JP2019070861A - Exposure device, exposure method, and device manufacturing method - Google Patents

Abstract

To provide an exposure device capable of suppressing generation of exposure defects.SOLUTION: A substrate is exposed by exposure light via a liquid. An exposure device has an optical member having an emission surface to which the exposure light is emitted, a stage which has a member arranged with an article capable of facing the emission surface with a gap and is movable under the optical member, a first liquid supply device for supplying the liquid between the article and the optical member and a second liquid supply device at least a part of which is arranged on the stage and which supplies the liquid to the gap.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  In the process of manufacturing microdevices such as semiconductor devices and electronic devices, an immersion exposure apparatus which exposes a substrate with exposure light through a liquid as disclosed in, for example, the following patent documents is used. The exposure apparatus includes a movable substrate stage that holds the substrate, and exposes the substrate held by the substrate stage.

US Patent Application Publication No. 2008/0043211 U.S. Patent Application Publication No. 2008/0100812

  In the immersion exposure apparatus, when the substrate is held with a gap around the substrate stage, the amount of liquid flowing into the gap may fluctuate depending on the surface characteristics of the substrate. When the liquid flowing into the gap is collected on the side of the substrate stage, the heat of vaporization of the liquid fluctuates due to the fluctuation of the amount of liquid described above, so that the temperature around the substrate on the substrate stage fluctuates and an exposure failure occurs. there is a possibility. As a result, defective devices may occur.

  An aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure defects. Another object of the present invention is to provide a device manufacturing method capable of suppressing the occurrence of defective devices.

  According to a first aspect of the present invention, an exposure apparatus for exposing a substrate with exposure light through a liquid, the optical member having an emission surface from which the exposure light is emitted, and an object capable of facing the emission surface A stage having a member disposed via a gap and movable under the optical member, a first liquid supply device for supplying a liquid between the object and the optical member, and at least a portion disposed on the stage An exposure apparatus is provided, comprising: a second liquid supply device for supplying liquid to the gap.

  According to a second aspect of the present invention, there is provided a device manufacturing method comprising exposing a substrate using the exposure apparatus of the first aspect of the present invention and developing the exposed substrate. .

  According to a third aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, comprising: an optical member having an emission surface from which exposure light is emitted; and a substrate facing the optical member Supplying a liquid by the first liquid supply device between them, disposing the member through the object and the gap that can be opposed to the exit surface, moving the member and the substrate, and between the moving substrate and the optical member There is provided an exposure method comprising: exposing a substrate through the liquid; and supplying the liquid to the gap by a second liquid supply apparatus at least partially disposed on the stage.

  According to a fourth aspect of the present invention there is provided a device manufacturing method comprising exposing a substrate using the exposure method of the third aspect of the present invention and developing the exposed substrate. .

  According to the aspect of the present invention, the occurrence of the exposure failure can be suppressed. Moreover, according to the aspect of this invention, generation | occurrence | production of a defect device can be suppressed.

FIG. 1 is a schematic configuration view showing an example of an exposure apparatus EX according to a first embodiment. FIG. 3 is a view showing an example of a liquid immersion member and a substrate stage according to the first embodiment. The figure which expanded a part of FIG. FIG. 6 is a view showing an example of a substrate P held by a first holding unit 31; FIG. 5 is a diagram showing the relationship between time and temperature in a substrate stage 2 FIG. 7 is a view showing the operation of the liquid supply device 50. FIG. 2 is a plan view showing an example of an exposure apparatus. The figure which shows an example of a board | substrate stage. The flowchart which shows an example of the manufacturing process of a device.

  Hereinafter, embodiments of the exposure apparatus, the exposure method, and the device manufacturing method of the present invention will be described with reference to FIGS. 1 to 9, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is taken as an X-axis direction, a direction orthogonal to the X-axis direction in a horizontal plane is taken as a Y-axis direction, and a direction (ie vertical direction) orthogonal to each of the X-axis direction and the Y-axis direction is taken as a Z-axis direction. Further, rotation (inclination) directions around the X axis, the Y axis, and the Z axis are taken as θX, θY, and θZ directions, respectively.

First Embodiment
The first embodiment will be described. FIG. 1 is a schematic block diagram showing an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus that exposes the substrate P with the exposure light EL via the liquid LQ. In the present embodiment, the immersion space LS is formed so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, area) filled with liquid. The substrate P is exposed to the exposure light EL through the liquid LQ in the immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  In addition, an exposure apparatus EX according to this embodiment includes an exposure apparatus including a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,889,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, the exposure apparatus EX measures the exposure light EL without holding the mask M, the mask stage 1 movable with the mask M, the substrate stage 2 movable with the substrate P, and the substrate P. Measuring member C and a measuring instrument are mounted and moved, a driving system 4 for moving the mask stage 1, a driving system 5 for moving the substrate stage 2, and a driving system 6 for moving the measuring stage 3 An illumination system IL for illuminating the mask M with the exposure light EL, a projection optical system PL for projecting an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of an optical path of the exposure light EL Is connected to the liquid immersion member 7 capable of forming the liquid immersion space LS so that the liquid LQ is filled, the control device 8 for controlling the overall operation of the exposure apparatus EX, and the control device 8, and stores various information on exposure And a storage device 8R that. The storage device 8R includes, for example, a memory such as a RAM, a hard disk, and a recording medium such as a CD-ROM. An operating system (OS) for controlling the computer system is installed in the storage device 8R, and a program for controlling the exposure apparatus EX is stored.

  The exposure apparatus EX further includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. Detection system 300 includes an alignment system 302 that detects an alignment mark of substrate P, and a surface position detection system 303 that detects the position of upper surface (surface) Pa of substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern to be projected onto the substrate P is formed. The mask M includes, for example, a transmissive mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Also, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an antireflective film, or may include a protective film (top coat film) that protects the photosensitive film.

  In addition, the exposure apparatus EX includes a chamber apparatus 103 that adjusts the environment (at least one of temperature, humidity, pressure, and degree of cleanliness) of the space 102 in which the exposure light EL travels. The chamber apparatus 103 has a chamber member 104 that forms a space 102 and an air conditioning system 105 that adjusts the environment of the space 102.

  Space 102 includes space 102A and space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 includes an air supply unit 105S that supplies gas to the spaces 102A and 102B, supplies gas from the air supply unit 105S to the spaces 102A and 102B, and adjusts the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are disposed in the space 102A.

