CN109003917A - Base board delivery device, exposure device, substrate supporting device and manufacturing method - Google Patents

Base board delivery device, exposure device, substrate supporting device and manufacturing method Download PDF

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Publication number
CN109003917A
CN109003917A CN201810725930.1A CN201810725930A CN109003917A CN 109003917 A CN109003917 A CN 109003917A CN 201810725930 A CN201810725930 A CN 201810725930A CN 109003917 A CN109003917 A CN 109003917A
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CN
China
Prior art keywords
substrate
aforementioned
base plate
vibration
aforesaid base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810725930.1A
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Chinese (zh)
Inventor
河江国博
柳川卓也
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Nikon Corp
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Nikon Corp
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN109003917A publication Critical patent/CN109003917A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A kind of curved base board delivery device, exposure device, substrate supporting device and manufacturing method that can solve the substrate generated in substrate delivery/reception is provided.A kind of base board delivery device (7), be to transport the substrate (P) for being placed in substrate support member (T) together with the substrate support member, it is characterised in that have: make the aforesaid base plate support member vibration for being placed with aforesaid base plate adds vibration portion (V)；Keep the conveying unit (4) of the aforementioned aforesaid base plate support member for adding vibration portion to make vibration and movement.

Description

Base board delivery device, exposure device, substrate supporting device and manufacturing method
The application is entitled " base board delivery device, exposure device, the substrate support application No. is 201080049093.7 The divisional application of the application for a patent for invention of device and manufacturing method ", the applying date of original application are on October 28th, 2010.
Technical field
The present invention relates to a kind of base board delivery device, exposure device, substrate supporting device and manufacturing methods.
Background technique
In the technique of the electronic component of flat-panel monitor etc., the place of the large substrates such as exposure device or check device is used Manage device.In step of exposure, the checking step using these processing units, transported using by large substrate (such as glass substrate) To the revealed carrying device of following patent documents of processing unit.
Patent document 1: Japanese Unexamined Patent Publication 2001-100169 bulletin.
Summary of the invention
However, in the carrying device of above-mentioned large substrate, substrate delivery/reception that access unit is kept will removed to substrate branch When holding device, substrate is supported respectively with substrate supporting device.Therefore, having according to the support method of substrate makes substrate because of itself Weight and curved situation downwards.If by be in because of weight itself bending state substrate delivery/reception to substrate supporting device, The part curved downwards of substrate can be contacted with substrate supporting device, due to the friction of contact portion, in substrate supporting device Upper substrate can maintain bending state.
Such as in exposure device, if will in as above-mentioned deformation state substrate delivery/reception to exposure substrate holding, Can lead to the problem of can not carry out the ill-exposed of set exposure etc. in the appropriate location on substrate.Also, being placed in substrate branch The substrate for holding device generates curved situation, handover is re-started to solve said circumstances, therefore can generate the place of substrate The problem of reason delay.
Form of the invention is designed to provide a kind of curved base that can solve the substrate generated in substrate delivery/reception Plate conveying device, exposure device, substrate supporting device and manufacturing method.
According to the 1st form of the invention, a kind of base board delivery device is provided, is that will be placed in the substrate of substrate support member and be somebody's turn to do Substrate support member transports together, it is characterised in that has: making the aforesaid base plate support member vibration for being placed with aforesaid base plate Add vibration portion；Keep the conveying unit of the aforementioned aforesaid base plate support member for adding vibration portion to make vibration and movement.
According to 2nd form of the invention, provide a kind of exposure device, the substrate irradiation exposure that substrate holding is kept is used up and Expose aforesaid base plate, it is characterised in that: to have the above-mentioned substrate conveying dress for keeping tool conveying aforesaid base plate to aforesaid base plate It sets.
According to the 3rd form of the invention, a kind of substrate supporting device is provided, supports substrate, it is characterised in that it is aforementioned to include mounting The mounting portion of substrate；Set on aforementioned mounting portion and make the vibration generating unit of aforementioned mounting portion vibration.
According to the 4th form of the invention, a kind of manufacturing method is provided, includes: making the substrate using above-mentioned exposure device The movement of exposure；And the movement based on the aforesaid base plate after exposure results processing exposure.
Form according to the present invention can solve the bending of the substrate generated in substrate delivery/reception.
Detailed description of the invention
Fig. 1 shows the cross sectional plan view of the whole outline of exposure device.
The stereoscopic figure of Fig. 2 conveying machine hand.
The perspective view of movement of the Fig. 3 to illustrate conveying machine hand.
Fig. 4 shows the side view for removing the schematic configuration of access unit.
Fig. 5 shows the top view of the planar configuration of pallet.
Fig. 6 shows that pallet is contained in the cross-sectional side view of the state of the groove portion of substrate holding.
Fig. 7 shows the tray of the 1st implementation form and transports the sectional view of the schematic configuration of hand.
Fig. 8 shows the tray of the 1st implementation form and removes the sectional view of the schematic configuration of access unit.
Fig. 9 is with the curved top view of the shading display substrate of color.
Figure 10 (a)~(c) illustrates the schematic diagram of the substrate delivery/reception step of existing known exposure device.
Figure 11 (a)~(c) illustrates the schematic diagram of the substrate delivery/reception step of existing known exposure device.
Figure 12 (a)~(c) illustrates the schematic diagram of the substrate delivery/reception step of the exposure device of this implementation form.
Figure 13 (a)~(c) illustrates the schematic diagram of the substrate delivery/reception step of the exposure device of this implementation form.
Figure 14 shows the tray of the 2nd implementation form and transports the sectional view of the schematic configuration of hand.
Figure 15 shows the tray of the 2nd implementation form and removes the sectional view of the schematic configuration of access unit.
Figure 16 shows the tray of the 3rd implementation form and transports the sectional view of the schematic configuration of hand.
Figure 17 shows the tray of the 3rd implementation form and removes the sectional view of the schematic configuration of access unit.
Figure 18 illustrates the flow chart of the manufacturing method of implementation form of the present invention.
[main element symbol description]
1: exposure device
3: exposure device ontology
4,4a, 4b: conveying machine hand (conveying unit)
5,5a, 5b: access unit (entering and leaving oral area) is removed
7,7a, 7b: base board delivery device
9: substrate holding
12: conveying hand
16,17: abutting part
18: side
20: mounting portion
20a: (substrate seating surface) above
30: groove portion
31: maintaining part (keeps tool portion)
52b: tray anchor (support sector)
52c, 52e: abutting part
61: hand actuator (actuator, vibration generating unit)
62: hand control unit (control unit, vibration generating unit)
71: support sector's actuator (actuator, vibration generating unit)
72: support sector's control unit (control unit, vibration generating unit)
EH, EH2: hand side power supply (power supply)
EP, EP2: support sector's side power supply (power supply)
ET: tray side power supply (power supply)
IL: exposure light
P: substrate
T, T1, T2: tray (substrate support member, substrate supporting device)
V, V1, V2: add vibration portion
VA, VA1, VA2: oscillation actuator (vibration generating unit)
Specific embodiment
Illustrate the 1st implementation form of the invention refering to schema.Also, the present invention is not limited thereto.Hereinafter, for having this hair Bright base board delivery device, exposure-processed that the substrate for being coated with emulsion is carried out making pattern exposure used for liquid crystal display element Exposure device is illustrated, and is also carried out for an implementation form of substrate supporting device and manufacturing method of the invention Explanation.
Fig. 1 shows the cross sectional plan view of the schematic configuration of the exposure device of this implementation form.Exposure device 1 has and makes liquid crystal Display element pattern exposure in substrate exposure device ontology 3, conveying machine hand (conveying unit) 4, remove access unit (entrance Portion) 5 and with do not illustrate plus vibration portion base board delivery device 7, it is described to be accommodated in by high cleaning and adjust to set In the chamber 2 of temperature.Add vibration portion about base board delivery device 7, is described in detail backward using drawing.In this implementation form, base Plate is large glass plate, and the size on one side is such as 500mm or more.
Fig. 2 is exposure device ontology 3 and substrate P is transported to the appearance of the so far conveying machine hand 4 of exposure device ontology 3 Perspective view.Exposure device ontology 3 has with the not shown lighting system of exposure light IL illumination light shield M, keeps being formed with liquid The mask stage (not shown) of the light shield M of crystal display element pattern, the projection optical system being configured at below this mask stage PL, be set as can on the pedestal 8 being configured at below projection optical system PL the substrate holding 9 of two-dimensional movement and keep substrate The mobile mechanism 33 for keeping tool 9 and keeping the substrate holding 9 mobile.Also that is, exposure device ontology 3, equipped with having substrate holding The bearing table device of tool 9 and mobile mechanism 33.
