JP2010192593A - Exposure device and exposure method, and device manufacturing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve overlay precision of a pattern by performing offset management for each plate. <P>SOLUTION: A main control unit of an exposure device obtains an offset ID being identification information of correction information (offset) for image distortion to be used to expose a plate carried in from a C/D each time the plate before exposure is carried in the exposure device from the C/D (step 307). Then the main control unit compares the obtained offset ID with an offset ID being set, and switches the offset being set to the obtained offset ID (steps 308, 310) when both are different from each other. Then when respective plates in a lot are exposed in a step 220, the formation state of the pattern is corrected using a suitable offset to form the pattern on the plates. Therefore, high overlay precision can be attained when all the plates in the lot are exposed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing system, and more specifically, an exposure apparatus and an exposure method used in a lithography process for manufacturing a liquid crystal display element, a semiconductor element, and the like, and a device manufacturing using the exposure apparatus About the system.

  In a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements, a step-and-repeat type projection exposure apparatus (so-called stepper) or a step-and-scan type exposure apparatus (so-called scanning / scanning apparatus). Steppers (also called scanners)) are mainly used.

  For example, a liquid crystal display element is manufactured by superposing and forming a plurality of layers of patterns on a glass plate (substrate). For this reason, a projection exposure apparatus, which is a liquid crystal display device manufacturing apparatus, accurately transfers (forms) an image obtained by superimposing an image of a mask pattern onto a pattern already formed on a substrate via a projection optical system. High overlay accuracy is required. In order to meet such requirements, a projection exposure apparatus for manufacturing a liquid crystal display element such as a scanner has a pattern as a function for correcting the shape and position (hereinafter simply referred to as a shape) of an image of a pattern formed on a substrate. A function that corrects the linear shape (shift, rotation, magnification, orthogonality) of the image and a function that corrects the nonlinear shape of the pattern image, that is, the shape (shift, rotation, magnification) of the partial image of the pattern. is doing. For example, in the case of a scanner, the former is performed by adjusting a relative position between a mask (mask stage) and a substrate (substrate stage) or a projection magnification of a projection optical system, and the latter is performed by a scanner using a multilens, for example. In this case, it is performed by correcting the shape (shift, rotation, magnification) of the partial image of the pattern projected by each lens according to the position of the substrate.

  By the way, in a liquid crystal display device manufacturing system, in operation, substrates are usually processed in units of lots (one lot is, for example, 50 or 100). That is, the substrates in the same lot go through the same processes (history) in a plurality of steps. Therefore, the correction information (so-called offset) of the pattern shape such as the shift and rotation is generally managed for each lot (see, for example, Patent Document 1).

  However, recently, for example, lots may be organized from 50 or 100 substrates that have been processed in different processes in units of substrates (not limited to one substrate, including a plurality of substrates less than the number of lot units). is there. In addition, an abnormality may occur during the lot processing, and a substrate may be generated in which the exposure processing has not been completed normally, or a substrate that has been inspected due to insufficient overlay accuracy. In this case, the resist is peeled off and stored, and a certain number of the substrates are collected to form a new lot (also called a reorganized lot). In such a lot, since substrates having different histories are mixed, it is difficult to maintain sufficient overlay accuracy in the conventional offset management for each lot described above.

JP 2003-31462 A

  The present invention has been made under the circumstances described above. From the first viewpoint, an exposure operation for sequentially performing an exposure operation for forming an image of a pattern formed on a mask on an object on a plurality of objects. An apparatus comprising: an optical system; and a moving body on which the object is placed, exposing an object placed on the moving body via the mask and the optical system by an energy beam, An exposure apparatus main body that forms an image of the pattern on the object; and when the next object to be exposed is carried in from the upstream apparatus, the object to be carried in the pattern is formed on the object by the exposure. Obtaining correction information used for correcting the image formation state or identification information thereof from an external device, comparing the obtained information with the correction information being set or identification information thereof, and only when both do not match Correction information being set A first control system that performs a switching process for switching to acquired information or correction information corresponding to the acquired information; and setting when forming an image of the pattern on the next object to be exposed using the exposure apparatus body And a second control system that uses the corrected information.

  According to this, even when objects having different pattern formation states (or histories) are mixed in a plurality of objects, it is possible to achieve high overlay accuracy in pattern formation for each of the plurality of objects. It becomes.

  According to a second aspect of the present invention, there is provided an exposure apparatus for sequentially performing an exposure operation for forming an image of a pattern formed on a mask on an object with respect to a plurality of objects, the optical system and the object comprising: An exposure apparatus that exposes an object placed on the moving body with the energy beam through the mask and the optical system, and forms an image of the pattern on the object. Prior to exposure of a predetermined number of objects, the main body; identification information of each predetermined number of objects and identification information of correction information used for correcting the formation state of the pattern image formed on the object by exposure Is obtained from the external device, and when the next object to be exposed is carried in from the upstream device, the identification information is obtained from the upstream device for the object to be carried in and obtained. Affection The identification information of the correction information obtained by searching the information of the combination using as a key is compared with the identification information of the correction information being set, and if the two do not match, the correction information being set is A first control system for performing a switching process for switching to correction information corresponding to the identification information obtained by the search; and setting when forming an image of the pattern on the next object to be exposed using the exposure apparatus body And a second control system that uses the corrected information.

  According to this, even if objects having different pattern formation states (or histories) are mixed in a plurality of objects, high overlay accuracy can be achieved in pattern formation for all of the plurality of objects. It becomes possible.

  According to a third aspect of the present invention, the first or second exposure apparatus of the present invention; the upstream apparatus that performs a predetermined process on each object carried into the exposure apparatus; the exposure apparatus and the upstream A device manufacturing system comprising: a management device that manages the device;

  According to this, it is possible to achieve high overlay accuracy for each of a plurality of objects, and as a result, it is possible to improve device productivity (including yield).

  From a fourth aspect, the present invention exposes an object placed on the moving body through the mask and the optical system by an energy beam, and forms an image of the pattern on the object. An exposure method that sequentially performs operations on a plurality of objects, and when the next object to be exposed is carried from an upstream apparatus, the object to be carried is formed on the object by the exposure. When the correction information used for correcting the pattern image formation state or its identification information is obtained from an external device, and the obtained information is compared with the correction information being set or its identification information. A first step of performing a switching process for switching the correction information being set to the acquired information or correction information corresponding to the information; and using the correction information that has been set, Is an exposure method comprising: second step and forming a turn image of.

  From the fifth aspect, the present invention exposes an object placed on the moving body via the mask and the optical system by an energy beam, and forms an image of the pattern on the object. An exposure method in which operations are sequentially performed on a plurality of objects, and prior to exposure on a predetermined number of objects, the identification information of each object and the pattern formed by exposure on the object for the predetermined number of objects The information of the combination with the identification information of the correction information used for correcting the image formation state is obtained from the external device, and when the next exposure target object is carried in from the upstream device, The identification information is obtained from the upstream device, and the identification information of the correction information obtained by searching the combination information using the obtained information as a key, and the identification information of the correction information being set In comparison, the first step of performing a switching process for switching the correction information being set to correction information corresponding to the identification information obtained by the search only when the two do not match; and using the set correction information And a second step of forming an image of the pattern on the next object to be exposed.

It is a figure which shows schematic structure of the device manufacturing system which concerns on 1st Embodiment. It is a figure which shows schematic structure of the exposure apparatus which comprises the device manufacturing system of FIG. It is a block diagram which shows the structure of the control system of the exposure apparatus which concerns on 1st Embodiment. FIG. 4A is a flowchart showing a processing algorithm executed by the first control device 50A (CPU) in the first embodiment, and FIG. 4B is a flowchart showing the processing algorithm executed by the second control device 50B (CPU). It is a flowchart which shows the process algorithm performed. FIG. 5A is a flowchart showing a processing algorithm executed by the first control device 50A (CPU) in the second embodiment, and FIG. 5B is a flowchart showing the processing algorithm executed by the second control device 50B (CPU). It is a flowchart which shows the process algorithm performed. It is a flowchart which shows the process algorithm performed by the 2nd control apparatus 50B in a 1st modification. It is a flowchart which shows the process algorithm performed by the 2nd control apparatus 50B in a 2nd modification.

<< First Embodiment >>
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 shows a schematic configuration of a device manufacturing system 100 according to the first embodiment. The device manufacturing system 100 includes a plurality of exposure apparatuses including the exposure apparatus 110 (not shown except for the exposure apparatus 110), a coater / developer (hereinafter abbreviated as “C / D”) 120 connected in-line to the exposure apparatus 110, Other processing apparatuses (not shown) such as an etching apparatus, a host computer (hereinafter abbreviated as “host”) 130, and the like are provided. In the following description, descriptions of other processing apparatuses such as an exposure apparatus other than the exposure apparatus 110 and an etching apparatus are omitted.