  The illumination system IL irradiates the exposure light EL on a predetermined illumination area IR. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a portion of the mask M disposed in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F2 laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light which is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination area IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover disposed on the mask stage 1 and a stator disposed on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 is movable in six directions of the X axis, Y axis, Z axis, θX, θY, and θZ directions on the guide surface 9G by the operation of the drive system 4.

  The projection optical system PL irradiates the predetermined projection area PR with the exposure light EL. The projection area PR includes a position to which the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection area PR. The projection optical system PL of this embodiment is a reduction system whose projection magnification is, for example, 1⁄4, 1⁄5, or 1⁄8. The projection optical system PL may be either an equal magnification system or a magnification system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. The projection optical system PL may form either an inverted image or an erected image.

  The substrate stage 2 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 can move on the guide surface 10G of the base member 10 including the projection area PR while holding the substrate P. Measurement stage 3 is movable to a position (projection region PR) to which exposure light EL emitted from projection optical system PL can be irradiated. Measurement stage 3 can move on guide surface 10G of base member 10 including projection area PR while holding measurement member C. The substrate stage 2 and the measurement stage 3 can move independently on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover disposed on the substrate stage 2 and a stator disposed on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, a drive system 6 for moving the measurement stage 3 includes a planar motor, and has a mover disposed on the measurement stage 3 and a stator disposed on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion (substrate holding portion) 31 which holds the lower surface Pb of the substrate P in a releasable manner, and an opening Th in which the substrate P can be disposed. It has the upper surface arrange | positioned around the upper surface Pa of the board | substrate P in the state hold | maintained at the holding | maintenance part 31. FIG.

  In the present embodiment, the substrate stage 2 has a periphery of the first holding portion 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. , And releasably hold the lower surface Tb of the cover member (regulating member) T. The cover member T is disposed around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding portion 31 is disposed. In the present embodiment, the cover member T has the upper surface 2U.

  In the present embodiment, the first holding unit 31 holds the substrate P such that the upper surface Pa of the substrate P and the XY plane are substantially parallel. The second holding portion 32 holds the cover member T such that the upper surface 2U of the cover member T and the XY plane are substantially parallel. In the present embodiment, the upper surface Pa of the substrate P held by the first holding portion 31 and the upper surface 2U of the cover member T held by the second holding portion 32 are arranged in substantially the same plane (substantially flush Is).

  The cover member T may be integrally formed on the substrate stage 2. For example, at least a part of the substrate stage 2 may have the upper surface 2U.

  In the present embodiment, the measurement stage 3 is disposed around the third holding unit 33 for holding the measurement member C in a releasable manner and the third holding unit 33, and is a fourth holding unit for holding the cover member Q in a releasable manner. And 34. The third and fourth holders 33 and 34 have a pin chuck mechanism. The cover member Q is disposed around the measurement member C held by the third holding unit 33. The holding mechanism used in at least one of the third holding portion 33 and the fourth holding portion 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the cover member Q may be integrally formed on the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C so that the upper surface of the measurement member C and the XY plane are substantially parallel. The fourth holding portion 34 holds the cover member Q so that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measuring member C held by the third holding unit 33 and the upper surface of the cover member Q held by the fourth holding unit 34 are arranged in substantially the same plane (almost flush is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2 and the upper surface of the measuring member C held by the third holding unit 33. The top surface of the cover member Q held by the fourth holding portion 34 is appropriately referred to as the top surface 3U of the measurement stage 3 as appropriate.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11 </ b> A can measure the position of the mask stage 1 using the measurement mirror 1 </ b> R disposed on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R disposed on the substrate stage 2 and the measurement mirror 3R disposed on the measurement stage 3.

  The alignment system 302 detects the alignment mark of the substrate P and detects the position of the shot area (exposure area) S of the substrate P. Alignment system 302 has a lower surface to which substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (surface) Pa of the substrate P held by the substrate stage 2 can face the lower surface of the alignment system 302 facing in the −Z direction.

  The surface position detection system 303 is also called, for example, an auto focus leveling system, and irradiates detection light to the upper surface (surface) Pa of the substrate P held by the substrate stage 2 to detect the position of the upper surface Pa of the substrate P Do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held by the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing the −Z direction.

  When performing the exposure process of the substrate P or performing a predetermined measurement process, the control device 8 controls the drive system 4, 5, 5, based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to execute position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is disposed in the vicinity of the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member, and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is disposed around the terminal optical element 12.

  The last optical element 12 has an emission surface 13 for emitting the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, the immersion space LS is formed on the side of the emission surface 13. The immersion space LS is formed such that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The emission surface 13 faces the traveling direction (−Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. In addition, the injection | emission surface 13 may incline with respect to XY plane, and a curved surface may be included.

  The liquid immersion member 7 has a lower surface 14 at least a part of which faces the -Z direction. In the present embodiment, the emission surface 13 and the lower surface 14 can hold the liquid LQ with an object disposed at a position (projection region PR) to which the exposure light EL emitted from the emission surface 13 can be irradiated. . The immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and an object disposed in the projection region PR. The immersion space LS is formed such that the optical path K of the exposure light EL between the emission surface 13 and the object disposed in the projection area PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ with the object so that the optical path K of the exposure light EL between the end optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, an object that can be disposed in the projection region PR includes an object that can be moved relative to the projection region PR on the image plane side (the exit surface 13 side of the terminal optical element 12) of the projection optical system PL. The object is movable relative to the end optical element 12 and the immersion member 7. The object has an upper surface (surface) that can face at least one of the emission surface 13 and the lower surface 14. The upper surface of the object can form an immersion space LS with the emission surface 13. The object is movable in a plane (in the XY plane) perpendicular to the optical axis (Z axis) of the terminal optical element 12. In the present embodiment, the upper surface of the object can form the immersion space LS between the emission surface 13 and at least a part of the lower surface 14. By holding the liquid LQ between the emission surface 13 and the lower surface 14 on one side and the upper surface (surface) of the object on the other side, the optical path K of the exposure light EL between the terminal optical element 12 and the object is The immersion space LS is formed to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held by the substrate stage 2, the measurement stage 3, and the measurement member C held by the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held by the substrate stage 2 are liquid immersions directed to the -Z direction and the exit surface 13 of the final optical element 12 directed to the -Z direction. It can face the lower surface 14 of the member 7. Of course, the object that can be disposed in the projection region PR is not limited to at least one of the substrate stage 2, the substrate P held by the substrate stage 2, the measurement stage 3, and the measurement member C held by the measurement stage 3. Also, the objects can face at least a portion of the detection system 300.

