JP2007065527A - Exposure device and method for manufacturing micro device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure device capable of efficiently cleaning the inside of a groove part formed in a substrate holding member. <P>SOLUTION: The exposure device exposing a photosensitive substrate with a prescribed pattern through a projection optical system is provided with: a substrate stage PH which holds a substrate P and has a recessed part (groove part) 50 on a holding surface for holding the substrate P along a prescribed direction; a cleaning device 30 cleaning the inside of the recessed part formed on the substrate stage PH; and a driving device relatively moving the cleaning device 30 and the substrate stage PH so that the cleaning device 30 is moved along the prescribed direction with respect to the recessed part 50. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure apparatus for manufacturing a microdevice such as a flat panel display element such as a liquid crystal display element in a lithography process and a method of manufacturing a microdevice using the exposure apparatus.

  Conventionally, when manufacturing a flat panel display element such as a liquid crystal display element by a photolithography technique, an exposure apparatus is used, and a photomask or reticle pattern is coated with a photosensitive agent such as a photoresist on the surface. Transferred onto the substrate. In such an exposure apparatus, in order to place the substrate on the substrate stage in a flat state, the substrate is held by a substrate holder (substrate holding member), and the substrate holder is placed on the substrate stage.

  Here, in the exposure apparatus, since a large number of substrates are subjected to exposure processing, the substrates are replaced. However, when replacing the substrates, dust, dirt, resist residue, etc. may adhere to the substrate holder. There was a need to perform regular cleaning work. Therefore, conventionally, in order to make the substrate holder cleanable, the apparatus is stopped at regular intervals, the exposure operation is interrupted, and the substrate holder is manually cleaned.

  However, when cleaning is performed manually, the operation takes time, and the operation efficiency of the exposure apparatus is reduced, and the state after cleaning may differ depending on the skill level of the operator. Therefore, a cleaning apparatus that mechanically cleans the substrate holder, an exposure apparatus that includes a cleaning unit, and the like have been developed. For example, a cleaning device has been developed that cleans a substrate holding member by placing a cleaning grindstone on the substrate holding member and rotationally driving the grindstone on the substrate holding member (see, for example, Patent Document 1). .

JP-A-8-330217

  By the way, the exposure apparatus may be provided with a concave portion on the substrate holding surface of the substrate holding member, that is, a groove portion for storing a substrate carrying holding member (substrate carrying tray) for carrying the substrate. . In this exposure apparatus, the substrate placed on the substrate transfer tray is transferred onto the substrate holding member, and the substrate transfer tray is stored in the groove portion of the substrate holding member to hold the substrate on the substrate holding member. . In such an exposure apparatus, even if the cleaning apparatus described in the above-mentioned patent document is used, cleaning in the groove of the substrate holder cannot be performed.

  An object of the present invention is to provide an exposure apparatus capable of efficiently cleaning the inside of a groove formed in a substrate holding member, and a method of manufacturing a micro device using the exposure apparatus.

  The exposure apparatus of the present invention is an exposure apparatus that exposes a predetermined pattern onto a photosensitive substrate via a projection optical system, and holds the photosensitive substrate and has a predetermined concave portion on a holding surface that holds the photosensitive substrate. A substrate holding member provided along the direction of the substrate, a cleaning unit for cleaning the inside of the recess formed in the substrate holding member, and the cleaning unit moves along the predetermined direction with respect to the recess. As described above, the apparatus includes a moving unit that relatively moves the cleaning unit and the substrate holding member.

  According to the exposure apparatus of the present invention, cleaning is performed by relatively moving the substrate holding member and the cleaning unit so that the cleaning unit moves along the recess provided in the holding surface for holding the photosensitive substrate in the substrate holding member. Is going. Therefore, cleaning can be performed quickly and at a constant level, and the operating efficiency of the exposure apparatus can be improved.