  The main controller 50 of the exposure apparatus 110, the controller 140 of the C / D 120, and the host 130 are connected to each other via a network (for example, a LAN) 150. Further, a direct communication path not via the network 150 is provided between the control device 140 and the main control device 50. That is, in the device manufacturing system 100, a communication path among the control device 140 (C / D 120), the main control device 50 (exposure device 110), and the host 130 is secured. The host 130 is a large computer that comprehensively manages the device manufacturing system 100.

  The exposure apparatus 110 is a multi-lens type step-and-scan projection exposure apparatus for liquid crystal display elements. The exposure apparatus 110 has a function of correcting the formation state (position and shape) of the pattern image. The configuration of the exposure apparatus 110 will be described later.

  The C / D 120 is a display element substrate (a coater (resist coating device) (not shown) for applying a resist (sensitive agent) on a glass plate (hereinafter abbreviated as a plate), and a pattern image is formed by exposure. A developer (developing device) (not shown) that develops the developed plate, and a control device 140 that controls these are provided, etc. A plate coated with a resist by a coater constituting a part of the C / D 120 is a C / D 120. A plate transport system (or a plate transport system in the inline connecting portion) (not shown) is transported from the coater to the exposure apparatus 110. An exposed plate is exposed to the exposure apparatus 110 by a plate transport system (not shown). It is carried out from 110 and carried into a developer constituting a part of the C / D 120.

  As shown in FIG. 1, the exposure apparatus 110 includes a chamber connected to the C / D 120, an exposure apparatus main body accommodated in the chamber, and a main controller 50 including a computer such as a workstation.

  As shown in FIG. 2, the exposure apparatus main body 110A includes an illumination system IOP, a mask stage MST that holds a mask M on which a pattern is formed, a projection optical system PL that projects the pattern onto the plate P, and a plate P. A holding plate stage PST, and a control system thereof are provided.

  In the following, the direction in which the mask stage MST and the plate stage PST are scanned with respect to the projection optical system PL during scanning exposure (the direction orthogonal to the plane of the drawing in FIG. 2) is the X-axis direction, and the vertical direction in the plane of the plane orthogonal to this is The description will be made with the Z-axis direction and the left-right direction in the plane orthogonal to these as the Y-axis direction.

The illumination system IOP includes a plurality of, here, five illumination system modules (hereinafter simply referred to as illumination systems) IOP _{1 to} IOP ₅ . Each of the illumination systems IOP _{1 to} IOP ₅ includes a light source (not shown) composed of an ultrahigh pressure mercury lamp, an elliptical mirror, and a wavelength selection filter disposed on the optical path of ultraviolet light generated by the light source and condensed by the elliptical mirror. And an illumination optical system including an optical integrator, a field stop, etc. (all not shown). Each of the light sources included in the illumination systems IOP _{1 to} IOP ₅ is provided with a shutter (not shown). The shutter selectively limits the incidence of ultraviolet light collected by the elliptical mirror on the wavelength selection filter. Further, the ultraviolet light is irradiated to the wavelength selection filter, and an ultraviolet bright line, for example, i-line (wavelength 365 nm) (or g-line (wavelength 436 nm), h-line (wavelength 405 nm)) and the like are extracted. Then, the bright lines become illumination lights IL _{1 to} IL ₅ .

The illumination systems IOP ₁ , IOP ₃ , IOP ₅ are arranged at a predetermined interval along the Y-axis direction, and the illumination systems IOP ₂ , IOP ₄ are a predetermined distance on the −X side of the illumination systems IOP ₁ , IOP ₃ , IOP _5. They are arranged so as to be positioned between the illumination systems IOP ₁ , IOP ₃ , and IOP ₅ . That is, the illumination systems IOP _{1 to} IOP ₅ are arranged in a staggered manner. Illumination systems IOP _{1 to} IOP ₅ are emitted from a light source, and the bright lines formed in the illumination optical system are used as illumination lights IL _{1 to} IL ₅ at respective field stops on the mask M arranged in a staggered manner. A specified illumination area (not shown) is illuminated with uniform illuminance. Each illumination area has an isosceles trapezoid shape defined by a field stop (not shown) in the illumination optical system. Details of the configuration of the illumination system IL of the present embodiment are disclosed in, for example, Japanese Patent Laid-Open No. 2001-215718 (corresponding US Pat. No. 6,552,775).

Mask stage MST is arranged below illumination systems IOP _{1 to} IOP ₅ in FIG. 2 (−Z side). Here, on the mask stage MST, a rectangular mask M on which a pattern (rectangular pattern region) is formed is fixed, for example, by vacuum suction. The mask stage MST can be finely driven in the horizontal plane (XY plane) by a mask stage drive system MSD (see FIG. 3) including a linear motor and the like, and is scanned with a predetermined stroke in the scanning direction (X-axis direction). It can be driven at speed.

  Position information of the mask stage MST in the XY plane is obtained by a laser interferometer (hereinafter referred to as a mask interferometer) 16 via a movable mirror (or a mirror-finished reflecting surface) 15 fixed to the mask stage MST. For example, it is always measured with a resolution of about 0.25 nm. The position information of the mask stage MST from the mask interferometer 16 is supplied to the main controller 50 (see FIG. 3). Main controller 50 drives and controls mask stage MST via mask stage drive system MSD based on position information of mask stage MST. Instead of the mask interferometer 16, an encoder (or an encoder system composed of a plurality of encoders) may be used. Alternatively, the mask interferometer 16 and the encoder may be used in combination.

Projection optical system PL is arranged below mask stage MST in FIG. 2 (on the −Z side). Although the projection optical system PL may be configured by a single optical system having a sufficient length in the Y-axis direction, in the present embodiment, the projection optical system PL is arranged in a staggered manner corresponding to the illumination systems IOP _{1 to} IOP _5. 5 projection optical system modules (hereinafter referred to as projection optical systems) PL _{1 to} PL ₅ . As each of the projection optical systems PL _{1 to} PL ₅ , for example, a bilateral telecentric catadioptric system that forms an equal magnification erect image is used. Since this catadioptric system forms an intermediate image, the principal ray is bent and its optical axis direction is not uniquely determined. In the following, the axis in the Z-axis direction shown in FIG. 2 is the projection optical system PL _1. it is assumed that the optical axis _AX 1 _{~AX 5} of through PL _5.

The arrangement of the projection optical system _PL 1 through PL ₅ above, five of the projection area on the plate P to the image of the pattern is projected by the projection optical system _PL 1 through PL ₅ (formation region of the pattern image), five lighting Like the area, they are arranged in a staggered pattern. Here, the five projection areas have the same isosceles trapezoid shape as the illumination area. By projecting the partial images of the patterns in the five illumination areas on the mask M onto the five projection areas on the plate P via the projection optical systems PL _{1 to} PL _{5 according} to the arrangement and shape of the five projection areas, By driving the mask M and the plate P synchronously in the scanning direction (X-axis direction), the partial image of the pattern projected on the plate P is combined into one image (composite image) equal to the pattern formed on the mask M. Is done. Therefore, the pattern of the mask M is transferred onto the plate P (in one shot area) through the projection optical systems PL _{1 to} PL ₅ by scanning exposure described later.

In the present embodiment, an optical system that projects an equal-magnification erect image is employed as the projection optical systems PL _{1 to} PL ₅ , and therefore, the shape and arrangement (positional relationship) of the five projection regions are the shapes of the five illumination regions and It is equal to the arrangement (positional relationship). Details of the configuration of the projection optical system PL of the present embodiment are disclosed in, for example, Japanese Patent Laid-Open No. 2001-215718 (corresponding US Pat. No. 6,552,775).

The exposure apparatus 110 is provided with a lens controller LC (see FIG. 3) that constitutes a part of an imaging characteristic correction apparatus for correcting distortion (position and shape) of the projection image by the projection optical systems PL _{1 to} PL ₅ . It has been. The lens controller LC uses the correction information (nonlinear offset) for correcting the nonlinear shape of the pattern image formed on the plate P at the time of exposure, and each of the optical elements constituting the projection optical systems PL _{1 to} PL _5. The element group (lens group) is driven in an arbitrary direction tilted and parallel to the optical axes AX _{1 to} AX ₅ . The lens controller LC adjusts the refractive index by controlling the air pressure in the airtight space inside each of the projection optical systems PL _{1 to} PL ₅ . Thereby, by the non-linear distortion of the image of the pattern formed on the substrate via the entire _five projection optical systems PL _{1 to} PL ₅ (projection optical system PL), that is, each of the projection optical systems PL _{1 to} PL ₅ . The distortion (X shift, Y shift, rotation, magnification (scaling)) of the partial image of the pattern projected onto the five projection areas on the plate P is corrected.

