JP2010016111A - Exposure apparatus and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus that suppresses the degradation of throughput. <P>SOLUTION: The exposure apparatus includes: an optical member which emits exposure light; first and second holding units which hold a substrate; and first and second members which have first and second surfaces disposed at least partially at peripheries of the first and second holding units and can move on a predetermined surface while holding the substrate. The first and second surfaces have first and second edges, and at least one short region of the substrate held by the first and second holding units is exposed while the first and second members are moved to the optical member in first and second directions which are neither parallel nor perpendicular to the first and second edges. The first and second members are moved during transition from a first state where the optical member and first surface face each other to a second state where the optical member and second surface face each other so as to maintain a state where the first and second edges are put close to each other or in contact with each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate with exposure light and a device manufacturing method.

In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an exposure apparatus that exposes a substrate with exposure light as disclosed in the following patent document is used.
US Pat. No. 6,262,796 US Pat. No. 6,341,007 US Pat. No. 7,372,538 US Patent Application Publication No. 2007/0127006

  In the exposure apparatus, a plurality of substrates are sequentially exposed. For example, if the time from the end of exposure of the first substrate to the start of exposure of the next second substrate becomes longer, the throughput may decrease. As a result, device productivity may be reduced.

  An object of an aspect of the present invention is to provide an exposure apparatus that can suppress a decrease in throughput. Moreover, the aspect of this invention aims at providing the device manufacturing method which can suppress the fall of productivity.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, an optical member that emits exposure light, a first holding unit that holds the substrate, and a first holding A first member disposed on at least a part of the periphery of the unit and movable while holding the substrate on the predetermined surface, a second holding unit for holding the substrate, and a second holding unit A second member disposed on at least a part of the periphery of the first member, and a second member movable while holding the substrate on the predetermined surface, wherein the first surface has a first edge, The second surface has a second edge, and exposure of at least one shot region of the substrate held by the first holding unit causes the first member to be non-parallel and non-perpendicular to the first edge with respect to the optical member. The exposure of at least one shot area of the substrate that is performed while moving in the first direction and held by the second holding unit is performed by the optical unit. The second state is executed while moving the second member in a second direction that is non-parallel and non-perpendicular to the second edge, and the first state in which at least a part of the emission surface of the optical member faces the first surface is optical. The first member so that the state in which the first edge and the second edge are brought close to or in contact with each other is maintained while at least a part of the emission surface of the member changes to the second state in which the second surface opposes. An exposure apparatus for moving the second member is provided.

  According to the second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light, comprising an optical member that emits exposure light and a first holding unit that holds the substrate, and an irradiation position of the exposure light. A substrate is held on a predetermined surface having a first region including a second region disposed on one side of the first region including a substrate replacement position, and a third region disposed on the other side of the first region. A first member that is movable; and a second member that has a second holding portion that holds the substrate and is movable while holding the substrate on a predetermined surface. The first member is disposed in the first region. An exposure apparatus is provided that moves the second member from the second region to the third region.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first and second aspects, and developing the exposed substrate. .

  According to the present invention, a decrease in throughput can be suppressed, and a decrease in device productivity can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, the exposure apparatus EX includes a mask stage 3 that can move while holding a mask M, first and second substrate stages 1 and 2 that can move while holding a substrate P, and a guide surface of a base member 4. 5, a drive system 6 for moving the mask stage 3 on the surface 5, a drive system 9 for moving the first and second substrate stages 1, 2 on the guide surface 8 of the base member 7, and the mask stage 3. At least one of an optical path of the exposure light EL, an illumination system IL that illuminates the exposed mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, The liquid immersion member 10 that forms the liquid immersion space LS so that the portion is filled with the liquid LQ, and the control device 11 that controls the operation of the entire exposure apparatus EX are provided.

The illumination system IL illuminates a predetermined illumination area IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage 3 holds the mask M so that it can be released. The mask stage 3 is movable while holding the mask M on the guide surface 5 of the base member 4 including the illumination region IR. The guide surface 5 is substantially parallel to the XY plane. The mask stage 3 moves on the guide surface 5 by the operation of the drive system 6. In the present embodiment, the drive system 6 includes a planar motor for moving the mask stage 3 on the guide surface 5. A planar motor for moving the mask stage 3 includes, for example, a magnet array 3M disposed on the mask stage 3 and a coil array 4C disposed on the base member 4 as disclosed in US Pat. No. 6,452,292. And have. In the present embodiment, the mask stage 3 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions by the operation of the drive system 6 including a planar motor.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The plurality of optical elements of the projection optical system PL are held by a lens barrel PK. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  Each of the first and second substrate stages 1 and 2 holds the substrate P in a releasable manner. Each of the first and second substrate stages 1 and 2 is movable while holding the substrate P on the guide surface 8 of the base member 7 including the projection region PR. The guide surface 8 is substantially parallel to the XY plane. The first and second substrate stages 1 and 2 move on the guide surface 8 by the operation of the drive system 9. In the present embodiment, the drive system 9 includes a planar motor for moving the first and second substrate stages 1 and 2 on the guide surface 8. A planar motor for moving the first and second substrate stages 1 and 2 is, for example, a magnet disposed on the first and second substrate stages 1 and 2 as disclosed in US Pat. No. 6,452,292. It has arrays 1M and 2M and a coil array 7C arranged on the base member 7. In the present embodiment, the first and second substrate stages 1 and 2 are moved in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 9 including a planar motor. It is movable.

