JP2020030434A - Stage apparatus, exposure apparatus and method for manufacturing device - Google Patents

Abstract

To provide an exposure apparatus capable of suppressing occurrence of an exposure failure.SOLUTION: The exposure apparatus irradiates an upper surface of a substrate with exposure light through a liquid. The apparatus includes: an optical member having an emission surface where the exposure light is emitted; and a substrate holding device including a first holding part for releasably holding a substrate, and a first member that has an upper surface and an edge portion as a part of an outer edge of the upper surface and opposing, along a circumference direction, to an end of a substrate to be held. Protrusions protruding toward a held substrate are arranged in a plurality of numbers along the circumference direction on the edge portion of the first member. The edge portion has a first region where a protrusion having a first shape is disposed and a second region where a protrusion having a second shape different from the first shape is disposed.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  2. Description of the Related Art In a manufacturing process of a micro device such as a semiconductor device and an electronic device, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid, as disclosed in, for example, the following patent document, is used. The exposure apparatus includes a substrate stage that can move while holding the substrate, and exposes the substrate held by the substrate stage.

US Patent Application Publication No. 2008/0043211 US Patent Application Publication No. 2008/0100081

  In the liquid immersion exposure apparatus, for example, if liquid remains on at least one of the upper surface of the substrate and the upper surface of the substrate stage, exposure failure may occur. As a result, a defective device may be generated.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress occurrence of exposure failure. It is another object of the present invention to provide a device manufacturing method, a program, and a recording medium that can suppress occurrence of a defective device.

  According to a first aspect of the present invention, there is provided an exposure apparatus for irradiating exposure light to an upper surface of a substrate via a liquid, wherein the optical member has an emission surface from which the exposure light is emitted, and the substrate is releasably held. And a first member having an upper surface and an edge portion which is a part of an outer edge of the upper surface and which faces an edge of the held substrate along a circumferential direction. A plurality of protruding portions protruding toward the held substrate are formed in the edge portion of the first member along the circumferential direction, and the edge portion has a protruding portion having a first shape. An exposure apparatus is provided that has a first region that has been set and a second region in which a projection having a second shape different from the first shape is arranged.

  According to a second aspect of the present invention, there is provided an exposure apparatus for irradiating exposure light to an upper surface of a substrate via a liquid, the optical member having an emission surface from which the exposure light is emitted, and the substrate being releasably held. A substrate holding device including a first holding portion, and a first member having an upper surface and an edge defining a part of an outer edge of the upper surface, the substrate holding device being adjacent to the first member with a gap below the optical member. A second member having a second upper surface movable in a state and capable of forming a liquid immersion space, wherein an edge of the first member is aligned with an end of the substrate held by the first holding portion. A first edge portion extending in a predetermined direction, and a second edge portion extending in a direction in which the gap between the second member and the second member extends. The second member defines a part of an outer edge of the second upper surface, and the second edge A third edge portion facing the first portion, a second edge portion of the first member, and a third edge portion of the second member. At least one is a di-section, the exposure apparatus is provided which protrusion protruding toward the other side is formed along the extending direction.

  According to a third aspect of the present invention, there is provided an exposure apparatus for irradiating exposure light to an upper surface of a substrate via a liquid, comprising: an optical member having an emission surface from which the exposure light is emitted; A substrate holding device, comprising: a first holding portion, and a first member having an upper surface and an edge portion which is a part of an outer edge of the upper surface and which is opposed to an edge of the held substrate along a circumferential direction. The first member has an opening in which the measurement member is arranged, and the opening has a plurality of protrusions projecting toward the arranged measurement member, which are formed side by side along the opening. An exposure apparatus having two regions is provided.

  According to a fourth aspect of the present invention, there is provided a device comprising: exposing a substrate using the exposure apparatus according to any one of the first to third aspects of the present invention; and developing the exposed substrate. A manufacturing method is provided.

  According to a fifth aspect of the present invention, there is provided an exposure method for irradiating exposure light to an upper surface of a substrate via a liquid, wherein the optical member has an emission surface from which the exposure light is emitted, and the substrate is releasably held. A first member having an upper surface of the substrate held by the first holding portion, and an edge portion which is a part of an outer edge of the upper surface and faces an end of the held substrate in a circumferential direction. Exposing the substrate in a state in which a liquid immersion space is formed with at least one of the upper surfaces of the first member, and protruding toward the held substrate at an edge portion of the first member. A plurality of projecting portions are formed along the circumferential direction, and the edge portion includes a first region in which the projecting portion having the first shape is arranged, and a projecting portion having a second shape different from the first shape. An exposure method having a second region is provided.

