. It is intended to be fastened to the member 19A. As for the lower surface support part TM11, the 1st part 223 is fastened to the 1st linear member 19A by the fixing ring 223b, and is being fixed to the mounting part 20. As shown in FIG.

The second portion 224 has a second movement restricting portion 224a protruding in the thickness direction of the placing portion 20, and as shown in FIG. 17C, the placing surface 20a of the second linear member 19B. As seen from the cross section joined to the side, it has a substantially co-shaped shape. As shown in FIG. 17B, the second movement restricting section 224a is a plate-shaped portion formed along the side surface of the second linear member 19B. The second movement restricting portion 224a is configured to restrict movement in the direction along the first linear member 19A of the lower surface support TM11 by contacting the side surface of the second linear member 19B.

18A is an enlarged side view of the outer edge support TM12. FIG. 18B is a plan view seen from a direction B of FIG. 18A. FIG. 18C is a cross-sectional view taken from the arrow direction taken along the line C-C 'of FIG. 18A. As shown to FIG. 18A, outer edge support part TM12 is provided so that it may protrude from the mounting surface 20a of the mounting part 20. FIG. Moreover, the surface which contacts the board | substrate P so that the height from the mounting surface 20a in the center side of the mounting part 20 may become lower than the height from the mounting surface 20a in the outer edge side of the mounting part 20. It is inclined.

As shown in FIG. 16, the outer edge support part TM12 is formed in the rectangular shape by planar view extended in the direction which intersects the outer edge of the mounting part 20. As shown in FIG. Thereby, as shown in FIG. 18B, the long longitudinal direction of the outer edge support part TM12 intersects with the outer edge of the board | substrate P arrange | positioned at the mounting part 20. As shown in FIG. Moreover, as shown to FIG. 18A, outer edge support part TM12 is provided so that the outer edge of the board | substrate P arrange | positioned at the mounting part 20 may be supported on an inclined surface.

In addition, as shown in FIG. 18C, the outer edge supporting portion TM12 protrudes in the thickness direction (long longitudinal direction of the cross section) of the first linear member 19A (the second linear member 19B). It has a 225a, and has a substantially co-shaped shape when seen from the cross section which engages with the arrangement surface 20a side of 1st linear member 19A (2nd linear member 19B). The movement control part 225a is a plate-shaped part formed along the side surface of the 1st linear member 19A (2nd linear member 19B), as shown to FIG. 18B. The movement restricting portion 225a is in contact with the side surface of the first linear member 19A (second linear member 19B), whereby the first linear member 19A (second linear member ( 19B)] in a direction intersecting with each other. The outer edge support TM12 is, for example, the first linear member 19A (the second) by a bolt 225b which is screwed into the screw hole formed in the first linear member 19A (the second linear member 19B). To a linear member 19B.

Here, as the material for forming the tray T shown in FIG. 16, it is preferable to use a material capable of suppressing warping due to the weight of the substrate P when the tray T supports the substrate P, for example. Various synthetic resins or metals can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, stainless steel, etc. are mentioned. Examples of the fiber-reinforced plastics include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic). Further, the first linear member 19A and the second linear member 19B that are unfolded in a lattice form may be formed using a member having excellent flexibility such as wire.

The board | substrate P is arrange | positioned so that a long side may become parallel to both side parts 18 and 18 of the tray T. The tray T is to be conveyed by placing the substrate P in the placement unit 20 in a state in which both side portions 18 and 18 are supported from the lower side by the transfer hand 12 of the transfer robot 4. (See FIGS. 2 and 3). That is, the conveyance robot 4 in this embodiment supports the both side parts 18 and 18 of the placement part 20 which is the supported part of the tray T by the conveyance hand 12, or its vicinity. . In addition, the transfer robot 4 holds the trays T on both sides 18 and 18 of the placement portion 20 of the tray T on which the substrate P is arranged by the transfer hand 12, or in the vicinity thereof. ) To move.

The tray T is such that the lower surface of the placement section 20 is supported by a plurality of tray support pins 52b of the tray support section 52 of the carry-in / out section 5 shown in FIG. 4. In addition, as shown in FIG. 4, the tray T is provided with a plurality of substrate support pins 51b of the substrate support part 51 in a state where the bottom surface of the placement unit 20 is supported by the tray support pins 52b. Is inserted into the plurality of openings 21 shown in FIG. 16.

