JP2007114570A - Substrate holder, exposure device and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holder that can mount substrates tightly on a substrate mount face without leaving a space. <P>SOLUTION: The substrate holder includes a substrate mount face 14 to mount a substrate P having an outer diameter of 500 mm or more and the thickness of 1.5 mm or less, and a vibration member 15 to vibrate a least a part of the substrate mount face 14 when mounting the substrate P on the substrate mount face 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate holder for manufacturing a microdevice such as a flat panel display element such as a liquid crystal display element in a lithography process, an exposure apparatus provided with the substrate holder, and a device manufacturing method using the exposure apparatus. is there.

  When manufacturing a liquid crystal display element or the like, which is one of the micro devices, a mask (reticle, photomask, etc.) pattern is applied to a large substrate (glass plate, semiconductor wafer) coated with photoresist, etc. via a projection optical system. Etc.) A projection exposure apparatus that performs projection exposure on top is used. When projection exposure is performed in the projection exposure apparatus, the large substrate is transported onto the substrate holder included in the projection exposure apparatus by the substrate transport apparatus, and is sucked and held on the substrate holder (see Patent Document 1).

JP 11-67882 A

  By the way, the glass substrate is enlarged with the enlargement of a liquid crystal display element, and the glass substrate of 1 square meter or more is also used now. In addition, the glass substrate is transported onto the substrate holder of the exposure apparatus and is sucked and held on the surface of the substrate holder (substrate mounting surface), but a gap is created between the glass substrate and the substrate mounting surface. It is necessary to make it adhere | attach on a board | substrate mounting surface. However, since the glass substrate is a thin plate, it has waviness and warpage, and when the glass substrate is adsorbed on the substrate mounting surface, a gap is partially generated between the glass substrate and the substrate mounting surface. Sometimes.

  An object of the present invention is to provide a substrate holder capable of bringing a substrate into close contact with a substrate mounting surface without any gap, an exposure apparatus provided with the substrate holder, and a device manufacturing method using the exposure apparatus.

  The substrate holder (14) of the present invention includes a substrate placement surface on which the substrate (P) is placed, and a vibration member (15) that vibrates at least a part of the substrate placement surface.

  Moreover, the exposure apparatus (100) of this invention is equipped with the board | substrate holder (14) of this invention which mounts the said board | substrate (P) in the exposure apparatus (100) which exposes a predetermined pattern on a board | substrate (P). It is characterized by that.

  The device manufacturing method of the present invention includes an exposure step of exposing a predetermined pattern on a substrate (P) using the exposure apparatus (100) of the present invention, and the substrate (P) exposed by the exposure step. And a developing step for developing the film.

  According to the substrate holder of the present invention, since the vibration member that vibrates at least a part of the substrate placement surface is provided, the substrate placement surface is vibrated when placing the substrate on the substrate placement surface. Can be brought into close contact with the substrate placement surface without any gap.

  In addition, according to the exposure apparatus of the present invention, since the substrate holder of the present invention is provided, the substrate can be brought into close contact with the substrate holder without any gap, and the substrate can be satisfactorily exposed on the flatness maintained. Can do.

  Further, according to the device manufacturing method of the present invention, since exposure is performed by the exposure apparatus of the present invention, it is possible to perform good exposure on a substrate maintaining flatness, and it is possible to obtain a good device.

  Since the exposure apparatus according to the present invention includes the substrate holder having the vibrating member, the substrate can be brought into close contact with the substrate holder without a gap by causing the substrate holder to vibrate slightly when the substrate is attracted onto the substrate holder. In particular, it is effective for a substrate having an outer diameter larger than 500 mm and a thickness smaller than 1.5 mm, such as a substrate for a flat panel display such as a liquid crystal display element.

  A liquid crystal exposure apparatus (exposure apparatus) according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view illustrating a schematic configuration of the liquid crystal exposure apparatus 100 and the transfer robot 20 according to the embodiment. In the following description, the orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the surface (substrate mounting surface) of the plate holder 14, and the Z axis is relative to the surface of the plate holder 14 (substrate mounting surface). It is set in the orthogonal direction. In the XYZ orthogonal coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z axis is set to the vertical direction.