In addition, in following explanation, if the two-dimensional movement of 9 opposite base 8 of substrate holding is to carry out in the horizontal plane, herein Mutually orthogonal directions setting X-axis and Y-axis in horizontal plane.Substrate holding 9 is to the retaining surface of substrate P, in normal condition (example Such as, state when carrying out the handover of substrate P) it divides into and is parallel to the horizontal plane.Also, Z axis is set in the direction orthogonal with X-axis and Y-axis, The optical axis of projection optical system PL sets parallel with Z axis.In addition, by θ X-direction, θ is referred to as around all directions of X-axis, Y-axis and Z axis Y-direction and θ Z-direction.
Mobile mechanism 33 has mobile mechanism's ontology 35, and is configured on mobile mechanism's ontology 35, keeps substrate holding 9 Pallet 34.Mobile mechanism's ontology 35 is to be supported in guiding face 8a (the upper surface of pedestal 8) in a non contact fashion by gas bearing, The direction XY can be displaced on guiding face 8a.Exposure device ontology 3, in the state of keeping substrate P, in (the projection of light emitting side The image planes side of optical system PL), it can be moved in the given area of guiding face 8a.
Mobile mechanism's ontology 35 is by the dynamic of the coarse motion system (mobile mechanism) including, for example, actuators such as linear motors Make, can be displaced into X/Y plane on guiding face 8a.Pallet 34 is by the fine motion system including, for example, actuators such as voice coil motors The movement of system, can relative moving mechanism ontology 35 it is mobile in Z axis, θ X, θ Y-direction.Pallet 34 is by comprising coarse motion system and micro- The movement of the baseplate carrier drive system of dynamic system can be in X-axis, Y-axis, Z axis, θ X, θ Y and θ Z in the state of keeping substrate P The six direction in direction is mobile.
Conveying machine hand 4 be to exposure device ontology 3 and remove access unit 5 transport substrate P person.Conveying machine hand 4 is protected Aftermentioned pallet (the substrate support member, substrate supporting device) T for supporting the substrate P of mounting is held, makes substrate P together with pallet T Movement to exposure device ontology 3 and removes the handover substrate P of access unit 5 to transport substrate P.
Exposure device 1 carries out step-scan side in the state that rectangular substrate P is placed on aforesaid substrate holding tool 9 The exposure of formula, the pattern for forming light shield M are sequentially transferred to multiple, such as 4 exposure areas (pattern transfer area in substrate P Domain).Also that is, in this exposure device 1, following scan exposures are carried out, that is, illuminate by the exposure light IL from lighting system In the state of the illumination region of slit-shaped on light shield M, by controller (not shown) by not shown drive system, make to protect It holds the mask stage of light shield M and 9 synchronizing moving of substrate holding of substrate P is kept (to be set as Y-axis side herein in set scanning direction To), the pattern of light shield M is transferred to 1 exposure area in substrate P whereby, also that is, being scanned exposure.In addition, this implementation The exposure device 1 of form constitute projection optical system PL have multiple projection optical modules, said lighting system include with it is multiple The so-called poly-lens type scanning-exposure apparatus of the corresponding multiple lighting modules of projection optical module.
After the scan exposure of this 1 exposure area, carry out making substrate holding 9 with both quantitative mobile in X-direction To the stepwise operation of the scanning starting position of next exposure area.Then, in exposure device ontology 3, by this is repeated Kind scan exposure and stepwise operation, are sequentially transferred to 4 exposure areas for the pattern of light shield M.
As shown in Fig. 2, conveying machine hand 4 has such as flapping articulation type constructor, have by being connected by drag articulation axis The arm 10 of the multiple portions composition of knot, the conveying hand 12 and driving device 13 for being linked to this 10 front end of arm.Arm 10 can be borrowed It is mobile for example in above-below direction (Z-direction) by driving device 13.Driving device 13 is controlled by not shown control device It drives.
Hand 12 is transported, front end is set as open generally u-shaped shape, by the longitudinal direction (long side of substrate P of pallet T Direction) both sides 18,18 be supported in the support direction parallel with the long side of pallet T, whereby can pass through pallet T keep substrate P. It is not illustrated in addition, conveying hand 12 has to what the oscillation actuator (vibration generating unit) not illustrated set on pallet T supplied electric power Power supply.About oscillation actuator and power supply, it is described in detail backward using drawing.
The perspective view of movement of the Fig. 3 to illustrate conveying machine hand 4.As shown in Figures 2 and 3, conveying machine hand 4 can so that The mode for transporting longitudinal direction (longitudinal direction of substrate P) towards 9 side of substrate holding of exposure device ontology 3 of hand 12 changes Transport the direction of hand 12.Whereby, substrate P is handover to substrate holding 9 by conveying machine hand 4.
In addition, this conveying machine hand 4, for convenience's sake and not shown in Fig. 2 and Fig. 3, but have and be set to conveying hand 12 Lower section, with this identical mechanism of conveying hand 12 and the both arms of conveying hand that can independently drive construct.Also, conveying machine hand 4 It is not limited to the mechanical hand of flapping articulation type construction, can suitably use well known mechanical hand (in general for transport mechanism) or group It closes to realize.
Fig. 4 shows the side view for removing the schematic configuration of access unit 5.It removes access unit 5 and is joined and matched adjacent with exposure device 1 The substrate P coating developing machine set coating emulsion (not shown) and transported.It removes access unit 5 and has the base for supporting substrate P Plate support sector 51 and the pallet support sector 52 for supporting pallet T.Substrate support sector 51 have flat 1st support sector 51a and It is vertically arranged on this 1st support sector 51a and supports respectively multiple substrate anchors (anchor) of the different parts below substrate P 51b.In this implementation form, substrate anchor 51b is arranged such as 30.
Each substrate anchor 51b is set as that the 1st support sector 51a is fixed in lower end, upper end (upper surface) can support substrate P.The adsorption hole for being connected to vacuum pump (not shown), adsorbable holding substrate P are equipped in the upper surface of substrate anchor 51b.Also, The substrate (not shown) detection whether detection substrate P is placed in substrate anchor 51b is equipped in the upper end of substrate anchor 51b Portion.
Substrate support sector 51 is to be connected to driving portion 54 by coupling member 53.Driving portion 54 is for example by including coarse motion system The movement of the drive system of system and fine motion system, moves in base portion 55 in X/Y plane and θ Z-direction.Whereby, access unit is removed 5 can be supported in the x-direction and y-direction of the substrate P of substrate anchor 51b position correction or make substrate P θ Z-direction revolve It turn 90 degrees.
Pallet support sector 52 has the 2nd support sector 52a of frame-shaped and is vertically arranged on this 2nd support sector 52a and supports respectively Multiple pallet anchors (the 2nd anchor) 52b of different parts below pallet T.In addition, pallet support sector 52 has to pallet The power supply not illustrated that the oscillation actuator (vibration generating unit) that T had do not illustrate supplies electric power.About oscillation actuator And power supply, it is described in detail backward using drawing.
Each pallet anchor 52b is set as that the 2nd support sector 52a is fixed in lower end, upper end can support pallet T.Pallet branch Pin 52b configuration is held on the outside of the 1st support sector 51a compared with substrate support sector 51.Also, being equipped in the upper end of pallet anchor 52b Whether detection pallet T is placed in the pallet test section (not shown) of pallet anchor 52b.
Pallet support sector 52 is set as that Z-direction can be displaced into along guidance part 56 by the movement of not shown driving portion. Guidance part 56 is located at the driving portion 54 of substrate support sector 51 and the outside of base portion 55.Also, the 1st support sector of substrate support sector 51 51a, coupling member 53 and driving portion 54 are configured at the inside of the 2nd support sector 52a of frame-shaped.Whereby, pallet support sector 52 can be with The 1st support sector 51a, coupling member 53 and the driving portion 54 of substrate support sector 51 do not generate interferingly mobile in Z-direction.
Also, pallet support sector 52, ramped up by toward Z axis pros, can make to be supported in the pallet T of pallet anchor 52b toward Z Axis pros ramp up, and the substrate P on the substrate anchor 51b for being supported in substrate support sector 51 is made to be placed in pallet T.Also, pallet The pallet T for being placed with substrate P supported by pallet anchor 52b is handover to the conveying hand of conveying machine hand 4 by support sector 52 12。
Then, the construction of pallet T is described in detail.Fig. 5 shows the top view of the planar configuration of pallet T.As shown in figure 5, support Disk T has by the mounting portion 20 for forming clathrate with the multiple wire-like members 19 that predetermined distance interweaves in length and breadth.Also that is, carrying The part that wire-like members 19 are not configured for setting portion 20 becomes the opening portion 21 of rectangle.Pallet T is in the both sides of mounting portion 20 18,18 Between commitment positions load substrate P, support substrate P from below.Also, the shape of pallet T is not limited to shape shown in fig. 5, For for example only the single frame of the frame-shaped of the peripheral part for only supporting substrate P of one opening portion 21 of formation also may be used.