  Here, the lens controller LC uses a non-linear offset to match the distortion (position and shape) of the projected pattern in accordance with the distortion (position and shape) of the pattern formed in the original process layer on the plate P. Shape). The nonlinear offset is transferred from the main controller 50 to a storage device (offset information buffer) provided in the lens controller LC and stored. Then, the data is read from the offset information buffer by the lens controller LC as necessary.

  The correction information of the pattern image, that is, the offset, includes the above-described nonlinear offset, as well as linear distortion (X shift, Y shift, rotation, magnification (scaling)) of the pattern image formed via the projection optical system PL. There is a linear offset to correct (orthogonality).

The plate stage PST is arranged below the projection optical systems PL _{1 to} PL ₅ in FIG. 2 (−Z side). A rectangular plate P is held on the plate stage PST by vacuum suction or the like. The plate stage PST is driven with a predetermined stroke in the X-axis direction and the Y-axis direction by a plate stage drive system PSD (see FIG. 3) including a linear motor or the like, and is minute in the rotation direction (θz direction) around the Z-axis. Driven.

  Position information of the plate stage PST in the XY plane (including rotation information about the rotation direction around the Z axis (θz direction)) is a movable mirror (or a mirror-finished reflecting surface) 17 fixed on the plate stage PST. , The laser interferometer (hereinafter referred to as “plate interferometer”) 18 always measures with a resolution of, for example, about 0.25 nm. The position information of the plate stage PST from the plate interferometer 18 is supplied to the main controller 50 (see FIG. 3). Main controller 50 drives and controls plate stage PST via plate stage drive system PSD based on the position information of plate stage PST. Instead of the plate interferometer 18, an encoder (or an encoder system composed of a plurality of encoders) may be used. Alternatively, the plate interferometer 18 and the encoder may be used in combination.

A rectangular mark plate (not shown) whose longitudinal direction is the Y-axis direction is fixed to the upper surface of the plate stage PST. The mark plate is set so that the surface thereof is substantially flush with the surface of the plate P placed on the plate stage PST. Six reference marks (not shown) are formed on the surface of the mark plate at regular intervals in the Y-axis direction. These reference marks are detected simultaneously and individually by _six alignment detection systems AL _{1 to} AL 6 described later.

Further, inside the plate stage PST, there are a lens system and an image sensor (CCD etc.) below (−Z side) of each of six reference marks (not shown) formed on a mark plate (not shown). 6 mark image detection systems MD _{1 to} MD ₆ (see FIG. 3) are arranged. These mark image detection systems MD _{1 to} MD ₆ are the projection optical systems PL _{1 to} PL ₅ and the projection image of the alignment mark on the mask M by the lens system, and the image of the reference mark (not shown) by the lens system. Simultaneously, the position of the alignment mark (image) is measured with reference to the position of the reference mark (image). The result is supplied to the main controller 50 (see FIG. 3) and used for alignment of the mask M (mask alignment) and the like.

Further, the exposure apparatus 110 of the present embodiment includes six off-axis methods for detecting alignment marks provided on each shot area on the plate P and six reference marks on a mark plate (not shown). Alignment detection systems AL _{1 to} AL ₆ (see FIG. 3) are provided. The alignment detection systems AL _{1 to} AL ₆ are arranged along the Y axis on the + X side of the projection optical system PL. As an example of the alignment detection systems AL _{1 to} AL ₆ , an image processing type FIA (Field Image Alignment) system is employed. The detection results of the alignment detection systems AL _{1 to} AL ₆ (image information of the index mark and the detection target mark) are sent to the main controller 50 via an alignment signal processing system (not shown). In addition to the FIA system, a target mark is irradiated with coherent detection light, and scattered light or diffracted light generated from the target mark is detected, or two diffracted lights (for example, of the same order) generated from the target mark. It is also possible to use an alignment sensor that detects and interferes with each other alone or in appropriate combination. Details of alignment measurement (mark detection) using the alignment detection systems AL _{1 to} AL ₆ are disclosed in, for example, Japanese Patent Laid-Open No. 2003-347184.

  Although not shown, in the chamber of the exposure apparatus 110, a plate delivery unit (carry-in side) on which a plate before exposure carried by the plate conveyance system in the C / D 120 is placed; and the C / D 120 A plate delivery unit (carrying-out side) on which an exposed plate carried out by the inner plate carrying system is placed. Then, in response to an instruction from the main controller 50, the plate placed on the plate delivery section (carry-in side) is loaded on the plate stage PST by a plate loader (not shown) (hereinafter abbreviated as loader). An exposed plate is unloaded from the plate stage PST by a plate unloader (hereinafter abbreviated as “unloader”) and is placed on the plate delivery section (unloading side).

  FIG. 3 is a block diagram showing a schematic configuration of the control system of the exposure apparatus 110. The control system is configured around the above-described main controller 50 that performs overall control of each component of the exposure apparatus main body 110A.

  According to the exposure apparatus 110 configured as described above, one plate is exposed as follows.

That is, main controller 50 monitors the measurement results of mask interferometer 16 and plate interferometer 18 and moves mask stage MST and plate stage PST to their respective scan start positions (acceleration start positions). The stages MST and PST are synchronously driven in the same direction along the X axis. Accordingly, the five illumination areas on the mask M are illuminated by the illumination lights IL _{1 to} IL ₅ , respectively, and the partial images of the patterns in the five illumination areas are respectively on the plate P via the projection optical systems PL _{1 to} PL _5. Are projected onto five projection areas.

When the entire surface of the pattern of the mask M is completely illuminated with the illumination lights IL _{1 to} IL ₅ , the scanning exposure for one shot region on the plate P is completed. As a result, the pattern of the mask M is transferred into the shot area. That is, a latent image having the same pattern as the pattern of the mask M is formed on the resist layer provided on the plate.

  When the scanning exposure for one shot area is completed, main controller 50 moves (steps) plate stage PST to the scanning start position (acceleration start position) for the next shot area. Then, as in the previous case, scanning exposure is performed on the next shot area. Thus, the stepping between the shot areas of the plate P and the scanning exposure for the shot areas are repeated. In this way, the pattern of the mask M is transferred to all shot regions on the plate P by the step-and-can exposure.

  Next, processing of one lot of plates in the device manufacturing system 100 according to the present embodiment will be described focusing on the processing in the exposure apparatus 110. In the following description, for the sake of convenience, the main controller 50 of the exposure apparatus 110 performs a process other than the process related to offset switching, which will be described later, and the second controller 50B executes a process related to offset switching. (See FIG. 3).

  FIG. 4A shows a flowchart showing a processing algorithm executed by the first control device 50A (its CPU). FIG. 4B shows a flowchart showing a processing algorithm executed by the second control device 50B (its CPU). Of course, the processing corresponding to these flowcharts may be executed by time-sharing processing by a single main controller 50 (CPU).

In response to the start instruction from the host 130, a series of processing for the plate of the target lot starts. When instructing, the host 130 transfers a recipe (process program file) including necessary information to the control device 140 of the C / D 120 and the main control device 50 of the exposure device 110. For example, the recipe for the C / D 120 constituting the upstream apparatus of the exposure apparatus 110 corresponds to the processing conditions (chemical solution type, heating time, etc.) for each plate and the offset O _Im used for each plate. The identifier (offset ID) I _m , lot information (the lot to be exposed, the order of the plates included in the lot, the order of the plates to be exposed), and the like are included. In addition, the recipe for the exposure apparatus 110 includes masks to be used, various information on exposure conditions, necessary information on plates, and the like. At this time, it is assumed that the plate of the designated lot is carried into the C / D 120.

Simultaneously with the transfer of the recipe, various offsets O _Im for correcting distortion of the projection image of the pattern created in advance are transferred to the main control device 50 by the host 130, and the storage device provided in the main control device 50 (Not shown). Incidentally, the offset is as described above, a linear offset, there is a non-linear offset, here, mainly nonlinear offset, corresponding offset ID; included in the offset O _Im managed using I _m . Here, the non-linear offset is map format data (or the position of the plate stage PST (plate)) consisting of correction values of each projection optical system (projection optical system module) for each coordinate of a fixed interval in the pattern used for exposure. Function).

When the recipe is transferred and the start of processing is instructed, the control device 140 of the C / D 120 uses the coater (resist coating device) to sequentially control the plates P _m (m = 1 to M, M in the lot). For example, a resist is applied to 50). Then, the plate _{P m} which a resist layer is formed, a plate conveying system in the C / D (not shown), is carried from the C / D120 to the exposure device 110. In principle, the plates are processed in the order described in the lot information.