  In the present embodiment, the positional information of the mask stage 3, the first substrate stage 1, and the second substrate stage 2 is measured by an interferometer system (not shown) including a laser interferometer. When executing the exposure processing of the substrate P or when executing the predetermined measurement processing, the control device 11 operates the drive systems 6 and 9 based on the measurement result of the interferometer system, and the mask stage 1 (mask M ), Position control of the first substrate stage 1 (substrate P) and the second substrate stage 2 (substrate P) is executed.

  In the present embodiment, the exposure apparatus EX includes an exposure station ST1 in which an exposure process for the substrate P is executed, and a measurement station ST2 in which a predetermined measurement process related to exposure and an exchange process for the substrate P are executed. Each of the first and second substrate stages 1 and 2 is movable between the exposure station ST1 and the measurement station ST2 while holding the substrate P. The guide surface 8 of the base member 7 is disposed so as to extend between the exposure station ST1 and the measurement station ST2. Each of the first and second substrate stages 1 and 2 is movable along the guide surface 8 between the exposure station ST1 and the measurement station ST2.

  In the exposure station ST1, an illumination system IL, a mask stage 3, a projection optical system PL, and the like are arranged. The exposure station ST1 has an irradiation position EP of the exposure light EL emitted from the terminal optical element 14 that is closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. The projection region PR includes the irradiation position EP of the exposure light EL.

  The measurement station ST2 includes a substrate P such as an alignment system 12 for acquiring position information of the substrate P in the XY plane, and a focus / leveling detection system (not shown) for acquiring position information of the surface of the substrate P. Various measuring devices capable of performing measurement relating to the exposure of the light are arranged. The alignment system 12 detects the alignment mark on the substrate P and measures the position information of the shot region S of the substrate P in the XY plane.

  The measurement station ST2 has a substrate replacement position RP. In the vicinity of the measurement station ST2, a transport device 13 capable of transporting the substrate P is disposed. The transport device 13 can perform the replacement process of the substrate P. The control device 11 moves the first substrate stage 1 (or the second substrate stage 2) to the substrate exchange position RP of the measurement station ST2, and uses the transfer device 13 to place the first substrate stage 1 (or the second substrate stage 2) at the substrate exchange position RP. The operation of unloading the unexposed substrate P from the substrate stage 1 (or the second substrate stage 2), and the unloading substrate P to the first substrate stage 1 (or the second substrate stage 2) (loading) The substrate P can be exchanged including at least one of the following operations.

  The guide surface 8 includes a first region 15 including the irradiation position EP of the exposure light EL, a substrate replacement position RP, a second region 16 disposed on the + Y side of the first region 15, and − of the first region 15. And a third region 17 disposed on the Y side. Each of the first and second substrate stages 1 and 2 is movable on the guide surface 8 including the first, second and third regions 15, 16 and 17.

  FIG. 2 is a side sectional view showing an example of the first and second substrate stages 1 and 2 and the liquid immersion member 10 according to the present embodiment.

  In FIG. 2, the first substrate stage 1 includes a first holding unit 18 that holds the substrate P in a releasable manner, and an upper surface 19 that is disposed around the first holding unit 18. In the present embodiment, the first holding unit 18 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The upper surface 19 is substantially parallel to the XY plane. In the present embodiment, the surface of the substrate P held by the first holding unit 18 and the upper surface 19 are disposed in substantially the same plane (they are flush).

  The second substrate stage 2 includes a second holding unit 20 that holds the substrate P in a releasable manner, and an upper surface 21 that is disposed around the second holding unit 20. In the present embodiment, the second holding unit 20 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The upper surface 21 is substantially parallel to the XY plane. In the present embodiment, the surface of the substrate P held by the second holding unit 20 and the upper surface 21 are arranged in substantially the same plane (they are flush).

  In the present embodiment, the control device 11 can adjust the positions of the first and second substrate stages 1 and 2 so that the upper surface 19 and the upper surface 21 are arranged in substantially the same plane.

  Each of the first and second holding portions 18 and 20 has a so-called pin chuck mechanism. The first holding unit 18 is disposed on the chuck surface 22 of the first substrate stage 1, and has a plurality of convex portions 23 that support the back surface of the substrate P, and a first surface that is disposed around the plurality of convex portions 23 on the chuck surface 22. A first peripheral wall 24 and a plurality of suction ports 25 provided on the chuck surface 22 inside the first peripheral wall 24 and capable of sucking gas are provided. The gas in the space surrounded by the back surface of the substrate P, the first peripheral wall 24 and the chuck surface 22 is sucked by the suction port 25, and the space becomes negative pressure, whereby the back surface of the substrate P is sucked and held by the convex portion 23. Is done. Further, the substrate P can be removed from the first holding unit 18 by stopping the suction operation using the suction port 25. The 2nd holding | maintenance part 20 has the structure equivalent to the 1st holding | maintenance part 18, and hold | maintains the board | substrate P so that release is possible. A description of the second holding unit 20 is omitted.