  In the present embodiment, when the substrate P is irradiated with the exposure light EL, the liquid immersion space LS is formed such that a partial region of the surface of the substrate P including the projection region PR is covered with the liquid LQ. At the time of exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ with the substrate P such that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment adopts the local liquid immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. FIG. 3 is an enlarged view of a part of FIG. In FIG. 2, the substrate P is disposed in the projection area PR (the position facing the terminal optical element 12 and the liquid immersion member 7), but as described above, the substrate stage 2 (cover member T), The measurement stage 3 (cover member Q, measurement member C) can also be disposed.

  As shown in FIG. 2, the liquid immersion member 7 has a facing portion 71 at least a part of which faces the emission surface 13 of the terminal optical element 12, and a main body part 72 at least a part of which is disposed around the terminal optical element 12. And. The facing portion 71 has a hole (opening) 7 K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least a portion of which faces the emission surface 13 via a gap, and a lower surface 7H to which the substrate P (object) can face. Hole 7K is formed to connect upper surface 7U and lower surface 7H. The upper surface 7U is disposed around the upper end of the hole 7K, and the lower surface 7H is disposed around the lower end of the hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and can be irradiated onto the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is disposed around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

  The liquid immersion member 7 also has a supply port 15 capable of supplying the liquid LQ, and a recovery port 16 capable of recovering the liquid LQ. The supply port 15 supplies the liquid LQ, for example, when the substrate P is exposed. The recovery port 16 recovers the liquid LQ, for example, at the time of exposure of the substrate P. The supply port 15 can supply the liquid LQ at one or both of the exposure time and the non-exposure time of the substrate P. The recovery port 16 can recover the liquid LQ at one or both of the exposure time and the non-exposure time of the substrate P.

  The supply port 15 is disposed in the vicinity of the optical path K of the exposure light EL emitted from the emission surface 13 so as to face the optical path K. Note that the supply port 15 may face one or both of the space between the emission surface 13 and the opening 7K and the side surface of the terminal optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to the space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and is then supplied onto the substrate P (object) through the opening 7K.

  The supply port 15 is connected to the liquid supply device (first liquid supply device) 18 via the flow path 17. The liquid supply device 18 can deliver the clean and temperature-controlled liquid LQ. The liquid supply device 18 may be provided in the exposure apparatus EX, or may be provided outside the exposure apparatus EX, for example, in a clean room. The flow path 17 includes a supply flow path 17R formed inside the liquid immersion member 7, and a flow path formed by a supply pipe connecting the supply flow path 17R and the liquid supply device 18. The liquid LQ delivered from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 is capable of recovering at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The recovery port 16 is disposed at least at a part of the periphery of the opening 7K through which the exposure light EL passes. In the present embodiment, the recovery port 16 is disposed in at least a part of the periphery of the holding surface 7H. The recovery port 16 is disposed at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body portion 72 has an opening 7P facing the substrate P (object). The opening 7P is disposed at least at a part of the periphery of the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 disposed in the opening 7P. In the present embodiment, the porous member 19 is a plate-like member including a plurality of openings (pores). A mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H to which the substrate P (object) can face, an upper surface 19U facing the opposite direction of the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is disposed on at least a part of the periphery of the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes the holding surface 7H and the lower surface 19H.

  In the present embodiment, the recovery port 16 includes the pores of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is recovered through the hole (recovery port 16) of the porous member 19. The porous member 19 may not be disposed.

  The recovery port 16 is connected to the liquid recovery device 21 via the flow path 20. The liquid recovery apparatus 21 can connect the recovery port 16 to, for example, a vacuum system provided outside the exposure apparatus EX, and can suction the liquid LQ via the recovery port 16. The liquid recovery apparatus 21 may be provided in the exposure apparatus EX, or may be provided, for example, in a clean room outside the exposure apparatus EX. The flow path 20 includes a recovery flow path 20R formed inside the liquid immersion member 7, and a flow path formed by a recovery pipe connecting the recovery flow path 20R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the recovery operation of the liquid LQ from the recovery port 16 in parallel with the supply operation of the liquid LQ from the supply port 15 to obtain the end optical element 12 on one side and An immersion space LS can be formed by the liquid LQ between the immersion member 7 and the object on the other side.

  As the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  As shown in FIGS. 2 and 3, in the present embodiment, the substrate stage 2 is a space portion leading to a gap (gap) Ga between the substrate (object) P and the cover member (member) T (substrate stage 2). Have twenty three. The space portion 23 is located below the gap Ga. The gap Ga is formed between the side surface Pc of the substrate P held by the first holding portion 31 and the inner surface Tc of the cover member T held by the second holding portion 32, which face each other.

  A porous member 80 is disposed in the space 23. In the present embodiment, the porous member 80 has an upper surface 80A to which at least one of the injection surface 13 and the lower surface 14 can face. The upper surface 80A is disposed below (−Z side) the substrate P and the cover member T. In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed, for example, by a sintering method. In the present embodiment, at least a part of the liquid LQ flowing into the gap Ga is recovered via the porous member 80.

  In the present embodiment, the porous member 80 is supported by the case 81. The case 81 is disposed in the space 23. In the present embodiment, the case 81 is made of, for example, ceramic, but may be made of metal. The porous member 80 may be directly disposed in the space 23 without using the case 81.

  Further, in the present embodiment, the support member 82 is disposed between the porous member 80 and the case 81 and the cover member T. The support member 82 is supported by at least a portion of the porous member 80 and the case 81. The support member 82 can face at least a part of the lower surface Tb of the cover member T. The support member 82 supports at least a portion of the lower surface Tb of the cover member T. Note that this may be omitted without using the support member 82.

  In the present embodiment, the substrate stage 2 has a suction port 24 disposed in the space 23. In the present embodiment, the suction port 24 is formed in at least a part of the inner surface of the substrate stage 2 forming the space 23. The suction port 24 sucks at least a part of the fluid in the space 23 so that the space 23 has a negative pressure. The suction port 24 can suction one or both of the liquid and the gas in the space 23.

