JP2014036114A - Exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device capable of restraining exposure failure.SOLUTION: A substrate is exposed by exposure light via liquid. The exposure device comprises: an optical member having an emission face for emitting the exposure light; a liquid immersion member for forming a liquid immersion space on an object movable below the optical member so that an optical path of the exposure light emitted from the emission face is filled with liquid; and an air supply port for supplying gas from an upper part of a gap to remove the liquid remaining in the gap of an object out of the liquid in the liquid immersion space.

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method for exposing a substrate by irradiating a substrate with exposure light via a liquid.

  In the manufacturing process of microdevices such as semiconductor devices and electronic devices, for example, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid as disclosed in the following patent document is used. The exposure apparatus includes a substrate stage that is movable while holding a substrate, and exposes the substrate held on the substrate stage.

US Patent Application Publication No. 2008/0043211 US Patent Application Publication No. 2008/0100812

  In the immersion exposure apparatus, for example, if the liquid remains on at least one of the upper surface of the substrate and the upper surface of the substrate stage, an exposure failure may occur. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and the exposure light that is emitted from the exit surface The liquid remaining in the gap between the objects is removed from the liquid immersion member that forms the liquid immersion space on the movable object below the optical member and the liquid in the liquid immersion space so that the optical path of the liquid is filled with the liquid. Thus, there is provided an exposure apparatus including an air supply port for supplying gas from above the gap.

  According to the second aspect of the present invention, an exposure apparatus that exposes a substrate with exposure light through a liquid, the optical member having an exit surface from which the exposure light is emitted, and the exposure light that is emitted from the exit surface An immersion member that forms an immersion space on an object that is movable below the optical member, and an upper surface that faces the gap, and is disposed in the lower space of the object gap. , A recovery member having a recovery port capable of recovering fluid, an air supply port arranged in a lower space and capable of supplying gas, and a control for supplying gas from the air supply port and recovering fluid from the recovery port And an exposure apparatus comprising the apparatus.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first or second aspect and developing the exposed substrate. .

According to a fourth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein the optical path of the exposure light emitted from the emission surface of the optical member is filled with the liquid. Forming an immersion space on an object movable below the member;
And supplying a gas from above the gap toward the gap so that the liquid remaining in the gap of the object separated from the immersion space is removed.

  According to a fifth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, wherein the optical path of the exposure light emitted from the emission surface of the optical member is filled with the liquid. Forming an immersion space on an object movable under the member, and recovering fluid from a recovery port provided in a recovery member disposed in a lower space of the object gap and having an upper surface facing the gap. And supplying gas from an air supply port disposed in the lower space.

  According to the sixth aspect of the present invention, exposing the substrate using the exposure method according to any one of the exposure methods according to the fourth or fifth aspect, and developing the exposed substrate. A device manufacturing method is provided.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

1 is a schematic block diagram showing an example of an exposure apparatus according to a first embodiment. The figure which shows an example of the liquid immersion member and substrate stage which concern on 1st Embodiment. The figure which expanded a part of FIG. FIG. 4 is a diagram illustrating an example of a substrate P held by a first holding unit 31. The figure which shows an example of operation | movement of the substrate stage 2 and the measurement stage 3. FIG. The figure which shows an example of operation | movement of the substrate stage 2 and the measurement stage 3. FIG. The figure which shows the principal part structure which concerns on 2nd Embodiment. The top view which shows an example of exposure apparatus. The figure which shows an example of a substrate stage. The flowchart which shows an example of the manufacturing process of a device.

  Hereinafter, embodiments of the exposure apparatus, the exposure method, and the device manufacturing method of the present invention will be described with reference to FIGS. 1 to 10, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, region) filled with liquid. The substrate P is exposed with the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  Further, the exposure apparatus EX of the present embodiment is an exposure apparatus provided with a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and exposure light EL without holding the substrate P. A measurement stage 3 that can be moved by mounting a measurement member C and a measuring instrument, a drive system 4 that moves the mask stage 1, a drive system 5 that moves the substrate stage 2, and a drive system 6 that moves the measurement stage 3 And an illumination system IL that illuminates the mask M with the exposure light EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of the optical path of the exposure light EL The immersion member 7 capable of forming the immersion space LS so as to be filled with the liquid LQ, the control device 8 for controlling the overall operation of the exposure apparatus EX, and the control device 8 for storing various information relating to exposure. And a storage device 8R that. The storage device 8R includes, for example, a memory such as a RAM, a recording medium such as a hard disk and a CD-ROM. In the storage device 8R, an operating system (OS) for controlling the computer system is installed, and a program for controlling the exposure apparatus EX is stored.

  Further, the exposure apparatus EX includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. The detection system 300 includes an alignment system 302 that detects an alignment mark on the substrate P, and a surface position detection system 303 that detects the position of the upper surface (surface) Pa of the substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflection film or a protective film (topcoat film) that protects the photosensitive film.