  In the present embodiment, the first substrate stage 1 is disposed around the first plate member T1 disposed around the substrate P and the first holding unit 18 and holds the first plate member T1 in a releasable manner. 3 holding part 26. The second substrate stage 2 includes a second plate member T2 arranged around the substrate P, a fourth holding unit 27 arranged around the second holding unit 20 and releasably holding the second plate member T2. Have

  The first plate member T1 has an opening in which the substrate P can be placed. The third holding unit 26 holds the first plate member T1 such that the first plate member T1 is disposed around the substrate P held by the first holding unit 18. The first holding unit 18 holds the substrate P inside the opening of the first plate member T1. A predetermined gap is formed between the outer edge of the substrate P held by the first holding part 18 and the inner edge of the opening of the first plate member T1 held by the third holding part 26. The third holding unit 26 holds the first plate member T1 so that the surface of the first plate member T1 and the XY plane are substantially parallel. The surface of the substrate P held by the first holding unit 18 and the surface of the first plate member T1 held by the third holding unit 26 are arranged in substantially the same plane. In the present embodiment, the upper surface 19 of the first substrate stage 1 includes the surface of the first plate member T <b> 1 held by the third holding unit 26.

  The second plate member T2 has an opening in which the substrate P can be placed. The fourth holding unit 27 holds the second plate member T2 such that the second plate member T2 is disposed around the substrate P held by the second holding unit 20. The second holding unit 20 holds the substrate P inside the opening of the second plate member T2. A predetermined gap is formed between the outer edge of the substrate P held by the second holding part 20 and the inner edge of the opening of the second plate member T2 held by the fourth holding part 27. The fourth holding unit 27 holds the second plate member T2 such that the surface of the second plate member T2 and the XY plane are substantially parallel. The surface of the substrate P held by the second holding unit 20 and the surface of the second plate member T2 held by the fourth holding unit 27 are arranged in substantially the same plane. In the present embodiment, the upper surface 21 of the second substrate stage 2 includes the surface of the second plate member T <b> 2 held by the fourth holding unit 27.

  Each of the third and fourth holding portions 26 and 27 has a so-called pin chuck mechanism. The third holding unit 26 includes a second peripheral wall 29 formed around the first peripheral wall 24 on the chuck surface 28 of the first substrate stage 1 and a third peripheral wall formed around the second peripheral wall 29 on the chuck surface 28. 30, a plurality of convex portions 31 formed on the chuck surface 28 between the second peripheral wall 29 and the third peripheral wall 30 and supporting the back surface of the first plate member T 1, and the second peripheral wall 29 and the third peripheral wall 30. And a plurality of suction ports 32 capable of sucking gas.

  The gas in the space surrounded by the back surface of the first plate member T1, the second peripheral wall 29, the third peripheral wall 30, and the chuck surface 28 is sucked by the suction port 32, and the space becomes negative pressure, whereby the first plate The lower surface of the member T1 is attracted and held by the convex portion 31. Further, the plate member T can be removed from the third holding portion 26 by stopping the suction operation using the suction port 32. The 4th holding part 27 has the same composition as the 3rd holding part 26, and holds the 2nd plate member T2 so that release is possible. A description of the fourth holding unit 27 is omitted.

  The liquid immersion member 10 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 10 is disposed in the vicinity of the last optical element 14 of the projection optical system PL. The liquid immersion member 10 is an annular member. The liquid immersion member 10 is disposed around the optical path of the exposure light EL.

  In the present embodiment, the liquid immersion member 10 is a liquid immersion member as disclosed in, for example, U.S. Patent Application Publication No. 2007/0132976 or European Patent Application Publication No. 1768170. Supply port 33 and a recovery port 34 for recovering liquid LQ. The liquid immersion member 10 can form the liquid immersion space LS so that the optical path of the exposure light EL emitted from the emission surface 35 of the last optical element 14 is filled with the liquid LQ. The liquid immersion member 10 has a liquid immersion space LS such that the optical path of the exposure light EL between the terminal optical element 14 and the object disposed at the irradiation position EP (projection region PR) of the exposure light EL is filled with the liquid LQ. Form. The liquid immersion member 10 has a lower surface 36 that can face an object, and can hold the liquid LQ between the lower surface 36 and the object. In the present embodiment, the object that can be placed at the irradiation position EP includes an object that can be moved to the irradiation position EP. In the present embodiment, the object includes at least one of the first and second substrate stages 1 and 2 and the substrate P held by the first and second substrate stages 1 and 2.

  At least during exposure of the substrate P, the optical path of the exposure light EL emitted from the exit surface 35 of the final optical element 14 is filled with the liquid LQ, and the final optical element 14 on one side, the liquid immersion member 10, and the other substrate on the other side. The liquid LQ is held between P and the liquid immersion space LS. In the present embodiment, when the exposure light EL is irradiated on the substrate P, the immersion space LS so that a partial region of the surface of the substrate P including the projection region PR of the projection optical system PL is covered with the liquid LQ. Is formed. At least a part of the interface (meniscus, edge) of the liquid LQ is formed between the lower surface 36 of the liquid immersion member 10 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method. The control device 11 executes the recovery operation of the liquid LQ using the recovery port 34 in parallel with the supply operation of the liquid LQ using the supply port 33, so that the terminal optical element 14 and the liquid immersion member 10 on one side and the other An immersion space LS can be formed with the liquid LQ between the substrate P (object) on the side.