  The liquid crystal exposure apparatus 100 includes an illumination system (not shown) that illuminates a reticle R as a mask with exposure illumination light IL, a reticle stage (not shown) that holds the reticle R, a projection optical system PL that is arranged below the reticle stage, and A plate stage PST or the like that moves on the base 12 in the XY two-dimensional direction below the projection optical system PL is provided. On the plate stage PST, a metal or ceramic plate holder (hereinafter referred to as a holder) 14 is mounted as a substrate holder.

  In this liquid crystal exposure apparatus 100, step-and-scan exposure is performed with a glass plate (hereinafter referred to as a plate) P serving as a substrate placed on the surface (substrate placement surface) of the holder 14. Is called. That is, a reticle stage (not shown) that holds the reticle R and the plate P are held via the holder 14 in a state where the slit illumination area on the reticle R is illuminated by the exposure illumination light IL from the illumination system (not shown). The pattern of the reticle R is sequentially transferred onto the plate P by moving it in a predetermined scanning direction (Y direction) in synchronization with the plate stage PST. The plate P is a substrate for a flat panel display, and has an outer diameter larger than 500 mm and a thickness smaller than 1.5 mm. Here, that the outer diameter is larger than 500 mm means that one side or diagonal of the plate P is larger than 500 mm.

  In addition, a horizontal joint type transfer robot (hereinafter referred to as a robot) 20 is provided in the vicinity of the liquid crystal exposure apparatus 100. The robot 20 includes an arm portion 22, a transfer arm 24 having two claw portions 23, and a drive device 25 that drives the arm portion 22. Four collar portions 27 provided at both ends of the holding member 26 for carrying the substrate holding the plate P are held from below by the two claw portions 23, and the holding member 26 is held by the transfer arm 24. The holding member 26 includes a rectangular outer frame 28 that is slightly larger than the plate P, and a plurality of linear members 32 stretched in a lattice pattern at predetermined intervals inside the outer frame 28. A plurality of rectangular openings 33 are formed inside each lattice constituted by the plurality of linear members 32.

  On the upper surface (substrate mounting surface) of the holder 14, a storage unit that stores the holding member 26 is provided so that the substrate mounting surface and the plate P are in contact with each other. In other words, the linear member 32 is engaged with (or fitted into) the substrate mounting surface corresponding to the grid-like linear members 32 constituting the holding member 26 so that the linear members 32 are embedded. A grid-like groove 14a having a depth is formed. The substrate mounting surface of the holder 14 is finished with high flatness so as to remove the bending of the plate P when the plate P is mounted. In addition, the substrate mounting surface of the holder 14 is provided with a number of intake holes (not shown) for closely contacting the plate P following the substrate mounting surface, corresponding to the plurality of rectangular openings 33. ing. In addition, an air intake hole (not shown) for attracting and fixing the lower surface of the outer frame 28 of the holding member 26 is provided around the holder 14.

  FIG. 2 is a diagram illustrating the configuration of the holder 14. As shown in FIG. 2, the groove 14 a of the holder 14 is provided with a plurality of vibration members 15 that vibrate (microvibration) at least a part of the substrate placement surface of the holder 14. The vibration member 15 includes a vibration element, a vibration motor, an electromagnetic resonance type vibration element, and the like that constitute a vibrator function used for calling a mobile phone, for example. When the vibration member 15 vibrates, part or all of the substrate placement surface of the holder 14 vibrates.

  FIG. 3 is a flowchart for explaining the operation until the plate P is transported by the transport robot 20 and is attracted to the substrate placement surface of the holder 14.

  The transport arm 24 is driven via the arm portion 22 by the driving device 25, and the plate P is transported to the upper portion of the holder 14 integrally with the holding member 26 (step S10). The position of the transfer arm 24 in the Z direction can be detected by a position detection device (not shown). By driving the driving device 25, the position of the transport arm 24 is adjusted so that the lattice-like linear member 32 and the lattice-like groove 14 a on the substrate mounting surface of the holder 14 face each other. Then, the transport arm 24 is driven downward by a predetermined amount by the driving device 25 (step S11). A position detection device (not shown) detects the position of the transport arm 24 in the Z direction (step S12). Based on the detection result by the position detection device, that is, when the transport arm 24 reaches a predetermined position (step S13), the plurality of vibration members 15 arranged in the groove 14a of the holder 14 starts vibrating (step S13). S14). When the vibration member 15 starts to vibrate, the substrate placement surface of the holder 14 slightly vibrates. Here, the predetermined position is any position before the plate P touches the substrate placement surface of the holder 14 after the transport arm 24 starts to descend. That is, the vibration member 15 starts to vibrate before the plate P touches the substrate mounting surface of the holder 14.