As shown in FIG. 2, the groove portion 30 holding the tray T is formed on the upper surface of the substrate holder 9. The groove portion 30 is formed in a lattice shape corresponding to the frame structure of the tray T. Moreover, since the groove part 30 is formed in the upper surface of the board | substrate holder 9, the holding part (holder part) 31 of the board | substrate P is provided in multiple island shape. That is, the groove part 30 is provided in the groove shape with respect to the holding part 31 of the board | substrate holder 9, and the holding part 31 has the magnitude | size corresponding to the opening part 21 of the tray T. As shown in FIG.

The upper surface of the holding part 31 is finished so that the substantially holding surface of the board | substrate holder 9 with respect to the board | substrate P may have a favorable top view. In addition, a plurality of suction holes K are formed on the upper surface of the holding part 31 for bringing the substrate P into close contact with this surface. (See FIG. 2). Each suction hole K is connected to the vacuum pump which is not shown in figure.

19 is a partial side cross-sectional view showing a state where the tray T is accommodated in the groove portion 30 of the substrate holder 9. As shown in FIG. 19, the thickness of the tray T is smaller than the depth of the groove part 30. As shown in FIG. As a result, the tray T is inserted into the groove portion 30 and sinks, whereby the holding portion 31 protrudes from the opening portion 21, and the substrate P disposed on the tray T. Bay is to be transmitted to the holding part 31.

Conical recesses 41 are formed in the four corners on the lower surface side of the mounting section 20 of the tray T, and the recesses 41 are located at positions corresponding to the recesses 41 in the grooves 30. The spherical convex part 42 couple | bonded with () is provided. The tray T has the groove portion 30 by engaging the convex portion 42 of the substrate holder 9 into the recess portion 41 of the placement portion 20 when the placement portion 20 is inserted into the groove portion 30. Position misalignment when accommodated).

FIG. 20: is a schematic diagram explaining the process of transferring the board | substrate P from the carry-in / out part 5 of the exposure apparatus 1 of this embodiment to the tray T. FIG.

As shown to the part (a) of FIG. 20, the board | substrate P supported by the some board | substrate support pin 51b is a state where the part which is not supported by the board | substrate support pin 51b is bent downward. It is. In this state, the tray support part 52 is raised, and the tray T supported by the tray support pin 52b is raised.

Then, as shown in part (b) of FIG. 20, the substrate P is disposed on the tray T, and the substrate P is placed on the tray T from the substrate support pin 51b of the carry-in / out part 5. P) is delivered. At this time, in the part where the lower surface support part TM11 of the center part of the tray T is not arrange | positioned, the center part of the board | substrate P bent downward contact | contacts the tray T. As shown in FIG. Moreover, the outer edge part of the board | substrate P rolled down contacts the outer edge support part TM12 provided in the tray T, and the center side part contacts the lower surface support part TM11 provided in the tray T. As shown in FIG.

Here, the installation density of the outer edge support part TM12 or lower surface support part TM11 in the outer edge side of the mounting part 20 is higher than the installation density of the lower surface support part TM11 in the center side of the mounting part 20. In other words, the space | interval of lower surface support parts TM11 arrange | positioned at the center side of the mounting part 20 is space | interval between lower surface support parts TM11 arrange | positioned at the outer edge side of the mounting part 20, or outer edge support part TM12. ) Wider than the gap between. For this reason, the center part of the board | substrate P and its vicinity contact the back surface 20a of the mounting part 20 with a comparatively large contact area. On the other hand, the outer edge part of the board | substrate P is supported by the lower surface support part TM11 and the outer edge support part TM12, and contacts or arrange | positions the mounting surface 20a of the mounting part 20 with a contact area smaller than a center part. It will be in the state spaced apart from the mounting surface 20a of the part 20.

Further, the surface in contact with the substrate P of the lower surface support part TM11 and the outer edge support part TM12 has a smaller coefficient of friction than the placement surface 20a of the placement part 20 of the tray T. For this reason, as shown to (b) part of FIG. 20, the center part of the board | substrate P with respect to the tray T by friction of the mounting surface 20a of the mounting part 20, and the board | substrate P. FIG. The position where the position is not shifted and contacted with the lower surface support part TM11 and the outer edge support part TM12 of the substrate P causes slippage on the lower surface support part TM11 and the outer edge support part TM12, and starts from the center part. To spread outwards. Thereby, the curvature of the board | substrate P is eliminated, and the board | substrate P can be arrange | positioned in the mounting part 20 of the tray T more flatly. Next, the board | substrate P is adjusted to the temperature at which an exposure process is performed. Next, the conveyance hand 12 of the conveyance robot 4 arrange | positioned under the tray T is raised.