  FIG. 3 is a plan view showing an example of the first and second substrate stages 1 and 2 according to the present embodiment. As shown in FIG. 3, the substrate P has a plurality of shot regions S that are exposure target regions. The shot areas S are arranged in a matrix on the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction.

  For example, when exposing the shot region S of the substrate P held on the first substrate stage 1 (first holding unit 18), the control device 11 places the first substrate stage 1 holding the substrate P on the exposure station ST1. To do. The control device 11 controls the mask stage 3 and the first substrate stage 1 in the exposure station ST1, and moves the substrate P in the Y-axis direction with respect to the projection region PR (terminal optical element 14) of the projection optical system PL. Simultaneously with the movement of the substrate P in the Y-axis direction, the immersion space on the projection optical system PL and the substrate P while moving the mask M in the Y-axis direction with respect to the illumination region IR of the illumination system IL. The substrate P is irradiated with the exposure light EL through the LS liquid LQ. As a result, the shot area S of the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the first shot area S.

  In the present embodiment, the control device 11 sequentially exposes a plurality of shot regions S of the substrate P. For example, after the exposure of the first shot region S of the substrate P is completed, the control device 11 starts the exposure of the next second shot region S, and the substrate P in a state where the immersion space LS is formed. An operation (stepping operation) for moving the surface in the X-axis direction (or a direction inclined with respect to the X-axis direction in the XY plane) is performed, and the second shot region S is moved to the exposure start position. Then, the control device 11 starts exposure of the second shot region S.

  The control device 11 performs a scan exposure operation for exposing the shot area S while moving the shot area S in the Y-axis direction with respect to the last optical element 14 (projection area PR), and after the exposure of the shot area S is completed. Then, the plurality of shot areas of the substrate P are sequentially exposed while repeating the stepping operation for moving the next shot area S to the exposure start position.

  Similarly, when exposing the shot region S of the substrate P held on the second substrate stage 2 (second holding unit 20), the control device 11 places the second substrate stage 2 holding the substrate P on the exposure station ST1. Deploy. The controller 11 sequentially exposes a plurality of shot areas S of the substrate P held on the second substrate stage 2 at the exposure station ST1.

  As shown in FIG. 3, in the present embodiment, the upper surface 19 and the upper surface 21 have substantially the same shape and approximately the same size. In the present embodiment, the upper surface 19 of the first substrate stage 1 is substantially parallel to the X axis during exposure of the shot region S of the substrate P, and is relative to the center of the substrate P held by the first holding unit 18. The edge E1 disposed on the −Y side is substantially parallel to the X axis, the edge E2 disposed on the + Y side with respect to the center of the substrate P, and substantially parallel to the Y axis, and to the center of the substrate P. The edge E3 disposed on the + X side, the edge E4 substantially parallel to the Y axis and disposed on the −X side with respect to the center of the substrate P, the edge E5 connecting the edges E1 and E3, and the edge And an edge E6 connecting E2 and the edge E4. The edges E5 and E6 are non-parallel and non-perpendicular to the X axis (Y axis).

  In the present embodiment, each of the edges E1 to E6 is a straight line. In the present embodiment, the angle formed by the edge E1 (edge E3) and the edge E5 is about 135 degrees, and the angle formed by the edge E2 (edge E4) and the edge E6 is about 135 degrees. Note that the angle formed by the edge E1 and the edge E5 and the angle formed by the edge E2 and the edge E6 may not be 135 degrees. In the present embodiment, the angle formed between the edge E1 and the edge E5 is the same as the angle formed between the edge E2 and the edge E6, but it may not be the same.

  Further, the upper surface 21 of the second substrate stage 2 is substantially parallel to the X axis during exposure of the shot region S of the substrate P, and is on the −Y side with respect to the center of the substrate P held by the second holding unit 20. The edge E7 to be arranged and substantially parallel to the X axis and the edge E8 to be arranged on the + Y side with respect to the center of the substrate P and substantially parallel to the Y axis and to the + X side with respect to the center of the substrate P The edge E9 to be arranged, the edge E10 which is substantially parallel to the Y axis and located on the −X side with respect to the center of the substrate P, the edge E11 connecting the edge E7 and the edge E9, the edge E8 and the edge E10 And an edge E12 connecting the two. The edges E11 and E12 are non-parallel and non-perpendicular to the X axis (Y axis).

  In the present embodiment, the edges E7 to E12 are straight lines. In the present embodiment, the angle formed by the edge E7 (edge E9) and the edge E11 is about 135 degrees, and the angle formed by the edge E8 (edge E10) and the edge E12 is about 135 degrees. Note that the angle formed between the edge E7 and the edge E11 and the angle formed between the edge E8 and the edge E12 may not be 135 degrees. In the present embodiment, the angle formed between the edge E7 and the edge E11 is the same as the angle formed between the edge E8 and the edge E12, but it may not be the same.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described with reference to the schematic diagrams of FIGS. As shown in FIG. 3, for example, when the first substrate stage 1 is disposed in the first region 15 of the exposure station ST1, the second substrate stage 2 executes a predetermined process in the second region 16 of the measurement station ST2. To do. In the present embodiment, the second region 16 is disposed away from the first region 15 on the + Y side.