  According to a sixth aspect of the present invention, there is provided an exposure method for irradiating exposure light to an upper surface of a substrate via a liquid, the optical member having an emission surface from which the exposure light is emitted, and the substrate being releasably held. At least a part of the first upper surface contacts the liquid immersion space with the first member having the upper surface of the substrate held by the first holder and the edge portion defining an outer edge of the upper surface. And moving the second member below the optical member below the optical member and adjacent to the first member with a gap below the optical member. The first portion includes a first edge portion extending in a predetermined direction along an end portion of the substrate held by the first holding portion, a second edge portion extending in a direction in which a gap with the second member extends, and a second portion. The member defines a part of the outer edge of the second upper surface, and the member opposes the second edge portion. An exposure including an edge portion, wherein at least one of the second edge portion of the first member and the third edge portion of the second member has a protruding portion protruding toward the other side formed along the extending direction. A method is provided.

  According to a seventh aspect of the present invention, there is provided an exposure method for irradiating exposure light to an upper surface of a substrate via a liquid, wherein the optical member has an emission surface from which the exposure light is emitted, and the substrate is releasably held. A first member having an upper surface of the substrate held by the first holding portion, and an edge portion which is a part of an outer edge of the upper surface and faces an end of the held substrate in a circumferential direction. Exposing the substrate in a state where a liquid immersion space is formed between at least one of the upper surfaces of the first member and the second member. Provides an exposure method having a second region in which a plurality of protrusions protruding toward an arranged measurement member are formed side by side along the opening.

  According to the aspect of the present invention, occurrence of exposure failure can be suppressed. According to the aspect of the present invention, occurrence of a defective device can be suppressed.

FIG. 2 is a schematic configuration diagram illustrating an example of an exposure apparatus EX according to the first embodiment. FIG. 2 is a diagram illustrating an example of a liquid immersion member and a substrate stage according to the first embodiment. The figure which expanded a part of FIG. FIG. 4 is a plan view in which a substrate P and a cover member T are held on the substrate stage 2. FIG. 4 is an enlarged plan view of the periphery of a notch portion PN on a substrate P. FIG. 3 is a detailed view of a convex portion GZ. FIG. 9 is a schematic configuration diagram illustrating an example of an exposure apparatus EX according to a second embodiment. FIG. 3 is a plan view of a substrate stage in the exposure apparatus EX. The figure which shows the other form of a convex part. The figure which shows another form of a 1st convex part. The figure which shows an example of a substrate stage. 5 is a flowchart illustrating an example of a device manufacturing process.

  Hereinafter, embodiments of an exposure apparatus, an exposure method, and a device manufacturing method according to the present invention will be described with reference to FIGS. 1 to 11, but the present invention is not limited thereto. In the following description, an XYZ rectangular coordinate system is set, and the positional relationship between the components will be described with reference to the XYZ rectangular coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, and a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (ie, a vertical direction) is defined as a Z-axis direction. The rotation (tilt) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First embodiment>
A first embodiment will be described. FIG. 1 is a schematic configuration diagram illustrating an example of the exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL via a liquid LQ. In the present embodiment, the liquid immersion space LS is formed such that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space refers to a portion (space, area) filled with liquid. The substrate P is exposed with the exposure light EL via the liquid LQ in the liquid immersion space LS. In the present embodiment, water (pure water) is used as the liquid LQ.

  The exposure apparatus EX of the present embodiment includes an exposure apparatus including a substrate stage and a measurement stage as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application Publication No. 1713113. It is.

  In FIG. 1, an exposure apparatus EX measures a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and measures exposure light EL without holding the substrate P. Stage 3, which can move by mounting a measuring member C and a measuring instrument to be measured, a driving system 4 that moves the mask stage 1, a driving system 5 that moves the substrate stage 2, and a driving system 6 that moves the measuring stage 3. An illumination system IL for illuminating the mask M with the exposure light EL, a projection optical system PL for projecting an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least a part of an optical path of the exposure light EL Immersion member 7 capable of forming an immersion space LS so as to be filled with the liquid LQ, a control device 8 for controlling the entire operation of the exposure apparatus EX, and connected to the control device 8 to store various information related to exposure. And a storage device 8R that. The storage device 8R includes a memory such as a RAM, a hard disk, and a recording medium such as a CD-ROM. An operating system (OS) for controlling the computer system is installed in the storage device 8R, and a program for controlling the exposure apparatus EX is stored.

  The exposure apparatus EX includes an interferometer system 11 that measures the positions of the mask stage 1, the substrate stage 2, and the measurement stage 3, and a detection system 300. The detection system 300 includes an alignment system 302 that detects an alignment mark on the substrate P, and a surface position detection system 303 that detects the position of the upper surface (front surface) Pa of the substrate P. The detection system 300 may include an encoder system that detects the position of the substrate stage 2 as disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The mask M includes a reticle on which a device pattern to be projected on the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chrome. Note that a reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes a base material such as a semiconductor wafer and a photosensitive film formed on the base material. The photosensitive film is a film of a photosensitive material (photoresist). Further, the substrate P may include another film in addition to the photosensitive film. For example, the substrate P may include an anti-reflection film, or may include a protective film (top coat film) for protecting the photosensitive film.