It is parallel with the both sides 18,18 of mounting portion 20 that substrate P is configured to long side.Pallet T is that mounting portion 20 loads substrate P In the state of, both sides 18,18 are supported from below by the conveying hand 12 of conveying machine hand 4 (refering to Fig. 2 and Fig. 3).Also that is, this reality The conveying machine hand 4 of form is applied by holding pallet T and makes to move, substrate P is supported by pallet T and transports substrate P to both Positioning is set.
Pallet T is multiple pallets by the pallet support sector 52 shown in Fig. 4 for removing access unit 5 below mounting portion 20 Anchor 52b is supported.Also, pallet T, as shown in figure 4, supporting the state below mounting portion 20 by pallet anchor 52b Under, so that multiple substrate anchor 51b of substrate support sector 51 is inserted through multiple opening portions 21 shown in fig. 5.
In addition, the forming material as pallet T, preferably uses the sheet that can inhibit substrate P when pallet T supports substrate P Curved material caused by body weight, such as various synthetic resin or metal can be used.Specifically, nylon, poly- third can be enumerated Alkene, AS (acrylonitritrile-styrene resin) resin, ABS (acrylonitrile-butadiene-styrene copolymer) resin, polycarbonate, Fiber-reinforced plastic, stainless steel etc..As fiber-reinforced plastic, GFRP (Glass Fiber Reinforced can be enumerated Plastic: glass fiber-reinforced thermosetting plastic) or CFRP (Carbon Fiber Reinforced Plastic: carbon fiber Dimension strengthens thermosetting plastic).Again, the wire-like members 19 of clathrate are woven into, the component shape that the flexibilities such as lead are excellent is used Cheng Yike.
Herein, as shown in Fig. 2, being formed with the groove portion 30 for keeping pallet T in the upper surface of substrate holding 9.Groove portion 30 be with The frame construction correspondence of pallet T is set as clathrate.Also, forming a groove 30 by the upper surface of substrate holding 9, island setting is more The maintaining part (keeping tool portion) 31 of a substrate P.Maintaining part 31 has size corresponding with the opening portion 21 of pallet T.
The upper surface of maintaining part 31, which is processed into substrate holding 9, has excellent planar degree to the substantive retaining surface of substrate P.Again Multiple suction hole K to make substrate P imitate this face closely sealed are arranged in the upper surface of maintaining part 31 in person (refering to Fig. 2).Each suction hole K is connected to vacuum pump (not shown).
Fig. 6 shows that pallet T is contained in the cross-sectional side view of the state of the groove portion 30 of substrate holding 9.As shown in fig. 6, The thickness of pallet T is less than the depth of groove portion 30.Whereby, pallet T insertion is fallen into groove portion 30, becomes maintaining part 31 from opening portion 21 State outstanding, the substrate P being only placed on pallet T are handover to maintaining part 31.
The quadrangle of side forms coniform recess portion 41 below the mounting portion 20 of pallet T, in groove portion 30 with each recess portion 41 corresponding positions are equipped with the spherical elevation 42 for being sticked in recess portion 41.Pallet T, when mounting portion 20 is inserted into groove portion 30, by The protrusion 42 of substrate holding 9 is sticked in the recess portion 41 of mounting portion 20, and the position for the pallet T for being contained in groove portion 30 can be prevented inclined It moves.
Hereinafter, being directed to adding vibration portion, vibrating generating unit and power supply for the base board delivery device 7 of this implementation form, Fig. 7 is used And Fig. 8 is described in detail.
Fig. 7 shows the figure of the conveying hand 12 of this implementation form and the schematic configuration of tray T, and (a) corresponds to the A- along Fig. 2 The constructed profile of the section of A ' line, (b) be (a) the portion α expanded view.Fig. 8 illustrates the pallet support sector 52 of this implementation form And the figure of the schematic configuration of tray T, (a) correspond to the constructed profile of the section of the B-B ' line along Fig. 4, are (b) β of (a) The expanded view in portion.
As shown in Fig. 7 (a) and 7 (b), the base board delivery device 7 of this implementation form has vibrate tray T plus vibration portion V. Vibration portion V is added to there is oscillation actuator (vibration generating unit) VA set on tray T, set on the tray side power supply (power supply of tray T Portion) ET, set on conveying hand 12 hand side power supply (power supply) EH.In addition, plus vibration portion V is the tool as shown in Fig. 8 (a) and 8 (b) There is support sector side power supply (power supply) EP for being set to the tray support sector 52 for removing access unit 5.
Oscillation actuator VA is embedded to the wire-like members 19 of composition mounting portion 20 and is configured at the inside of mounting portion 20, to mounting Portion 20 is fixed.As oscillation actuator VA, can be used for example by the vibrating motor for making bias that copper rotation be divided to generate vibration Or has the ultrasonic motor etc. of the piezoelectric element corresponding to the voltage deformation applied.Though being more for having in this implementation form The composition of a oscillation actuator VA illustrates, but with condition difference, oscillation actuator VA is 1 and also may be used.
As long as making mounting portion 20 with the vibration of desired vibration frequency in addition, oscillation actuator VA is securable to mounting portion 20 Dynamic person, is not limited to above-mentioned vibrating motor or ultrasonic motor.In addition, oscillation actuator VA is not necessarily to embedment mounting The inside in portion 20, is also securable to below wire-like members 19 or side.In addition, oscillation actuator VA is configured at mounting portion 20 It is more effective near the position of vibration to be given.
Oscillation actuator VA is driven by set voltage is applied to portion of terminal VAT, make the mounting portion 20 of tray T with Set vibration frequency vibration.Here, the frequency of the vibration of oscillation actuator VA corresponds to the frequency of the vibration of mounting portion 20 Setting.The frequency of the vibration of mounting portion 20 is set as below the substrate P for being placed in mounting portion 20 and the upper surface of mounting portion 20 (base Plate seating surface) 20a generates the high frequency of sliding because of the effect of vibration.
Hand side power supply EH is by being set to the power supply unit of conveying machine hand 4 (diagram is omited), hand side wiring 14, hand side sub-portion 15 are constituted.Hand side wiring 14 is hand side sub-portion 15 to be connected to by one end and another side is connected to conveying machine hand 4 Hand side sub-portion 15 and power supply unit are electrically connected by the power supply unit not illustrated.
The exposing of tray side sub-portion 22 that hand side sub-portion 15 corresponds to be configured at below tray T is formed in conveying hand The upper surface of 12.Hand side sub-portion 15 is to be formed in tray T with exposing when transporting hand 12 and positioning to tray T and keep tray T The following contact of tray side sub-portion 22 to be electrically connected with tray side sub-portion 22.
In addition, hand side sub-portion 15 is set as elastically deformable, when transporting hand 12 and keeping tray T, by be set to tray T Tray side sub-portion 22 contact and toward conveying 12 side flexible deformation of hand and tray side sub-portion 22 is suppressed.Whereby, hand side Sub-portion 15 contacts tray side sub-portion 22 under pressing state, it is ensured that the electrical connection with tray side sub-portion 22.
Tray side power supply ET is made of the tray side wiring 23 set on tray T, tray side sub-portion 22.
Tray side wiring 23 is the portion of terminal VAT of oscillation actuator VA to be connected to by one end and another side is connected to The vibration that tray side sub-portion 22 will be exposed to the tray side below tray T and sub-portion 22 Yu be configured inside mounting portion 20 The portion of terminal VAT of actuator VA is electrically connected.
The exposing of hand side sub-portion 15 that tray side sub-portion 22 corresponds to be configured at the upper surface of conveying hand 12 is formed in load It sets below portion 20.Tray side sub-portion 22 is to be formed in remove with exposing when transporting hand 12 and keeping tray T to tray T positioning It send the hand side sub-portion 15 of the upper surface of hand 12 to contact to be electrically connected with hand side sub-portion 15.
In addition, tray side sub-portion 22 is set as elastically deformable, when transporting hand 12 and keeping tray T, removed by with being set to Send hand 12 hand side sub-portion 15 contact and toward tray T side flexible deformation and opponent side sub-portion 15 is suppressed.Whereby, tray side The opponent side sub-portion 15 under pressing state of sub-portion 22 contacts, it is ensured that the electrical connection with hand side sub-portion 15.
By above composition, hand side power supply EH and tray side power supply ET are in hand side sub-portion 15 and tray side terminal When portion 22 is electrically connected, the electric power that the power supply unit not illustrated for being connected to the other end of hand side wiring 14 is supplied can be passed through hand Side wiring 14 and tray side wiring 23 supply the oscillation actuator VA as vibration generating unit.