  Further, the transport arm 24 is lowered, the lattice-like linear member 32 is fitted into the groove 14 a of the holder 14, and the linear member 32 is lowered below the substrate placement surface of the holder 14. Thereby, only the plate P contacts the substrate placement surface of the holder 14. Here, the suction starts after the plate P touches the substrate placement surface of the holder 14 (step S15). That is, suction by a vacuum pump (not shown) is started, and the plate P is sucked radially from the center of the holder 14 that is microvibrated (step S16). The lower surface of the plate P is adsorbed radially from the center of the holder 14 through the intake holes formed corresponding to the plurality of openings 33 and fixed to the holder 14. At this time, since the substrate mounting surface of the holder 14 is slightly vibrated, the frictional force between the plate P and the substrate mounting surface of the holder 14 can be reduced, and the plate P is radiated from the center of the holder 14. In addition, there is no gap between the holder 14 and the substrate mounting surface. After the plate P is adsorbed onto the substrate mounting surface of the holder 14 and the suction by the vacuum pump is finished (step S17), the vibration member 15 stops the vibration (step S18).

  When the transfer operation of the plate P onto the holder 14 is completed, the transport arm 24 is driven by the driving device 25 and retracted from the holder 14. When the exposure is completed, the transport arm 24 is driven by the driving device 25, and the two claw portions 23 of the transport arm 24 are − on both sides in the X direction of the holder 14 below the holding member 26 placed on the holder 14. It is inserted from the Y direction side. At the same time, the adsorption of the plate P by the holder 14 is released. When the transport arm 24 is driven upward by a predetermined amount by the driving device 25, the holding member 26 that supports the plate P is lifted above the holder 14. The transport arm 24 is driven by the driving device 25, and the plate P is transported to a developing device (not shown) while being held by the holding member 26.

  Since the plate holder according to this embodiment includes the vibration member that vibrates at least a part of the substrate placement surface of the holder, the plate can be brought into close contact with the substrate placement surface without any gap.

  In addition, according to the liquid crystal exposure apparatus according to this embodiment, since the plate holder that allows the plate to be closely attached to the substrate mounting surface of the plate holder without a gap is provided, the flatness is maintained on the plate. Good exposure can be achieved.

  In this embodiment, the plate P is sucked radially from the center of the holder 14 in step S16 of FIG. 3, but the two parts are sucked after the center of the holder 14 is sucked. May be adsorbed. Moreover, you may adsorb | suck the whole surface of the holder 14 at once.

  In this embodiment, the vibration member 15 for vibrating the substrate mounting surface of the holder 14 is disposed at the bottom of the groove 14a of the holder 14, but a place other than the groove 14a of the holder 14, for example, a holder You may arrange | position so that it may embed in the back surface of 14.

  Further, in this embodiment, the vibration member 15 is vibrated until the plate P touches the substrate placement surface of the holder 14 until it is adsorbed, but at least the plate P is placed on the substrate placement of the holder 14. The vibration member 15 may be vibrated when placed on the surface. That is, the vibration member 15 may be vibrated at one or more times at least at any time from when the plate P touches the substrate mounting surface of the holder 14 until it is attracted.

  Further, in this embodiment, the vibration member 15 is vibrated based on the position of the transfer arm 24 in the Z direction detected by the position detection device, but the vibration member 15 is driven based on the drive time of the transfer arm 24. You may make it vibrate. That is, the vibration of the vibration member 15 is started when a predetermined drive time has elapsed.

  In this embodiment, an exposure apparatus for manufacturing a liquid crystal display element is described as an example. However, the present invention is not limited to the liquid crystal exposure apparatus, and for example, an integrated circuit pattern is transferred onto a wafer. It may be an exposure apparatus for manufacturing a semiconductor or an exposure apparatus for manufacturing a thin film magnetic head.