  The microdevice manufacturing method of the present invention is a microdevice manufacturing method in which a predetermined pattern is exposed on a photosensitive substrate, and the microdevice is manufactured from the photosensitive substrate, using the exposure apparatus of the present invention. The method includes an exposure step of exposing the predetermined pattern on the photosensitive substrate, and a developing step of developing the photosensitive substrate exposed by the exposure step.

  According to the microdevice manufacturing method of the present invention, since the predetermined pattern is exposed on the photosensitive substrate using the exposure apparatus of the present invention, the microdevice can be manufactured with high throughput.

  According to the exposure apparatus of the present invention, the substrate holding member and the cleaning unit are relatively moved so that the cleaning unit moves along the recess provided in the holding surface for holding the photosensitive substrate in the substrate holding member. To clean the inside of the recess. Accordingly, it is possible to always perform the cleaning operation at a constant level, and it is possible to greatly reduce the time for stopping the operation of the exposure apparatus in order to perform the cleaning operation. Therefore, it is possible to improve the operation efficiency of the exposure apparatus, and it is possible to perform exposure with a high throughput by performing a reliable cleaning operation, and thus it is possible to manufacture a microdevice with a high throughput.

  An exposure system including an exposure apparatus according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic block diagram of a device manufacturing system provided with an exposure system including an exposure apparatus according to this embodiment. In the following description, the synchronous movement direction (scanning direction) between the mask M (see FIG. 2) and the substrate P in the horizontal plane is the X direction, and the direction orthogonal to the X direction is the Y direction (non-scanning direction) in the horizontal plane. A direction perpendicular to the X direction and the Y direction is taken as a Z direction.

  As shown in FIG. 1, the device manufacturing system includes an exposure system EXS and a coater / developer apparatus CDS. The coater / developer apparatus CDS develops the substrate P after the exposure process in the coating apparatus (coater) C for applying a photoresist to the substrate P before the exposure process and the exposure apparatus EX provided in the exposure system EXS. A developing device (developer) D and a transport device 100 for transporting the substrate P to the exposure system EXS are provided. The coater / developer apparatus CDS is accommodated in the second chamber CH2 in which the cleanliness is controlled.

  The exposure system EXS includes a transport unit H that transports a substrate P for a flat panel display having an outer diameter larger than 500 mm between the coater developer device CDS and the substrate stage PST of the exposure device EX, an exposure device EX, and an exposure system. And a control device CONT that controls the overall operation of the EXS. In addition, that an outer diameter is larger than 500 mm means that one side or a diagonal is larger than 500 mm. The exposure system EXS (exposure apparatus EX and transport unit H) is accommodated in the first chamber CH1 in which the cleanness is controlled.

  The transport unit H forms part of an interface unit with the coater / developer apparatus CDS, receives the substrate P transported from the transport apparatus 100 of the coater / developer apparatus CDS, and the substrate stage PST and the port section of the exposure apparatus EX. 10 is provided with a substrate transfer unit 20 that transfers the substrate P to and from 10. The port unit 10 also has a function of receiving the exposed substrate P from the substrate transport unit 20.

  The port unit 10 includes a tray support unit 2 that supports a tray (substrate holding member) T on which a substrate is placed. The tray support portion 2 includes a frame-shaped support member 9 and a plurality (eight in this embodiment) of tray support pins 11 provided on the support member 9 and supporting the lower surface of the tray T. ing.

  The tray support portion 2 is configured to be movable in the Z direction by a tray support portion driving device (not shown). The control device CONT moves the tray support 2 in the Z direction via the tray support drive. As the tray support 2 moves, the tray T supported by the tray support 2 also moves in the Z direction. As the tray support unit 2 is raised, the tray T rises and approaches the substrate P to support the lower surface of the substrate P. Further, the substrate transport unit 20 constituting a part of the transport unit H is configured to place the substrate P on the tray T and transport the substrate P, and loads and unloads the substrate P with respect to the substrate stage PST.