  The suction port 24 is connected to the fluid suction device 26 via the flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suction one or both of liquid and gas via the suction port 24. Further, the fluid suction device 26 may include a flow meter (not shown), and the amount of fluid (liquid) sucked may be measured by the flow meter. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of liquid and gas) sucked from the suction port 24 is sucked by the fluid suction device 26 through the flow path 25. The fluid suction device 26 may be provided in the exposure apparatus EX, or may be provided in, for example, a clean room outside the exposure apparatus EX.

  In the present embodiment, the case 81 has a hole (opening) 81H connecting the outer surface and the inner surface of the case 81. The opening 83 at the upper end of the hole 81H faces the lower surface of the porous member 80. The opening at the lower end of the hole 81 H is connected to the suction port 24. The suction port 24 can suction the fluid in the space inside the case 81 through the hole 81H so that the space inside the case 81 becomes negative pressure.

  In the present embodiment, the flow path 51 of the liquid supply device (second liquid supply device) 50 for supplying the liquid into the gap Ga is disposed in the substrate stage 2. One end of the flow path 51 faces the space portion 23 as a supply port 51a and is opened, and the other end side is connected to the liquid supply device 50. The liquid supply device 50 supplies the liquid to the space 23 through the flow path 51 under the control of the controller 8. In the present embodiment, the same water (pure water) as the liquid LQ described above is used as the liquid supplied from the liquid supply device 50.

  In the present embodiment, the first holding unit 31 has, for example, a pin chuck mechanism. The first holding portion 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall portion 35 to which the lower surface Pb of the substrate P can face and on the support surface 31S inside the peripheral wall portion 35. And a suction port 37 disposed on the support surface 31S for suctioning fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the controller 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space at least in part between the peripheral wall portion 35 and the lower surface Pb of the substrate P. In the support surface 31, the peripheral wall portion 35 is substantially circular, and the center of the first holding portion 31 is the center of the peripheral wall portion 35 in the above-described and following descriptions. In the present embodiment, the peripheral wall 35 is substantially circular (annular) in the XY plane. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall 35 are in contact with each other, the peripheral wall 35 and the lower surface Pb of the substrate P and the support surface 31S The space 31H formed by can be negative pressure. Thus, the substrate P is held by the first holding unit 31. Further, the substrate P is released from the first holding unit 31 by canceling the suction operation of the suction port 37.

  In the present embodiment, the lower surface of the substrate P is held at the upper end of the support portion 36 (a plurality of pin members) by applying a negative pressure to the space 31H. That is, at least a part of the holding surface 36S for holding the substrate P is defined by the upper end of the support portion 36 (a plurality of pin members).

  In the present embodiment, the second holding unit 32 has, for example, a pin chuck mechanism. The second holding portion 32 is disposed so as to surround the peripheral wall portion 35 on the support surface 32S of the substrate stage 2 so as to surround the peripheral wall portion 38 on the support surface 32S and the peripheral wall portion 38 to which the lower surface Tb of the cover member T can face. And a support portion 40 including a plurality of pin members disposed on the support surface 32S between the peripheral wall 38 and the peripheral wall 39, and a support surface 32S and has a suction port 41 for suctioning fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the controller 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space at least in part between the peripheral wall portions 38 and 39 and the lower surface Tb of the cover member T. The control device 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other. The space 32H formed by the lower surface Tb and the support surface 32S can be negative pressure. Thus, the cover member T is held by the second holding portion 32. In addition, the cover member T is released from the second holding portion 32 by releasing the suction operation of the suction port 41.

  The space 23 includes a space around the peripheral wall 35. In the present embodiment, the space 23 includes a space between the peripheral wall 35 and the peripheral wall 38.

  Further, as shown in FIG. 4, the substrate stage 2 is provided with heaters HT1 and HT2, and temperature sensors TS1 and TS2. The heater HT1 mainly heats the first holding portion 31, and a plurality of (six in FIG. 4) are arranged at intervals in the circumferential direction at positions near the outer peripheral portion of the substrate P with respect to the XY plane. ing. The operation (heating / heating cancellation) of each heater HT1 is controlled by the controller 8.

  The heater HT2 mainly heats the second holding portion 32, and is arranged in a rectangular shape along the edge of the cover member T with respect to the XY plane. The controller 8 controls the operation (heating / heating cancellation) of each heater HT2.

  The temperature sensor TS1 measures the temperature of the first holding unit 31 and outputs the measurement result to the control device 8. The temperature sensor TS1 is disposed in the vicinity of the central portion in the circumferential direction of each heater HT1 with respect to the XY plane. The temperature sensor TS2 measures the temperature of the second holding unit 32 and outputs the measurement result to the control device 8. The temperature sensor TS2 is disposed at the corner of the rectangular heater HT2 and the center of the side with respect to the XY plane. It is done.

  Next, an example of the operation of the exposure apparatus EX will be described with reference to FIGS. 3 to 5. FIG. 5 is a diagram showing the relationship between time and temperature in the substrate stage 2.

  In order to expose the substrate P held in the first holding unit 31, the control device 8 controls the operation of the heaters HT1 and HT2 in advance based on the temperature measurement result by the temperature sensors TS1 and TS2 in advance to perform the first holding. The temperatures of the unit 31 and the second holding unit 32 are controlled to a predetermined temperature T1 (see FIG. 5). Then, the control device 8 moves the substrate stage 2 to the exposure position, and the immersion space LS is formed with the liquid LQ between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 (substrate P). Thereafter, the control device 8 starts the exposure processing of the substrate P.

  The exposure apparatus EX of this embodiment is a scanning exposure apparatus (so-called scanning stepper) which projects an image of a pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is taken as the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also taken as the Y-axis direction. The controller 8 moves the substrate P in the Y-axis direction with respect to the projection area PR of the projection optical system PL, and synchronizes with the movement of the substrate P in the Y-axis direction to the illumination area IR of the illumination system IL. The exposure light EL is irradiated to the substrate P via the projection optical system PL and the liquid LQ in the liquid immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thus, the substrate P is exposed to the exposure light EL through the liquid LQ, and the image of the pattern of the mask M is projected onto the substrate P through the projection optical system PL and the liquid LQ.

  As shown in FIG. 4, in the present embodiment, a plurality of shot areas S which are exposure target areas are arranged in a matrix on the substrate P. The control device 8 sequentially exposes a plurality of shot areas S defined on the substrate P.