In addition, being equipped with multiple abutting parts 16 below the mounting portion 20 for supporting tray T in the upper surface of conveying hand 12.It abuts Portion 16 is configured at not with the oscillation actuator VA set on tray T in the Chong Die position of vertical view.In other words, oscillation actuator VA be In the state that tray T keeps the conveying positioning of hand 12, the direction along tray T be configured at 2 abutting parts 16 and abutting part 16 it Between.Here, oscillation actuator VA is configured at the wire-like members 19 in the vibration of mounting portion 20 of the tray T supported by abutting part 16 The position of the antinode of vibration is more satisfactory.
As shown in Fig. 8 (a) and 8 (b), support sector side power supply EP be by be set to remove access unit 5 power supply unit (diagram omit), Support sector's side wiring 57, support sector's side sub-portion 58 are constituted.Support sector's side wiring 57 is that support sector side is connected to by one end Portion of terminal 58 and another side, which are connected to, removes the power supply unit not illustrated of access unit 5 for support sector's side sub-portion 58 and power supply unit Electrical connection.
The exposing of tray side sub-portion 22 that support sector's side sub-portion 58 corresponds to be configured at below tray T is formed in support The upper end of disk anchor 52b.Support sector's side sub-portion 58 is when tray T positions holding to pallet anchor 52b and to expose The contact of tray side sub-portion 22 below tray T is formed in be electrically connected with tray side sub-portion 22.
In addition, support sector's side sub-portion 58 is set as elastically deformable, when pallet anchor 52b supports tray T, by with The contact of tray side sub-portion 22 set on tray T is simultaneously toward 52 side flexible deformation of tray support sector and to 22 bullet of tray side sub-portion Pressure.Whereby, support sector side sub-portion 58 contacts tray side sub-portion 22 under pressing state, it is ensured that with tray side sub-portion 22 Electrical connection.
By above composition, support sector side power supply EP is electrical in support sector's side sub-portion 58 and tray side sub-portion 22 When connection, the electric power that the power supply unit not illustrated for being connected to the other end of support sector's side wiring 57 is supplied can be passed through support sector Side wiring 57 and tray side wiring 23 supply the oscillation actuator VA as vibration generating unit.
In addition, being equipped with multiple abutting parts below the mounting portion 20 for supporting tray T in the upper surface of pallet anchor 52b 52c.Pallet anchor 52b is configured to not Chong Die in vertical view with the oscillation actuator VA set on tray T.Also that is, oscillation actuator VA is to be configured at 2 along the direction of tray T when tray T is positioned pallet anchor 52b and supported with pallet anchor 52b Between a abutting part 52c and abutting part 52c.Here, oscillation actuator VA is configured at the tray T's supported by abutting part 52c The position of the antinode of the vibration of wire-like members 19 is more satisfactory when mounting portion 20 is vibrated.
Fig. 9 is to be bowed with the shading display of color by the curved of substrate P that substrate anchor 51b shown in Fig. 4 is supported View.In figure, color more indicates that (the Z axis negative direction in Fig. 4) is bent substrate P downwards.As shown in figure 9, substrate P be by 5 × 6 total 30 substrate anchor 51b for being configured to array shape support following side.Therefore, it is left from substrate anchor 51b Substrate P central portion or outer edge become curved state downwards because of weight of substrate P itself.Also, along substrate P long side Part become most curved state downwards, the part and the center portion parallel with short side then along short side become downward The curved state in side.
Then, illustrate the movement of exposure device 1.Specifically, for substrate P is moved in and is removed by conveying machine hand 4 Method out is illustrated.Herein, it loads for by substrate P to pallet T, the substrate P for being placed in this pallet T is moved in, is moved out The step of exposure device ontology 3, is illustrated.
The substrate P for being coated with emulsion is to be transported from coating developing machine to shown in FIG. 1 to remove access unit 5, and positioning is placed in Commitment positions on the substrate anchor 51b of substrate support sector 51 shown in Fig. 4, absorption are held in the upper of substrate anchor 51b Face.As above-mentioned, by the substrate P that multiple substrate anchor 51b are supported, as shown in figure 9, becoming not by substrate anchor 51b branch The part held curved state downwards.
After substrate P absorption is held in the upper surface of substrate anchor 51b, substrate support sector 51 keeps adsorbing substrate P In the state of the upper surface of substrate anchor 51b, driving portion 54 is acted, makes substrate P in alignment with pallet T.Substrate P and pallet T Alignment after, remove access unit 5 make pallet support sector 52 along guidance part 56 rise so that the support on pallet anchor 52b Disk T rises.Whereby, substrate P is placed in the mounting portion 20 of pallet T in the state of positioning.
At this point, by the substrate-placing of bending state when pallet, there is below ask in existing known exposure device Topic.Figure 10 (a)~Figure 10 (c) illustrates to remove access unit 500 to existing known pallet T0's from existing known exposure device The schematic diagram of the handover procedure of substrate P 0.
As shown in Figure 10 (a), by the substrate P 0 that multiple substrate anchor 510b are supported, become not by substrate anchor The part curved state downwards that 510b is supported.In this case, increase pallet support sector 520, so as to be supported by pallet The pallet T0 that 520b is supported is sold to rise.
Then, as shown in Figure 10 (b), substrate P 0 is placed on pallet T0, by substrate P 0 from the substrate branch for removing access unit 500 It holds pin 510b and is handover to pallet T0.At this point, substrate P 0 is contacted from curved part downwards with pallet T0, because of the part and pallet The friction of T0, substrate P can not extend on pallet T0, maintain curved state as wave.Then, make to be configured at below pallet T0 Conveying machine hand 400 conveying hand 1200 rise.
Then, as shown in Figure 10 (c), the both sides of pallet T0 are kept by conveying hand 1200, and pallet T0 is in mounting base Toward being picked up above pallet anchor 520b in the state of plate P0.The both sides pallet T0 are supported, because of substrate P 0 and pallet T0 Weight itself, the middle part for the both sides supported by conveying hand 1200 becomes curved state downwards.Therefore, substrate P 0 Convex bending state under becoming as central portion, the stress compressed towards central portion and substrate P 0 viewed from above are put down Area becomes smaller.
Later, make to transport that hand 1200 is mobile, the pallet T0 of substrate P 0 will be loaded towards substrate holding 900 shown in Figure 11 Top conveying.
Figure 11 illustrates to keep from existing known pallet T0 by the substrate that substrate P 0 is handover to existing known exposure device Has the schematic diagram of 900 the step of.
As shown in Figure 11 (a), after transporting substrate P 0 toward the top of substrate holding 900 by conveying hand 1200, make to remove Hand 1200 is sent to decline.Then, as shown in Figure 11 (b), pallet T0 is contained in the groove portion 300 of substrate holding 900, and substrate P 0 loads In on substrate holding 900.At this point, substrate P 0 is contacted from the most past curved part in lower section with substrate holding 900.
As shown in Figure 11 (c), further make after transporting the decline of hand 1200, substrate P 0 is placed in substrate holding 900, substrate P0 is handover to substrate holding 900 from pallet T0.Also, pallet T0 is abutted with the bottom of the groove portion 300 of substrate holding 900, support Disk T0 is handover to the groove portion 300 of substrate holding 900 from conveying hand 1200.At this point, due to substrate holding 900 and substrate P 0 Friction, the shape of the bending state of substrate P 0 can not reply completely, and the situation that the plane product of substrate P 0 is more completely flat reduces.Such as Above-mentioned, in existing known exposure device, substrate P 0 becomes bending state on substrate holding 900, and having generation can not be Appropriate location on substrate carries out the situation of the ill-exposed problems such as set exposure.
On the other hand, the exposure device 1 of this implementation form, in order to solve the problems, such as above-mentioned existing known exposure device, Use aforesaid substrate carrying device 7.Hereinafter, illustrating movement and the work of the base board delivery device 7 of this implementation form of exposure device 1 With.
Figure 12 (a), (b) and (c) illustrate the substrate P for removing access unit 5 to pallet T from the exposure device 1 of this implementation form Handover procedure schematic diagram.
As shown in Figure 12 (a), by the substrate P that multiple substrate anchor 51b are supported, become not by substrate anchor 51b The part of support curved state downwards.
In addition, tray T is with pallet anchor 52b support, as shown in Fig. 8 (a) and 8 (b), below tray T Tray side sub-portion 22 is contacted with support sector's side sub-portion 58 set on the front end of pallet anchor 52b and is electrically connected.Also That is, support sector side power supply EP is supplied electric power by the power supply unit not illustrated, becoming can be to the oscillation actuator for being set to tray T The state of the portion of terminal VAT power supply of VA.In this case, increase pallet support sector 52, so as to be supported by pallet anchor 52b Pallet T rise.