When the plate P _m (m = 1 to M) is transported from the C / D 120 toward the exposure apparatus 110, the controller 140 of the C / D 120 uses the recipe (or information on correspondence between the plate and the offset obtained separately). The offset ID; I _m corresponding to the plate P _m to be transported is read and transmitted to the main controller 50 of the exposure apparatus 110.

In this way, the C / D120 of the target lot top plate _{P 1} is loaded into the exposure apparatus 110, the control unit 140 from the offset ID corresponding to the plate _{P 1; I m} is after given time sent At the time, processing corresponding to the flowchart of FIG.

First, in step 202, the first control device 50A initializes the count value m of the counter to 1 (m ← 1) as an initial setting. At the same time, flags F1 and F2 described later are both lowered (F1 ← 0, F2 ← 0). Here, the count value m represents the index m of the code P _m of the plate (plate number in the lot). Hereinafter, the counter of the count value m is described as a counter m. The flag F1 is a flag for controlling the start of the processing of steps 302 to 312 by the second control device 50B and the waiting state after the end. The flag F2 is a flag indicating whether or not the offset switching is being executed. When the processing in step 202 is performed, processing corresponding to the flowchart of FIG. 4B starts.

  After the control is started, the second control device 50B monitors the flag F1 in step 302 and waits for the flag F1 to be set (F1 = 1).

On the other hand, after the initial setting, the first control device 50A performs preparatory work such as mask loading, mask alignment, and baseline measurement of the alignment systems AL _{1 to} AL ₆ in a predetermined procedure in the next step 204. . First control device 50A loads mask M onto mask stage MST using a mask loader (not shown). After loading, the first control device 50A detects the alignment mark on the mask M and the reference mark on the mark plate (not shown) using the mark image detection systems MD _{1 to} MD ₆ and performs mask alignment. The position of the projection center of the mask pattern obtained as a result of the mask alignment, the result of detecting the reference mark on the mark plate (not shown) using the alignment systems AL _{1 to} AL ₆ , and the respective detection times Based on the measurement result of the interferometer, the baselines of the alignment systems AL _{1 to} AL ₆ are calculated. Details of these preparatory operations are disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-347184.

In the next step 206, the first controller 50A sets an offset O _I1 corresponding to the offset ID; I ₁ corresponding to the plate P ₁ obtained in advance. Here, the setting of the offset means that the first control device 50A (main control device 50) transfers and holds the offset in a storage device (offset information buffer) provided in the lens controller LC.

In the next step 208, the first control device 50A determines whether or not the counter m is 2 or more. In this case, since m = 1 is initialized, the determination here is denied, and the routine jumps to step 214. In step 214, after loading the plate P _m (here P ₁ ) onto the plate stage PST using a loader (not shown), the process proceeds to step 216 and the flag F2 is lowered (F2 = 0). Is determined (confirmed). If the determination here is affirmed, the process proceeds to step 218. If the determination is negative, the process waits until the flag F2 is cleared. In this case, since the flag F2 is lowered (F2 = 0) in the initial setting, the process proceeds to step 218.

In step 218, the first controller 50A includes, (in this case, the plate _{P 1)} the m-th plate _{P m} loaded on the plate stage PST performing alignment. Specifically, the alignment marks given to the plate _{P m,} detected using alignment systems _AL 1 _{~AL 6,} a predetermined computation based on the detection result (e.g., U.S. Patent No. 4,780,617 Statistical calculation disclosed in the specification and the like) is performed to obtain the above-described linear offset.

Next, in Step 220, the first control device 50A performs exposure on the plate P _m (in this case, the plate P ₁ ). Specifically, the first controller 50A performs step-and-scan exposure in the above-described procedure based on the mask alignment and baseline measurement results in step 204 and the plate alignment results in step 218. to all the shot areas on the plate P _m, sequentially transferred by scanning the mask pattern is exposed M. At this time, the first controller 50A controls the synchronous movement of the mask stage MST and the plate stage PST based on the linear offset, and the lens controller LC responds to the position of the plate P _m (plate stage PST). The imaging characteristics of the projection optical systems PL _{1 to} PL ₅ are adjusted based on the set offset O _Im (in this case, O _I1 ) (and the offset component for correcting the magnification (scaling) of the pattern image). Is called. Thereby, the distortion of the projected image of the pattern is corrected so as to overlap the pattern formed in the original process layer.

  Here, the fine adjustment of the synchronous driving of the mask stage MST and the plate stage PST is a relative position between the mask M (mask stage MST) and the plate P (plate stage PST) based on the linear offset obtained as a result of the alignment. And adjusting the relative speed. For example, the position, rotation, and orthogonality of the pattern image formed on the plate by scanning exposure are corrected by the former, and the X magnification of the pattern image in the scanning direction is corrected by the latter, for example.

The adjustment of the imaging characteristics of the projection optical system _PL 1 through PL ₅ is, as described above, the lens controller LC is offset based on the (non-linear _{offset) O Im,} the projection optical system _PL 1 through PL ₅ of each internal This includes driving the optical element or adjusting the refractive index by controlling the air pressure in a part of the airtight space inside each of the projection optical systems PL _{1 to} PL ₅ . As a result, the nonlinear distortion of the projected image (shift, rotation, and magnification of the partial images of the patterns in the five projected areas) is corrected.

  Next, in Step 218, the first control device 50A increments the counter m by 1 (m ← m + 1) and simultaneously sets the flag F1 (F1 ← 1).

Thereby, the waiting state in step 302 on the second control device 50B side is released, and the process proceeds to step 304. In step 304, the second control device 50B sets the flag F2 (F2 ← 1), and then proceeds to step 306, where the offset ID; I _m (I _{2 in} this case) is sent from the control device 140 of the C / D 120. It is judged whether it has come. If the determination in step 306 is affirmed, the process proceeds to step 307. If the determination is negative, it waits for the offset ID; _{Im to} be sent. In this case, for example, in a case where the second sheet of loading of the plates P ₂ in the lot is not started, the offset ID; a waiting state waiting for the I ₂ is sent.

  Concurrently with the execution of the processing of step 218 and step 220 described above, if there is a plate on the plate transfer section (unloading side) by the plate transport system on the C / D 120 side, unloading the plate (C / Conveying to the D side) and the next plate carrying-in operation to the plate delivery section (carrying-in side) are sequentially performed. It is assumed that the plate carry-out operation has been completed with certainty when the exposure is completed. However, as described above, the plate loading operation may not be completed.

  Subsequent to step 222, the first controller 50A determines in step 224 whether the value of the counter m is greater than M, so that all (M) plates in the lot are processed. It is determined whether or not it has been completed. In this case, since m = 2, the determination here is denied and the routine returns to step 208.

In step 208, the first controller 50A determines whether or not the counter m is 2 or more. Since m = 2 at this time, the determination in step 208 is affirmed, and the process proceeds to step 210. In Step 210, the first controller 50A uses the unloader (not shown) to replace the (m−1) th plate P _m−1 (in this case, the plate P ₁ ) loaded on the plate stage PST. Then, it is unloaded from the plate stage PST and placed on the plate delivery section on the carry-out side.

Next, in Step 212, the first control device 50A determines whether or not the _mth plate Pm in the lot has been loaded into the delivery section on the carry-in side. Normally, prior to the decision point, the plate transfer system of the C / D120 side, (m-1) th sheet of plate _{P m-1} of the alignment and in parallel with the exposure, the (m-2) th In addition to the unloading of the plate, the m-th plate Pm is loaded. However, if the alignment and exposure of the lot top of the plate P ₁ is performed, the final plate before the lot (this is only if placed on the plate transfer unit (carry-out side)) out and the plate P ₂ of Is being carried in. Therefore, normally, the determination in step 212 is affirmed, the process proceeds to step 214, and after loading the plate P _m (here P ₂ ) onto the plate stage PST using a loader (not shown), the process proceeds to step 216. Then, it is judged (confirmed) whether or not the flag F2 is lowered (F2 = 0).

On the other hand, in the second control unit 50B side, when the m-th plate P _m is carried to the transfer portion of the carry-in side, the control device 140 from the offset ID corresponding to the plate P _m; sent is I _m Therefore, the waiting state in step 306 is released, and the process proceeds to step 307.

In step 307, the second control device 50B saves the sent offset ID; _Im in the storage device, and then proceeds to step 308, where the offset ID; _Im is the offset ID currently set. It is determined whether or not it is different from I _m−1 . If the determination in step 308 is negative, that is, if I _m = I _m−1 (when it is not necessary to switch the offset), the process proceeds to step 312. On the other hand, if the determination in step 308 is affirmative, the process proceeds to step 310.