  Further, the exposure apparatus EX includes a chamber apparatus 103 that adjusts the environment (at least one of temperature, humidity, pressure, and cleanness) of the space 102 in which the exposure light EL travels. The chamber apparatus 103 includes a chamber member 104 that forms the space 102, and an air conditioning system 105 that adjusts the environment of the space 102.

  The space 102 includes a space 102A and a space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 includes an air supply unit 105S that supplies gas to the spaces 102A and 102B, and supplies the gas from the air supply unit 105S to the spaces 102A and 102B to adjust the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are arranged in the space 102A.

  The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can move in six directions on the guide surface 9G in the X axis, Y axis, Z axis, θX, θY, and θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 can be moved to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 is movable on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C. The substrate stage 2 and the measurement stage 3 can move independently on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measurement stage 3 includes a planar motor, and includes a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion (substrate holding portion) 31 that holds the lower surface Pb of the substrate P so as to be releasable, and an opening Th in which the substrate P can be disposed. And an upper surface disposed around the upper surface Pa of the substrate P in a state of being held by the holding unit 31.

  In the present embodiment, the substrate stage 2 is arranged around the first holding unit 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. And a second holding portion 32 that holds the lower surface Tb of the cover member T in a releasable manner. The cover member T is disposed around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding portion 31 is disposed. In the present embodiment, the cover member T has an upper surface 2U.

  In the present embodiment, the first holding unit 31 holds the substrate P so that the upper surface Pa of the substrate P and the XY plane are substantially parallel. The second holding part 32 holds the cover member T so that the upper surface 2U of the cover member T and the XY plane are substantially parallel. In the present embodiment, the upper surface Pa of the substrate P held by the first holding unit 31 and the upper surface 2U of the cover member T held by the second holding unit 32 are arranged in substantially the same plane (substantially flush with each other). Is).

  The cover member T may be formed integrally with the substrate stage 2. For example, at least a part of the substrate stage 2 may have the upper surface 2U.

  In the present embodiment, the measurement stage 3 includes a third holding part 33 that holds the measurement member C so as to be releasable, and a fourth holding part that is disposed around the third holding part 33 and holds the cover member Q so as to be releasable. 34. The third and fourth holding portions 33 and 34 have a pin chuck mechanism. The cover member Q is disposed around the measurement member C held by the third holding unit 33. The holding mechanism used at least one of the third holding part 33 and the fourth holding part 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the cover member Q may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding portion 34 holds the cover member Q so that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measurement member C held by the third holding unit 33 and the upper surface of the cover member Q held by the fourth holding unit 34 are arranged in substantially the same plane (substantially flush with each other). is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measuring member C held by the third holding unit 33. In addition, the upper surface of the cover member Q held by the fourth holding portion 34 is appropriately referred to as the upper surface 3U of the measurement stage 3.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11 </ b> A can measure the position of the mask stage 1 using a measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R arranged on the substrate stage 2 and the measurement mirror 3R arranged on the measurement stage 3.

  The alignment system 302 detects the alignment mark of the substrate P and detects the position of the shot region S of the substrate P. The alignment system 302 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the alignment system 302 facing the −Z direction.

  The surface position detection system 303 is also called, for example, an autofocus / leveling system, and detects the position of the upper surface Pa of the substrate P by irradiating the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 with detection light. To do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held on the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing the −Z direction.

  When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 8 drives the drive systems 4, 5, 5 based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to perform position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an exit surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is formed on the emission surface 13 side. The immersion space LS is formed so that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The exit surface 13 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. The emission surface 13 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 7 has a lower surface 14 at least partially facing the −Z direction. In the present embodiment, the emission surface 13 and the lower surface 14 can hold the liquid LQ with an object arranged at a position (projection region PR) where the exposure light EL emitted from the emission surface 13 can be irradiated. . The immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and the object arranged in the projection region PR. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 13 and the object arranged in the projection region PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ with the object so that the optical path K of the exposure light EL between the terminal optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, the objects that can be arranged in the projection region PR include objects that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12). The object is movable with respect to the last optical element 12 and the liquid immersion member 7. The object has an upper surface (surface) that can face at least one of the emission surface 13 and the lower surface 14. An immersion space LS can be formed between the upper surface of the object and the emission surface 13. The object is movable in a plane (XY plane) perpendicular to the optical axis (Z axis) of the last optical element 12. In the present embodiment, an immersion space LS can be formed between the upper surface of the object and at least a part of the emission surface 13 and the lower surface 14. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the upper surface (front surface) of the object on the other side, the optical path K of the exposure light EL between the last optical element 12 and the object is changed. An immersion space LS is formed so as to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held on the substrate stage 2 are the exit surface 13 of the last optical element 12 facing the −Z direction and the liquid immersion facing the −Z direction. The lower surface 14 of the member 7 can be opposed. Of course, the object that can be placed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. Further, these objects can face at least a part of the detection system 300.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. During the exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ with the substrate P so that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. FIG. 3 is an enlarged view of a part of FIG. In FIG. 2, the substrate P is disposed in the projection region PR (position facing the terminal optical element 12 and the liquid immersion member 7), but as described above, the substrate stage 2 (cover member T), and The measurement stage 3 (cover member Q, measurement member C) can also be arranged.