  The control device 11 controls the movement of the first substrate stage 1 in the first region 15 and sequentially exposes the shot region S of the substrate P held by the first holding unit 18 via the liquid LQ. The exposure of the shot region S of the substrate P held by the first holding unit 18 is performed while moving the first substrate stage 1 in the Y-axis direction that is non-parallel and non-perpendicular to the edges E5 and E6 with respect to the last optical element 14. Executed. In the present embodiment, the upper surface (19 or 21) of the substrate stage (1 or 2) is exposed during the exposure of the plurality of shot regions S of the substrate P held on the substrate stage (1 or 2) in the XY plane. , It does not protrude from the first region 15.

  Further, during the exposure of the substrate P held by the first holding unit 18 of the first substrate stage 1, the control device 11 controls the movement of the second substrate stage 2 in the second region 16 to perform a predetermined process. Execute. The predetermined process includes an exchange process of the substrate P and a measurement process using, for example, the alignment system 12. In the present embodiment, the upper surface (19 or 21) of the substrate stage (1 or 2) does not protrude from the second region 16 during execution of the predetermined process on the XY plane.

  The predetermined processing of the second substrate stage 2 in the second region 16 ends before the exposure of the substrate P held by the first holding unit 18 in the first region 15 ends. The second holding unit 20 of the second substrate stage 2 holds the substrate P before exposure. The control device 11 moves the second substrate stage 2 from the second region 16 to the third region 17 when the first substrate stage 1 is disposed in the first region 15. The third region 17 is disposed adjacent to the −Y side of the first region 15.

  In the present embodiment, the second substrate stage 2 moves from the second region 16 to the third region 17 during exposure of the substrate P held by the first holding unit 18 of the first substrate stage 1. The control device 11 places the second substrate stage 2 in the second region 16 so that the second substrate stage 2 does not contact the first substrate stage 1, for example, so as not to prevent the movement of the first substrate stage 1 during the exposure operation. To the third region 17.

  FIG. 4 shows a state immediately after the exposure of the last shot region Se among the plurality of shot regions S of the substrate P held by the first holding unit 18 is completed. As shown in FIG. 4, in the present embodiment, the control device 11 finally exposes the shot region Se of the substrate P on the first substrate stage 1 near the edge E5. In the present embodiment, the movement of the second substrate stage 2 from the second region 16 to the third region 17 is completed before the exposure of the last shot region Se of the substrate P on the first substrate stage 1 is completed. ing.

  The control device 11 performs an operation for starting exposure of the substrate P on the second substrate stage 2 after the exposure of the last shot region Se of the substrate P on the first substrate stage 1 is completed. The operation for starting the exposure of the substrate P on the second substrate stage 2 includes the operation of moving the first substrate stage 1 from the first region 15 to the second region 16 and the first region of the first substrate stage 1. And an operation of moving the second substrate stage 2 from the third region 17 to the first region 15 in parallel with at least a part of the movement from 15 to the second region 16.

  That is, in the present embodiment, the movement of the second substrate stage 2 from the second region 16 to the third region 17 is finished, and the exposure of the last shot region Se of the substrate P on the first substrate stage 1 is finished. Thereafter, in order to start exposure of the first shot region Sf of the substrate P on the second substrate stage 2, at least a part of the exit surface 35 of the last optical element 14 and the upper surface 19 of the first substrate stage 1 face each other. The first and second substrate stages 1 and 2 are changed from the first state to a second state in which at least a part of the exit surface 35 of the last optical element 14 and the upper surface 21 of the second substrate stage 2 face each other. Each moves.

  In the present embodiment, the control device 11 first exposes the shot region Sf of the substrate P on the second substrate stage 2 close to the edge E12. In the present embodiment, the control device 11 controls the second substrate so that the distance between the shot region Sf that is first exposed on the substrate P on the second substrate stage 2 and the projection region PR (irradiation position EP) is short. The stage 2 is moved to the third region 17.

  In the present embodiment, as shown in FIG. 4, the control device 11 uses at least a part of the upper surface 19 (or the substrate P) of the first substrate stage 1 as the emission surface 35 of the last optical element 14 and the liquid immersion member 10. The edge E5 and the edge E12 are brought close to or in contact with each other in a state of being disposed at a position facing the lower surface. In this state, the distance between the irradiation position EP and the shot region Sf that is first exposed on the substrate P on the second substrate stage 2 is sufficiently short.

  The controller 11 starts the movement of the first and second substrate stages 1 and 2 so that the edge E5 and the edge E12 are brought close to or in contact with each other and then changed from the first state to the second state. The control device 11 moves the first substrate stage 1 and the second substrate stage 2 while maintaining the state in which the edge E5 and the edge E12 approach or contact each other while the first state changes to the second state. .

  In the present embodiment, as shown in FIG. 5, the control device 11 is arranged in the direction intersecting the edge E5 and the edge E12 so that the state where the edge E5 and the edge E12 are brought close to or in contact with each other is maintained. The first substrate stage 1 and the second substrate stage 2 are moved.