In step 310, the second control device 50B switches the offset. That is, the second control device 50B replaces the offset O _Im-1 stored in the storage device (offset information buffer) included in the lens controller LC with the offset O _Im corresponding to the offset ID; Im. After the offset switching, the process proceeds to step 312.

  In step 312, both flags F1 and F2 are lowered (F1 ← 0, F2 ← 0). Thereafter, the process returns to step 302, where the flag F1 is monitored, and the process waits for the flag F1 to be set (F1 = 1).

Therefore, the determination in step 216 by the first control device 50A includes, when the load on the plate stage PST of the plate P _m has been completed, when the offset switch by the second controller 50B has ended, or offset switching If it is not necessary, the determination is affirmative and the routine proceeds to step 218. For example, the a case where loading of the prior plate P _m to the plate P _m-1 unloading at step 210 has been completed, the determination in step 216 are often positive. On the other hand, if the offset switching has not ended, the determination in step 216 is denied, and a wait state is entered in which it waits for the offset switching to end. In this case, when the offset switching is completed, the process proceeds to step 218.

The other hand, when the unloading of the plate P _m-1 of the plate stage PST as described above has been completed, when the plate P _m is not carried, the determination in step 212 described above is negative, the plate P _m Waiting to be loaded, it will be in a waiting state. Then, when the plate _Pm is carried in, the process proceeds to step 214.

In this manner, the first controller 50A, an alignment for the plates P _m, after exposure has taken place, the process of step 222 is performed. When the flag F1 is set in step 222, the second control device 50B starts processing from step 302 onwards as a trigger, and thereafter the first control device 50A according to the flowchart of FIG. The process and the process by the second control device 50B according to the flowchart of FIG. 4B are repeated in parallel until the determination in step 244 is affirmed. The processing by the first control device 50A and the second control device 50B is performed in conjunction with the processing by the C / D 120. Then, when the exposure is completed for the M-th plate (final plate) P _m in the lot, the determination in step 244 is affirmative, a series of processing ends. Incidentally, the plate _{P m} which exposure has been completed, is unloaded to the C / D120, is developed by internal developers of C / D120. Then, the developed lot (M sheets) of the plate is conveyed to a processing step following development such as etching.

As described above in detail, according to exposure apparatus 110 of the present embodiment, the second control unit 50B of the main control unit 50, is carried from the C / D120 plate P _m of the next exposure target is upstream apparatus The offset ID; I, which is identification information of correction information (offset O _Im ) used for correcting the formation state of the pattern image formed on the plate P _m by exposure, for the plate P _{m to be} carried in _m is obtained from the control device 140 of the C / D 120 (steps 306 and 307). Then, the second controller 50B, the offset ID has been obtained; and _{I m,} the offset ID is identification information of the correction information in the set (offset _{O Im-1);} and _{I m-1} are compared (step 308 ), only if they do not match, the offset _{O Im-1} being set, the offset ID obtained; is switched to the offset _{O Im} corresponding to _{I m} (step 310). Accordingly, the first control device 50A of the main control device 50 can sequentially perform the exposure operation using the corresponding offset for each of the plurality (M) of plates in the lot. Therefore, even if a plurality of (M) plates in a lot contain plates with different pattern formation states (histories), high overlay accuracy can be achieved in pattern formation for each plate. It becomes possible.

  In addition, according to the device manufacturing system 100 according to the present embodiment, it is possible to achieve high overlay accuracy for each of the plurality of plates, thereby improving the productivity (including yield) of the liquid crystal display elements. Is possible.

  In the above embodiment, the second control device 50B of the main control device 50 obtains the offset ID corresponding to the plate to be loaded from the control device 140 of the C / D 120, but instead of the offset ID. The offset corresponding to the plate to be loaded may be obtained.

In the above embodiment, the offset switching process by the second control device 50B is often performed in parallel with the plate exchange operation on the plate stage PST, and in consideration of the ease of explanation, the step is performed. Although the determination of 216 is performed after the plate _Pm is loaded, the present invention is not limited to this, and the determination of step 216 may be performed in parallel at any time during the plate replacement operation. That is, the flowcharts of FIGS. 4A and 4B are examples, and various modifications can be made within a range in which an effect equivalent to that of the above embodiment can be obtained.

  By the way, in the device manufacturing system 100 according to the above-described first embodiment, when the next plate loading is not completed during the exposure for some reason, the offset ID to be switched next is not determined. In some cases, offset switching processing cannot be performed. In such a case, there is a waiting time for the offset switching process to be completed after the plate is loaded (see step 216), the process tact time becomes unnecessarily long, and the throughput may be reduced.

The following second embodiment has been made to prevent the above-described increase in tact time.
<< Second Embodiment >>
Next, a second embodiment of the present invention will be described based on FIGS. 5 (A) and 5 (B). In the second embodiment, the processing algorithm of the main control device 50 of the exposure apparatus 110 and the processing algorithm of the control device 140 of the C / D 120 corresponding thereto are different from those of the first embodiment described above. The configuration of the device manufacturing system and the configuration of each apparatus are the same. Therefore, hereinafter, the second embodiment will be described focusing on the differences. Further, from the viewpoint of avoiding repeated explanation, the same reference numerals are used for the same or equivalent parts as those in the first embodiment described above, and the explanation thereof is omitted.

  Here, the processing of one lot of plates in the device manufacturing system according to the second embodiment will be described focusing on the processing in the exposure apparatus 110.

  FIG. 5A shows a flowchart showing a processing algorithm executed by the first control device 50A (its CPU). FIG. 5B shows a flowchart showing a processing algorithm executed by the second control device 50B (CPU thereof). Note that the processing corresponding to these flowcharts may actually be executed by time-sharing processing by a single main controller 50 (CPU).

  In response to the start instruction from the host 130, a series of processing for the plate of the target lot is started. In giving the instruction, the host 130 transfers each recipe (process program file) described above to the control device 140 of the C / D 120 and the main control device 50 of the exposure device 110. At this time, it is assumed that the plate of the designated lot is carried into the C / D 120.

Simultaneously with the transfer of the above recipe, various non-linear offsets O _Im for correcting distortion of the projection image of the pattern created in advance are transferred to the main controller 50 by the host 130 and stored in the main controller 50. It is stored in a device (not shown).

When the recipe is transferred and the start of processing is instructed, the control device 140 of the C / D 120 uses the coater (resist coating device) to sequentially control the plates P _m (m = 1 to M, M in the lot). For example, a resist is applied to 50). Then, the plate _{P m} which a resist layer is formed, a plate conveying system in the C / D (not shown), is carried from the C / D120 to the exposure device 110.

When the plate P _m (m = 1 to M) is transported from the C / D 120 toward the exposure apparatus 110, the controller 140 of the C / D 120 uses the recipe (or information on correspondence between the plate and the offset obtained separately). plate _{P m} and the offset _ID corresponding to the plate _{P m + 1} of the next transport object transport target; _{I m,} I m _{+ 1} is read and transmitted to the main controller 50 of exposure apparatus 110.

In this way, the _first plate P ₁ of the target lot is carried into the exposure apparatus 110 from the C / D 120, and offset IDs I ₁ and I ₂ corresponding to the plates P ₁ and P ₂ respectively are sent from the control apparatus 140. It is assumed that the processing corresponding to the flowchart of FIG. 5A starts at a predetermined time after the incoming time.

  First, in step 402, the first control device 50A initializes the counter m to 1 (m ← 1) as an initial setting, and lowers both the flags F1 and F2 (F1 ← 0, F2 ← 0). When the processing in step 402 is performed, processing corresponding to the flowchart of FIG. 5B starts.

  After starting control, the second control device 50B monitors the flag F1 in step 501, and waits for the flag F1 to be set (F1 = 1).

On the other hand, the first control unit 50A after the initial setting, in the next step 404, the load of the mask, the mask alignment, and the preparation of such baseline measurement of alignment system AL ₁ ~AL _6, a predetermined procedure mentioned above Execute.

In the next step 406, the first controller 50A sets an offset O _I1 corresponding to the offset ID; I ₁ corresponding to the plate P ₁ obtained in advance. That is, the first control device 50A transfers and holds the offset O _I1 in a storage device (offset information buffer) provided in the lens controller LC.

In the next step 408, the first controller 50A determines whether or not the counter m is 2 or more, but the determination here is denied and the routine jumps to step 416. In step 416, after loading the plate P _m (here P ₁ ) onto the plate stage PST using a loader (not shown), the routine proceeds to step 417, where the flag F2 is lowered (F2 = 0). Is determined (confirmed). If the determination here is affirmed, the process proceeds to step 418. If the determination is negative, the process waits until the flag F2 is cleared. In this case, since the flag F2 is cleared (F2 = 0) in the initial setting, the process proceeds to step 418.