  As shown in FIG. 2, the liquid immersion member 7 includes at least a part 71 facing the exit surface 13 of the last optical element 12 and a main body 72 at least partly disposed around the last optical element 12. Including. The facing portion 71 has a hole (opening) 7 </ b> K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least partially facing the emission surface 13 via a gap, and a lower surface 7H on which the substrate P (object) can face. The hole 7K is formed so as to connect the upper surface 7U and the lower surface 7H. The upper surface 7U is disposed around the upper end of the hole 7K, and the lower surface 7H is disposed around the lower end of the hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and irradiate the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is disposed around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

  Further, the liquid immersion member 7 includes a supply port 15 that can supply the liquid LQ and a recovery port 16 that can recover the liquid LQ. The supply port 15 supplies the liquid LQ when the substrate P is exposed, for example. The recovery port 16 recovers the liquid LQ, for example, when the substrate P is exposed. The supply port 15 can supply the liquid LQ during one or both of the exposure and non-exposure of the substrate P. Note that the recovery port 16 can recover the liquid LQ during one or both of exposure and non-exposure of the substrate P.

  The supply port 15 is disposed so as to face the optical path K in the vicinity of the optical path K of the exposure light EL emitted from the emission surface 13. The supply port 15 only needs to face one or both of the space between the exit surface 13 and the opening 7K and the side surface of the last optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to the space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and then is supplied onto the substrate P (object) through the opening 7K.

  The supply port 15 is connected to the liquid supply device 18 via the flow path 17. The liquid supply device 18 can deliver clean and temperature-adjusted liquid LQ. The liquid supply device 18 may be provided in the exposure apparatus EX, or may be installed, for example, in a clean room outside the exposure apparatus EX. The channel 17 includes a supply channel 17 </ b> R formed inside the liquid immersion member 7 and a channel formed by a supply pipe connecting the supply channel 17 </ b> R and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The collection port 16 is disposed at least at a part around the opening 7K through which the exposure light EL passes. In the present embodiment, the collection port 16 is disposed at least at a part around the holding surface 7H. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 72 has an opening 7P that faces the substrate P (object). The opening 7P is disposed at least at a part around the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 disposed in the opening 7P. In the present embodiment, the porous member 19 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H on which the substrate P (object) can face, an upper surface 19U facing in the opposite direction of the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is disposed on at least a part of the periphery of the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes a holding surface 7H and a lower surface 19H.

  In the present embodiment, the recovery port 16 includes a hole of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 16) of the porous member 19. Note that the porous member 19 may not be disposed.

  The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to a vacuum system outside the exposure apparatus EX, for example, and can suck the liquid LQ through the recovery port 16. The liquid recovery apparatus 21 may be provided in the exposure apparatus EX, or may be provided in, for example, a clean room outside the exposure apparatus EX. The channel 20 includes a recovery channel 20R formed inside the liquid immersion member 7 and a channel formed by a recovery pipe that connects the recovery channel 20R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and An immersion space LS can be formed with the liquid LQ between the immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  As shown in FIGS. 2 and 3, in the present embodiment, the substrate stage 2 is a space that leads to a gap Ga between the substrate (first object) P and the cover member (second object) T (substrate stage 2). Part 23. The space 23 is located below the gap Ga. The gap Ga is formed between the side surface Pc of the substrate P held by the first holding unit 31 and the inner surface Tc of the cover member T held by the second holding unit 32 that face each other.

  A porous member 80 is disposed in the space 23. In the present embodiment, the porous member 80 has an upper surface 80A that can face at least one of the injection surface 13 and the lower surface 14. The upper surface 80A is disposed below the substrate P and the cover member T (−Z side). In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed by, for example, a sintering method. In the present embodiment, at least a part of the liquid LQ flowing into the gap Ga is recovered through the porous member 80.

  In the present embodiment, the porous member 80 is supported by the case 81. The case 81 is disposed in the space part 23. In the present embodiment, the case 81 is made of, for example, ceramic, but may be made of metal. Note that the porous member 80 may be disposed in the space portion 23 without using the case 81.