  The exposure apparatus EX includes a chamber device 103 for adjusting the environment (at least one of temperature, humidity, pressure, and cleanliness) of the space 102 in which the exposure light EL travels. The chamber device 103 has a chamber member 104 that forms the space 102 and an air conditioning system 105 that adjusts the environment of the space 102.

  The space 102 includes a space 102A and a space 102B. The space 102A is a space where the substrate P is processed. The substrate stage 2 and the measurement stage 3 move in the space 102A.

  The air conditioning system 105 has an air supply unit 105S that supplies gas to the spaces 102A and 102B, and supplies gas to the spaces 102A and 102B from the air supply unit 105S to adjust the environment of the spaces 102A and 102B. In the present embodiment, at least the substrate stage 2, the measurement stage 3, and the terminal optical element 12 of the projection optical system PL are arranged in the space 102A.

  The illumination system IL irradiates a predetermined illumination region IR with exposure light EL. The illumination region IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as a bright line (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, or ArF Vacuum ultraviolet light (VUV light) such as excimer laser light (wavelength 193 nm) and F2 laser light (wavelength 157 nm) is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 9G of the base member 9 including the illumination region IR while holding the mask M. The drive system 4 includes a planar motor for moving the mask stage 1 on the guide surface 9G. The planar motor has a mover arranged on the mask stage 1 and a stator arranged on the base member 9 as disclosed in, for example, US Pat. No. 6,452,292. In the present embodiment, the mask stage 1 can be moved on the guide surface 9G in six directions of the X axis, the Y axis, the Z axis, the θX, θY, and the θZ directions by the operation of the drive system 4.

  The projection optical system PL irradiates a predetermined projection area PR with exposure light EL. The projection region PR includes a position where the exposure light EL emitted from the projection optical system PL can be irradiated. The projection optical system PL projects an image of the pattern of the mask M on at least a part of the substrate P arranged in the projection area PR at a predetermined projection magnification. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either a unity magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. Further, the projection optical system PL may be any one of a refractive system not including a reflective optical element, a reflective system not including a refractive optical element, and a catadioptric system including a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The substrate stage 2 can move on the guide surface 10G of the base member 10 including the projection region PR while holding the substrate P. The measurement stage 3 is movable to a position (projection region PR) where the exposure light EL emitted from the projection optical system PL can be irradiated. The measurement stage 3 can move on the guide surface 10G of the base member 10 including the projection region PR while holding the measurement member C. The substrate stage 2 and the measurement stage 3 are independently movable on the guide surface 10G.

  The drive system 5 for moving the substrate stage 2 includes a planar motor for moving the substrate stage 2 on the guide surface 10G. The planar motor has a mover arranged on the substrate stage 2 and a stator arranged on the base member 10 as disclosed in, for example, US Pat. No. 6,452,292. Similarly, the drive system 6 for moving the measuring stage 3 includes a planar motor, and has a mover arranged on the measuring stage 3 and a stator arranged on the base member 10.

  In the present embodiment, the substrate stage 2 defines a first holding portion (substrate holding portion) 31 that holds the lower surface Pb of the substrate P in a releasable manner and an opening Th in which the substrate P can be arranged. And an upper surface arranged around the upper surface Pa of the substrate P while being held by the holding portion 31.

  In this embodiment, the substrate stage 2 surrounds the first holding portion 31 as disclosed in, for example, US Patent Application Publication No. 2007/0177125, US Patent Application Publication No. 2008/0049209, and the like. And a second holding portion 32 that holds the lower surface Tb of the cover member T in a releasable manner. The cover member T is arranged around the substrate P held by the first holding unit 31. In the present embodiment, the cover member T has an opening Th in which the substrate P held by the first holding unit 31 is arranged. In the present embodiment, the cover member T has an upper surface 2U.

  In the present embodiment, the first holding unit 31 holds the substrate P such that the upper surface Pa of the substrate P is substantially parallel to the XY plane. The second holding unit 32 holds the cover member T such that the upper surface 2U of the cover member T is substantially parallel to the XY plane. In the present embodiment, the upper surface Pa of the substrate P held by the first holding portion 31 and the upper surface 2U of the cover member T held by the second holding portion 32 are arranged in substantially the same plane (substantially flush). Is).

  Note that the cover member T may be formed integrally with the substrate stage 2. For example, at least a part of the members of the substrate stage 2 may have the upper surface 2U. In the present embodiment, the opening Th in the cover member T is provided with a convex portion (also referred to as a “protruding portion”; the same applies hereinafter) that protrudes toward the side surface Pc of the substrate P. It will be described later.