In step 418, the first controller 50A includes, (in this case, the plate _{P 1)} the m-th plate _{P m} loaded on the plate stage PST performing alignment. Specifically, the alignment marks given to the plate P _m, detected using alignment systems AL ₁ ~AL _6, by performing a predetermined calculation based on the detection result, obtaining the linear offset described above.

Next, in Step 420, the first control device 50A performs exposure on the plate P _m (in this case, the plate P ₁ ) in the same manner as described above, and sequentially scans and exposes all shot areas on the plate P _m. Thus, the pattern of the mask M is transferred. At this time, the first controller 50A and the lens controller LC perform synchronous movement control between the mask stage MST and the plate stage PST described above based on the linear offset and the set nonlinear offset O _Im (in this case, O _I1 ). Then, the imaging characteristics of the projection optical systems PL _{1 to} PL ₅ are adjusted, and the distortion of the projected image of the pattern is corrected so as to overlap the pattern formed in the original process layer.

  Next, in step 422, the first control device 50A increments the counter m by 1 (m ← m + 1) and simultaneously sets the flag F1 (F1 ← 1).

  Thereby, the waiting state in step 501 on the second control device 50B side is released, and the process proceeds to step 502.

  In step 502, the second control device 50B sets the flag F2 (F2 ← 1), and then proceeds to step 504.

In step 504, the second control device 50B sets the offset ID; I _m (here, the offset ID; I ₂ sent earlier) corresponding to the next plate P _m to be exposed. It is determined whether or not the offset ID corresponding to the offset; I _m−1 (in this case, I ₁ ) is different. If the determination in step 504 is negative, that is, if I _m = I _m−1 (when switching of the offset is not necessary), the process proceeds to step 508. On the other hand, if the determination in step 504 is affirmed, the process proceeds to step 506.

In step 506, the second control device 50B performs offset switching (replacement between the offset O _Im-1 and the offset O _Im for the storage device (offset information buffer) provided in the lens controller LC). After offset switching, the process proceeds to step 508.

In step 508, the second controller 50B lowers the flag F2 (F2 ← 0), and then proceeds to step 510. In step 510, the second controller 50B is offset ID corresponding to the plate _{P m} of the next exposure target; or _{I m + 1} has been _transmitted; offset ID corresponding to _{I m} and the plate _{P m + 1} of the next exposure objective Judge whether or not. If the determination at step 510 is affirmative, the routine proceeds to step 512. On the other hand, if the determination in step 510 is negative, the system waits for the offset IDs; I _m and I _{m + 1 to} be sent.

In Step 512, the second control device 50B stores the sent offset IDs; I _m and I _{m + 1} in the storage device, and then proceeds to Step 514 to lower the flag F1 (F1 ← 0). After that, the process returns to step 501 to monitor the flag F1 and wait for the flag F1 to be set (FI = 1).

  On the other hand, the following processing is performed by the first control device 50A in parallel with the processing from step 501 onward by the second control device 50B. That is, the first control device 50A determines whether or not the value of the counter m is greater than M in step 424 following the processing in step 422 described above, whereby all (M) plates in the lot are determined. It is determined whether or not the processing for is completed. In this case, since m = 2, the determination here is denied and the process returns to step 408.

In Step 408, the first control device 50A determines whether or not the counter m is 2 or more. At this time, since m = 2, the determination in Step 208 is affirmed and the process proceeds to Step 410. In step 410, the first controller 50A uses the unloader (not shown) to replace the (m−1) th plate P _m−1 (in this case, the plate P ₁ ) loaded on the plate stage PST. Then, after unloading from the plate stage PST and placing it on the plate delivery section on the carry-out side, the process proceeds to step 414.

In Step 414, the first control device 50 </ _b > A determines whether or not the _m-th plate P _m (here, P ₂ ) has been carried into the delivery unit on the carry-in side. When the mth plate _Pm is carried in by the C / D side plate conveyance system, the determination in step 414 is affirmed, and the process proceeds to step 416. On the other hand, if the plate P _m has not been loaded at the time when the unloading of the plate P _{m−1 from} the plate stage PST is completed or when the switching of the offset is completed thereafter, the determination in step 414 is made. denied, wait for the plate P _m is carried, a wait state. Then, when the plate _Pm is loaded, the process proceeds to step 416.

Thereafter, the first controller 50A, the plate _{P m} is loaded on the plate stage PST (step 416), the flag F2 is (has become F2 = 0) and are unloaded whether the determination (confirmation) (Step 417). Determination in step 417 by the first control device 50A includes, when the load on the plate stage PST of the plate P _m has been completed, when the offset switch by the second controller 50B has ended, or offset switch is not required If yes, the determination is affirmative, and the routine proceeds to step 418.

Then, the first controller 50A, the plate stage PST on the alignment of the loaded plate _{P m} is performed (step 418), exposure of the plate _{P m} is performed (step 420). During the exposure, the distortion of the projected image of the pattern is corrected by the first control device 50A and the lens controller LC so as to overlap the pattern formed in the original process layer.

Then, the first control device 50A performs the processing of step 422, and using this as a trigger, the processing of step 501 and subsequent steps by the second control device 50B is started again, and thereafter the first control according to the flowchart of FIG. The processing by the control device 50A and the processing by the second control device 50B according to the flowchart of FIG. 5B are repeated in parallel until the determination at step 424 is affirmed. The processing by the first control device 50A and the second control device 50B is performed in conjunction with the processing by the C / D 120. Then, when the exposure of the _Mth plate (final plate) PM in the lot is completed, the determination in step 424 is affirmed, and the series of processes is completed. Incidentally, the plate _{P m} which exposure has been completed, is unloaded to the C / D120, is developed by internal developers of C / D120. Then, the developed lot (M sheets) of the plate is conveyed to a processing step following development such as etching.

According to the exposure apparatus according to the second embodiment described above, the pattern formation state (history) in a plurality (M) of plates in the lot, as in the exposure apparatus 110 of the first embodiment described above. ), Even when different plates are mixed, it is possible to achieve high overlay accuracy in pattern formation for each plate. In addition, the exposure apparatus according to the second embodiment, C / D120 from when the m-th plate P _m in the lot is loaded, the second controller 50B is offset ID; I _m and Obtain _{Im + 1} . That is, prior to the loading of the ( _{m + 1) th} plate P _{m + 1} , the offset ID; O _{Im + 1} can be obtained, so the unloading of the previous exposed plate P _m is started without waiting for the loading of the plate P _{m + 1.} At the same time or prior to this, it is possible to switch the offset used in the exposure of the plate P _{m + 1} .

  In addition, according to the device manufacturing system according to the second embodiment, it is possible to achieve high overlay accuracy for each of a plurality of plates, thereby improving the productivity (including yield) of the liquid crystal display elements. It becomes possible to make it.

In the first and second embodiments, the C / D 120 processes the plates in the lot in accordance with the order described in the lot information, and transports them to the exposure apparatus 110 in principle. However, due to troubles in the C / D 120, the plates may be conveyed in an order different from the order described. Therefore, when the plate _{P m} is carried from the C / D120, from the control unit 140, an offset ID for the plate _{P m} of the carry-subject; an _{I m + 1; I m,} the offset ID for the plate _{P m + 1} are conveyed further to the next It is significant that the main control device 50 of the exposure apparatus 110 obtains. This is also effective when the order is not described in the lot information (the exposure order is not specified), or when the plates are transported out of order.

In the first and second embodiments, the second control unit 50B of the main controller 50, an offset ID for the plate _{P m} of the carry-target from the controller 140 of the C / D120; _{I m,} is conveyed further to the next that offset ID for the plate P _{m + 1;} the I m + _1, it is assumed to obtain, not limited to this, other devices, the offset ID from such management apparatus for managing the transport of the plates that are connected to, for example, a network 150 to obtain It is also good to do.

  Further, the flowcharts of FIGS. 5A and 5B described in the second embodiment are examples, and in the same manner as described above, the same effects as those of the second embodiment can be obtained. Various modifications are possible.

  In the above embodiment, the magnification is uniformly adjusted without distinguishing between the X-axis direction and the Y-axis direction out of the distortion of the partial image of the pattern due to the configuration of the imaging characteristic correction device. Not limited to this, the X magnification (scaling) and the Y magnification (scaling) may be adjusted (corrected) separately.