  In the present embodiment, a support member 82 is disposed between the porous member 80 and the case 81 and the cover member T. The support member 82 is supported by at least a part of the porous member 80 (second portion 802) and the case 81. The support member 82 can face at least a part of the lower surface Tb of the cover member T. The support member 82 supports at least a part of the lower surface Tb of the cover member T. The support member 82 may be omitted without using it.

  In the present embodiment, the substrate stage 2 has a suction port 24 disposed in the space 23. In the present embodiment, the suction port 24 is formed on at least a part of the inner surface of the substrate stage 2 that forms the space 23. The suction port 24 sucks at least a part of the fluid in the space portion 23 so that the space portion 23 has a negative pressure. The suction port 24 can suck one or both of the liquid and gas in the space 23.

  The suction port 24 is connected to the fluid suction device 26 via the flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suck one or both of liquid and gas through the suction port 24. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of liquid and gas) sucked from the suction port 24 is sucked into the fluid suction device 26 via the flow path 25.

  In the present embodiment, the case 81 has a hole (opening) 81 </ b> H that connects the outer surface and the inner surface of the case 81. The opening 83 at the upper end of the hole 81 </ b> H faces the lower surface of the porous member 80. The opening at the lower end of the hole 81H is connected to the suction port 24. The suction port 24 can suck the fluid in the space inside the case 81 through the hole 81H so that the space inside the case 81 has a negative pressure.

  In the present embodiment, the first holding unit 31 has, for example, a pin chuck mechanism. The first holding portion 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall portion 35 that can be opposed to the lower surface Pb of the substrate P, and the support surface 31S on the inner side of the peripheral wall portion 35, and includes a plurality of pin members. The support portion 36 includes a suction port 37 that is disposed on the support surface 31S and sucks fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space in at least a part between the lower surface Pb of the substrate P. Note that, in the support surface 31, the peripheral wall portion 35 is substantially circular, and the center of the first holding portion 31 is the center of the peripheral wall portion 35 in the above description and the following description. In the present embodiment, the peripheral wall portion 35 is substantially circular (annular) in the XY plane. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall portion 35 are in contact with each other, whereby the peripheral wall portion 35, the lower surface Pb of the substrate P, the support surface 31S, and the like. The space 31H formed by can be set to a negative pressure. As a result, the substrate P is held by the first holding unit 31. In addition, the substrate P is released from the first holding unit 31 by releasing the suction operation of the suction port 37.

  In this embodiment, the lower surface of the board | substrate P is hold | maintained at the upper end of the support part 36 (a some pin member) by making the space 31H into a negative pressure. That is, at least a part of the holding surface 36S that holds the substrate P is defined by the upper end of the support portion 36 (a plurality of pin members).

  In the present embodiment, the second holding unit 32 has, for example, a pin chuck mechanism. The second holding part 32 is arranged so as to surround the peripheral wall part 35 on the support surface 32S of the substrate stage 2, and surrounds the peripheral wall part 38 on the support surface 32S so that the lower surface Tb of the cover member T can be opposed. And a support surface 40 that includes a plurality of pin members, and a support surface that is disposed on the support surface 32S between the peripheral wall portion 39 and the peripheral wall portion 39. And a suction port 41 for sucking fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space in at least a portion between the lower surface Tb of the cover member T. The control device 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other, whereby the peripheral wall portion 38, the peripheral wall portion 39, and the cover member T The space 32H formed by the lower surface Tb and the support surface 32S can be set to a negative pressure. Thereby, the cover member T is held by the second holding portion 32. Further, the cover member T is released from the second holding portion 32 by releasing the suction operation of the suction port 41.

  The space portion 23 includes a space around the peripheral wall portion 35. In the present embodiment, the space portion 23 includes a space between the peripheral wall portion 35 and the peripheral wall portion 38.

In the present embodiment, an air supply portion 61 that can face the substrate P, the cover member T, and the gap Ga is provided on the outer peripheral portion of the liquid immersion member 7. Air as a gas is supplied to the air supply unit 61 from the gas supply device 62 via the air supply path 63. The air supply unit 61 is provided with an air supply port 64 that opens toward the −Z side and blows air downward from above. In this embodiment, air is wiped from the air supply port 64 from above to below along the Z direction. However, the present invention is not limited to this form. For example, air is blown from above to below along the direction intersecting the Z direction. May be.
The gas supply device 62 supplies air having a humidity higher than the humidity of the space 102 in the chamber device 103 adjusted by the air conditioning system 105. As described above, in the present embodiment, air is used as air with adjusted humidity. However, air having a humidity similar to or lower than the humidity of the space 102 may be supplied. Further, the gas supplied from the gas supply device 62 is not limited to the above air, and an inert gas such as nitrogen may be used. Further, when an inert gas is used, the humidity may be adjusted.