  When the shot area S of the substrate P is exposed, the terminal optical element 12 and the liquid immersion member 7 are opposed to the substrate P, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. Immersion space LS is formed so that it may be carried out. When sequentially exposing the plurality of shot areas S of the substrate P, the immersion space LS is formed between the terminal optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2 with the liquid LQ. In the state in which the substrate stage 2 is formed, the substrate stage 2 is moved by the drive system 5 in the XY plane. The controller 8 controls the substrate in a state where the immersion space LS is formed of the liquid LQ between the terminal optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2 Exposure of the substrate P is performed while moving the stage 2.

  For example, in order to expose the first shot area S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to the exposure start position. The controller 8 moves the first shot area S (substrate P) in the Y-axis direction with respect to the projection area PR of the projection optical system PL in the state where the immersion space LS is formed. The exposure light EL is irradiated to the shot area S.

  After the exposure of the first shot area S is completed, the controller 8 exposes the substrate P in the X-axis direction (in the state where the immersion space LS is formed) in order to expose the next second shot area S. Alternatively, the second shot area S is moved to the exposure start position by moving in the direction inclined with respect to the X-axis direction in the XY plane. The controller 8 exposes the second shot area S in the same manner as the first shot area S.

  The control device 8 moves the shot area S in the Y-axis direction with respect to the projection area PR while irradiating the shot area S with the exposure light EL (scan exposure operation) and the exposure of the shot area S is completed. Thereafter, while repeating the operation (stepping operation) for moving the next shot area S to the exposure start position, the plurality of shot areas S on the substrate P are exposed to the liquid LQ of the projection optical system PL and the immersion space LS. Exposure is sequentially performed via The exposure light EL is sequentially irradiated to a plurality of shot areas S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection area PR of the projection optical system PL and the substrate P relatively move along the movement trajectory shown by the arrow R1 in FIG. Meanwhile, the projection area PR is irradiated with the exposure light EL, and the plurality of shot areas S of the substrate P are sequentially exposed with the exposure light EL through the liquid LQ. In at least a part of the movement of the substrate stage 2 in the exposure of the substrate P, the immersion space LS is formed on the gap Ga.

  At this time, as shown in FIG. 3, the liquid LQ supplied from the liquid supply device 18 flows into the gap Ga. The liquid LQ which has flowed into the gap Ga is sucked through the hole of the porous member 80 by the negative pressure suction force by the operation of the fluid suction device 26, and is suctioned and recovered through the suction port 24, the hole 81H and the flow path 25. . Here, the amount of the liquid LQ flowing into the gap Ga may vary depending on, for example, the liquid repelling characteristics of the surface Pa and the side surface Pc of the substrate P.

  For example, as shown in FIG. 6, when the amount of the liquid LQ flowing into the gap Ga is smaller than the amount of the liquid LQ shown in FIG. 3, the heat of vaporization of the liquid LQ also decreases. As shown by the graph G1, the temperature of the substrate stage 2 may become higher than the predetermined temperature T1 due to the heat generation of the drive system 5 or the like as time passes. Conversely, when the amount of the liquid LQ flowing into the gap Ga is large, the heat of vaporization of the liquid LQ also increases, and as shown by the graph G2 in FIG. Even if there is, the temperature of the substrate stage 2 may be lower than the predetermined temperature T1. As described above, when the temperature of the substrate stage 2 fluctuates, an error occurs in the position, size, etc. of the shot area S on the substrate P with the thermal deformation of the substrate P. If provided, the measurement accuracy may be reduced to cause exposure failure.

Therefore, in the present embodiment, the control device 8 controls the liquid supply device 50 to follow the fluctuation of the amount of the liquid flowing in through the gap Ga, as shown in FIG. The liquid is supplied to Ga (the space 23). In other words, the control device 8 controls the liquid from the liquid supply device 50 to the gap Ga (the space 23) via the flow path 51 so as to offset the fluctuation of the amount of liquid flowing from the liquid immersion space LS into the gap Ga. Supply.
Specifically, the controller 8 reduces the fluctuation of the amount of liquid in the gap Ga in the following manner.

(Liquid supply according to the liquid recovery amount)
By the operation of the fluid suction device 26, the liquid in the gap Ga is sucked and recovered, and the amount of the recovered liquid is detected by the first sensor, and the amount of the liquid detected by the first sensor is out of the preset range In this case, the liquid supply device 50 supplies an amount such that the amount of liquid detected by the first sensor falls within the set range. As the first sensor, for example, a flow meter provided in the above-described fluid suction device 26 can be exemplified. In this case, the control device 8 synchronously controls the operation of the fluid suction device 26 and the operation of the liquid supply device 50 so that, for example, the amount of liquid from the liquid supply device 50 among the liquid in the gap Ga By making the amount of the liquid flowing from the LS into the gap Ga relatively large, it is possible to suppress an adverse effect such as foreign matter contained in the liquid from the liquid supply device 18 flowing into the gap Ga through the surface Pa of the substrate P.

(Liquid supply according to the temperature of the collected liquid)
By the operation of the fluid suction device 26, the liquid in the gap Ga is sucked and collected, and the temperature of the collected liquid is detected by the second sensor, and the temperature of the liquid detected by the second sensor is out of the preset range In this case, the amount of the liquid in the gap Ga may fluctuate, which may cause a temperature fluctuation of the substrate stage 2. Therefore, the amount of the liquid detected by the second sensor within the set range is the liquid supply device 50 Supply by Also in this case, the control device 8 synchronously controls the operation of the fluid suction device 26 and the operation of the liquid supply device 50, so that the amount of liquid from the liquid supply device 50 among the liquid in the gap Ga By making the amount of the liquid flowing from the space LS into the gap Ga relatively large, it is possible to suppress an adverse effect such as foreign matter contained in the liquid from the liquid supply device 18 flowing into the gap Ga through the surface Pa of the substrate P. . In each of the above examples, if the amount of liquid recovery (suction) by the fluid suction device 26 is constant, the amount of liquid from the liquid supply device 50 is not necessarily the amount of liquid flowing from the immersion space LS into the gap Ga. It may not be relatively more than the amount.