  In the present embodiment, the measurement stage 3 includes a third holding unit 33 that holds the measurement member C in a releasable manner, and a fourth holding unit that is disposed around the third holding unit 33 and holds the cover member Q in a releasable manner. 34. The third and fourth holding units 33 and 34 have a pin chuck mechanism. The cover member Q is disposed around the measurement member C held by the third holding unit 33. The holding mechanism used in at least one of the third holding unit 33 and the fourth holding unit 34 is not limited to the pin chuck mechanism. Further, at least one of the measurement member C and the cover member Q may be formed integrally with the measurement stage 3.

  In the present embodiment, the third holding unit 33 holds the measurement member C such that the upper surface of the measurement member C is substantially parallel to the XY plane. The fourth holding unit 34 holds the cover member Q such that the upper surface of the cover member Q and the XY plane are substantially parallel. In the present embodiment, the upper surface of the measuring member C held by the third holding portion 33 and the upper surface of the cover member Q held by the fourth holding portion 34 are arranged in substantially the same plane (substantially flush). is there).

  Here, in the following description, the upper surface 2U of the cover member T held by the second holding unit 32 is appropriately referred to as the upper surface 2U of the substrate stage 2, and the upper surface of the measurement member C held by the third holding unit 33. The upper surface of the cover member Q held by the fourth holder 34 is also referred to as the upper surface 3U of the measurement stage 3 as appropriate.

  The interferometer system 11 includes a laser interferometer unit 11A that measures the position of the mask stage 1, and a laser interferometer unit 11B that measures the positions of the substrate stage 2 and the measurement stage 3. The laser interferometer unit 11A can measure the position of the mask stage 1 using the measurement mirror 1R arranged on the mask stage 1. The laser interferometer unit 11B can measure the positions of the substrate stage 2 and the measurement stage 3 using the measurement mirror 2R disposed on the substrate stage 2 and the measurement mirror 3R disposed on the measurement stage 3.

  The alignment system 302 detects an alignment mark on the substrate P and detects a position of a shot area (exposure area) S on the substrate P. The alignment system 302 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface (front surface) Pa of the substrate P held by the substrate stage 2 can be opposed to the lower surface of the alignment system 302 oriented in the −Z direction.

  The surface position detection system 303 is also called, for example, an autofocus / leveling system, and irradiates detection light onto the upper surface (front surface) Pa of the substrate P held on the substrate stage 2 to detect the position of the upper surface Pa of the substrate P. I do. The surface position detection system 303 has a lower surface to which the substrate stage 2 (substrate P) can face. The upper surface 2U of the substrate stage 2 and the upper surface Pa of the substrate P held by the substrate stage 2 can be opposed to the lower surface of the surface position detection system 303 facing in the −Z direction.

  When performing the exposure processing of the substrate P or performing a predetermined measurement processing, the control device 8 controls the driving systems 4, 5, 5 based on the measurement result of the interferometer system 11 and the detection result of the detection system 300. 6 is operated to execute position control of the mask stage 1 (mask M), the substrate stage 2 (substrate P), and the measurement stage 3 (measurement member C).

  The liquid immersion member 7 can form the liquid immersion space LS such that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The liquid immersion member 7 is arranged near the terminal optical element 12 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 7 is an annular member, and is disposed around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 7 is arranged around the terminal optical element 12.

  The terminal optical element 12 has an emission surface 13 that emits the exposure light EL toward the image plane of the projection optical system PL. In the present embodiment, a liquid immersion space LS is formed on the exit surface 13 side. The liquid immersion space LS is formed such that the optical path K of the exposure light EL emitted from the emission surface 13 is filled with the liquid LQ. The exposure light EL emitted from the emission surface 13 travels in the −Z direction. The exit surface 13 faces the traveling direction (-Z direction) of the exposure light EL. In the present embodiment, the emission surface 13 is a plane substantially parallel to the XY plane. Note that the emission surface 13 may be inclined with respect to the XY plane, or may include a curved surface.

  The liquid immersion member 7 has a lower surface 14 at least partially facing the −Z direction. In the present embodiment, the exit surface 13 and the lower surface 14 can hold the liquid LQ between the exit surface 13 and an object disposed at a position (projection region PR) where the exposure light EL emitted from the exit surface 13 can be irradiated. . The liquid immersion space LS is formed by the liquid LQ held between at least a part of the emission surface 13 and the lower surface 14 and an object arranged in the projection region PR. The liquid immersion space LS is formed such that the optical path K of the exposure light EL between the emission surface 13 and the object arranged in the projection area PR is filled with the liquid LQ. The liquid immersion member 7 can hold the liquid LQ between the terminal optical element 12 and the object so that the optical path K of the exposure light EL between the terminal optical element 12 and the object is filled with the liquid LQ.