Then, as shown in part (c) of FIG. 20, the disposition part 20 of the tray T is arranged along the two side parts 18 and 18 (see FIGS. 2 and 16) of the transfer robot 4. It is held by the conveyance hand 12, and the tray T is lifted upward of the tray support pin 52b in the state which arrange | positioned the board | substrate P. As shown in FIG. As the tray T is supported by both side portions 18 and 18, the intermediate portion of both side portions 18 and 18 supported by the transfer hand 12 by the weight of the substrate P and the tray T is lowered. 휜 state becomes.

Here, in this embodiment, as shown in FIG. 16, the support part row | line | column containing 5 lower surface support parts TM11 is arrange | positioned at the center side of the mounting part 20, for example. Further, from the outer edge portion side of the placement portion 20 to the central portion side, for example, a support column including six lower surface supports TM11 and a support column including seven lower surface supports TM11 are arranged. And these support part rows are arrange | positioned symmetrically with respect to the intermediate part of both side parts 18 and 18, corresponding to the tray T bending symmetrically with respect to the intermediate part of both side parts 18 and 18. As shown in FIG. . In addition, the space | interval of the support part rows arrange | positioned at the center side of the mounting part 20 becomes wider than the space | interval of the support part rows arrange | positioned at the outer edge side of the mounting part 20.

For this reason, in the board | substrate P, the part long in the long side direction of the intermediate part in a short side direction contacts the mounting surface 20a in the intermediate part of both side parts 18 and 18 of the mounting part 20. . And the board | substrate P is supported by the several support part row | line | column with which the both side part 18 and 18 side part of the long part in the long side direction which contacted the mounting surface 20a was arrange | positioned as mentioned above, and a center side The outer edge side is more likely to move toward both side portions 18 and 18 along the short side direction of the substrate P. As shown in FIG.

Therefore, when the both sides 18 and 18 of the placement part 20 of the tray T are hold | maintained by the conveyance hand 12 of the conveyance robot 4, the center part of the short side direction of the board | substrate P is carried out. Even when the part along the long side direction bends downward and the board | substrate P is bent in the shape of a fish cake, the part of the outer side edge (long side) of the center part of the short side direction of the board | substrate P is arrange | positioned by the tray T It can be moved by sliding to both side parts 18 and 18 of the part 20. Thereby, the stress which acts to compress the board | substrate P toward the center part of a short side direction is alleviated, and the state in which the board | substrate P was waved in the short side direction (refer FIG. 10 (c) part) is Can be prevented.

Moreover, the outer edge part of the board | substrate P is supported by the some outer edge support part TM12. Here, outer edge support part TM12 is formed so that it may extend in the direction which cross | intersects the outer edge of placement part 20. As shown in FIG. Therefore, when the outer edge (long side) orthogonal to the short side of the board | substrate P moves to the short side direction of the board | substrate P, the outer edge support part TM12 has a movement range of the outer edge of the board | substrate P. The lower surface of the board | substrate P can be supported over the whole, and the outer edge of the board | substrate P can be made to slide smoothly, without a blockage. Thus, since the outer edge of the board | substrate P moves smoothly, the part from the center part of the short side direction to the outer edge part of the short side direction of the board | substrate P is changed into the both side parts 18 of the mounting part 20, It can be unfolded smoothly in the direction crossing the outer edge of the 18) side.

In addition, as shown to FIG. 18A, in the outer edge support part TM12, the height from the mounting surface 20a in the center side of the mounting part 20 is the mounting surface 20a in the outer edge side of the mounting part 20. As shown in FIG. The surface which contacts the board | substrate P inclines so that it may become lower than the height from the inside. Even when the board | substrate P is bent by making the angle with respect to the mounting surface 20a of this inclined surface correspond to the angle with respect to the mounting surface 20a of the outer edge part of the board | substrate P when the board | substrate P is bent. The outer edge portion of the substrate P can be more reliably supported by the inclined surface.

Further, while increasing the height of the outer edge side end portion of the placement portion 20 of the outer edge support portion TM12 to have a thickness, the height of the center side end portion of the placement portion 20 of the outer edge support portion TM12 can be reduced and thinned. Can be. Thereby, the step formed between the mounting surface 20a of the mounting part 20 and the outer edge support part TM12 can be made small, and the board | substrate P can be arrange | positioned more stably, and outer edge support part TM12 is not only possible. ) Can be sufficiently secured to the strength of the portion for fixing the) to the placement portion 20.