  In the liquid supply by the liquid supply device 50, the heat of vaporization associated with the evaporation of the liquid is adjusted. For example, a temperature control device for adjusting the temperature of the liquid supplied by the liquid supply device 50 is provided. By setting the liquid whose temperature is controlled so that the temperature of the liquid in the above becomes within the set range from the liquid supply device 50, it is possible to make it possible to adjust the liquid temperature in a short time. It goes without saying that the liquid supply by the liquid supply device 50 according to the temperature of the collected liquid and the liquid supply by the liquid supply device 50 according to the liquid collection amount described above may be used in combination.

(Liquid supply according to the temperature of substrate stage 2)
If the measurement result of at least one of the temperature sensors TS1 and TS2 deviates from the preset range, it is estimated that the amount of the liquid flowing into the gap Ga from the immersion space LS fluctuates to cause the temperature fluctuation of the substrate stage 2 it can. Therefore, the control device 8 controls the liquid supply device 50 to supply the liquid from the supply port 51a to the space 23 so that the temperature measured by the temperature sensors TS1 and TS2 falls within the set range.

(Liquid supply according to exposure conditions)
Depending on the exposure condition of the substrate P, for example, even when the various sensors described above are not used, it is possible to estimate the amount of liquid flowing from the immersion space LS into the gap Ga. Therefore, it is also possible to adjust the amount of liquid supplied from the liquid supply device 50 according to the exposure condition. Examples of this type of exposure conditions include the shape of the substrate P, the liquid repellency of the substrate P to the liquid, and the movement conditions of the substrate stage 2.

  When it is known that the width of the gap Ga varies as the shape of the substrate P, for example, due to the circularity of the circular substrate P, the gap due to the variation of the amount of liquid flowing into the gap Ga estimated in advance The liquid is supplied from the liquid supply device 50 in the manner described above so as to reduce fluctuations in the amount of liquid in Ga. Similarly, with regard to the liquid repellency of the substrate P with respect to the liquid, when the liquid repellency varies, the amount of liquid flowing into the gap Ga fluctuates. Therefore, when the variation degree of the liquid repellency of the substrate P is known, the variation of the liquid amount in the gap Ga due to the variation of the amount of the liquid flowing into the gap Ga estimated in advance is described above. The liquid may be supplied from the liquid supply device 50 by a method.

  Further, as described above, the movement condition of the substrate stage 2 is the case where the substrate stage 2 moves so that the immersion space LS straddles the gap Ga, and the case where the substrate stage 2 moves without straddling the gap Ga And the amount of liquid flowing into the gap Ga may vary. In this case, the controller 8 reduces the variation of the liquid amount in the gap Ga due to the variation of the amount of the liquid flowing into the gap Ga estimated in advance based on the distribution of the shot area S and the exposure order set in advance. Then, the liquid may be supplied from the liquid supply device 50 by the method described above. For example, when the exposure process is performed with the immersion space LS straddling the gap Ga, the amount of liquid supplied from the liquid supply device 50 is reduced (or the liquid supply is stopped), and the immersion space LS When the exposure processing is performed without straddling Ga, the supply amount may be adjusted so as to increase the amount of liquid supplied from the liquid supply device 50.

  The timing at which the liquid is supplied from the liquid supply device 50 described above can be implemented, for example, for each substrate P. In this case, by supplying the liquid before or after the exposure processing on the substrate P, it is possible to eliminate adverse effects such as vibration when performed during the exposure processing. Further, even when the amount of the liquid flowing from the liquid supply device 18 into the gap Ga fluctuates by adjusting the amount of the liquid supplied from the liquid supply device 50 each time the preset number of the substrates P is exposed, The variation of the amount of liquid in the gap Ga can be managed with higher accuracy. Alternatively, while constantly supplying a constant amount of liquid from the liquid supply device 50, the liquid supply amount from the liquid supply device 50 may be changed so as to suppress the fluctuation when there is the above-mentioned fluctuation.

  As described above, in the present embodiment, by supplying the liquid from the liquid supply device 50 to the gap Ga, it is possible to suppress the temperature variation generated in the substrate stage 2 due to the variation of the amount of liquid in the gap Ga. it can. Therefore, in the present embodiment, it is possible to suppress the occurrence of the exposure failure caused by the temperature fluctuation of the substrate stage 2.

Second Embodiment
Next, a second embodiment of the exposure apparatus EX will be described.
In the second embodiment, the liquid supply amount from the liquid supply device 50 is adjusted based on the liquid recovery amount of the liquid recovery device 21.

  The liquid recovery device 21 includes a flow meter that measures the amount of liquid recovered from the liquid immersion space LS by the liquid immersion member 7. The value of the flow meter of the liquid recovery device 21 fluctuates depending on the amount of liquid flowing from the immersion space LS into the gap Ga. That is, when the liquid recovery amount measured by the flow meter of the liquid recovery apparatus 21 increases, it can be estimated that the amount of the liquid flowing from the immersion space LS into the gap Ga decreases.

Therefore, in the present embodiment, for example, when the value of the flow meter of the liquid recovery device 21 is increased, the liquid supply device 50 is controlled to start supply of the liquid to the space portion 23. When a constant amount of liquid is constantly supplied from the liquid supply device 50, the amount supplied may be increased.
Thus, the amount of fluid (liquid) sucked from the space 23 to the fluid suction device 26 can be adjusted, and the fluctuation of the heat of vaporization described above can be suppressed.

  Although the preferred embodiments according to the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such examples. The shapes, combinations, and the like of the constituent members shown in the above-described example are merely examples, and various changes can be made based on design requirements and the like without departing from the spirit of the present invention.

  For example, in the above embodiment, the configuration of adjusting the temperature of the substrate stage 2 by adjusting the amount of liquid in the gap Ga has been described, but the present invention is not limited to this. The temperature adjustment of the substrate stage 2 may be performed by combining the heat treatment by the heaters HT1 and HT2.

  When the substrate is not exposed, the cleaning liquid may be supplied from the supply port 51 a of the liquid supply device 50. Thus, the porous member 80 and the space 23 can be cleaned. The cleaning liquid may include, for example, at least one of ethanol, isopropyl alcohol (IPA), and pentanol. Alternatively, the cleaning liquid may include an alkaline liquid such as tetramethylammonium hydroxide (TMAH). An acidic liquid may be used as the cleaning liquid. For example, the liquid LC may contain hydrogen peroxide. For example, a hydrogen peroxide aqueous solution (hydrogen peroxide water) may be used as the liquid LC.