  In the present embodiment, the objects that can be arranged in the projection region PR include objects that can move with respect to the projection region PR on the image plane side of the projection optical system PL (the exit surface 13 side of the terminal optical element 12). The object is movable with respect to the last optical element 12 and the liquid immersion member 7. The object has an upper surface (front surface) that can face at least one of the emission surface 13 and the lower surface 14. A liquid immersion space LS can be formed between the upper surface of the object and the emission surface 13. The object is movable in a plane (XY plane) perpendicular to the optical axis (Z axis) of the terminal optical element 12. In the present embodiment, the upper surface of the object can form a liquid immersion space LS between the emission surface 13 and at least a part of the lower surface 14. Since the liquid LQ is held between the emission surface 13 and the lower surface 14 on one side and the upper surface (front surface) of the object on the other side, the optical path K of the exposure light EL between the terminal optical element 12 and the object is reduced. The liquid immersion space LS is formed so as to be filled with the liquid LQ.

  In the present embodiment, the object includes at least one of the substrate stage 2, the substrate P held by the substrate stage 2, the measurement stage 3, and the measurement member C held by the measurement stage 3. For example, the upper surface 2U of the substrate stage 2 and the surface (upper surface) Pa of the substrate P held by the substrate stage 2 are the exit surface 13 of the terminal optical element 12 facing in the −Z direction and the liquid immersion facing in the −Z direction. The lower surface 14 of the member 7 can be opposed. Of course, the objects that can be arranged in the projection region PR are not limited to at least one of the substrate stage 2, the substrate P held on the substrate stage 2, the measurement stage 3, and the measurement member C held on the measurement stage 3. In addition, those objects can face at least a part of the detection system 300.

  In the present embodiment, when the substrate P is irradiated with the exposure light EL, the liquid immersion space LS is formed such that a part of the surface of the substrate P including the projection region PR is covered with the liquid LQ. During exposure of the substrate P, the liquid immersion member 7 can hold the liquid LQ between the terminal P and the substrate P such that the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. is there. At least a part of the interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 14 of the liquid immersion member 7 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs the local immersion method.

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 7 and the substrate stage 2 according to the present embodiment. FIG. 3 is an enlarged view of a part of FIG. In FIG. 2, the substrate P is disposed in the projection region PR (a position facing the terminal optical element 12 and the liquid immersion member 7). However, as described above, the substrate stage 2 (cover member T) and The measurement stage 3 (cover member Q, measurement member C) can also be arranged.

  As shown in FIG. 2, the liquid immersion member 7 has an opposing portion 71 at least partially facing the emission surface 13 of the terminal optical element 12, and a main body portion 72 at least partially disposed around the terminal optical element 12. And The facing portion 71 has a hole (opening) 7K at a position facing the emission surface 13. The facing portion 71 has an upper surface 7U at least partially facing the emission surface 13 via a gap, and a lower surface 7H to which the substrate P (object) can face. Hole 7K is formed to connect upper surface 7U and lower surface 7H. Upper surface 7U is arranged around the upper end of hole 7K, and lower surface 7H is arranged around the lower end of hole 7K. The exposure light EL emitted from the emission surface 13 can pass through the hole 7K and irradiate the substrate P.

  In the present embodiment, each of the upper surface 7U and the lower surface 7H is arranged around the optical path K. In the present embodiment, the lower surface 7H is a flat surface. The lower surface 7H can hold the liquid LQ with the substrate P (object). In the following description, the lower surface 7H is appropriately referred to as a holding surface 7H.

The liquid immersion member 7 has a supply port 15 that can supply the liquid LQ and a recovery port 16 that can recover the liquid LQ. The supply port 15 supplies the liquid LQ when exposing the substrate P, for example.
The recovery port 16 recovers the liquid LQ when, for example, the substrate P is exposed. The supply port 15 can supply the liquid LQ during one or both of exposure and non-exposure of the substrate P. The recovery port 16 can recover the liquid LQ during one or both of the exposure and the non-exposure of the substrate P.

  The supply port 15 is arranged near the optical path K of the exposure light EL emitted from the emission surface 13 so as to face the optical path K. The supply port 15 only needs to face one or both of the space between the emission surface 13 and the opening 7K and the side surface of the terminal optical element 12. In the present embodiment, the supply port 15 supplies the liquid LQ to a space between the upper surface 7U and the emission surface 13. The liquid LQ supplied from the supply port 15 flows through the space between the upper surface 7U and the emission surface 13, and is then supplied onto the substrate P (object) via the opening 7K.

  The supply port 15 is connected to a liquid supply device (first liquid supply device) 18 via a flow path 17. The liquid supply device 18 is capable of delivering a clean and temperature-adjusted liquid LQ. The flow path 17 includes a supply flow path 17R formed inside the liquid immersion member 7, and a flow path formed by a supply pipe connecting the supply flow path 17R and the liquid supply device 18. The liquid LQ sent from the liquid supply device 18 is supplied to the supply port 15 via the flow path 17. At least in the exposure of the substrate P, the supply port 15 supplies the liquid LQ.