The lower surface support TM11 includes a base 222 disposed at a portion where the first linear member 19A and the second linear member 19B intersect, and the base 222 along the first linear member 19A. It is formed in a cross shape having a first portion 223 formed on both sides of and a second portion 224 formed on both sides of the base 222 along the second linear member 19B. For this reason, in the arrangement | positioning part 20 provided in grid | lattice form by the 1st linear member 19A and the 2nd linear member 19B, only in the intersection of the 1st linear member 19A and the 2nd linear member 19B. Compared with the case where the lower surface support part TM11 is provided, it becomes possible to support the wider range of the board | substrate P. FIG. Thereby, the surface pressure between the board | substrate P and lower surface support part TM11 can be reduced, the frictional force acting on the board | substrate P can be made small, and the board | substrate P can be made to slip more easily.

Further, the first portion 223 is in contact with the side surface of the first linear member 19A to control the movement in the direction intersecting the first linear member 19A of the support TM11 in the first movement restricting portion. It has 223a. In addition, the second portion 224 is in contact with the side surface of the second linear member 19B to control the movement in the direction intersecting the second linear member 19B of the support portion TM11 in the second movement restricting portion. Has 224a. Thereby, even when a part of board | substrate P moves with respect to the mounting part 20 of the tray T, the lower surface support part TM11 is prevented from moving with respect to the mounting part 20 of the tray T. can do.

In addition, in this embodiment, the lower surface support part TM11 fastens the lower surface support part TM11 to the arrangement | positioning part 20 by fastening the 1st part 223 extended to both sides of the base 222 to the arrangement | positioning part 20. It is fixed to. Therefore, the lower surface support TM11 can be easily fixed to the placement portion 20, and the lower surface support TM11 can be easily removed from the placement portion 20.

Subsequently, as shown in FIG. 3, the conveyance robot 4 carries out the long longitudinal direction (long side direction of the board | substrate P) of the conveyance hand 12, the board | substrate holder 9 of the exposure apparatus main body 3. As shown in FIG. The direction of the conveyance hand 12 is changed so that it may face the side. Then, the conveyance hand 12 is moved and the tray T which arrange | positioned the board | substrate P is conveyed toward the upper side of the board | substrate holder 9 shown in FIG.

Moreover, the conveyance hand 12 conveys the board | substrate P so that the surface of the board | substrate P and the holding | maintenance part 31 of the board | substrate holder 9 may become substantially parallel. Here, substantially parallel means the state which is parallel or near parallel, when the warpage of the board | substrate P by self weight is excluded. Specifically, the conveyance hand 12 conveys the board | substrate P so that the to-be-held part of the board | substrate P by the conveyance hand 12 and the board | substrate arrangement surface of the holding | maintenance part 31 may become substantially parallel.

FIG. 21: is a schematic diagram explaining the process of transferring the board | substrate P from the tray T of this embodiment to the board | substrate holder 9 of the exposure apparatus 1. FIG.

The transfer robot 4 conveys the board | substrate P to the upper side of the board | substrate holder 9 by the conveyance hand 12, as shown to part (a) of FIG. 21, The tray T and the groove part ( After the 30 is aligned, the drive device 13 shown in FIG. 2 is driven to lower the conveyance hand 12. Then, as shown in part (b) of FIG. 21, the tray T is accommodated in the groove portion 30 of the substrate holder 9, and the substrate P is disposed on the substrate holder 9. At this time, the board | substrate P contacts the holding part 31 (refer FIG. 3) of the board | substrate holder 9 from the lowest part. Moreover, when the contact area of the board | substrate P and the holding | maintenance part 31 of the board | substrate holder 9 increases, the lower surface support part TM11 of the tray T, the outer edge support part TM12, and the board | substrate P Slip occurs between them.

As shown in part (c) of FIG. 21, when the transfer hand 12 is further lowered, the substrate P is placed on the holding part 31 of the substrate holder 9, and the substrate P is placed in the tray ( From T) to the substrate holder 9. In addition, the tray T is in contact with the bottom portion of the groove portion 30 of the substrate holder 9, and the tray T is transferred from the transfer hand 12 to the groove portion 30 of the substrate holder 9. At this time, slippage occurs between the lower surface support part TM11 and the outer edge support part TM12 and the substrate P of the tray T, so that the outer edge (in the short side direction) from the center of the short side direction of the substrate P ( The portion over the long side moves to both side portions 18 and 18 side of the tray T supported by the transfer hand 12.