Then, as shown in Figure 12 (b), substrate P is placed on pallet T, by substrate P from the substrate anchor for removing access unit 5 51b is handover to pallet T.At this point, removing access unit 5 is the power supply unit not illustrated with support sector side power supply EP to oscillation actuator The portion of terminal VAT of VA is supplied electric power, and vibrates oscillation actuator VA with set frequency.Oscillation actuator VA is with set frequency After vibration, it is fixed with the mounting portion 20 of the tray T of oscillation actuator VA and is vibrated with set frequency.
Here, the frequency of the vibration of oscillation actuator VA corresponds to the frequency setting of the vibration of mounting portion 20.Mounting portion The frequency of 20 vibration is set as below the substrate P for being placed in mounting portion 20 and the upper surface of mounting portion 20 (substrate seating surface) 20a generates the high frequency of sliding because of the effect of vibration.Therefore, after mounting portion 20 is with set frequency vibration, mounting portion 20 it is upper Face 20a with become the state that repeating part and moment separate with contact below substrate P, become the upper surface of mounting portion 20 20a and The state that frictional force between below substrate P reduces.
Whereby, it is bent into as shown in Figure 12 (a) and compresses in face direction and be placed in mounting in the state that plane product becomes smaller The stress of the substrate P in portion 20 is open, and as shown in Figure 12 (b), the outer edge of substrate P from the central portion of substrate P toward outside to expand Mode it is mobile.Whereby, substrate P is placed in tray T with flat state.
At this point, as shown in figure 8, pallet anchor 52b be configured at set on tray T oscillation actuator VA overlook it is heavy Folded position.Therefore, the wire-like members 19 between pallet anchor 52b can be made to be easier to vibrate, 20 efficiency of mounting portion can be made good Ground vibration.In addition, the part occasion in the antinode for the vibration that oscillation actuator VA is configured to wire-like members 19 can make linear structure The vibration amplification of part 19 keeps 20 efficiency of mounting portion more preferable and effectively vibrates.
Secondly, making to be configured at the conveying machine below pallet T after the temperature that substrate P is adjusted to to implement exposure-processed The conveying hand 12 of hand 4 rises.
Then, as shown in Figure 12 (c), the both sides 18,18 (refering to Fig. 2 and Fig. 5) of pallet T are protected by conveying hand 12 It holds, toward being picked up above pallet anchor 52b in the state that pallet T loads substrate P.It is propped up the both sides pallet T 18,18 It holds, because of itself weight of substrate P and pallet T, becomes curved downwards between the both sides 18,18 supported by conveying hand 12 State.
At this point, as shown in Fig. 7 (a) and 7 (b), set on the hand side sub-portion 15 of the upper surface of conveying hand 12 and set on tray T's Following tray side sub-portion 22 is contacted and is electrically connected.Also that is, hand side power supply EH is by the power supply unit supply not illustrated Electric power, become can to set on tray T oscillation actuator VA portion of terminal VAT power supply state.
Here, conveying machine hand 4 is when supporting the both sides pallet T 18,18 to lift toward top to transport hand 12, by hand The power supply unit of side power supply EH not illustrated supplies electric power the portion of terminal VAT of oscillation actuator VA, make oscillation actuator VA with Set frequency vibration.After oscillation actuator VA is with set frequency vibration, it is fixed with the mounting of the tray T of oscillation actuator VA Portion 20 is vibrated with set frequency.
Here, the frequency of the vibration of oscillation actuator VA corresponds to the frequency setting of the vibration of mounting portion 20.In addition, carrying The frequency for setting the vibration in portion 20 is set as below the substrate P for being placed in mounting portion 20 and the upper surface of mounting portion 20 (substrate support Face) 20a generates the high frequency of sliding because of the effect of vibration.Therefore, after mounting portion 20 is with set frequency vibration, mounting portion 20 Above 20a with become the state that repeating part and moment separate with contact below substrate P, become the upper surface of mounting portion 20 20a The state reduced with the frictional force between below substrate P.
Whereby, as shown in Figure 12 (c), with the upper surface of the mounting portion 20 of tray T 20a to open substrate P below substrate P The mode of stress is slided, and substrate P can be prevented to be bent to the state as wave.Also, can mitigate compresses substrate P towards central portion Stress.
Then, as shown in figure 3, conveying machine hand 4 changes the direction of conveying hand 12 so as to transport the longitudinal direction (base of hand 12 The longitudinal direction of plate P) towards 9 side of substrate holding of exposure device ontology 3.Later, make to transport the movement of hand 12, base will be placed with The pallet T of plate P is towards transporting above substrate holding 9 shown in Figure 13.Vibration is activated at this point, hand side power supply EH can be continued The power supply of device VA continues the vibration of the mounting portion 20 of pallet T, or temporarily interrupts and supply the electric power of oscillation actuator VA It gives, interrupts the vibration of the mounting portion 20 of pallet T and also may be used.
It is transported in addition, conveying hand 12 becomes substantially parallel mode with the maintaining part 31 on substrate P surface and substrate holding 9 Substrate P.Herein, the state being parallel or nearly parallel when the substantially parallel bending for meaning substrate P caused by excluding because of weight itself. Specifically, conveying hand 12 keeps the substrate-placing face of the held portion of substrate P and maintaining part 31 to become big to transport hand 12 Parallel mode is caused to transport substrate P.Whereby, even if the occasion of the vibration continuation to make mounting portion 20 when the conveying of tray T, also It can prevent the positional shift of substrate P or tray T.
Figure 13 illustrates the schematic diagram for the step of substrate P is handover to substrate holding 9 of exposure device 1 from pallet T.
Conveying machine hand 4, as shown in Figure 13 (a), by conveying hand 12 by substrate P to transporting above substrate holding 9, into After the alignment of row pallet T and groove portion 30, drive driving device 13 shown in Fig. 2 so that conveying hand 12 declines.Then, such as Figure 13 (b) shown in, pallet T is contained in the groove portion 30 of substrate holding 9, and substrate P is placed on substrate holding 9.At this point, substrate P from The most past curved part in lower section is contacted with the maintaining part 31 (refering to Fig. 3) of substrate holding 9.
Here, conveying machine hand 4 is to supply electric power to make oscillation actuator VA to oscillation actuator VA with hand side power supply EH Vibration vibrates the mounting portion 20 of tray T with set vibration frequency.Then, become the upper surface of mounting portion 20 20a and substrate P Below between frictional force reduce state.Later, substrate P and the maintaining part 31 of substrate holding 9 contact area by The cumulative added-time keeps the stress of substrate P open below substrate P, prevents substrate P with the 20a sliding of the upper surface of the mounting portion 20 of tray T Bending.
As shown in Figure 13 (c), further make after transporting the decline of hand 12, substrate P is placed in the maintaining part of substrate holding 9 31, substrate P is handover to substrate holding 9 from pallet T.Also, pallet T is abutted with the bottom of the groove portion 30 of substrate holding 9, pallet T is handover to the groove portion 30 of substrate holding 9 from conveying hand 12.As above-mentioned, in the exposure device 1 of this implementation form, in substrate P The bending of substrate P is prevented when handover, substrate P becomes flat condition on substrate holding 9.It therefore, can be appropriate in substrate P Position carries out set exposure well.
After the completion of the handover of the substrate P of substrate holding 9, conveying machine hand 4 makes to transport hand 12 from substrate holding 9 Keep out of the way.
It loads in substrate P to substrate holding 9, light shield shown in Fig. 2 is illuminated with exposure light IL by lighting system M.With exposure light IL illumination light shield M pattern, be by projection optical system PL projection exposure in be placed in substrate keep The substrate P of tool 9.
In exposure device 1, substrate P can be placed in well on substrate holding 9 Ru above-mentioned, therefore can be in substrate P Appropriate location high-precision carry out set exposure, it can be achieved that the high exposure-processed of reliability.Also, in exposure device 1, it is such as above-mentioned can The handover of the substrate P to pallet T and substrate holding 9 is gone on smoothly, therefore can be carried out without delay at the exposure to substrate P Reason.
Then, the movement that moves out for the substrate P of the slave substrate holding 9 after exposure-processed is illustrated.In addition, Though bright conveying hand 12 carries out moving out for substrate P in the following description, another conveying hand in both hands construction is moved out Also may be used.
After exposure-processed, the driving conveying hand 12 of conveying machine hand 4, the pallet T's being placed on substrate holding 9 Conveying hand 12 is inserted into the X-direction two sides of substrate holding 9 by lower section from -Y direction side.At the same time, by not shown Control device releases the attraction of vacuum pump, releases the absorption for the substrate P that substrate holding 9 carries out.
Then, after conveying 12 driven device 13 of hand is both quantified toward top driving, conveying hand 12 is connected to pallet T's respectively Below the both sides 18,18 of mounting portion 20.After conveying hand 12 is further driven toward top, it is placed in substrate holding 9 The substrate P of maintaining part 31 is handover to pallet T.At this point, according to this implementation form, such as above-mentioned bending for preventing substrate P, therefore When keeping pallet T mobile toward top, in the mounting portion 20 that substrate P can be placed in pallet T in the state of relatively previous flat.Conveying Hand 12 further by toward top driving after, support the pallet T of substrate P to be picked up toward the top of substrate holding 9, mounting portion 20 from Substrate holding 9 leaves.