Further, in the above embodiment, the configuration formed between the substrate P and the cover member T has been illustrated as the gap Ga. However, the present invention is not limited to this. For example, as shown in FIG. When a scale member (measurement member) GT as a member is provided by opening a gap Gm around the cover member T as an object in the case, and an encoder system for measuring the position of the substrate stage 2 using the scale member GT is used It is also possible to adjust the amount of liquid LQ remaining in the gap Gm in the same manner as in the above embodiment. The gap Gm in this case is formed between the edge part Egg of the scale member GT and the edge part Eg of the cover member T.
Such an encoder system is disclosed, for example, in US Patent Application Publication No. 2007/0288121.

  In addition to the substrate stage 2, as shown in FIG. 7, in the measurement stage 3, the gap Gn formed between the measurement member (measuring device) C for measuring the exposure light EL and the cover member Q It is also possible to adjust the amount of liquid LQ remaining in the same as in the above embodiment. The gap Gn in this case is formed between the edge portion Egq of the cover member Q and the edge portion Egc of the measuring member C. Further, at the time of transition from exposure processing to measurement processing, or at the transition from measurement processing to exposure processing, the immersion space LS is on the substrate stage 2 while maintaining the state in which the substrate stage 2 and the measurement stage 3 are in close proximity. It is also possible to adjust the liquid LQ remaining in the gap between the substrate stage 2 and the measurement stage 3 in the same manner as in the above embodiment when moving relative to the measurement stage 3.

  In each of the above-described embodiments, the light path K on the emission side (image plane side) of the last optical element 12 of the projection optical system PL is filled with the liquid LQ. The light path on the incident side (object plane side) of the terminal optical element 12 as disclosed in the 2004/019128 pamphlet may also be a projection optical system filled with the liquid LQ.

  In each of the above-described embodiments, water is used as the liquid LQ for exposure, but a liquid other than water may be used. The liquid LQ is transparent to the exposure light EL, has a high refractive index to the exposure light EL, and is a film such as a photosensitive material (photoresist) that forms the surface of the projection optical system PL or the substrate P Those stable against are preferred. For example, as liquid LQ, it is also possible to use hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, and the like. Moreover, it is also possible to use various fluids, for example, a supercritical fluid, as the liquid LQ.

  As the substrate P in each of the above-described embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original plate of a mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that synchronously moves the mask M and the substrate P to scan and expose the pattern of the mask M, the mask M and the substrate P It is possible to apply the present invention to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed in a stationary state and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat type exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system in a state where the first pattern and the substrate P are substantially stationary, the second pattern And the substrate P in a substantially stationary state, the reduced image of the second pattern may be partially overlapped with the first pattern using the projection optical system, and may be collectively exposed on the substrate P (Stitch-type collective exposure apparatus ). Further, as a stitch type exposure apparatus, it is also applicable to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P and the substrate P is sequentially moved.

  Also, as disclosed in, for example, US Pat. No. 6,611,316, patterns of two masks are synthesized on a substrate through projection optics, and one shot area on the substrate by one scanning exposure. The present invention can also be applied to an exposure apparatus and the like which double-exposures substantially simultaneously. The present invention can also be applied to a proximity type exposure apparatus, a mirror projection aligner, and the like.

  Further, the present invention is a twin-stage type exposure including a plurality of substrate stages as disclosed in US Pat. Nos. 6,341,007, 6,208,407, and 6,262,796. It can be applied to the device. For example, as shown in FIG. 8, the exposure apparatus EX may include two substrate stages 2001 and 2002. In that case, the object that can be arranged to face the emission surface 13 is one substrate stage, a substrate held by one substrate stage, a substrate stage held by the other substrate stage, and a substrate stage held by the other substrate stage. Includes at least one.

  The present invention can also be applied to an exposure apparatus provided with a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to the exposure apparatus for semiconductor element production which exposes the semiconductor element pattern to the substrate P, and an exposure apparatus for liquid crystal display element production or display production, thin film magnetic head, imaging element (CCD The present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, or a reticle or a mask.

  In the above embodiment, a light transmission type mask in which a predetermined light shielding pattern (or a phase pattern / light reduction pattern) is formed on a light transmitting substrate is used. Instead of this mask, for example, US Pat. As disclosed in US Pat. No. 6778257, a variable-shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern or a reflection pattern or a light emission pattern based on electronic data of a pattern to be exposed ) May be used. Further, instead of the variable molding mask provided with the non-light emitting type image display device, a pattern forming apparatus including a self-light emitting type image display device may be provided.

  In each of the above-described embodiments, the exposure apparatus including the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and a substrate, and the substrate can be irradiated with exposure light through the optical member.

  Also, as disclosed in, for example, WO 2001/035168, an exposure apparatus (lithography system) that exposes a line-and-space pattern on a substrate P by forming interference fringes on the substrate P. The present invention can also be applied.

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including respective components so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical systems to ensure these various accuracies Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, wiring connection of electric circuits, piping connection of pressure circuits, etc. among the various subsystems. It goes without saying that there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature and the degree of cleanliness are controlled.

  A microdevice such as a semiconductor device is, as shown in FIG. 9, a step 201 of performing function / performance design of the microdevice, a step 202 of manufacturing a mask (reticle) based on this design step, a substrate which is a substrate of the device. A substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask, and developing the exposed substrate according to the above-described embodiment 203, It is manufactured through a device assembly step (including processing steps such as a dicing step, a bonding step, and a package step) 205, an inspection step 206 and the like.

  In addition, the requirements of each above-mentioned embodiment can be combined suitably. In addition, some components may not be used. In addition, the disclosures of all of the published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated as part of the description of the text as far as the laws and regulations permit.