  The recovery port 16 can recover at least a part of the liquid LQ on the object facing the lower surface 14 of the liquid immersion member 7. The recovery port 16 is arranged at least partially around the opening 7K through which the exposure light EL passes. In the present embodiment, the recovery port 16 is disposed at least partially around the holding surface 7H. The recovery port 16 is arranged at a predetermined position of the liquid immersion member 7 facing the surface of the object. At least in the exposure of the substrate P, the substrate P faces the recovery port 16. In the exposure of the substrate P, the recovery port 16 recovers the liquid LQ on the substrate P.

  In the present embodiment, the main body 72 has an opening 7P facing the substrate P (object). The opening 7P is arranged at least partially around the holding surface 7H. In the present embodiment, the liquid immersion member 7 has a porous member 19 arranged in the opening 7P. In the present embodiment, the porous member 19 is a plate-shaped member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member having a large number of small holes formed in a mesh shape, may be arranged in the opening 7P.

  In the present embodiment, the porous member 19 has a lower surface 19H to which the substrate P (object) can face, an upper surface 19U facing in a direction opposite to the lower surface 19H, and a plurality of holes connecting the upper surface 19U and the lower surface 19H. The lower surface 19H is arranged at least partially around the holding surface 7H. In the present embodiment, at least a part of the lower surface 14 of the liquid immersion member 7 includes the holding surface 7H and the lower surface 19H.

In the present embodiment, the recovery port 16 includes a hole of the porous member 19. In the present embodiment, the liquid LQ on the substrate P (object) is collected through the holes (collection ports 16) of the porous member 19.
Note that the porous member 19 need not be provided.

  The recovery port 16 is connected to a liquid recovery device 21 via a flow path 20. The liquid recovery device 21 can connect the recovery port 16 to a vacuum system, and can suck the liquid LQ through the recovery port 16. The flow path 20 includes a recovery flow path 20 </ b> R formed inside the liquid immersion member 7 and a flow path formed by a recovery pipe connecting the recovery flow path 20 </ b> R and the liquid recovery device 21. The liquid LQ recovered from the recovery port 16 is recovered by the liquid recovery device 21 via the flow path 20.

  In the present embodiment, the control device 8 executes the operation of recovering the liquid LQ from the recovery port 16 in parallel with the operation of supplying the liquid LQ from the supply port 15, so that the terminal optical element 12 on one side and The liquid immersion space LS can be formed with the liquid LQ between the liquid immersion member 7 and the object on the other side.

  In addition, as the liquid immersion member 7, for example, a liquid immersion member (nozzle member) as disclosed in US Patent Application Publication No. 2007/0132976 and European Patent Application Publication No. 1768170 can be used.

  As shown in FIGS. 2 and 3, in the present embodiment, the substrate stage 2 has a space 23 communicating with a gap Ga between the substrate (object) P and the cover member T (substrate stage 2). . The space 23 is located below the gap Ga. The gap Ga is formed between the side surface Pc of the substrate P held by the first holding unit 31 and the inner surface Tc of the cover member T held by the second holding unit 32, facing each other. The inner surface Tc is disposed parallel to the side surface Pc of the substrate P and has an upper end connected to the upper surface Ta, and the first inner surface Td is disposed below the first inner surface Td in a non-parallel manner with the first inner surface Td. And an inclined surface Ts inclined downward toward the outside with respect to the center.

  The porous member 80 is disposed in the space 23. In the present embodiment, the porous member 80 has an upper surface 80A to which at least one of the emission surface 13 and the lower surface 14 can face. The upper surface 80A is disposed below (−Z side) the substrate P and the cover member T. In the present embodiment, the porous member 80 is made of, for example, titanium. The porous member 80 can be formed by, for example, a sintering method. In the present embodiment, at least a portion of the liquid LQ flowing into the gap Ga is collected via the porous member 80.

  In the present embodiment, the porous member 80 is supported by the case 81. The case 81 is arranged in the space 23. In the present embodiment, the case 81 is made of, for example, ceramic. The case 81 may be made of metal. Note that the case 81 is not necessarily required, and may be omitted. In that case, the porous member 80 is accommodated in the space 23 without the interposition of the case 81.

  In the present embodiment, a support member 82 is arranged between the porous member 80 and the case 81 and the cover member T. The support member 82 is supported by at least a part of the porous member 80 and the case 81. The support member 82 can face at least a part of the lower surface Tb of the cover member T. The support member 82 supports at least a part of the lower surface Tb of the cover member T.