<< First Modification >>
In the lithography system 100 according to the first embodiment described above, when the plate P _m (m = 1 to M) in a lot is managed using the identifier (plate ID), the main controller 50 The second control device 50B can perform processing according to the processing algorithm shown in the flowchart of FIG. 6 instead of the processing algorithm shown in the flowchart of FIG. In this case, when instructing the start of a series of processes for the plate of the target lot, the host 130 sends the above-described recipes (process program files), the controller 140 of the C / D 120 to the main controller 50 of the exposure apparatus 110. Forward. At the same time, the host 130 also stores the combination of the identification information (plate ID) of each plate in the lot to be input and the offset ID, that is, the data of the ID correspondence list indicating the correspondence between the two, as the main information of the exposure apparatus 110. It is assumed that the data is transferred to the control device 50. Further, the control unit 140 of the C / D120, upon loading of the plates, the offset ID, not the plate ID plate _{P m} of the carry-target (for convenience, is intended to refer to the same _{P m} as the symbols of the plate), an exposure device It is also assumed that the data is transferred to 110 main controller 50. Under such a premise, basically, the first control device 50A performs the same processing in the same procedure as in the first embodiment described above.

The second controller 50B, in step 306, the offset ID; instead _{I m,} the plate ID; _{P m} determines whether sent from the control unit 140 of the C / D120. Then, the second controller 50B in step 307, the plate ID sent; Save _{P m.}

Further, the second controller 50B in step 307A, the plate ID stored at step 307; the _{P m} as a key, combination of the plate ID and an offset ID, i.e. the ID correspondence list indicating their correspondence relationship plates ID; Search _{I m;} offset ID corresponding to _{P m.}

  The processing of these three steps 306, 307, and 307A is different from that of the first embodiment described above, but the processing of the other steps is the same as that of the first embodiment.

According to this first modification, it is possible to obtain the same effect as that of the first embodiment.
<< Second Modification >>
In the lithography system according to the second embodiment described above, when the plates P _m (m = 1 to M) in the lot are managed using the identifiers (plate IDs), the main controller 50 The two control devices 50B can perform processing according to the processing algorithm shown in the flowchart of FIG. 7 instead of the processing algorithm shown in the flowchart of FIG. In this case, when instructing the start of a series of processes for the plate of the target lot, the host 130 sends the above-described recipes (process program files), the controller 140 of the C / D 120 to the main controller 50 of the exposure apparatus 110. Forward. At the same time, the host 130 also stores the combination of the identification information (plate ID) of each plate in the lot to be input and the offset ID, that is, the data of the ID correspondence list indicating the correspondence between the two, as the main information of the exposure apparatus 110. It is assumed that the data is transferred to the control device 50. Further, the control unit 140 of the C / D120, at the time of loading of the plate, the plate _ID corresponding to the plate _{P m + 1} of the next transport object the plate _{P m} of the transport object; P _m, the _{P m + 1,} the main exposure apparatus 110 It is also assumed that the data is transmitted to the control device 50. Under such a premise, basically, the first control device 50A performs the same processing in the same procedure as in the second embodiment described above.

In step 510, the second control device 50B determines whether or not the offset ID; I _m and I _{m + 1} is sent from the control device 140 of the C / D 120 instead of the plate ID; P _m and P _{m + 1.} . In step 512, the second control device 50B stores the sent plate IDs; P _m and P _{m + 1} .

Further, in step 502A, the second control device 50B uses the plate ID stored in step 512; _Pm as a key to combine the plate ID and the offset ID, that is, from the ID correspondence list indicating the correspondence between the two. plates ID; Search _{I m;} offset ID corresponding to _{P m.}

  The processing of these three steps 510, 512, and 502A is different from that of the second embodiment described above, but the processing of the other steps is the same as that of the second embodiment. Note that the process of step 502A may be performed between step 512 and step 514.

  According to the second modification, the same effect as that of the second embodiment described above can be obtained.

  In the first and second modified examples, the combination of identification information (plate ID) and offset ID of each plate in the lot to be input, that is, the data of the ID correspondence list indicating the correspondence between the two, The host 130 transfers to the main controller 50 of the exposure apparatus 110. However, the present invention is not limited to this, and the controller 140 of the C / D 120, which is an upstream apparatus, may transfer to the main controller 50.

In addition, the main control device 50 of the exposure apparatus 110 may receive a list including offset IDs arranged in the order of plate loading (carrying-in) from an external device such as the host 130 at the time of lot loading. As long as they are arranged in the order of loading (carrying-in), a list of only offset IDs or a pair with plate IDs may be used. In this case, the main controller 50 of the exposure apparatus 110 can determine the offset ID to be switched next from this list, so that the offset switching can be performed in advance even if the loading of the plate is delayed. That is, as in the second embodiment or the second modification described above, when the plate P _m is carried from the C / D120, is conveyed from the controller 140, to the plate P _m and the next carrying object The offset IDs for the plate P _{m + 1} ; I _m and I _{m + 1} (or plate IDs; P _m and P _{m + 1} ) need not necessarily be transmitted to the main controller 50.

  Even if the processing sequence of each device of the device manufacturing system as in the second embodiment or the second modification is employed, if the offset data amount is large, the offset switching process takes a long time, There may be a case where the offset switching is not completed even after the plate exchange is completed. In this case, a waiting time is generated after the plate replacement, and the tact time is unnecessarily increased by the waiting time.

  As a countermeasure in such a case, the following method can be employed. However, this countermeasure is premised on that there is a margin in the offset information buffer (hereinafter simply referred to as a buffer) of the lens controller LC, that is, there is still a free area even if offset information for one plate is held. .

  In this case, for example, as in the first embodiment and the first modification, the offset ID (or plate ID) of the plate to be loaded is transmitted from the C / D 120 side to the exposure apparatus 110 at the time of loading. However, when the next exposure target plate is completely loaded and the offset ID of the plate is determined, the main controller 50 is in parallel with the exposure process even during the plate exposure process. The offset switching process can be started. However, in this case, the offset switching process is not to take out the current offset set for use in the plate being exposed from the buffer and store the next offset to be used in the next plate in the buffer. This means that the next offset is stored in the empty area while the current offset is held in the buffer, and a command to use the next offset is given to the lens controller LC. Of course, when the next offset is stored in the buffer before the switching process, it is only necessary to give a command to use the next offset to the lens controller LC.

The second embodiment described above or as in the second modification, when the plate P _m is carried from the C / D120, from the control unit 140, is conveyed to the plate P _m and the next carrying object that the plate _{P m + 1} to the offset ID; _{I m} and _{I m + 1} (or plate ID; _{P m} and _{P m + 1)} if, and transmits to the main controller 50, or the main controller 50 of exposure apparatus 110 during lot input is, the host When a list including offset IDs arranged in the order of loading (carrying in) the plate is received from an external device such as 130, the next offset described above in parallel with the exposure process without waiting for completion of loading of the next exposure target plate. It is possible to start the offset switching process including the use instruction.

  Further, as in the first and second modified examples described above, the host 130 (external device such as an external device) combines the identification information (plate ID) and offset ID of each plate in the lot to be loaded (ID correspondence). (Related list) data is transferred to the main controller 50 of the exposure apparatus 110, or when the lot is inserted, the main controller 50 is arranged from the external device such as the host 130 in the order of plate loading (carrying-in). In the case of receiving a list including offset IDs, the main control device 50 can grasp the type (number) of offset IDs to be switched within a lot before plate exposure at the beginning of the lot. In this case, if the controller 50 transfers all the offsets to the buffer of the lens controller LC and the buffer still has an empty area, the main controller 50 sets all the offsets before the top plate exposure. It is only necessary to specify for each plate which of the transferred offsets to use before the start of exposure at the latest for each plate.

  In each of the above-described embodiments and modifications, the non-linear offset is mainly managed by the offset ID among the offsets. However, the present invention is not limited to this, and even if position correction is performed using the linear offset obtained by alignment, the residual remains. Since there is a linear offset (due to device adjustment residue, a tendency unique to the manufacturing device (its manufacturing process), etc.), this remaining linear offset may be managed by an offset ID alone or together with a non-linear offset. .

  In each embodiment and each modification, the case where the host 130 holds and manages the “recipe” of the exposure apparatus and the C / D 120 has been described. However, the present invention is not limited to this, and an apparatus such as an exposure apparatus or a C / D. Holds and manages “recipe” and “offset file”, and “lot information” including a recipe identifier may be transferred from the host.

  In addition, there are many types of offsets, and it is impossible to hold all offsets in the buffer of the lens controller LC. However, when it is possible to hold two or more offsets, the most frequently used (the offsets are set). (The number of plates to be used is large.) The offsets are selected in order from the offset according to the frequency of use, and as many selected offsets as possible are stored in the buffer of the lens controller LC at the same time and stored in those buffers. When exposing a plate using an offset, the main controller 50 gives only an instruction to switch the offset to the lens controller LC, and when exposing a plate using another offset that is less frequently used. Of the offsets stored in the buffer, the least frequently used offset And bets, it is also possible to switch between the other offset (replacement for the buffer). By doing so, it is possible to reduce the frequency of occurrence of actual offset switching and the time required for offset switching.