  In the present embodiment, in order to maintain the state in which the edge E5 and the edge E12 are brought close to or in contact with each other, the direction perpendicular to the edge E5 and the edge E12, that is, the XY plane is 45 with respect to the X axis and the Y axis. The first substrate stage 1 and the second substrate stage 2 are moved in a direction inclined at a degree. The direction intersecting with the edge E5 and the edge E12 is not limited to the direction orthogonal to the edge E5 and the edge E12.

  Thereby, the space formed between at least one of the upper surface 19 and the upper surface 21 and the exit surface 35 of the last optical element 14 and the lower surface 36 of the liquid immersion member 10 is changed while the first state is changed to the second state. Liquid LQ can be held.

  That is, the control device 11 keeps forming a space capable of holding the liquid LQ between at least one of the first substrate stage 1 and the second substrate stage 2 and the last optical element 14 and the liquid immersion member 10. With the upper surface 19 of the first substrate stage 1 (first plate member T1) and the upper surface 21 of the second substrate stage 2 (second plate member T2) approaching or contacting, the upper surface 19 of the first substrate stage 1 and the first The first substrate stage 1 and the second substrate with respect to the last optical element 14 while facing at least one of the upper surface 21 of the two-substrate stage 2 and the emission surface 35 of the last optical element 14 and the lower surface 36 of the liquid immersion member 10. The stage 2 is synchronously moved on the guide surface 8 in the direction intersecting with the edges E5 and E12. Thereby, the immersion space LS of the liquid LQ can be moved from the upper surface 19 of the first substrate stage 1 to the upper surface 21 of the second substrate stage 2 while suppressing leakage of the liquid LQ.

  In the second state, the second substrate stage 2 is disposed in the first region 15. After the second substrate stage 2 is disposed in the first region 15 and the liquid LQ is held between the terminal optical element 14 and the liquid immersion member 10 and the second substrate stage 2, as shown in FIG. 11 separates the first substrate stage 1 and the second substrate stage 2 and moves the first substrate stage 1 to the second region 16.

  The control device 11 forms an immersion space LS with the liquid LQ between the last optical element 14 and the immersion member 10 and the substrate P (second substrate stage 2). The control device 11 controls the movement of the second substrate stage 2 in the first region 15 and sequentially exposes the shot region S of the substrate P held by the second holding unit 20 via the liquid LQ. The exposure of the shot region S of the substrate P held by the second holding unit 20 is performed while moving the second substrate stage 2 in the Y-axis direction that is non-parallel and non-perpendicular to the edges E11 and E12 with respect to the last optical element 14. Executed.

  The first substrate stage 1 holding the exposed substrate P moves from the first region 15 to the second region 16 and then executes a predetermined process in the second region 16. The predetermined process includes an exchange process of the substrate P and a measurement process. The controller 11 moves the first substrate stage 1 holding the exposed substrate P to the substrate exchange position RP in the second region 16 and unloads the exposed substrate P from the first substrate stage 1; And the exchange process of the board | substrate P including the operation | movement which loads the board | substrate P before exposure to the 1st board | substrate stage 1 is performed. In addition, in the second region 16, the control device 11 performs a measurement process for the unexposed substrate P held on the first substrate stage 1.

  After the predetermined processing of the first substrate stage 1 in the second region 16 is completed, the control device 11 moves the first substrate stage 1 to the second state while the second substrate stage 2 is disposed in the first region 15. The region 16 moves to the third region 17.

  The controller 11 operates to start exposure of the first shot region Sf of the substrate P on the first substrate stage 1 after the exposure of the last shot region Se of the substrate P on the second substrate stage 2 is completed. To start. As shown in FIG. 7, in the present embodiment, the control device 11 first exposes the shot region Sf of the substrate P on the first substrate stage 1 close to the edge E6. In the present embodiment, the second region 16 to the third region are set so that the distance between the shot region Sf that is first exposed on the substrate P on the first substrate stage 1 and the projection region PR (irradiation position EP) is shortened. The movement of the first substrate stage 1 to 17 is executed.

  Similarly to the above-described operation, the control device 11 starts from the second state in which at least a part of the emission surface 35 of the terminal optical element 14 and the upper surface 21 of the second substrate stage 2 face each other. The edge E11 and the edge E6 are approached or brought into contact with each other so that at least a part of the first substrate stage 1 and the upper surface 19 of the first substrate stage 1 are opposed to each other, and the second direction is intersected with the edges E11 and E6. 1. Move the second substrate stage 1, 2.

  In the present embodiment, in order to maintain the state in which the edge E6 and the edge E11 are close to or in contact with each other, the direction orthogonal to the edge E6 and the edge E11, that is, the XY plane, is 45 with respect to the X axis and the Y axis. The first substrate stage 1 and the second substrate stage 2 are moved in a direction inclined at a degree. The direction intersecting with the edge E5 and the edge E12 is not limited to the direction orthogonal to the edge E5 and the edge E12.

  Thereby, the immersion space LS of the liquid LQ can be moved from the upper surface 21 of the second substrate stage 2 to the upper surface 19 of the first substrate stage 1 while the leakage of the liquid LQ is suppressed.