  The air supply port 64 is provided over the entire circumferential direction of the liquid immersion member 7 so that air can be selectively supplied to any portion of the gap Ga. As the arrangement of the air supply ports 64, for example, a plurality of dot-like air supply ports 64 are arranged in the circumferential direction with a space between each other, or a plurality of air supply ports 64 extending in an arcuate shape (linear shape) are mutually connected. It is possible to adopt a configuration in which they are arranged in the circumferential direction at intervals. In the case where the air supply port 64 is either a dot shape or a linear shape, the air supply is selectively and independently supplied for each specific air supply port 64 or a specific air supply port group among the plurality of air supply ports 64. It is possible. Selection of the air supply port 64 for supplying air is controlled by the control device 4.

  Next, an example of the operation of the exposure apparatus EX will be described with reference to FIGS. FIG. 4 is a diagram illustrating an example of the substrate P held by the first holding unit 31 (substrate stage 2). 5 and 6 are diagrams illustrating an example of the operations of the substrate stage 2 and the measurement stage 3.

  In order to expose the substrate P held by the first holding unit 31, the substrate stage 2 is moved to the exposure position, and between the last optical element 12 and the liquid immersion member 7 and the substrate stage 2 (substrate P). After the immersion space LS is formed with the liquid LQ, the control device 8 starts an exposure process for the substrate P.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. As a result, the substrate P is exposed with the exposure light EL through the liquid LQ, and the pattern image of the mask M is projected onto the substrate P through the projection optical system PL and the liquid LQ.

  As shown in FIG. 4, in the present embodiment, a plurality of shot regions S that are exposure target regions are arranged on the substrate P in a matrix. The control device 8 sequentially exposes a plurality of shot areas S determined on the substrate P.

  When exposing the shot region S of the substrate P, the terminal optical element 12 and the liquid immersion member 7 and the substrate P are opposed to each other, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. The immersion space LS is formed as described above. When sequentially exposing the plurality of shot regions S of the substrate P, the immersion space LS is filled with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Is formed, the substrate stage 2 is moved in the XY plane by the drive system 5. In the state where the immersion space LS is formed with the liquid LQ between the last optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2, the control device 8 While moving the stage 2, the substrate P is exposed.

  For example, in order to expose the first shot area S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to the exposure start position. The control device 8 moves the first shot region S (substrate P) in the Y-axis direction with respect to the projection region PR of the projection optical system PL while the immersion space LS is formed. The exposure light EL is irradiated to the shot area S.

  After the exposure of the first shot area S is completed, in order to expose the next second shot area S, the control device 8 moves the substrate P in the X-axis direction (with the immersion space LS formed) Alternatively, the second shot region S is moved to the exposure start position by moving in the direction inclining with respect to the X-axis direction in the XY plane. The control device 8 exposes the second shot area S in the same manner as the first shot area S.

  The control device 8 finishes the operation (scan exposure operation) of irradiating the shot region S with the exposure light EL while moving the shot region S in the Y-axis direction with respect to the projection region PR, and the exposure of the shot region S. Thereafter, while repeating the operation (stepping operation) for moving the next shot region S to the exposure start position, the plurality of shot regions S on the substrate P are transferred to the projection optical system PL and the liquid LQ in the immersion space LS. Are sequentially exposed. The exposure light EL is sequentially irradiated onto the plurality of shot regions S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection region PR of the projection optical system PL and the substrate P relatively move along the movement locus indicated by the arrow R1 in FIG. While exposing the projection area PR to the exposure light EL, the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL through the liquid LQ. In at least part of the movement of the substrate stage 2 in the exposure of the substrate P, the immersion space LS is formed on the gap Ga.

  For example, when the projection area PR moves relative to the substrate P from the shot area S1 shown in FIG. 4 to the shot area S2 in the Y direction (first direction) along the movement locus R1, the gap Ga in the shot area S1. Changes from the first state in which the liquid is in contact with the liquid LQ in the immersion space LS to the second state in which the gap Ga is not in contact with the liquid LQ in the immersion space LS in the shot region S2. After the change from the first state to the second state, there is a possibility that a part of the liquid LQ in the immersion space LS is separated and remains in the gap Ga as shown in FIG.