  FIG. 2 is a schematic perspective view of the device manufacturing system shown in FIG. As shown in FIG. 2, in the exposure apparatus EX, a mask stage MST that supports a mask M, a substrate stage PST, and a groove portion (concave portion) 50 that is placed on the substrate stage PST and accommodates the tray T in a predetermined direction. A substrate holder (substrate holding member) PH provided along the illumination optical system IL for illuminating the mask M supported by the mask stage MST with the exposure light EL, and a pattern of the mask M illuminated with the exposure light EL. A projection optical system PL that projects and exposes an image onto the substrate P and a cleaning device 30 (cleaning means) that cleans the grooves of the substrate holder PH are provided. The exposure apparatus EX is configured so that the mask M and the substrate P are synchronously moved in a predetermined direction with respect to the projection optical system PL composed of a plurality (five in this embodiment) of projection optical modules PL1 to PL5. This is a multi-lens scan type exposure apparatus that projects and exposes a pattern onto a substrate P.

  The positions of mask stage MST and substrate stage PST are measured and controlled by a laser interferometer (not shown). A laser interferometer used for measuring and controlling the position of the substrate stage PST includes a movable mirror (not shown) fixed to the substrate stage PST and a fixed mirror (not shown) fixed to the projection optical system PL. Measure and control the relative position of

  The projection optical system PL includes first-row projection optical modules PL1, PL3, and PL5 arranged in the non-scanning direction, and second-row projection optical modules PL2 and PL4 arranged in the non-scanning direction. Between the projection optical modules PL1, PL3, and PL5 in the first row and the projection optical modules PL2 and PL4 in the second row, an off-axis fine alignment system 52 for aligning the substrate P, and a mask M In addition, an autofocus system 54 for detecting a focus position with respect to the substrate P is disposed.

  As shown in FIG. 3, the substrate holder PH is provided with a groove 50 extending in a predetermined direction on a holding surface for holding the substrate P. That is, the substrate holder PH is provided with a groove portion 50 extending in the X direction and separated in the Y direction and a groove portion 50 extending in the Y direction and separated in the X direction.

  As shown in FIG. 3, the cleaning device 30 includes a plurality of nozzles (cleaning units) 36 that are spaced apart from each other in the Y direction and arranged in line with the interval in the Y direction of the groove portion 50 of the substrate holder PH. The intervals are substantially the same as the intervals of the groove portions 50, or are arranged at an integer multiple such as two times or three times. The nozzle 36 is supported by the support member 34, and the suction device 32 shown in FIG. Are not shown). The nozzle 36 is made of a flexible member such as rubber or resin, and prevents the substrate holder PH from being damaged even when it comes into contact with the substrate holder PH during the cleaning operation. The interval between the nozzles may be an interval for skipping one groove portion sandwiching one groove portion of the groove portion 50.

  The support member 34 is provided with an image sensor 38 for detecting the state in the groove 50. Further, the cleaning device 30 can be driven along the Z-axis shown in FIG. 3 and can be retracted from the substrate holder PH when the exposure processing on the substrate P is performed in the exposure device EX. Has been. That is, as shown in FIG. 4, the cleaning device 30 includes a drive device 40 that relatively moves the cleaning device 30 and the substrate holder PH. That is, a drive device 40 (not shown in FIG. 3) that can be driven along the Z axis is provided. Accordingly, by driving this driving device, the nozzle 36 is moved upward, the substrate stage PST is moved in the X direction, the cleaning device 30 is retracted from the substrate holder PH, and the exposure process is affected. It is preventing. The cleaning operation by the cleaning device 30 is controlled by the control device CONT (see FIG. 1).

  In addition, an image showing the state in the groove 50 taken by the image sensor 38 is transmitted to the control device CONT. In the control device CONT, analysis processing or the like of the video imaged by the image sensor 38 is performed, and the state in the groove portion 50, for example, whether or not dust is present in the groove portion 50, that is, adheres in the groove portion 50. Processing for confirming the presence or absence of resist residue is performed.