  In the above embodiment, a scanning exposure apparatus is adopted as the exposure apparatus 110. However, the present invention is not limited to this, and the mask and the substrate are stationary, and the pattern formed on the mask is placed on the substrate via the projection optical system. A batch exposure type exposure apparatus (stepper) for transfer may be employed. However, it is necessary that the projection exposure apparatus has a function of correcting distortion of the projection image.

  In the above embodiment, the device manufacturing system 100 is provided with a plurality of exposure apparatuses including the exposure apparatus 110. Here, as exposure apparatuses other than the exposure apparatus 110, not only a scanning stepper but also a batch exposure type exposure apparatus such as a stepper, and a step-and-stitch type exposure apparatus that synthesizes a shot area and a shot area are adopted. Also good. Further, as each exposure apparatus, an immersion type exposure apparatus that exposes a substrate through an optical system and a liquid may be adopted.

  When each exposure apparatus of the above embodiment is a projection exposure apparatus, the projection optical system may be not only a reduction system but also an equal magnification system and an enlargement system, and the projection optical system may be a refraction system, a reflection system, and a catadioptric system. Any of the systems may be used, and the projected image may be either an inverted image or an erect image. Further, as a light source for the exposure apparatus 110 and the like, not only an ultrahigh pressure mercury lamp but also a KrF excimer laser (248 nm), an ArF excimer laser (193 nm), or the like can be used.

  Moreover, although the case where this invention was applied to the exposure apparatus (and device manufacturing system containing the same) which manufactures a liquid crystal display element was illustrated in the said embodiment, it is not restricted to this, A semiconductor element, organic EL, thin film magnetism The present invention can also be applied to an exposure apparatus (and a device manufacturing system including the head) that manufactures a head, an image sensor (CCD or the like), a micromachine, a DNA chip, and the like.

  The exposure apparatus and exposure method of the present invention are suitable for forming a pattern on an object. The device manufacturing system of the present invention is suitable for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements.

DESCRIPTION OF SYMBOLS 50 ... Main control apparatus, 50A ... 1st control apparatus, 50B ... 2nd control apparatus, 100 ... Device manufacturing system, 110 ... Exposure apparatus, 110A ... Exposure apparatus main body, 120 ... Coater / developer (C / D), 130 ... Host computer, IL _{1 to} IL ₅ ... illumination light, LC ... lens controller, M ... mask, P ... plate, PL _{1 to} PL ₅ ... projection optical system, PST ... plate stage.

Claims (20)

An exposure apparatus that sequentially performs an exposure operation for forming an image of a pattern formed on a mask on an object on a plurality of objects,
An optical system and a moving body on which the object is placed are exposed. The object placed on the moving body is exposed to the pattern on the object by the energy beam through the mask and the optical system. An exposure apparatus body for forming an image of
When the next exposure target object is carried in from the upstream apparatus, the correction information used to correct the formation state of the image of the pattern formed on the object by the exposure or the identification information thereof. Is obtained from an external device, the obtained information is compared with the correction information being set or its identification information, and the correction information being set corresponds to the acquired information or the information only if they do not match. A first control system that performs a switching process for switching to correction information to be performed;
An exposure apparatus comprising: a second control system that uses set correction information when forming an image of the pattern on the next object to be exposed using the exposure apparatus main body.   Prior to the next exposure target object being carried in from the upstream device, the exposure target object in front of the object is exposed on the moving body, and the previous exposure target object is exposed. The exposure apparatus according to claim 1, wherein unloading is performed.   The exposure apparatus according to claim 2, wherein the next object to be exposed is further carried in parallel with the object to be exposed being exposed on the movable body.   4. The exposure apparatus according to claim 3, wherein the first control system performs the switching process in parallel with an exchange operation between the object on the moving body and the next object to be exposed.   When the first control system can store a plurality of types of correction information in the correction information storage area of the storage device in which the correction information is set, before the exposure of the object to be exposed on the moving body is completed The exposure apparatus according to claim 3 or 4, wherein when the next object to be exposed is completed, the switching process is started before the end of the exposure, if necessary.   When the next object to be exposed is carried in from the upstream apparatus, the first control system also applies the correction information or identification information to the object to be carried in next to the object in addition to the object to be carried in. The exposure apparatus according to claim 1 or 2, wherein:   The first control system starts the switching process during the exposure of the object to be exposed on the movable body before the completion of the next object to be exposed at the latest. Exposure device.   The exposure apparatus according to claim 1, wherein the external apparatus is a host apparatus or the upstream apparatus. An exposure apparatus that sequentially performs an exposure operation for forming an image of a pattern formed on a mask on an object on a plurality of objects,
An optical system and a moving body on which the object is placed are exposed. The object placed on the moving body is exposed to the pattern on the object by the energy beam through the mask and the optical system. An exposure apparatus body for forming an image of
Prior to exposure of a predetermined number of objects, a combination of identification information for each object and identification information for correction information used for correcting the formation state of the pattern image formed on the object by exposure. When the next exposure target object is carried in from the upstream apparatus, the identification information is obtained from the upstream apparatus, and the obtained information is keyed. Comparing the identification information of the correction information obtained by searching the combination information and the identification information of the correction information being set, and if both do not match, the correction information being set is A first control system that performs a switching process for switching to correction information corresponding to the obtained identification information;
An exposure apparatus comprising: a second control system that uses set correction information when forming an image of the pattern on the next object to be exposed using the exposure apparatus main body.   Prior to the next exposure target object being carried in from the upstream device, the exposure target object in front of the object is exposed on the moving body, and the previous exposure target object is exposed. The exposure apparatus according to claim 9, wherein unloading is performed.   The exposure apparatus according to claim 10, wherein the next object to be exposed is further carried in parallel with the object to be exposed being exposed on the movable body.   The exposure apparatus according to claim 11, wherein the first control system performs the switching process in parallel with an exchange operation between the object on the moving body and the next object to be exposed carried in.   When the first control system can store a plurality of types of correction information in the correction information storage area of the storage device in which the correction information is set, before the exposure of the object to be exposed on the moving body is completed The exposure apparatus according to claim 11 or 12, wherein when the next object to be exposed is completed, if necessary, the switching process is started before the exposure is completed.   The first control system obtains identification information of an object to be carried in next to the object in addition to the object to be carried in when the next object to be exposed is carried in from the upstream apparatus. The exposure apparatus according to claim 9 or 10.   The first control system obtains, from the external device, information on the combination of the predetermined number of objects arranged in the order of being loaded from the upstream device prior to exposure of the predetermined number of objects. The exposure apparatus according to any one of -14.   The first control system starts the switching process during the exposure of the object to be exposed on the moving body before the completion of the next object to be exposed at the latest. The exposure apparatus described.   The exposure apparatus according to claim 9, wherein the external apparatus is a host apparatus or the upstream apparatus. An exposure apparatus according to any one of claims 1 to 17;
The upstream apparatus for performing predetermined processing on each object carried into the exposure apparatus;
A management apparatus that manages the exposure apparatus and the upstream apparatus;
A device manufacturing system comprising: An exposure operation for exposing an object placed on the moving body via the mask and the optical system with an energy beam and forming an image of the pattern on the object is sequentially performed on a plurality of objects. An exposure method comprising:
When the next exposure target object is carried in from the upstream apparatus, the correction information used to correct the formation state of the image of the pattern formed on the object by the exposure or the identification information thereof. Is obtained from an external device, the obtained information is compared with the correction information being set or its identification information, and the correction information being set corresponds to the acquired information or the information only if they do not match. A first step of performing a switching process for switching to correction information to be performed;
And a second step of forming an image of the pattern on the next object to be exposed using the set correction information. An exposure operation for exposing an object placed on the moving body via the mask and the optical system with an energy beam and forming an image of the pattern on the object is sequentially performed on a plurality of objects. An exposure method comprising:
Prior to exposure of a predetermined number of objects, a combination of identification information for each object and identification information for correction information used for correcting the formation state of the pattern image formed on the object by exposure. When the next exposure target object is carried in from the upstream apparatus, the identification information is obtained from the upstream apparatus, and the obtained information is keyed. Comparing the identification information of the correction information obtained by searching the combination information and the identification information of the correction information being set, and if both do not match, the correction information being set is A first step of performing a switching process for switching to correction information corresponding to the obtained identification information;
And a second step of forming an image of the pattern on the next object to be exposed using the set correction information.

Images