It is picked up the time point that so far mounting portion 20 and substrate holding 9 position away from pallet T, keeps the support of substrate P Disk T is kept out of the way from substrate holding 9 by conveying hand 12.By this method, it completes to the substrate P of exposure device ontology 3 Move out movement.
Secondly, being directed to the 2nd implementation form of the invention, Fig. 1~Figure 13 is quoted, Figure 14 and Figure 15 explanation is used.This implementation The base board delivery device 7a vibration generating unit of form be not set to tray (substrate support member) T1 and be set to conveying machine hand 4a and The aspect for removing access unit (entering and leaving oral area) 5a is different from the above-mentioned base board delivery device 7 of the 1st implementation form.Other aspects and the The base board delivery device 7 of 1 implementation form is identical, therefore assigns identical symbol to identical part and illustrate to omit.
Figure 14 shows the tray T1 of this implementation form and transports the constructed profile of the schematic configuration of hand 12.
As shown in figure 14, it is being not provided in the oscillation actuator VA shown of Fig. 7 (a) and 7 (b) and the tray side power supply side ET Face and the tray T-phase illustrated in the 1st implementation form are different, and other aspects are then set as same with tray T-phase.
Conveying machine hand (conveying unit) 4a has: keeping the conveying hand 12 of tray T1, makes to transport the mobile hand actuating of hand 12 Device (actuator, vibration generating unit) 61, the hand control unit (control unit, vibration generating unit) 62 for controlling hand actuator 61.Hand actuating Device 61 has actuator body 61a, lifting driving portion 63, direct acting driving portion 64.
Lifting driving portion 63 has by being pivoted the feed screw 63a for making to transport hand 12 and going up and down, is fixed on actuating Device ontology 61a and the lift motor 63b for being pivoted feed screw 63a, the hand support sector 63c for being fixed on conveying hand 12.? Actuator body 61a is formed with sliding slot 61b along the direction for going up and down conveying hand 12.Hand support sector 63c have be set as can be set to The holding section 63d of the sliding slot 61b engaging of actuator body 61a and along the chute 61b prolonged in direction sliding.
Lifting driving portion 63 is by being pivoted feed screw 63a with lift motor 63b and make to transport hand 12 and hand 61b is mobile along the chute together makes to transport hand 12 in the side that the upper surface of mounting portion 20 with tray T1 20a intersects by support sector 63c To, such as vertical direction (Z-direction) movement.
Direct acting driving portion 64 is linear with actuator body 61a is moved along the upper surface of the mounting portion 20 of tray T1 20a Motor 64a, the direct acting guidance part 64b for engaging actuator body 61a slideably.Linear motor 64a and direct acting guidance part 64b Along the moving direction setting of the conveying hand 12 of the upper surface of mounting portion 20 20a.
Direct acting driving portion 64 be by make linear motor 64a drive and make actuator body 61a along direct acting guidance part 64b move It moves to make through the conveying hand 12 of hand support sector 63c and actuator body 61a connection in the side along the upper surface of mounting portion 20 20a To, such as horizontal direction (X/Y plane direction) movement.
Hand control unit 62 be set as can opponent's actuator 61 lift motor 63b and linear motor 64a convey respectively it is set Signal is controlled, is set as that vibratility control lift motor 63b and linear motor 64a can be distinguished.Here, so-called vibratility control is instigated Each motor generates the vibration of set frequency, makes to transport hand 12 in each moving direction with set frequency vibration.
The frequency of the vibration of lift motor 63b and linear motor 64a is the frequency setting of the vibration based on conveying hand 12.This Outside, transport hand 12 vibration frequency be based on conveying hand 12 vibration be conveyed to be held in transport hand 12 tray T1 and tray The frequency setting of the vibration of mounting portion 20 when T1 vibrates.The frequency of the vibration of mounting portion 20 is set as and in the 1st implementation form It is identical with the frequency of the vibration of the mounting portion 20 of the tray T of oscillation actuator VA vibration.
Multiple abutting parts 17 below the mounting portion 20 for supporting tray T1 are equipped in the upper surface of conveying hand 12.This implementation shape The abutting part 17 of state is set as that the vibration efficiency that generated in conveying hand 12 tray T1 can be conveyed to well.Also that is, this implementation shape The abutting part 17 of state is also as the vibration reception and registration component performance function for conveying vibration.
Figure 15 shows the tray T1 of this implementation form and removes the constructed profile of the schematic configuration of access unit 5a.
As shown in figure 15, the tray support sector 52 for removing access unit 5a of this implementation form, which has, goes up and down tray support sector 52 Support sector's actuator (actuator, vibration generating unit) 71, control support sector's actuator 71 support sector's control unit (control unit, Vibrate generating unit) 72.
Support sector's actuator 71 be such as in above-mentioned 1st implementation form it is stated that, be set as that tray support sector 52 can be made along in Fig. 4 The guidance part 56 of display is mobile in Z-direction.Support sector's control unit 72 is set as that support sector's actuator 71 can be conveyed set control Signal processed, being set as can vibratility control support sector's actuator 71.Here, so-called vibratility control instigates each actuator generation set Frequency vibration, vibrate tray support sector 52 with set frequency along Z-direction.
It is above-mentioned hand actuator 61 and hand control unit 62, support sector's actuator 71 and support sector's control in this implementation form Portion 72, which respectively constitutes, makes to transport hand 12 and tray support sector 52 generates the vibration generating unit of vibration.In addition, these vibration generating units Constitute based on supply electric power make keep tray T1 conveying hand 12 and pallet anchor 52b respectively generates vibrate add vibration portion V1.
In addition, being equipped with multiple abutting parts below the mounting portion 20 for supporting tray T1 in the upper surface of pallet anchor 52b 52e.The abutting part 52e of this implementation form is set as that the vibration efficiency that generated in tray support sector 52 tray can be conveyed to well T1.Also that is, the abutting part 52e of this implementation form is also as the vibration reception and registration component performance function for conveying vibration.
In the shown load for making the substrate P supported by substrate anchor 51b be placed in tray T1 of such as Figure 12 (a)~Figure 12 (b) When the portion 20 of setting, first act as shown in figure 15 support sector's actuator 71.Then, as shown in Figure 12 (a), by supporting tray Portion 52 rises, and makes to rise with the tray T1 that tray support sector 52 keeps.
Secondly, in the shown mounting portion for making the substrate P supported by substrate anchor 51b be placed in tray T1 of such as Figure 12 (b) When 20, vibrate support sector's actuator 71 with set frequency with the support sector's control unit 72 shown in Figure 15.Then, such as Figure 15 Shown, the vibration of support sector's actuator 71 is conveyed to tray support sector 52, and pallet anchor 52b is vibrated with set frequency.
After pallet anchor 52b is with set frequency vibration, which is conveyed to tray T1 by abutting part 52e, with the 1st Implementation form similarly, vibrated with set frequency by the mounting portion 20 of tray T1.Whereby, with Figure 12 (b) show the 1st implement Form similarly, removes the bending of substrate P, and substrate P flattens smooth.
In addition, as shown in Figure 12 (c), when keeping tray T1 to transport hand 12 and lifting, with the manual control shown in Figure 14 Portion 62 processed vibrates the lift motor 63b and linear motor 64a of hand actuator 61 with set frequency.At this point, can correspond to base The situation of plate P only vibrates lift motor 63b, or only vibrates linear motor 64a.
Then, the vibration of lift motor 63b and linear motor 64a are conveyed to conveying hand 12, transport hand 12 with set vibration Dynamic frequency vibrates in the direction that the upper surface of mounting portion 20 with tray T1 20a intersects and along the direction of 20a above.Transport hand 12 with After set frequency vibration, the vibration of conveying hand 12 is conveyed to tray T1 by abutting part 17, and the mounting portion 20 of tray T1 was with both Fixed vibration frequency is vibrated in all directions.
Then, in the same manner as the 1st implementation form shown in Figure 12 (c), below substrate P with the mounting portion 20 of tray T1 The upper surface of 20a sliding, the stress of substrate P is open, prevents the bending of substrate P.In addition, as shown in Figure 13 (a)~Figure 13 (c), When the substrate P for being placed in tray T1 is handover to substrate holding 9 also the curved of substrate P can be prevented in the same manner as the 1st implementation form It is bent.
As described above, using this implementation form, it not only can get effect same as the 1st implementation form, and nothing is being dragged Disk T1 sets necessity of oscillation actuator VA or tray side power supply ET, therefore the composition of base board delivery device 7 can be made succinct.