  Next, a process for cleaning the substrate holder of the exposure apparatus EX according to this embodiment will be described with reference to the flowchart of FIG. First, the control device CONT determines whether or not the exposure apparatus EX has a free time, that is, whether or not there is a time when the exposure process is not performed in the exposure apparatus EX (step S10). Here, in the exposure system EXS, after the exposure processing on the substrate P in the exposure apparatus EX is completed and the substrate P subjected to the exposure processing is unloaded, the substrate P to be processed next is loaded within a predetermined time. Is done. In this case, after the processed substrate P is unloaded from the exposure apparatus EX, if a new substrate P is not loaded even after a predetermined time has elapsed, the control apparatus CONT generates a free time in the exposure apparatus EX. It is judged that

  If it is determined in step S10 that a free time has occurred in the exposure apparatus EX, the state in the groove 50 formed in the substrate holder PH is detected (step S11). That is, the cleaning device 30 that has been retracted to a predetermined retracted position (a predetermined position that does not affect the exposure processing in the exposure apparatus EX) is moved onto the substrate stage PST by driving the substrate stage PST, and the driving device 40 Is moved in the Z-axis direction to approach the substrate holder PH. Next, at least one groove 50 is selected from the grooves 50 formed in the substrate holder PH, and the state in the selected groove 50 is photographed by the image sensor 38. For example, by driving the substrate stage PST, the substrate holder PH is moved along the X axis or the Y axis, and the inside of the groove 50 is photographed by the image sensor 38. In addition, the image | video inside the groove part 50 image | photographed in the image sensor 38 is transmitted to the control apparatus CONT. In the control device CONT, the state in the groove 50 is detected based on the video imaged by the image sensor 38.

  Next, based on the state in the groove 50 detected in step S11, it is determined whether or not the groove 50 needs to be cleaned (step S12). If it is determined that there is no need for cleaning, the process ends.

  On the other hand, when it is determined in step S12 that cleaning is necessary, a cleaning process is performed by the cleaning device 30 (step S13). That is, by driving the driving device 40, the nozzle 36 is brought close to the substrate holder PH, and by driving the substrate stage PST, the substrate holder PH is moved so that the nozzle 36 and the groove portion 50 correspond to each other. At this time, the nozzle 36 and the groove 50 need only be in a state in which dust existing in the groove 50 can be sucked by the nozzle 36, and it is not necessary to perform alignment or the like with high accuracy.

  Next, by driving the suction device 32, the gas in the groove 50 is sucked through the nozzle 36 to remove dust. At this time, the substrate stage PST is moved so that the nozzle 36 moves along the groove 50. That is, first, the substrate holder PH is moved in the X direction so that the nozzle 36 moves to a position where the groove portion 50 along the X axis and the groove portion 50 along the Y axis intersect (intersection position). Next, after reaching the crossing position, the substrate holder PH is moved in the -Y direction until the next crossing position is reached, and when the next crossing position is reached, the substrate holder PH is moved again in the X direction, and the next crossing position is reached. Is reached, the substrate holder PH is moved in the Y direction. That is, the cleaning is performed by sucking the gas in each groove portion 50 through the nozzle 36 while moving the substrate holder while alternately switching in the direction along the X axis and the direction along the Y axis.

  Next, the process returns to step S11, and the state in the groove 50 after cleaning is detected through the image sensor 38 by the same process as described above. That is, in order to confirm that dust has been completely removed, the image sensor 38 captures the state in the groove 50 after cleaning, and the captured image is transmitted to the control device CONT. Then, in the control device CONT, it is determined whether or not cleaning is necessary (step S12). If it is determined that it is necessary to clean, the process proceeds to step S13, and cleaning is performed again by the same process as described above. On the other hand, if it is determined that there is no need for cleaning, the process is terminated. In addition, about the arrangement | positioning of the groove part of a substrate holder, arrangement | positioning information is input previously and it is made to drive a substrate stage from the relative positional relationship of the value and cleaning apparatus.