Thereby, the stress which acts on the board | substrate P is open | released, and it is prevented that the board | substrate P is arrange | positioned at the holding | maintenance part of the board | substrate holder 9 in the state which rested. Thus, in the exposure apparatus 1 of this embodiment, the board | substrate P will be in the flat state on the board | substrate holder 9, and predetermined exposure can be performed favorably at the suitable position on the board | substrate P. As shown in FIG.

When transfer of the board | substrate P to the board | substrate holder 9 is completed, the conveyance robot 4 will retract the conveyance hand 12 from the board | substrate holder 9 on.

After the board | substrate P is arrange | positioned at the board | substrate holder 9, the mask M shown in FIG. 2 is illuminated by exposure light IL with the illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P disposed on the substrate holder 9 via the projection optical system PL.

In the exposure apparatus 1, the board | substrate P can be arrange | positioned favorably (that is, in the state which suppressed generation | occurrence | production of the distortion) on the board | substrate holder 9 as mentioned above. For this reason, predetermined exposure can be performed at a suitable position on the board | substrate P with high precision, and highly reliable exposure process can be implement | achieved. In the exposure apparatus 1, as described above, since the substrate P can be smoothly transferred to the tray T and the substrate holder 9, the exposure processing to the substrate P can be performed without delay. Can be.

Next, the carrying out operation | movement of the board | substrate P from the board | substrate holder 9 after completion | finish of an exposure process is demonstrated. In addition, although the following description demonstrates that the conveyance hand 12 carries out the board | substrate P, you may make it carry out the other conveyance hand of a double hand structure.

When the exposure process is finished, the transfer robot 4 drives the transfer hand 12 to transfer the transfer hands to both sides of the X-axis direction of the substrate holder 9 from below the tray T disposed on the substrate holder 9. Insert (12) from the -Y direction side. At the same time, suction by the vacuum pump is released by a control device (not shown), and suction of the substrate P by the substrate holder 9 is released.

Next, when the conveyance hand 12 is driven upward by a predetermined amount by the drive device 13, the conveyance hand 12 is connected to the lower surface of both side portions 18, 18 of the placement portion 20 of the tray T. Each contact. When the conveyance hand 12 is driven further upward, the substrate P disposed on the holding portion 31 of the substrate holder 9 is transferred to the tray T. At this time, according to this embodiment, since the warpage of the board | substrate P is prevented as mentioned above, when the tray T is moved upward, the board | substrate P is placed on the mounting part 20 of the tray T. It can arrange | position in a state flatter than conventional. When the transfer hand 12 is driven upward, the tray T supporting the substrate P is lifted upward of the substrate holder 9 so that the placement portion 20 is spaced apart from the substrate holder 9. .

At the time when the tray T is lifted up to the position where the placement portion 20 and the substrate holder 9 are separated, the tray T holding the substrate P is moved by the transfer hand 12. (9) Retreat from the phase. In this way, the carrying out operation | movement of the board | substrate P with respect to the exposure apparatus main body 3 is completed.

As explained above, according to the board | substrate conveying apparatus 7 provided with the tray T of this embodiment, as shown to (a)-(c) part of FIG. 20, and (a) part of FIG. The board | substrate P is arrange | positioned at the tray T, and hold | maintains and conveys by the conveyance hand 12 both sides 18 and 18 of the tray T in which the board | substrate P was arrange | positioned. It is not distorted as in the prior art. In addition, as shown to (b)-(c) of FIG. 21, the board | substrate P can be transmitted to the holding part 31 of the board | substrate holder 9 in the flat state in which distortion and curvature were suppressed. Therefore, the problem caused by the conventional warp of the board | substrate P shown to (a)-(c) of FIG. 10, and the board | substrate P shown to (a)-(c) of FIG. The problem of distortion due to compression or a combination thereof can be all solved.

In addition, in the above-mentioned embodiment, although the structure to which the to-be-held part of a tray was provided in both sides was demonstrated, the to-be-supported part may be provided in parts other than both sides, such as the intermediate part of both sides, for example. In addition, in each embodiment mentioned above, when the board | substrate is arrange | positioned in a tray, the case where the tray arrange | positioned under the board | substrate was moved up with respect to the board | substrate was demonstrated, but the board | substrate arrange | positioned above a tray is moved downward with respect to a tray. May be placed on a tray.

In addition, as the board | substrate P of embodiment mentioned above, not only the glass substrate for display devices but the semiconductor wafer for semiconductor device manufacture, the ceramic wafer for thin-film magnetic heads, or the original plate of the mask or reticle used in an exposure apparatus (synthetic quartz, Silicon wafer) and the like.