Secondly, being directed to the 3rd implementation form of the invention, Fig. 1~Figure 13 is quoted, Figure 16 and Figure 17 explanation is used.This implementation The base board delivery device 7b vibration generating unit of form be not set to tray (substrate support member) T2 and be set to conveying machine hand 4b and The aspect for removing access unit (entering and leaving oral area) 5b is different from the above-mentioned base board delivery device 7 of the 1st implementation form.Other aspects and the The base board delivery device 7 of 1 implementation form is identical, therefore assigns identical symbol to identical part and illustrate to omit.
Figure 16 shows the figure of the conveying hand 12 of this implementation form and the schematic configuration of tray T2, and (a) is corresponded to along Fig. 2's The constructed profile of the section of A-A ' line, (b) be (a) α 1 expanded view.Figure 17 illustrates that the pallet of this implementation form is supported The figure of the schematic configuration of portion 52 and tray T2, (a) correspond to the constructed profile of the section of the B-B ' line along Fig. 4, are (b) (a) β 1 expanded view.
As shown in Figure 16 (a) and Figure 16 (b), the tray T2 of this implementation form is being not provided in the display of Fig. 7 (a) and 7 (b) Oscillation actuator VA and tray side power supply ET aspect and the tray T-phase illustrated in the 1st implementation form are different, and other aspects are then set It is same with tray T-phase.
As shown in Figure 16 (a) and Figure 16 (b), the base board delivery device 7b of this implementation form have make transport hand 12 vibration and Make tray T2 vibration adds vibration portion V2.Add vibration portion V2 that there are the multiple oscillation actuators (vibration generating unit) for being set to conveying hand 12 VA1, set on conveying hand 12 hand side power supply (power supply) EH2.In addition, plus vibration portion V2 be as shown in Figure 17 (a) and 17 (b), It (is supplied with oscillation actuator (vibration generating unit) VA2, the support sector's side power supply for removing the tray support sector 52 of access unit 5b is set to Electric portion) EP2.
As shown in Figure 16 (a) and Figure 16 (b), oscillation actuator VA1 uses same with the oscillation actuator VA of the 1st implementation form Sample person, embedment transport the inside of hand 12 and are fixed on conveying hand 12.Oscillation actuator VA1 is respectively arranged on the mounting for supporting tray T2 The both sides of the part of a pair of of claw-like of the both sides 18,18 in portion 20.
Hand side power supply EH2 is made of power supply unit (diagram is omited), the hand side wiring 14b set on conveying machine hand 4b.Hand Side wiring 14 is that the power supply unit not illustrated of conveying machine hand 4b is connected to by one end by oscillation actuator VA1 and terminal Portion VAT1 electrical connection.
In addition, being equipped with and the same multiple abutting parts 17 of the 2nd above-mentioned implementation form in conveying the upper surface of hand 12.In this reality Form is applied, abutting part 17 is set near oscillation actuator VA1, is configured to Chong Die with oscillation actuator VA1 plane earth.Change speech It, in this embodiment, oscillation actuator VA1 is set near abutting part 17, is configured at Chong Die with 17 plane earth of abutting part Position.
As shown in Figure 17 (a) and Figure 17 (b), oscillation actuator VA2 uses same with the oscillation actuator VA of the 1st implementation form Sample person is embedded to pallet anchor 52b and is fixed on pallet anchor 52b.Support sector side power supply EP2 is to remove access unit by being set to Power supply unit (diagram is omited), the support sector side wiring 57b of 5b is constituted.Support sector side wiring 57b is that vibration is connected to by one end Actuator VA2 and another side, which are connected to, removes the power supply unit not illustrated of access unit 5b for oscillation actuator VA2 and power supply unit Electrical connection.
In addition, being equipped with abutting part 52e same as the 2nd above-mentioned implementation form in the upper surface of pallet anchor 52b.At this Implementation form, abutting part 52e are set near oscillation actuator VA2, are configured to Chong Die with oscillation actuator VA2 plane earth.It changes Yan Zhi, in this embodiment, oscillation actuator VA2 are set near abutting part 52e, are configured at and abutting part 52e plane earth The position of overlapping.
In this implementation form, in the shown substrate P mounting for making to be supported by substrate anchor 51b of such as Figure 12 (a)~Figure 12 (b) When the mounting portion 20 of tray T2, as shown in Figure 17 (a) and Figure 17 (b), from support sector side power supply EP2 to oscillation actuator VA2 is supplied electric power, and vibrates oscillation actuator VA2 with set frequency.Then, as shown in Figure 17 (b), oscillation actuator VA2 Vibrate pallet anchor 52b with set frequency.
After pallet anchor 52b is with set frequency vibration, which is conveyed to tray T2 by abutting part 52e, with the 1st Similarly, the mounting portion 20 of tray T2 is vibrated with set vibration frequency for implementation form and the 2nd implementation form.Whereby, with scheming 1st implementation form of 12 (b) displays similarly, removes the bending of substrate P, substrate P flattens smooth.
Here, oscillation actuator VA2 is set near abutting part 52e in this implementation form, it is configured at and abutting part 52e The position of plane earth overlapping.It is therefore prevented that subtracting for vibration declines, it can be good by the vibrational energy efficiency generated in oscillation actuator VA2 It is conveyed to tray T2 and substrate P well.
In addition, as shown in Figure 12 (c), when keeping tray T2 to transport hand 12 and lifting, in Figure 16 (a) and Figure 16 (b) the hand side power supply EH2 shown supplies electric power oscillation actuator VA2, and oscillation actuator VA1 is made to shake with set frequency It is dynamic.After oscillation actuator VA1 is with set frequency vibration, transports hand 12 and vibrated with set frequency.Hand 12 is transported with set After frequency vibration, the vibration of conveying hand 12 is conveyed to tray T2 by abutting part 17, and the mounting portion 20 of tray T2 is with set vibration Dynamic frequency vibration.
Then, in the same manner as the 1st implementation form shown in Figure 12 (c), below substrate P with the mounting portion 20 of tray T2 The upper surface of 20a sliding, the stress of substrate P is open, prevents the bending of substrate P.In addition, as shown in Figure 13 (a)~Figure 13 (c), When the substrate P for being placed in tray T2 is handover to substrate holding 9 also the curved of substrate P can be prevented in the same manner as the 1st implementation form It is bent.
Here, as shown in Figure 16 (a) and Figure 16 (b), oscillation actuator VA1 is set to abutting part 17 in this implementation form Near, it is configured at the position Chong Die with 17 plane earth of abutting part.It, can will be in oscillation actuator VA1 it is therefore prevented that vibration subtracts and declines The vibrational energy efficiency of generation is conveyed to tray T2 and substrate P well.
As described above, using this implementation form, it not only can get effect same as the 1st implementation form, and nothing is being dragged Disk T2 sets necessity of oscillation actuator VA or tray side power supply ET, therefore the composition of base board delivery device 7 can be made succinct.In addition, Compared with the 2nd implementation form, can also tray T2 be continued to give the same vibration in the movement of hand 12 and tray support sector 52 by transporting It is dynamic.
Though in addition, in this implementation form it is stated that have the composition of multiple oscillation actuator VA1, VA2 respectively, these Respectively to be arranged in conveying hand 12 and tray support sector 52 1 few.
Also, the substrate P as above-mentioned implementation form, not only the glass substrate of suitable displays element, is also applied for half Light shield or graticule used in the semiconductor crystal wafer of conductor element manufacture, the ceramic wafer of film magnetic head or exposure device Master (synthetic quartz, Silicon Wafer) of piece etc..
Also, making light shield M and substrate P synchronizing moving via the exposure of the pattern of light shield M in addition to being applicable in as exposure device The scanning exposure apparatus (scanning stepper) for making the step-scan mode of substrate P scan exposure with light IL outside, is also applicable to Repeat the pattern single exposure of light shield M, the stepping for keeping substrate P sequentially stepping mobile in the state that light shield M and substrate P are static The projection aligner (stepper) of mode.
Also, the present invention is also applicable to No. 6208407 No. 6341007 specifications of U.S. Patent No., U.S. Patent No. explanations The revealed double microscope carrier type exposure devices for having multiple baseplate carriers such as No. 6262796 book, U.S. Patent No. specifications.
Also, the present invention is also applicable to No. 6897963 specifications of U.S. Patent No., European Patent Application Publication No. 1713113 specifications etc. are revealed to be had the baseplate carrier for keeping substrate and substrate, mounting is not kept to be formed with fiducial mark The exposure device of the measurement microscope carrier of the reference feature of note and/or various photoelectric sensors.Have multiple baseplate carriers also, can be used And the exposure device of measurement microscope carrier.