  In the present embodiment, the substrate stage 2 has a suction port 24 arranged in the space 23. In the present embodiment, the suction port 24 is formed on at least a part of the inner surface of the substrate stage 2 forming the space 23. The suction port 24 sucks at least a part of the fluid in the space 23 so that the space 23 has a negative pressure. The suction port 24 can suck one or both of the liquid and the gas in the space 23.

  The suction port 24 is connected to a fluid suction device 26 via a flow path 25. The fluid suction device 26 can connect the suction port 24 to a vacuum system, and can suck one or both of a liquid and a gas through the suction port 24. At least a part of the flow path 25 is formed inside the substrate stage 2. The fluid (at least one of a liquid and a gas) sucked from the suction port 24 is sucked into the fluid suction device 26 via the flow path 25.

  In the present embodiment, the case 81 has a hole (opening) 81H that connects the outer surface and the inner surface of the case 81. The opening 83 at the upper end of the hole 81H faces the lower surface of the porous member 80. The opening at the lower end of the hole 81H is connected to the suction port 24. The suction port 24 can suck the fluid in the space inside the case 81 through the hole 81H so that the space inside the case 81 has a negative pressure.

  In the present embodiment, the first holding unit 31 has, for example, a pin chuck mechanism. The first holding unit 31 is disposed on the support surface 31S of the substrate stage 2, and is disposed on the peripheral wall 35 to which the lower surface Pb of the substrate P can face, and on the support surface 31S inside the peripheral wall 35. And a suction port 37 disposed on the support surface 31S for sucking a fluid. The suction port 37 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surface of the peripheral wall portion 35 can face the lower surface Pb of the substrate P. The peripheral wall portion 35 can form a negative pressure space at least in part between the peripheral wall portion 35 and the lower surface Pb of the substrate P. In the support surface 31, the peripheral wall 35 is substantially circular, and in the above and below descriptions, the center of the first holding unit 31 is the center of the peripheral wall 35. In the present embodiment, the peripheral wall portion 35 is substantially circular (annular) in the XY plane. The control device 8 performs the suction operation of the suction port 37 in a state where the lower surface Pb of the substrate P and the upper surface of the peripheral wall portion 35 are in contact with each other, so that the peripheral wall portion 35, the lower surface Pb of the substrate P, the support surface 31S The space 31H formed by the above can be made negative pressure. Thereby, the substrate P is held by the first holding unit 31. The substrate P is released from the first holding unit 31 by releasing the suction operation of the suction port 37.

  In the present embodiment, the lower surface of the substrate P is held at the upper end of the support portion 36 (a plurality of pin members) by setting the space 31H to a negative pressure. That is, at least a part of the holding surface 36S that holds the substrate P is defined by the upper end of the support portion 36 (a plurality of pin members).

  In the present embodiment, the second holding unit 32 has, for example, a pin chuck mechanism. The second holding portion 32 is disposed so as to surround the peripheral wall portion 35 on the support surface 32S of the substrate stage 2, and the peripheral wall portion 38 to which the lower surface Tb of the cover member T can face, and the peripheral wall portion 38 on the support surface 32S. And a support portion 40 including a plurality of pin members, the support portion 40 including a plurality of pin members, and being disposed on a peripheral wall portion 39 to which the lower surface Tb of the cover member T can face, and a support surface 32S between the peripheral wall portion 38 and the peripheral wall portion 39. 32S, and a suction port 41 for sucking a fluid. The suction port 41 is connected to a fluid suction device. The fluid suction device is controlled by the control device 8. The upper surfaces of the peripheral wall portions 38 and 39 can face the lower surface Tb of the cover member T. The peripheral wall portions 38 and 39 can form a negative pressure space at least in part between the peripheral wall portions 38 and 39 and the lower surface Tb of the cover member T. The controller 8 performs the suction operation of the suction port 41 in a state where the lower surface Tb of the cover member T and the upper surfaces of the peripheral wall portions 38 and 39 are in contact with each other, so that the peripheral wall portion 38, the peripheral wall portion 39, and the cover member T The space 32H formed by the lower surface Tb and the support surface 32S can be set to a negative pressure. Thereby, the cover member T is held by the second holding portion 32. When the suction operation of the suction port 41 is released, the cover member T is released from the second holding unit 32.

  The space 23 includes a space around the peripheral wall 35. In the present embodiment, the space 23 includes a space between the peripheral wall 35 and the peripheral wall 38.

FIG. 4 is a plan view in which the substrate P and the cover member T are held on the substrate stage 2.
As shown in FIG. 4, an edge EG defining an opening Th in the direction around the Z axis in the cover member T protrudes toward a side surface Pc of the substrate P held by the first holding portion 31 (see FIG. 3). Convex portion (projecting portion) GZ is provided. In other words, as shown in FIG. 4, the opening Th in the cover member T has a shape (a so-called “saw”) in which a plurality of protrusions GZ are arranged at a predetermined pitch along the circumferential direction when viewed from the Z direction. State)). In other words, the opening Th in the cover member T has a shape in which a plurality of concave portions are arranged at a predetermined pitch along the circumferential direction when viewed from the tip (described later).