  After the first substrate stage 1 is disposed in the first region 15 and the liquid LQ is held between the last optical element 14 and the liquid immersion member 10 and the first substrate stage 1, the control device 11 includes the first substrate stage 1. 1 and the second substrate stage 2 are separated, and the second substrate stage 2 is moved to the second region 16. The control device 11 performs exposure of the substrate P on the first substrate stage 1 in the first region 15. The second substrate stage 2 performs a predetermined process in the second region 16. Thereafter, the same processing is repeated.

  As described above, according to the present embodiment, the edges E5 and E12 are provided on the upper surfaces 19 and 21, respectively, and when changing from the first state to the second state, the edge E5 and the edge E12 approach or contact each other. Since the first and second substrate stages 1 and 2 are moved so as to maintain the state, after the exposure of the last shot region Se of the substrate P on the first substrate stage 1 is completed, the second substrate stage 2 It is possible to shorten the moving distance and moving time of the first and second substrate stages 1 and 2 until the shot area Sf to be exposed first of the upper substrate P is arranged at the irradiation position EP. Similarly, the edges E6 and E11 are provided on the upper surfaces 19 and 21, respectively, and when changing from the second state to the first state, the first and first edges E6 and E11 are maintained so as to be close to or in contact with each other. Since the second substrate stages 1 and 2 are moved, after the exposure of the last shot region Se of the substrate P on the second substrate stage 2 is completed, the first exposure of the substrate P on the first substrate stage 1 is performed. The moving distance and moving time of the first and second substrate stages 1 and 2 until the shot area Sf is arranged at the irradiation position EP can be shortened. Therefore, a decrease in throughput can be suppressed, and a decrease in device productivity can be suppressed.

  Further, in the present embodiment, the second substrate stage 2 that has performed a predetermined process in the second region 16 while the first substrate stage 1 (or the second substrate stage 2) is disposed in the first region 15. Since (or the first substrate stage 1) is moved to the third region 17, in the first region 15, the last shot region Se of the substrate P on the first substrate stage 1 (or on the second substrate stage 2). It is possible to shorten the time from the time when the exposure is completed until the time when the exposure of the first shot region Sf of the substrate P on the second substrate stage 2 (or on the first substrate stage 1) is disclosed. Therefore, a decrease in throughput can be suppressed, and a decrease in device productivity can be suppressed.

  In the present embodiment, the second substrate stage from the second region 16 to the third region 17 is completed before the exposure of the substrate P held by the first holding unit 18 (or the second holding unit 20) is completed. The movement of the second substrate stage 2 (or the first substrate stage 1) is ended. For example, during the movement of the second substrate stage 2 (or the first substrate stage 1) from the second region 16 to the third region 17, the second substrate 16 is moved. The exposure of the substrate P held by the first holding unit 18 (or the second holding unit 20) may be completed, or the second substrate stage 2 from the second region 16 to the third region 17 (or the first substrate). Before the movement of the stage 1) is started, the exposure of the substrate P held by the first holding unit 18 (or the second holding unit 20) may be completed.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 8 is a plan view showing an example of the first and second substrate stages 1B and 2B according to the second embodiment. The upper surfaces 19B and 21B of the first and second substrate stages 1B and 2B according to this embodiment do not have edges that are non-parallel and non-perpendicular to the X axis (Y axis). Even when the first and second substrate stages 1B and 2B are used, when the first substrate stage 1B is disposed in the first region 15, the second substrate stage 2B is moved from the second region 16 to the third region 17. By moving, throughput reduction can be suppressed. When the exposure of the shot region Sf of the substrate P on the second substrate stage 2B is started after the exposure of the shot region Se of the substrate P on the first substrate stage 1B is completed, as shown in FIG. By moving the second substrate stage 2B to the third region 17 so that the distance between the shot region Sf exposed first of the substrate P on the stage 2B and the irradiation position EP is shortened, a decrease in throughput can be suppressed. . In the example illustrated in FIG. 8, the control device 11 causes the first substrate stage 1 and the first substrate stage 1 so that the distance between the shot area Sf that is first exposed on the substrate P on the second substrate stage 2B and the irradiation position EP is short. The first and second substrate stages 1B and 2B are moved in a state where the position in the X-axis direction with respect to the two-substrate stage 2 is shifted and a part of the edge E1 of the upper surface 19B and the edge E8 of the upper surface 21B are approached or contacted. Moving.

  In the first and second embodiments described above, the first region 15 and the second region 16 may partially overlap in the Y-axis direction, and / or the first region 15 and the third region 17 May partially overlap in the Y-axis direction.

  In the first and second embodiments described above, the case where two substrate stages that hold and move the substrate P are described as an example, but three or more substrate stages may be disposed. Good. By using a driving system including a planar motor, each substrate stage can be moved smoothly.

  Further, as disclosed in, for example, US Pat. No. 6,897,963, etc., a measurement stage on which a reference member on which a reference mark is formed and / or various photoelectric sensors are mounted without holding a substrate is provided on a guide surface 8. You may move it up.

  In the first and second embodiments described above, water is used as the liquid LQ, but a liquid other than water may be used. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ.