  Reference Signs List 2 substrate stage (stage) 8 control device 12 end optical element (optical member) 13 emission surface 18 liquid supply device (first liquid supply device) 31 first holding unit 32 Second holding unit 50: liquid supply device (second liquid supply device) 51a: supply port 80: porous member DP: dummy substrate (second object, second liquid supply device) EL: exposure light EX: Exposure apparatus, Ga, Gm, Gn: Gap, GT: Scale member (member, measuring member), LQ: liquid, LS: immersion space, P: substrate (object), S: shot area (exposure Area), T ... Cover member (member, regulation member)

Claims (36)

An exposure apparatus for exposing a substrate with exposure light through a liquid, the exposure apparatus comprising:
An optical member having an emission surface from which the exposure light is emitted;
A stage which is movable under the optical member, having an object which can be opposed to the emission surface, and a member which is disposed via a gap;
A first liquid supply device for supplying a liquid between the object and the optical member;
An exposure apparatus comprising: a second liquid supply device at least a part of which is disposed on the stage to supply a liquid to the gap; The second liquid supply device supplies liquid to the gap so as to reduce fluctuations in the amount of liquid in the gap including the liquid supplied from the first liquid supply device and flowing into the gap. Exposure apparatus as described. The exposure apparatus according to claim 1, wherein the second liquid supply device supplies the liquid so as to offset the fluctuation of the amount of the liquid flowing into the gap among the liquids supplied from the first liquid supply device. . The exposure according to claim 1 or 2, wherein the second liquid supply device supplies the liquid to the gap such that the amount of the liquid from the second liquid supply device among the liquid in the gap is relatively large. apparatus. A liquid recovery device for recovering the liquid in the gap;
The exposure apparatus according to any one of claims 1 to 4, wherein the second liquid supply device adjusts the amount of liquid supplied to the gap based on the liquid recovered by the liquid recovery device. The liquid recovery device comprises a first sensor for detecting the amount of liquid recovered;
The exposure apparatus according to claim 5, wherein the second liquid supply device adjusts the amount of liquid to be supplied to the gap in accordance with the detection result of the first sensor. The exposure apparatus according to claim 6, wherein the second liquid supply device adjusts the amount of liquid supplied to the gap when the amount of liquid detected by the first sensor deviates from a preset range. The liquid recovery apparatus further includes a second sensor that detects the temperature of the recovered liquid,
The exposure apparatus according to any one of claims 5 to 7, wherein the second liquid supply device adjusts the amount of liquid to be supplied to the gap according to the detection result of the second sensor. 9. The exposure apparatus according to claim 8, wherein the second liquid supply device adjusts the amount of liquid supplied to the gap when the temperature of the liquid detected by the second sensor deviates from a preset range. The exposure apparatus according to any one of claims 1 to 9, wherein the second liquid supply apparatus adjusts the amount of liquid supplied to the gap each time a predetermined number of the substrates are exposed. The exposure apparatus according to any one of claims 1 to 10, further comprising: a control device configured to control an amount of liquid supplied to the gap by the second liquid supply device. The exposure apparatus according to claim 11, wherein the control device controls the second liquid supply position based on the liquid recovered from the gap. The exposure apparatus according to claim 11, wherein the control device controls the second liquid supply device based on a result of detecting a temperature of the stage. The control device controls the second liquid supply device based on an estimation result of estimating the amount of liquid supplied from the first liquid supply device and flowing into the gap. An exposure apparatus according to item 5. The exposure apparatus according to any one of claims 11 to 14, wherein the control device controls the second liquid supply device based on an exposure condition of the substrate. The exposure apparatus according to claim 15, wherein the exposure condition of the substrate includes at least one of the shape of the substrate and the liquid repellency with respect to the liquid. The exposure apparatus according to claim 15, wherein the exposure condition of the substrate includes a movement condition of the stage. The exposure apparatus according to claim 17, wherein the movement condition of the stage is set according to the distribution of the exposure area on the substrate. The exposure apparatus according to any one of claims 1 to 18, wherein the second liquid supply apparatus supplies the liquid to the gap in at least a part of the exposure of the substrate. The exposure apparatus according to any one of claims 1 to 19, wherein the second liquid supply apparatus supplies the liquid to the gap at least one of before and after exposure of the substrate. The stage according to any one of claims 1 to 20, wherein the liquid supplied from the first liquid supply device moves across the gap at least in part while holding the substrate. Exposure device. The stage includes a first holding unit that holds the object, and a second holding unit that holds the member.
The exposure apparatus according to any one of claims 1 to 21, wherein the gap includes at least a part of a space between the first holding unit and the second holding unit. The stage comprises a porous member disposed in the gap,
The exposure apparatus according to claim 22, wherein the liquid supplied by the second liquid supply device is in contact with the porous member. The exposure apparatus according to any one of claims 1 to 23, wherein the second liquid supply device supplies the liquid to the gap through a supply port provided on the stage facing the gap. The object comprises the substrate;
The second liquid supply device arranges a second object on the stage instead of the substrate to adjust the amount of the liquid flowing into the gap among the liquid supplied from the first liquid supply device. The exposure apparatus according to any one of claims 1 to 23. The exposure apparatus according to claim 25, wherein a distance between the member and the second object arranged on the stage is different from a distance between the substrate held by the stage and the member. The liquid repellency between the portion of the second object disposed on the stage adjacent to the gap and the liquid is determined by the portion of the substrate held on the stage adjacent to the gap and the liquid. 27. The exposure apparatus according to claim 25 different from liquid repellency. The shape of the portion adjacent to the gap in the second object disposed on the stage is different from the shape of the portion adjacent to the gap in the substrate held on the stage. An exposure apparatus according to any one of the preceding claims. The object comprises the substrate;
The exposure apparatus according to any one of claims 1 to 28, wherein the member includes a defining member that defines a position at which the stage holds the substrate. The exposure apparatus according to any one of claims 1 to 28, wherein the object includes a defining member that defines a position at which the stage holds the substrate. The exposure apparatus according to claim 30, wherein the member includes a measurement member for measuring the stage. The exposure apparatus according to claim 30 or 31, wherein the member includes a measurement member for measuring the exposure light. Exposing a substrate using the exposure apparatus according to any one of claims 1 to 32;
Developing the exposed substrate. An exposure method for exposing a substrate with exposure light through a liquid, comprising:
Supplying a liquid by a first liquid supply device between an optical member having an emission surface from which the exposure light is emitted, and a substrate facing the optical member;
Placing a member through an object and a gap that can be opposed to the emission surface, and moving the member and the substrate;
Exposing the substrate through the liquid between the moving substrate and the optical member;
Supplying a liquid to the gap by a second liquid supply device at least partially disposed on the stage;
Exposure method.   The second liquid supply device supplies liquid to the gap so as to reduce fluctuation in the amount of liquid in the gap including the liquid supplied between the optical member and the substrate and flowing into the gap. An exposure method according to claim 34. Exposing the substrate using the exposure method according to claim 34 or 35;
Developing the exposed substrate.

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