  For this reason, the control device 8 moves during the relative movement when the projection area PR of the projection optical system PL described above and the substrate P move relatively to sequentially expose the plurality of shot areas S of the substrate P with the exposure light EL. After changing to the second state, air is blown downward from the air supply port 64 at a position where the air supply port 64 of the air supply unit 61 faces the gap Ga. In other words, air is blown out from the air supply port 64 disposed on the rear side of the liquid immersion member 7 in the relative movement direction of the liquid immersion member 7 with respect to the substrate P. At this time, air is blown out from the air supply port 64 disposed at least on the rear side described above. As a result, as shown in FIG. 6, the liquid LQ remaining in the gap Ga is removed from the gap Ga by the pressure of the air blown out from the air supply port 64, and the porous member 80 disposed immediately below the gap Ga. It adheres to the upper surface 80A. The liquid LQ adhering to the porous member 80 is sucked through the hole of the porous member 80 by the negative pressure suction force by the operation of the fluid suction device 26, and sucked and collected through the suction port 24, the hole 81H and the flow path 25. The

  As described above, in the present embodiment, air is blown out from the air supply port 64 toward the gap Ga, and the liquid LQ remaining in the gap Ga is removed and collected. It is possible to suppress the occurrence of defective exposure due to the liquid LQ remaining on the upper surface. Further, in the present embodiment, after the liquid LQ in the immersion space LS changes to the second state in which the liquid LQ does not contact the gap Ga, air is blown out from the air supply port 64 toward the gap Ga. An adverse effect on the liquid LQ in the space LS can be suppressed. In addition, in the present embodiment, since the humidity of the air blown from the air supply port 64 is higher than the humidity in the chamber device 103, the evaporation (vaporization) of the liquid LQ accompanying the blowing of air can be suppressed. It becomes possible to suppress the temperature fluctuation of the substrate P due to the heat of vaporization. Therefore, in the present embodiment, it is possible to perform highly accurate exposure processing while suppressing deformation (distortion) of the substrate P due to temperature fluctuation.

Second Embodiment
Next, a second embodiment of the exposure apparatus EX will be described with reference to FIG.
In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 7, the porous member (recovery member) 80 in the exposure apparatus EX of the present embodiment is not supported by the case 81 shown in the first embodiment, but is provided directly on the substrate stage 2. The porous member 80 includes an upper surface 80A, an upper surface 80B, and a side surface 80C. The upper surface 80A is disposed below the gap Ga at a position facing (facing) the gap Ga. The upper surface 80B is disposed at a position (+ Z side) higher than the upper surface 80A. The upper surface 80B is provided in parallel with the lower surface Tb 'via the gap A1 between the upper surface 80B and the lower surface Tb' of the cover member T. The lower surface Tb 'is arranged in a region where the cover member T is thinly formed on the substrate P side (the first holding unit 31 side) in a shape in which the lower surface Tb is omitted. The side surface 80C is disposed on the side opposite to the upper surface 80A with the upper surface 80B interposed therebetween. The upper surface 80B and the side surface 80C are coated with, for example, a liquid repellent film so that air and liquid LQ are not sucked into the holes.

  A space A2 facing the side surface 80C is formed below the cover member T. The space A2 communicates with one end of the gap A1. The other end of the gap A1 opens into a space A3 formed between the gap Ga and the upper surface 80A of the porous member 80, and serves as an air supply port 65 through which air can be supplied. These spaces A2 and A3 and the gap A1 form a lower space located below the gap Ga.

  In the space A2, the other end of the flow path 27 having one end connected to the compressed air supply unit 28 opens as an air supply port 27A.

  In the exposure apparatus EX configured as described above, the air supplied from the compressed air supply unit 28 is introduced from the air supply port 65 into the space A3 through the space A2 and the gap A1. Since the space A3 is sucked by the fluid suction device 26 through the upper surface 80A, the air supplied from the compressed air supply unit 28 follows the space A2, the gap A1, the space A3, the porous member 80, and the flow path 25. Sucked in. At this time, since the upper surface 80B and the side surface 80C of the porous member 80 are coated, air is not sucked from the upper surface 80B and the side surface 80C, but is sucked from the upper surface 80A to the porous member 80.

  Then, after changing to the above-described second state, when air is blown out from the air supply port 64 and the air supply port 65 and the liquid LQ remaining in the gap Ga adheres to the upper surface 80A of the porous member 80, the upper surface 80A Since the air suction is suppressed and the suction amount is reduced, the air pressure in the space A3 is increased. As a result, the suction of the liquid LQ adhering to the upper surface 80A to the porous member 80 is promoted.

  Therefore, in the present embodiment, in addition to the same operation and effect as the first embodiment, the liquid LQ removed from the gap Ga can be quickly discharged through the suction port (recovery port) 24 and the flow path 25. Therefore, it is possible to improve the work efficiency.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