  According to the exposure apparatus of this embodiment, the substrate stage PST is driven so that the nozzle moves along the groove formed in the substrate holder PH, and the gas in the groove is sucked through the nozzle so as to move the inside of the groove. Cleaning. Accordingly, the inside of the groove can be reliably cleaned. Further, cleaning can be performed by driving the substrate stage PST without providing a complicated drive mechanism or the like for cleaning. Unlike manual cleaning work, the cleaning work can be performed at a constant level and the cleaning work can be performed quickly, improving the operating efficiency of the exposure apparatus and performing exposure at a high throughput. It can be carried out. Further, by providing a plurality of nozzles along the Y direction, not only cleaning in the groove extending in the X direction can be performed, but also cleaning in the groove extending in the Y direction can be efficiently performed with a short stroke.

  Further, according to the exposure apparatus of this embodiment, it is determined whether or not a free time has occurred in the exposure apparatus and whether or not cleaning is necessary, it is determined that a free time has occurred, and cleaning is necessary. If it is determined that it is, cleaning is performed. Therefore, it is not necessary to stop the operation of the exposure apparatus in order to perform cleaning, and it is possible to effectively use the idle time generated in the exposure apparatus and perform cleaning appropriately only when cleaning is necessary. Can be operated efficiently.

  Further, according to the exposure apparatus of this embodiment, the state in the groove is detected even after cleaning, and it is determined whether or not it is necessary to perform cleaning again. Therefore, when the cleaning work is insufficient, the inside of the groove can be reliably cleaned by cleaning again.

  In the above-described exposure apparatus, three nozzles are arranged. However, at least one nozzle may be arranged, for example, depending on the number of grooves formed in the substrate holder PH. The number of nozzles to be arranged may be determined. Further, when a plurality of nozzles are arranged, for example, a support member having three nozzles and a support member having one nozzle may be installed and driven individually.

In addition, the nozzles may be arranged along the X axis, or the nozzles may be arranged along both the Y axis and the X axis. Furthermore, the nozzles may be arranged along a predetermined direction in which the groove is provided or a direction intersecting the predetermined direction. When grooves are formed at an interval of x _{1 in} the X-axis direction and y _{1 in} the Y-axis direction, the second nozzle is obliquely positioned at the position (x ₁ , y ₁ ) with respect to the position of the _first nozzle May be provided. In this case, the inside of the plurality of grooves can be cleaned on both sides.

  In the above-described exposure apparatus, cleaning is performed by sucking the gas in the groove through the nozzle. However, cleaning may be performed by discharging the gas through the nozzle. Furthermore, the nozzle tip may be divided into two, and both a nozzle for sucking gas and a nozzle for discharging gas may be provided. In addition, as shown in FIG. 6, by attaching a sponge-like substance 37 to the tip of the nozzle 36, the dust in the groove is sucked and the inner wall, bottom and corners in the groove are uniformly and reliably cleaned. Also good. Further, a brush-like member may be attached to the tip of the nozzle 36.

  In the above-described exposure apparatus, the state in an arbitrary groove is photographed by the image sensor. However, the state in all the grooves formed on the substrate holder PH may be photographed. That is, the state of all the groove portions may be detected, and only the portion where dust is confirmed to be cleaned may be cleaned. The surface of the substrate holder PH may be cleaned by the cleaning device 30. In this case, for example, the height position of the substrate holder may be detected by an autofocus system, and the cleaning device 30 may perform cleaning on a portion that is higher than the other portions.

  Further, in the above-described exposure apparatus, it is determined whether or not cleaning is performed based on an image showing a state in the groove portion taken by the image sensor, but without determining whether or not cleaning is performed. When a free time occurs, cleaning may be performed immediately, and only after cleaning, the inside of the groove may be photographed by an image sensor, and the state in the groove after cleaning may be confirmed.

  In the above-described exposure apparatus, the idle time is determined based on the time from when the substrate is carried out until the next substrate is carried in. However, the idle time is determined using other criteria. May be. For example, cleaning may be performed every time a predetermined number of substrates are processed or when the operation of the production line is stopped for some reason.