  As the substrate P in the above-described embodiment, not only a semiconductor wafer for manufacturing a semiconductor device but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask (reticle) used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this. In this case, it is good also as a hybrid system provided with both an interferometer system and an encoder system.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from a mask and developing the exposed substrate according to the above-described embodiment, device assembly It is manufactured through steps (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. FIG. 3 is a side cross-sectional view illustrating an example of a first and second substrate stage and a liquid immersion member according to the first embodiment. It is a top view which shows an example of the 1st, 2nd substrate stage which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating an example of operation | movement of the exposure apparatus which concerns on 1st Embodiment. It is a top view which shows an example of the 1st, 2nd substrate stage which concerns on 2nd Embodiment. It is a flowchart which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... 1st substrate stage, 2 ... 2nd substrate stage, 8 ... Guide surface, 9 ... Drive system, 14 ... Terminal optical element, 15 ... 1st area | region, 16 ... 2nd area | region, 17 ... 3rd area | region, 18 ... 1st holding part, 19 ... upper surface, 20 ... 2nd holding part, 21 ... upper surface, 26 ... 3rd holding part, 27 ... 4th holding part, 35 ... exit surface, E1-E12 ... edge, EL ... exposure light, EP ... irradiation position, EX ... exposure apparatus, LQ ... liquid, M ... mask, P ... substrate, RP ... substrate exchange position, S ... shot region, T1 ... first plate member, T2 ... second plate member

Claims (14)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member for emitting the exposure light;
A first member having a first holding part for holding the substrate and a first surface arranged at least in a part of the periphery of the first holding part, and capable of moving while holding the substrate on a predetermined surface;
A second holding part that holds the substrate, and a second member that is disposed on at least a part of the periphery of the second holding part, and a second member that is movable while holding the substrate on the predetermined surface; With
The first surface has a first edge;
The second surface has a second edge;
Exposure of at least one shot region of the substrate held by the first holding unit is performed while moving the first member in a first direction that is non-parallel to and non-perpendicular to the first edge with respect to the optical member. And
Exposure of at least one shot region of the substrate held by the second holding unit is performed while moving the second member relative to the optical member in a second direction that is non-parallel and non-perpendicular to the second edge. And
While the first state in which at least a part of the emission surface of the optical member faces the first surface changes to the second state in which at least a part of the emission surface of the optical member faces the second surface And an exposure apparatus that moves the first member and the second member so that the state in which the first edge and the second edge are brought close to or in contact with each other is maintained. Each of the first edge and the second edge is a straight line,
The first member and the second member in a direction intersecting the first edge and the second edge so that the state in which the first edge and the second edge are brought close to or in contact with each other is maintained. The exposure apparatus according to claim 1, which moves.   The space between at least one of the first surface and the second surface and the exit surface of the optical member can hold a liquid while the first state changes to the second state. 2. The exposure apparatus according to 2. Each of the first member and the second member includes a first region including an irradiation position of the exposure light, a second region including a substrate replacement position and disposed on one side of the first region, and the first region Movable on a predetermined surface having a third region arranged on the other side,
The exposure apparatus according to any one of claims 1 to 3, wherein the second member is moved from the second region to the third region when the first member is disposed in the first region.   The exposure apparatus according to claim 4, wherein the second member is moved from the second region to the third region during exposure of the substrate held by the first holding portion of the first member.   After the second member moves from the second region to the third region, the first member and the second member are maintained while maintaining a state in which the first edge and the second edge are brought close to or in contact with each other. The exposure apparatus according to claim 4 or 5, wherein the exposure apparatus is moved.   The exposure apparatus according to claim 6, wherein the second member is disposed in the first region in the second state.   In order to expose the substrate on the second member in parallel with at least part of the movement of the first member from the first region to the second region, the second member is moved from the third region to the second region. The exposure apparatus according to any one of claims 4 to 7, which moves to the first region. Multiple shot areas of the substrate are exposed sequentially,
The said 2nd member is moved to the said 3rd area | region so that the distance of the shot area | region exposed first of the board | substrate on the said 2nd member and the said irradiation position may become short. The exposure apparatus described. The first member has a third holding part that is disposed around the first holding part and holds the first plate member,
The second member is disposed around the second holding part, and has a fourth holding part for holding the second plate member,
The first surface includes a surface of the first plate member held by the third holding portion,
The exposure apparatus according to claim 1, wherein the second surface includes a surface of the second plate member held by the fourth holding unit. Multiple shot areas of the substrate are exposed sequentially,
Finally exposing a shot area of the substrate on the first member close to the first edge;
The exposure apparatus according to any one of claims 1 to 10, wherein a shot region of the substrate on the second member close to the second edge is first exposed. An exposure apparatus that exposes a substrate with exposure light,
An optical member for emitting the exposure light;
A first holding part for holding a substrate; a first area including the exposure light irradiation position; a second area including a substrate replacement position and disposed on one side of the first area; and A first member movable while holding a substrate on a predetermined surface having a third region arranged on the other side;
A second member having a second holding part for holding the substrate, and capable of moving while holding the substrate on the predetermined surface,
An exposure apparatus that moves the second member from the second region to the third region when the first member is disposed in the first region.   The exposure apparatus according to any one of claims 1 to 12, further comprising a planar motor for moving the first and second members on the predetermined surface. Exposing the substrate using the exposure apparatus according to claim 1;
Developing the exposed substrate; and a device manufacturing method.

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