In addition, in above-mentioned implementation form, though using set light-shielding pattern (or phase diagram is formed on transmitance substrate Case, dim light pattern) light transmission type light shield, but substitute this light shield, taken off using such as No. 6778257 specifications of U.S. Patent No. That shows forms the variable forming light shield of transmission pattern or reflection graphic patterns or luminous pattern according to the electronic data of pattern to be exposed (also referred to as electronics light shield, active light shield or image generator) also may be used.Also, substitution has non-luminescent type image display element Variable forming light shield, has the patterning device comprising emissive type image display element and also may be used.
The exposure device of above-mentioned implementation form is the group in a manner of keeping set mechanical precision, electric precision, optical accuracy Dress includes each subsystem for each component that scope of the present invention patent is recorded to manufacture.In order to ensure the various essences Various optical systems are carried out the adjustment to reach optical accuracy before and after the assembling, used various mechanical systems by degree To reach the adjustment of mechanical precision, the adjustment to reach electric precision is carried out to various electrical systems.
From each subsystem to the assembling steps of exposure device, include the mutual mechanical connection of each subsystem, circuit Wiring connection, the piping of pneumatic circuit connection etc..Before the assembling steps from each subsystem to exposure device, have certainly each The other assembling steps of subsystem.After the assembling steps of each subsystem to exposure device, structure adjusting is carried out with true Protect the various precision of exposure device entirety.In addition, the manufacture of exposure device is dustless to be managed in temperature and vacuum degree etc. Room is preferred.
The microcomponent of semiconductor element etc. is as shown in figure 18 manufactured via following step, that is, carries out the function of microcomponent The step 201 of energy/performance design, according to the design procedure make light shield (graticule) step 202, manufacture element substrate be The step 203 of substrate, comprising processing substrate (exposure-processed) (comprising according to above-mentioned implementation form using the pattern of light shield to expose Use up the movement for making base plate exposure and make expose metacoxal plate (emulsion) development movement) substrate processing step 204, element Assembling steps (processing program comprising cutting step, engagement step, encapsulation step etc.) 205 and checking step 206 etc..This Outside, in step 204, comprising it is (photosensitive after development to form exposure diagram pattern layer corresponding with the pattern of light shield by making emulsion develop The layer of agent), the movement that substrate is processed by the exposure diagram pattern layer.
In addition, the important document of above-mentioned implementation form can be suitably combined.Also, also there is the constituent element that a part is not used Situation.Also, quoting in the reference of above-mentioned implementation form in the range of being allowed by the law about all open public of exposure device etc. A part that the announcement of report and United States Patent (USP) is recorded as this specification.

Claims (21)

1. a kind of base board delivery device is to transport the substrate for being placed in substrate support member together with the substrate support member, It is characterized in that having:
Make the aforesaid base plate support member vibration for being placed with aforesaid base plate adds vibration portion；
Keep the conveying unit of the aforementioned aforesaid base plate support member for adding vibration portion to make vibration and movement.
2. base board delivery device as described in claim 1, it is characterised in that wherein, aforementioned plus vibration portion includes to be set to aforesaid base plate Support member simultaneously vibrates generating unit based on at least one for making aforesaid base plate support member generate vibration is supplied electric power.
3. base board delivery device as claimed in claim 2, it is characterised in that wherein, aforementioned plus vibration portion includes to produce to aforementioned vibration Life portion carries out the power supply of power supply, and at least part of the power supply is set to aforementioned conveying unit.
4. base board delivery device as claimed in claim 2, it is characterised in that wherein, have: support is placed with aforesaid base plate The discrepancy oral area of aforesaid base plate support member；
Aforementioned plus vibration portion includes the power supply that power supply is carried out to aforementioned vibration generating unit, and at least part of the power supply is set In aforementioned discrepancy oral area；
Aforementioned conveying unit keeps being supported in the aforementioned aforesaid base plate support member for entering and leaving oral area and movement.
5. base board delivery device as claimed in claim 4, it is characterised in that wherein, before aforementioned discrepancy oral area has support respectively State multiple support sectors of the different location of substrate support member；
Aforesaid plurality of support sector is configured at the aforementioned vibration in the aforesaid base plate support member that do not support with multiple support sector and produces Life portion is in the position for overlooking overlapping.
6. base board delivery device as described in claim 1, it is characterised in that wherein, aforementioned plus vibration portion includes to be based on supplying electric power The part for keeping aforesaid base plate support member among aforementioned conveying unit is set to generate at least one vibration generating unit of vibration.
7. base board delivery device as claimed in claim 6, it is characterised in that wherein, aforementioned conveying unit has holding aforesaid base plate The conveying hand of support member, the actuator for keeping aforementioned conveying hand mobile；
Aforementioned vibration generating unit, which has, controls the control unit that aforementioned actuator vibrates aforementioned conveying hand.
8. base board delivery device as claimed in claim 6, it is characterised in that wherein, aforementioned conveying unit has holding aforesaid base plate The conveying hand of support member；
Aforementioned vibration generating unit has at least one oscillation actuator for being set to aforementioned conveying hand and vibrating aforementioned conveying hand.
9. base board delivery device as claimed in claim 8, it is characterised in that wherein, before aforementioned conveying unit is further equipped with support State multiple abutting parts of substrate support member；
Aforementioned oscillation actuator is configured near aforementioned abutting part.
10. the base board delivery device as described in any claim in claim 7 to 9, it is characterised in that wherein, aforementioned actuating Device be set as can by it is aforementioned conveying hand the substrate seating surface along aforesaid base plate support member direction and with aforesaid base plate seating surface At least one party in the direction of intersection is mobile.
11. base board delivery device as described in claim 1, it is characterised in that wherein, have: support is placed with aforesaid base plate The discrepancy oral area of aforesaid base plate support member；
Aforementioned plus vibration portion includes to be set to aforementioned discrepancy oral area and so that aforementioned discrepancy oral area is generated at least the 1 of vibration based on supplying electric power A vibration generating unit.
12. base board delivery device as claimed in claim 11, it is characterised in that wherein, aforementioned discrepancy oral area has to be supported respectively Multiple support sectors of the different location of aforesaid base plate support member；
Aforementioned vibration generating unit has set on aforementioned support sector and makes at least one oscillation actuator of aforementioned support sector's vibration.
13. the base board delivery device as described in any claim in claim 11 or 12, it is characterised in that wherein, it is aforementioned go out Inlet portion has the multiple support sectors for the different location for supporting aforesaid base plate support member respectively, the cause for keeping aforementioned support sector mobile Dynamic device；
Aforementioned vibration generating unit, which has, controls the control unit that aforementioned actuator vibrates aforementioned support sector.
14. the base board delivery device as described in any claim in claim 1 to 13, it is characterised in that wherein, aforementioned to remove Portion is sent to make aforesaid base plate support member toward the substrate holding movement for keeping aforesaid base plate, before which is supported It states substrate delivery/reception and keeps having to aforesaid base plate.
15. base board delivery device as claimed in claim 14, it is characterised in that wherein, aforementioned conveying unit is by aforesaid base plate branch It holds component and is handover to aforesaid base plate holding tool.
16. base board delivery device as claimed in claim 15, it is characterised in that wherein, aforementioned conveying unit is protected to aforesaid base plate Hold the middle mounting aforesaid base plate of tool holding tool portion handover aforesaid base plate, to aforesaid base plate keep tool among with aforementioned holding tool portion Different portion interfaces aforesaid base plate support member.
17. base board delivery device as claimed in claim 16, it is characterised in that wherein, aforementioned conveying unit is protected to aforesaid base plate It holds the groove portion that channel-shaped is set as to aforementioned holding tool portion among tool and joins aforesaid base plate support member.
18. the base board delivery device as described in any one of claim 2 to 17 claim, it is characterised in that wherein, aforementioned The both sides of conveying unit holding aforesaid base plate support member.
19. a kind of exposure device uses up the substrate irradiation exposure that substrate holding is kept and exposes aforesaid base plate, feature It is:
Have and substrate described in any one of claims 1 to 18 claim of tool conveying aforesaid base plate is kept aforesaid base plate Carrying device.
20. a kind of substrate supporting device supports substrate, it is characterised in that include
Load the mounting portion of aforesaid base plate；
Set on aforementioned mounting portion and make the vibration generating unit of aforementioned mounting portion vibration.
21. a kind of manufacturing method, it is characterised in that include:
Make the movement of the base plate exposure using the exposure device described in claim 19；And
Movement based on the aforesaid base plate after exposure results processing exposure.
CN201810725930.1A 2009-10-28 2010-10-28 Base board delivery device, exposure device, substrate supporting device and manufacturing method Pending CN109003917A (en)

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US27274509P 2009-10-28 2009-10-28
US61/272,745 2009-10-28
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JPWO2011052683A1 (en) 2013-03-21
CN104221137B (en) 2018-08-03
TW201132570A (en) 2011-10-01
KR101982454B1 (en) 2019-05-27

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