For example, in the above-described embodiment, the liquid LQ remaining in the gap Ga is removed and collected by the supply from the supply port 64 of the supply unit 61. However, the present invention is not limited to this. The liquid LQ remaining in the gap Ga may be recovered through the hole of the porous member 80, the suction port 24, and the flow path 25 by operating the fluid suction device 26 without supplying air from the air port 64. For example, in the case of the first embodiment, when a so-called bridge phenomenon in which the remaining liquid LQ stays in the gap Ga occurs, the pressure difference generated above and below the gap Ga is sucked by the space portion 23 below the gap Ga. Thus, the liquid LQ leaves the gap Ga, adheres to the porous member 80, and is sucked and collected. In the case of the second embodiment, when the bridge phenomenon occurs, for example, the control device 8 controls the suction amount by the fluid suction device 26 to be larger than the air supply amount by the compressed air supply unit 28. A pressure difference can be generated above and below the gap Ga, and the liquid LQ in the gap Ga can be recovered without supplying air from the air supply port 64 as in the case of the first embodiment. In this case, the air supply from the air supply port 65 may be stopped.
Further, the air supply from the air supply port 64 or the air supply port 65 described above may be performed constantly or intermittently. Alternatively, control may be performed so that air is supplied only when the gap Ga passes below the air supply port 64 or the air supply port 65.
In addition, although the air supply unit 61 is provided on the outer peripheral portion of the liquid immersion member 7, the supply unit 61 is not limited to this and may be disposed in the frame of the exposure apparatus EX or the chamber apparatus 103, for example.

Moreover, in the said embodiment, although the structure formed between the board | substrate P and the cover member T as gap Ga was illustrated, it is not limited to this, For example, as shown in FIG. When a scale member (measuring member) GT is provided with a gap Gm around the cover member T and an encoder system for measuring the position of the substrate stage 2 using the scale member GT is used, the gap Gm The remaining liquid LQ can be removed in the same manner as in the above embodiment. In this case, the gap Gm is formed between the edge portion Egg of the scale member GT and the edge portion Eg of the cover member T.
Such an encoder system is disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  In addition to the substrate stage 2, as shown in FIG. 8, in the measurement stage 3, the liquid LQ remaining in the gap Gn formed between the measurement member (measuring instrument) C and the cover member Q It can also be removed as in the embodiment. In this case, the gap Gn is formed between the edge portion Egq of the cover member Q and the edge portion Egc of the measurement member C. Further, when the transition from the exposure process to the measurement process or the transition from the measurement process to the exposure process, the immersion space LS is on the substrate stage 2 while maintaining the state in which the substrate stage 2 and the measurement stage 3 are close to each other. When moving relative to the measurement stage 3, the liquid LQ remaining in the gap between the substrate stage 2 and the measurement stage 3 can be removed as in the above embodiment.

  In each of the above-described embodiments, the optical path K on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the 2004/019128 pamphlet, the optical path on the incident side (object plane side) of the last optical element 12 may also be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the exposure liquid LQ, but a liquid other than water may be used. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices. For example, as shown in FIG. 9, the exposure apparatus EX may include two substrate stages 2001 and 2002. In that case, the object that can be arranged so as to face the emission surface 13 is one of the substrate stages, the substrate held on the one substrate stage, the other substrate stage, and the substrate held on the other substrate stage. Including at least one.

  The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 10, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage 3 ... Measuring member 7 ... Immersion member 8 ... Control device 12 ... Terminal optical element (optical member) 13 ... Ejection surface 24 ... Suction port (collection port), 27A ... Air supply port 31 ... First holding part (substrate holding part), 64, 65 ... Air supply port, 80 ... Porous member (collecting member), 103 ... Chamber device, C ... Measuring member (measuring instrument), EL ... Exposure light, EX ... Exposure apparatus, Ga ... Gap, GT ... Scale member (measurement member), LQ ... Liquid, LS ... Immersion space, P ... Substrate (first object), T ... Cover member (second object), Tb '... First 2 bottom surface

Claims (29)