  Further, in the above-described exposure apparatus, when the exposure process is performed in the exposure apparatus, the cleaning apparatus is retracted to the retracted position. However, dust or the like in the nozzle is removed from the nozzle of the cleaning apparatus retracted to the retracted position. You may provide the member which prevents falling on the holder PH. That is, as shown in FIG. 7, even when dust or the like falls from the nozzle when the cleaning device is retracted to the retracted position, a shutter 39 that prevents the dust from falling on the substrate holder PH is provided. It may be provided. The shutter 39 can be moved in the direction indicated by the arrow in FIG. 7. When the cleaning device 30 is retracted to the retracted position, the shutter 39 is moved to the position illustrated in FIG. 7, and the cleaning device 30 approaches the substrate holder PH. When it does, it is comprised so that a movement to the position which does not prevent the movement of the cleaning apparatus 30 is possible.

  In the above-described exposure apparatus, a sensor for confirming whether or not the cleaning device is retracted to the retracted position may be installed. That is, when the cleaning operation is performed, the idle time ends, and the exposure processing is performed, the cleaning device has been retracted before the substrate is carried in, in other words, the cleaning device affects the exposure processing. You may make it install the sensor which confirms that it does not exist in the range.

  In the exposure system according to the above-described embodiment, the mask (reticle) M is illuminated by the illumination optical system IL, and the transfer pattern formed on the mask M is exposed to the photosensitive substrate P using the projection optical system PL. By performing (exposure step), a micro device (semiconductor element, imaging element, liquid crystal display element, thin film magnetic head, etc.) can be manufactured. FIG. 8 is a flowchart of an example of a technique for obtaining a semiconductor device as a micro device by forming a predetermined circuit pattern on a plate or the like as a photosensitive substrate using the exposure system EXS of the above-described embodiment. Will be described with reference to FIG.

  First, in step S301 in FIG. 8, a metal film is deposited on one lot of plates P. In the next step S302, a photoresist is coated on the metal film on the plate P of one lot by the coating device provided in the coater / developer apparatus CDS. Thereafter, the plate P coated with the photoresist is transported by the transport apparatus 100 to the transport section H provided in the exposure system EXS, and is transported by the transport section H onto the substrate stage PST of the exposure apparatus EX. Next, in step S303, using the exposure apparatus EX provided in the exposure system EXS of the above-described embodiment, an image of the pattern on the mask M is placed on the one lot of plates P via the projection optical system PL. The exposure is sequentially transferred to each shot area.

  Thereafter, the exposed plate P is transported from the substrate stage PST to the transport apparatus 100 by the transport unit H, and transported by the transport apparatus 100 to the developing device provided in the coater / developer apparatus CDS. Next, after developing the photoresist on the one lot of plates P by the developing device in step S304, etching is performed on the one lot of plates P using the resist pattern as a mask in step S305. A circuit pattern corresponding to the pattern on the mask M is formed in each shot region on each plate. Thereafter, a device pattern such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer. According to the above-described semiconductor device manufacturing method, exposure can be performed on the plate with high throughput, and a good semiconductor device can be obtained.

  In the exposure system of the above-described embodiment, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. In FIG. 9, in the pattern formation step S401, a so-called photolithography step is carried out in which the mask pattern is transferred and exposed to a photosensitive substrate (such as a glass substrate coated with a resist) using the exposure system of the above-described embodiment. The By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step S402.

  Next, in the color filter forming step S402, a large number of groups of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three of R, G, and B are arranged. A color filter is formed by arranging a plurality of stripe filter sets in the horizontal scanning line direction. Then, after the color filter formation step S402, a cell assembly step S403 is executed. In the cell assembly step S403, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern formation step S401, the color filter obtained in the color filter formation step S402, and the like.

  In the cell assembling step S403, for example, liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S401 and the color filter obtained in the color filter forming step S402. ). Thereafter, in a module assembly step S404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display element, the photosensitive substrate can be exposed with high throughput, and a good liquid crystal display element can be obtained.