Moreover, as an exposure apparatus, the scanning type of the step-and-scan system which carries out the synchronous movement of the mask M and the board | substrate P, and scan-exposes the board | substrate P with exposure light IL across the pattern of the mask M. In addition to the exposure apparatus (scanning stepper), the projection exposure apparatus of the step-and-repeat method of collectively exposing the pattern of the mask M in a state in which the mask M and the substrate P are stopped, and sequentially moving the substrate P in steps. It can also be applied to (stepper).

The present invention is also applicable to a twin stage type exposure apparatus having a plurality of substrate stages, which is disclosed in the specifications of US Pat. No. 634,1007, US Pat. No. 6,264,073, US Pat.

In addition, the present invention discloses a substrate stage for holding a substrate, a reference member on which a reference mark is formed without holding the substrate, and / or various materials disclosed in the specifications of US Pat. No. 6,977,963, European Patent Application Publication No. 1713113, and the like. It is applicable also to the exposure apparatus provided with the measurement stage in which the photoelectric sensor was mounted. Moreover, the exposure apparatus provided with the some board | substrate stage and the measurement stage can be employ | adopted.

In addition, in the above-mentioned embodiment, although the light transmissive mask which formed the predetermined light-shielding pattern (or phase pattern-photosensitive pattern) was used on the light transmissive board | substrate, it is disclosed instead of this mask, for example in US Patent No. 6778257 specification. As described above, a variable shaping mask (also referred to as an electronic mask, an active mask, or an image generator) that forms a transmission pattern or a reflection pattern or a light emission pattern based on the electronic data of the pattern to be exposed may be used. In addition, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-light-emitting image display element.

The exposure apparatus of the above-mentioned embodiment is manufactured by assembling various sub-systems containing each component covered by this claim so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to secure these various precisions, before and after this assembly, adjustment for achieving optical precision for various optical systems, adjustment for achieving mechanical precision for various mechanical systems, and electrical precision for various electrical systems are achieved. Adjustment is made.

The assembling process from various sub-systems to the exposure apparatus includes mechanical connection of various sub-systems, wiring connection of electric circuits, piping connection of air pressure circuits, and the like. It goes without saying that there is an assembling step for each of the subsystems before the assembling step from these various subsystems to the exposure apparatus. When the assembly process to the exposure apparatus of various subsystems is complete | finished, comprehensive adjustment is performed and the various precision as the whole exposure apparatus is ensured. Moreover, it is preferable to manufacture an exposure apparatus in the clean room in which temperature, a clean degree, etc. were managed.

As shown in Fig. 22, a microdevice such as a semiconductor device manufactures a substrate which is a substrate of the device, in step 201 of performing a function and performance design of the microdevice, and in step 202 of manufacturing a mask (reticle) based on the design step. Step 203, the substrate processing step including the substrate treatment (exposure treatment) comprising exposing the substrate with exposure light using a pattern of a mask and developing the exposed substrate (photosensitive agent) according to the above-described embodiment. 204, device assembly steps (including machining processes such as dicing process, bonding process, package process, etc.) 205, inspection step 206, and the like. Further, in step 204, developing a photosensitive agent includes forming an exposure pattern layer (layer of developed photosensitive agent) corresponding to the pattern of the mask, and processing the substrate through the exposure pattern layer.

In addition, the requirement of embodiment mentioned above can be combined suitably. In addition, some components may not be used. In addition, as long as it is permitted by law, all the publications concerning the exposure apparatus etc. which were quoted by the above-mentioned embodiment, and the indication of a US patent are used as a part of this description.

1: Exposure apparatus 4: Transfer robot (transport part)
5: carrying in / out part (transport part) 7: board | substrate conveying apparatus
9: board | substrate holder 12: conveyance hand (conveyance part)
18: both sides 19A: first linear member (first member)
19B: second linear member (second member) 20: placement
20b: concave portion (limiting portion) 22: base
23: contact portion 24: connection portion (elastic member)
25: base 26: connection portion (elastic member)
27: sliding part 30: groove part
31: holding part (holder part) 51b: substrate supporting pin (supporting pin)
61: base (limit) 63: contact
64: Donation 64b: Restricted
65: contact 222: base
223: first portion 223a: first movement restricting portion
224: second portion 224a: second movement restricting portion
IL: exposure light M1, M2, M3, M4: magnetic member
P: Substrate
T, T1, T2, T3, T4, T5: Trays (substrate support device, substrate support member)
TM, TM2, TM3, TM4, TM5: Support movable part (support part, protrusion part)
TM11: Lower surface support part (support part, protrusion part)
TM12: outer edge support (support, protrusion)