  In the exposure apparatus according to the above-described embodiment, a micro pattern (semiconductor) is obtained by exposing a photosensitive substrate (plate) with a transfer pattern formed by a reticle (mask) using a projection optical system (exposure process). Element, image sensor, liquid crystal display element, thin film magnetic head, etc.). FIG. 4 is a flowchart of an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate or the like as a photosensitive substrate using the exposure apparatus according to the above-described embodiment. Will be described with reference to FIG.

  First, in step S301 in FIG. 4, a metal film is deposited on one lot of plates. In the next step S302, a photoresist is applied on the metal film on the one lot of plates. Thereafter, in step S303, using the exposure apparatus according to the above-described embodiment, the mask pattern image is sequentially exposed and transferred to each shot area on the plate of the one lot via the projection optical system. After that, in step S304, the photoresist on the one lot of plates is developed, and in step S305, etching is performed on the one lot of plates using the resist pattern as a mask to cope with the mask pattern. A circuit pattern to be formed is formed in each shot region on each plate.

  Thereafter, an upper layer circuit pattern is formed, and the plate is cut into a plurality of devices to manufacture devices such as semiconductor elements. According to the semiconductor device manufacturing method described above, since the exposure is performed using the exposure apparatus described above, a good semiconductor device can be obtained. In steps S301 to S305, a metal is vapor-deposited on the plate, a resist is applied on the metal film, and exposure, development and etching processes are performed. Prior to these processes, the process is performed on the plate. It is needless to say that after forming a silicon oxide film, a resist may be applied on the silicon oxide film, and steps such as exposure, development, and etching may be performed.

  In the exposure apparatus according to the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. First, in FIG. 5, in a pattern forming step S401, a so-called photolithographic step of transferring and exposing a mask pattern onto a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure apparatus according to the above-described embodiment. Is executed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix or three of R, G, and B A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like. In the cell assembly step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern formation step S401 and the color filter obtained in the color filter formation step S402, and a liquid crystal panel (liquid crystal cell ).

  Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, since exposure is performed using the above-described exposure apparatus, a good liquid crystal display element can be obtained.

It is a perspective view which shows schematic structure of the liquid-crystal exposure apparatus concerning embodiment, and a conveyance robot. It is a figure which shows the structure of the plate holder concerning embodiment. It is a flowchart for demonstrating operation | movement until a plate is conveyed by the conveyance robot and is adsorb | sucked to a substrate mounting surface. It is a flowchart which shows the manufacturing method of the semiconductor device as a microdevice concerning embodiment of this invention. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 12 ... Base, 14 ... Plate holder, 15 ... Vibration member, 20 ... Robot, 22 ... Arm part, 23 ... Claw part, 24 ... Transfer arm, 25 ... Drive apparatus, 26 ... Holding member, 27 ... Collar part, 28 ... Outer frame, 32 ... linear member, 33 ... opening, 100 ... liquid crystal exposure apparatus, IL ... illumination light for exposure, R ... reticle, PL ... projection optical system, P ... plate, PST ... plate stage.

Claims (9)

A substrate mounting surface on which the substrate is mounted;
A substrate holder comprising: a vibration member that vibrates at least a part of the substrate placement surface.   The substrate holder according to claim 1, wherein the vibration member vibrates the substrate placement surface at least when the substrate is placed on the substrate placement surface.   3. The vibrating member vibrates the substrate mounting surface at least at any time between the time when the substrate touches the substrate mounting surface and the time when the substrate is attracted. The substrate holder as described. The substrate is held by a holding member for transporting the substrate when transported on the substrate mounting surface,
The said board | substrate mounting surface is equipped with the accommodating part which accommodates the said holding member so that the said board | substrate mounting surface and the said board | substrate may contact | connect, The Claim 1 thru | or 3 characterized by the above-mentioned. The substrate holder as described.   The substrate holder according to any one of claims 1 to 4, wherein the substrate has an outer diameter larger than 500 mm.   The substrate holder according to any one of claims 1 to 5, wherein the substrate has a thickness of less than 1.5 mm.   The substrate holder according to any one of claims 1 to 6, wherein the substrate is a substrate for a flat panel display. In an exposure apparatus that exposes a predetermined pattern on a substrate,
An exposure apparatus comprising the substrate holder according to claim 1, wherein the substrate is placed thereon. An exposure step of exposing a predetermined pattern on the substrate using the exposure apparatus according to claim 8;
And a development step of developing the substrate exposed in the exposure step.

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