An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
An immersion member that forms an immersion space on an object that is movable below the optical member so that an optical path of the exposure light emitted from the emission surface is filled with the liquid;
An exposure apparatus comprising: an air supply port that supplies gas from above the gap so that liquid remaining in the gap between the objects is removed from the liquid in the immersion space.  The first direction perpendicular to the optical axis of the optical member is changed so that the gap between the objects changes from one of a first state in which the gap between the objects contacts the liquid in the immersion space and a second state in which the gap does not contact the liquid in the immersion space. The exposure apparatus according to claim 1, wherein the gas is supplied from above the gap during at least a part of a period in which the object moves in one direction.  The exposure apparatus according to claim 2, wherein the gas is supplied from the air supply port toward the gap in the second state.   The exposure apparatus according to claim 2, wherein the gas is supplied from the air supply port after the gap has changed from the first state to the second state. A chamber device for adjusting the humidity of a space in which the optical member is disposed;
The exposure apparatus according to any one of claims 1 to 4, wherein a gas having a humidity higher than a humidity adjusted by the chamber apparatus is supplied from the air supply port.   The exposure apparatus according to claim 1, wherein the air supply port is disposed in the liquid immersion member.   The exposure apparatus according to claim 6, wherein the gas is supplied from the air supply port around the immersion space in at least a part of a period in which the immersion space is formed on the upper surface of the object.   The exposure apparatus according to claim 7, wherein the gas is supplied toward a gap between the objects while the object is moving.   The exposure apparatus according to claim 1, wherein a liquid remaining on the object is removed by a gas supplied from the air supply port to the upper surface of the object.   The exposure according to any one of claims 1 to 9, further comprising a suction port that is disposed below the gap and sucks fluid from the gap in parallel with at least a part of the gas supply through the air supply port. apparatus.   The exposure apparatus according to claim 10, wherein the suction port includes a hole of a porous member.   The gap of the object is movable below the optical member, and moves in a state adjacent to the first object below the optical member, and a first object having a first upper surface with which the immersion space can contact. The exposure apparatus according to any one of claims 1 to 11, wherein the exposure apparatus is formed between a second object having a second upper surface that can be contacted with the immersion space. A substrate stage having a substrate holding portion for holding the substrate in a releasable manner;
The exposure apparatus according to claim 12, wherein the first object and the second object are at least part of the substrate and the substrate stage disposed around the substrate. The substrate stage includes a cover member having an upper surface disposed around the upper surface of the substrate, and a measurement member disposed adjacent to the cover member,
The exposure apparatus according to claim 13, wherein the first object and the second object are the cover member and the measurement member. Without holding the substrate, equipped with a measurement stage mounted with a measuring instrument,
The exposure apparatus according to claim 13 or 14, wherein the first object and the second object are the substrate stage and the measurement stage. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An optical member having an exit surface from which the exposure light is emitted;
An immersion member that forms an immersion space on an object that is movable below the optical member so that an optical path of the exposure light emitted from the emission surface is filled with the liquid;
A recovery member disposed in a lower space of the gap between the objects, having a top surface facing the gap, and having a recovery port capable of recovering fluid;
An air supply port arranged in the lower space and capable of supplying gas;
An exposure apparatus comprising: a control device that supplies the gas from the air supply port and recovers the fluid from the recovery port.   The first direction perpendicular to the optical axis of the optical member is changed so that the gap between the objects changes from one of a first state in which the gap between the objects contacts the liquid in the immersion space and a second state in which the gap does not contact the liquid in the immersion space. The exposure apparatus according to claim 16, wherein the gas is supplied from above the gap in at least a part of a period in which the object moves in one direction.   The exposure apparatus according to claim 16, wherein the air supply port is disposed below the upper surface of the recovery member.   The exposure apparatus according to any one of claims 16 to 18, wherein the recovery port includes a hole of a porous member. The gap between the objects is movable below the optical member and has a first upper surface with which the immersion space can come into contact, and moves below the optical member in a state adjacent to the first object. Is formed between a second object having a second upper surface with which the immersion space can be contacted,
The lower space is formed at least on the second lower surface side of the second object,
The exposure apparatus according to any one of claims 16 to 19, wherein the air supply port is disposed to face the second lower surface.   21. The exposure apparatus according to claim 20, wherein an upper surface of the recovery member is opposed to at least a part of the second lower surface.   The exposure apparatus according to claim 21, wherein a distance between the second lower surface and the upper surface of the recovery member is shorter than a distance between the second lower surface and the air supply port.   The exposure apparatus according to claim 21 or 22, wherein an upper surface of the recovery member faces the gap. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 23;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Forming an immersion space on an object movable below the optical member so that an optical path of the exposure light emitted from the emission surface of the optical member is filled with the liquid;
Supplying a gas from above the gap toward the gap so as to remove the liquid separated from the immersion space and remaining in the gap of the object.   A first perpendicular to the optical axis of the optical member so that the gap between the objects changes from one of a first state in which the gap between the objects contacts the liquid in the immersion space and a second state in which the gap does not contact the liquid in the immersion space. The exposure method according to claim 25, wherein the gas is supplied from above the gap during at least a part of a period in which the object moves in a direction. An exposure method for exposing a substrate with exposure light through a liquid,
Forming an immersion space on an object movable below the optical member so that an optical path of the exposure light emitted from the emission surface of the optical member is filled with the liquid;
Recovering fluid from a recovery port disposed in a recovery member disposed in a space below the gap of the object and having an upper surface facing the gap;
Supplying gas from an air supply port arranged in the lower space.   The supply of the gas from the air supply port and the recovery of the fluid from the recovery port are performed in a first state where the gap of the object is in contact with the liquid in the immersion space and in a first state where the gap in the immersion space is not in contact with the liquid in the immersion space. 28. The exposure method according to claim 27, wherein the exposure method is performed in at least a part of a period in which the object moves in a first direction perpendicular to the optical axis of the optical member so as to change from one of two states to the other. Exposing the substrate using the exposure method according to any one of claims 25 to 28;
Developing the exposed substrate. A device manufacturing method.

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