Claims (39)

A substrate support device for supporting a substrate,
An arrangement part on which the substrate is disposed;
At least one support projecting from the placement portion to support a portion of the substrate disposed on the placement portion
And the support portion includes a base fixed to the placement portion, and a contact portion provided to be movable relative to the base portion, the contact portion being in contact with the substrate disposed on the placement portion. Device. The board | substrate support apparatus of Claim 1 in which the said support part includes the connection part which connects the said base and the said contact part so that relative movement is mutually possible. The board | substrate support apparatus of Claim 2 in which the said connection part contains an elastic member which has elasticity. The board | substrate supporting apparatus of Claim 2 with which the said connection part has a magnetic member group containing a some magnetic member which mutually exerts a magnetic force. The substrate supporting apparatus according to any one of claims 2 to 4, wherein the connecting portion includes a limiting portion for limiting a relative movement range of the contact portion with respect to the base. The substrate supporting apparatus according to claim 1, wherein the base and the contact portion are provided with magnetic members that exert magnetic force on each other. The substrate support device according to any one of claims 1 to 6, wherein the contact portion is provided to be slidable with respect to the placement portion or the base. The substrate support apparatus according to any one of claims 1 to 7, wherein the contact portion is provided so as to be movable in a direction along a substrate placement surface of the placement portion. The said support part is a board | substrate support apparatus of Claim 8 provided so that a movement to the direction which cross | intersects the board | substrate arrangement surface of the said mounting part is possible. The board | substrate support apparatus of Claim 1 in which the said support part is arrange | positioned in multiple numbers so that the center side of the said mounting part may be coarse, and the outer edge side of the said mounting part may be dense. The substrate support apparatus of Claim 10 in which the space | interval of the said support parts arrange | positioned at the center side of the said mounting part is wider than the space | interval of the said support parts arrange | positioned at the outer edge side of the said mounting part. According to claim 10 or 11, The arrangement is provided to be supported along both sides,
The arrangement part is provided with a plurality of rows of support parts including a plurality of the support parts arranged in a line along the both sides,
A substrate support device, wherein the interval between the support portion rows arranged on the center side of the placement portion is wider than the interval between the support portion rows disposed on the outer edge side of the placement portion. As a substrate conveyance apparatus which conveys a board | substrate,
The substrate support apparatus of any one of Claims 1-12 which supports the said board | substrate,
Carrying unit for holding and moving the substrate support device
Substrate conveyance apparatus provided with. The board | substrate conveyance apparatus of Claim 13 with which the said conveyance part hold | maintains both sides of the said arrangement | positioning part. The board | substrate of Claim 13 or 14 which the said conveyance part moves the said board | substrate support apparatus toward the board | substrate holder holding the said board | substrate, and transfers the said board | substrate supported by the said board | substrate support apparatus to the said board | substrate holder. Conveying device. The said conveyance part is a board | substrate conveying apparatus of Claim 15 which delivers the said substrate support apparatus to the said substrate holder. The said conveyance part is a board | substrate conveyance of Claim 16 which delivers the said board | substrate to the holder part in which the said board | substrate is arrange | positioned among the said board | substrate, and delivers the said board | substrate support apparatus to a part different from the said holder part among the said board | substrate holder. Device. The board | substrate conveying apparatus of Claim 17 with which the said conveyance part delivers the said board | substrate support apparatus to the groove part formed in the groove shape with respect to the said holder part among the said substrate holders. 19. The apparatus according to any one of claims 13 to 18, further comprising a plurality of support pins for supporting the substrate and transferring the substrate to the substrate support apparatus.
The said conveyance part arrange | positions the said board | substrate supported by the said support pin to the said substrate conveyance apparatus by moving the said substrate conveyance apparatus. An exposure apparatus that exposes a substrate by irradiating exposure light to a substrate held by a substrate holder,
The exposure apparatus provided with the board | substrate conveying apparatus in any one of Claims 13-19 which conveys the said board | substrate to the said board | substrate holder. Exposing the said board | substrate using the exposure apparatus of Claim 20,
Treating the exposed substrate based on the exposure result
Device manufacturing method comprising a. A substrate support member for supporting a substrate,
An arrangement part on which both sides are supported while the substrate is disposed;
A plurality of support portions protruding from the placement portion to support a portion of the substrate disposed on the placement portion;