It is a figure which shows schematic structure of the exposure system concerning Embodiment. 1 is a schematic perspective view of an exposure system according to an embodiment. It is a figure for demonstrating the cleaning apparatus concerning embodiment. It is a figure which shows schematic structure of the cleaning apparatus concerning embodiment. It is a flowchart for demonstrating the cleaning operation | work concerning embodiment. It is a figure which shows the other example of a nozzle. It is a figure for demonstrating a shutter. It is a flowchart which shows the manufacturing method of the semiconductor device as a micro device concerning embodiment. It is a flowchart which shows the manufacturing method of the liquid crystal display element as a microdevice concerning embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Port part, 20 ... Board | substrate conveyance part, 30 ... Cleaning apparatus, 36 ... Nozzle, 50 ... Groove part, CONT ... Control apparatus, EXS ... Exposure system, EX. ..Exposure device, IL ... illumination optical system, H ... transport section, M ... mask, MST ... mask stage, P ... substrate, PST ... substrate stage, PH ... Substrate holder, PL ... projection optical system, T ... tray.

Claims (13)

In an exposure apparatus that exposes a predetermined pattern on a photosensitive substrate via a projection optical system,
A substrate holding member that holds the photosensitive substrate and has a recess provided along a predetermined direction on a holding surface that holds the photosensitive substrate;
Cleaning means for cleaning the inside of the recess formed in the substrate holding member;
An exposure apparatus comprising: a moving unit that relatively moves the cleaning unit and the substrate holding member so that the cleaning unit moves along the predetermined direction with respect to the concave portion.   2. The exposure apparatus according to claim 1, wherein the concave portion provided in the substrate holding member is a groove for storing a substrate transfer holding member for transferring the photosensitive substrate. In an exposure apparatus that exposes a predetermined pattern on a photosensitive substrate via a projection optical system,
A substrate holding member that holds the photosensitive substrate together with a substrate transfer holding member for transferring the photosensitive substrate, and a plurality of recesses that store the substrate transfer holding member along a predetermined direction;
Cleaning means for cleaning the inside of the recess formed in the substrate holding member;
An exposure apparatus comprising: a moving unit that relatively moves the cleaning unit and the substrate holding member so that the cleaning unit moves along the predetermined direction with respect to the concave portion. A plurality of the recesses are formed apart from each other in a direction intersecting the predetermined direction,
4. The cleaning device according to claim 1, wherein the cleaning unit includes the plurality of cleaning units, and the plurality of cleaning units are arranged apart from each other in a direction intersecting the predetermined direction. The exposure apparatus according to one item.   5. The exposure apparatus according to claim 4, wherein an interval between the plurality of cleaning units is substantially the same as an interval between the concave portions provided apart from each other in a direction intersecting the predetermined direction. The holding member includes a second recess provided in a plurality of positions extending in a direction intersecting the predetermined direction and spaced apart in the predetermined direction,
6. The exposure apparatus according to claim 4, wherein the plurality of cleaning units move in a direction intersecting the predetermined direction to clean the second recess. The cleaning means includes
The exposure apparatus according to claim 1, wherein at least one of gas suction and discharge is performed.   The exposure apparatus according to claim 7, wherein the cleaning unit includes at least one nozzle. The cleaning means includes
9. The exposure apparatus according to claim 1, wherein the exposure apparatus retracts from the substrate holding member during an exposure process for exposing the predetermined pattern to the photosensitive substrate. 10. The cleaning means includes
10. The concave portion formed in the substrate holding member is cleaned during an idle time of exposure processing for exposing the predetermined pattern to the photosensitive substrate. The exposure apparatus described in 1.   The exposure apparatus according to any one of claims 1 to 10, wherein the photosensitive substrate has an outer diameter larger than 500 mm.   The exposure apparatus according to claim 1, wherein the photosensitive substrate is a substrate for a flat panel display. In a microdevice manufacturing method of exposing a predetermined pattern on a photosensitive substrate and manufacturing a microdevice from the photosensitive substrate,
An exposure step of exposing the predetermined pattern on the photosensitive substrate using the exposure apparatus according to any one of claims 1 to 12,
And a development step of developing the photosensitive substrate exposed in the exposure step.

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