And a mounting density of the support portion on the outer edge side of the placement portion is higher than an installation density of the support portion on the center side of the placement portion. The board | substrate supporting member of Claim 22 whose spacing of the said support parts arrange | positioned at the center side of the said mounting part is wider than the space | interval of the said support parts arrange | positioned at the outer edge side of the said mounting part. According to claim 22 or 23, The arrangement is provided to be supported along both sides,
The arrangement part is provided with a plurality of rows of support parts including a plurality of the support parts arranged in a line along the both sides,
The space | interval of the said support part rows arrange | positioned at the center side of the said mounting part is wider than the space | interval of the said support part rows arrange | positioned at the outer edge side of the said mounting part. The substrate support member according to any one of claims 22 to 24, wherein a frictional coefficient of the surface in contact with the substrate of the support portion is smaller than a frictional coefficient of the surface in contact with the substrate of the placement portion. 26. The substrate support according to any one of claims 22 to 25, wherein the plurality of supports includes a plurality of outer edge supports disposed along the outer edge of the placement portion to support the outer edge of the substrate. absence. The said outer edge support part is formed so that it may extend in the direction which cross | intersects the outer edge of the said arrangement | positioning part, The height from the said arrangement | positioning part in the center side of the said arrangement | positioning part is from the said arrangement | positioning part in the outer edge side of the said arrangement | positioning part. Substrate support member that is lower than the height of. 28. The plurality of first members extending in the first direction and the plurality of second members extending in the second direction crossing the first direction. By lattice,
The support portion includes a base disposed at a portion where the first member and the second member intersect, a first portion formed at both sides of the base along the first member, and both sides of the base along the second member. And a second portion formed in the substrate supporting member. The said 1st part has a 1st movement control part which contacts the side surface of the said 1st member, and restricts the movement to the direction which cross | intersects the said 1st direction of the said support part,
And said second portion has a second movement restricting portion that contacts a side surface of said second member and regulates movement in a direction intersecting said second direction of said support portion. The said support part is a board | substrate supporting member of Claim 28 or 29 fixed to the said mounting part by fastening the said 1st part to the said 1st member. As a substrate conveyance apparatus which conveys a board | substrate,
The board | substrate support member in any one of Claims 22-30 which supports the said board | substrate,
Carrier part holding and moving the said board | substrate support member
Substrate conveyance apparatus provided with. The said conveyance part is a board | substrate conveying apparatus of Claim 31 which hold | maintains the said both side parts of the said arrangement | positioning part, when holding and moving the said board | substrate support member. The board | substrate of Claim 31 or 32 which transfers the said board | substrate support member toward the board | substrate holder holding the said board | substrate, and transfers the said board | substrate supported by the said board | substrate support member to the said board | substrate holder. Conveying device. The said conveyance part is a board | substrate conveying apparatus of Claim 33 which delivers the said board | substrate support member to the said substrate holder. The substrate conveyance of Claim 34 in which the said conveyance part delivers the said board | substrate to the holder part in which the said board | substrate is arrange | positioned among the said board | substrate, and delivers the said board | substrate support member to the part different from the said holder part among the said board | substrate holder. Device. The said conveyance part is a board | substrate conveying apparatus of Claim 35 which delivers the said board | substrate support member to the groove part formed in the groove shape with respect to the said holder part among the said substrate holders. 37. The apparatus according to any one of claims 31 to 36, further comprising a plurality of support pins for supporting the substrate and transferring the substrate to the substrate support member.
The said conveyance part arrange | positions the said board | substrate supported by the said support pin to the said board | substrate support member by moving the said board | substrate support member. An exposure apparatus that exposes a substrate by irradiating exposure light to a substrate held by a substrate holder,
The exposure apparatus provided with the board | substrate conveying apparatus in any one of Claims 31-37 which conveys the said board | substrate to the said board | substrate holder. Exposing the said board | substrate using the exposure apparatus of Claim 38,
Treating the exposed substrate based on the exposure result
Device manufacturing method comprising a.
KR1020127010331A 2009-10-20 2010-10-20 Substrate supporting apparatus, substrate supporting member, substrate transfer apparatus, exposure apparatus, and device manufacturing method KR101925151B1 (en)

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US10784100B2 (en) * 2016-07-21 2020-09-22 Tokyo Electron Limited Back-side friction reduction of a substrate
JP7438018B2 (en) * 2020-05-11 2024-02-26 東京エレクトロン株式会社 Substrate mounting method and substrate mounting mechanism

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TW201135372A (en) 2011-10-16
KR101925151B1 (en) 2019-02-27

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