FIG. 5 is an enlarged plan view around the notch portion PN of the substrate P.
The convex portion GZ is formed at an edge on the −X side of the substrate P and is arranged in the region A1 facing the notch portion PN serving as an index regarding the position of the substrate P, and the other region A2 And a second convex portion GZ2 disposed on the second portion. As shown in FIG. 5, the region A1 (also referred to as a first region) does not have a shape in which a concave portion and a convex portion are repeated, while the region A2 (also referred to as a second region) has a plurality of convex portions. The portions are arranged in a circumferential direction at a predetermined pitch PZ (described later). In other words, the width W (described later) of the distal end portion Tf of the first convex portion GZ1 in the region A1 is larger than the width W of the distal end portion of the second convex portion GZ2 in the region A2. Note that the first convex portion GZ1 in the region A1 is not necessarily limited to this mode. For example, the first convex portion GZ1 may have a shape in which a plurality of convex portions are arranged at a finer pitch ZP (described later) than the second convex portion GZ2. Alternatively, the protrusion amount ZL (described later) may be smaller than the second protrusion GZ2. As described above, in the present embodiment, the edge portion EG that defines the opening Th in the cover member T has the region A1 and the region A2 along the circumferential direction, and a convex portion having a different shape in each region. Is formed.

FIG. 6 is a detailed view of the convex portion GZ.
The convex portion GZ has a size of an arc portion R formed on the base Te (a portion farthest from the placed substrate P in the convex portion GZ), a length h from the center of the arc portion R to the tip portion, This is represented by specifications (shape) including a projection amount ZL represented by the sum of the size of the arc portion R and the length h, a width W of the tip portion, and an arrangement pitch ZP. In addition, as for the first convex portion GZ1, a width W1 (see FIG. 5) of the front end portion is formed in a range including the opening width of the notch portion PN of the substrate P. In this case, it is shown in FIG. In the convex portion GZ, ZP ≦ W may be set, and the convex portion GZ may be set based on the specifications expressed by the following equation (1).
W1 = n × W− (n−1) × (W−ZP) (1)
n: Number of convex portions GZ (positive integer)

When the gap Ga between the substrate P and the cover member T is, for example, 200 μm, preferable specifications of the second convex portion GZ2 include a length h of 0.3 to 0.8 mm and an arc portion R of 0.05 to 0.8 mm. 0.15 mm, the pitch ZP is 0.3 to 1.0 mm, the width W is 0.1 to 0.5 mm, and the protrusion ZL is 0.35 to 0.95 mm. In this case, a preferable ratio between the length h and the pitch ZP is about 0.3 to 1.5. As described above, the first convex portion GZ1 and the second convex portion GZ2 have different specifications at least in the pitch ZP. The inner surfaces Tc of the first and second convex portions GZ1 and GZ2 have the first inner surface Td and the inclined surface Ts described above with reference to FIG.
As shown in FIG. 6, when the liquid repellent film HM is formed on the surface of the cover member T with a film thickness of, for example, 20 μm, the above-mentioned convex portions GZ1 and GZ2 are offset (added) by the film thickness. ).

Next, an example of the operation of the exposure apparatus EX will be described.
The controller 8 moves the substrate stage 2 to the exposure position, and after the liquid immersion space LS is formed with the liquid LQ between the terminal optical element 12 and the liquid immersion member 7 and the substrate stage 2 (substrate P), The exposure processing of the substrate P is started.

  The exposure apparatus EX of the present embodiment is a scanning type exposure apparatus (a so-called scanning stepper) that projects an image of a pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 8 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and moves the substrate P to the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL via the projection optical system PL and the liquid LQ in the liquid immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the substrate P is exposed to the exposure light EL via the liquid LQ, and an image of the pattern of the mask M is projected onto the substrate P via the projection optical system PL and the liquid LQ.

  As shown in FIG. 4, in the present embodiment, a plurality of shot areas S, which are exposure target areas, are arranged on a substrate P in a matrix. The control device 8 sequentially exposes a plurality of shot areas S defined on the substrate P.

  When exposing the shot area S of the substrate P, the terminal optical element 12 and the liquid immersion member 7 face the substrate P, and the optical path K of the exposure light EL between the terminal optical element 12 and the substrate P is filled with the liquid LQ. Thus, the liquid immersion space LS is formed. When sequentially exposing the plurality of shot areas S of the substrate P, the liquid LQ is used to fill the liquid immersion space LS between the terminal optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Is formed, the substrate stage 2 is moved in the XY plane by the drive system 5. The control device 8 controls the substrate in a state where the liquid immersion space LS is formed by the liquid LQ between the terminal optical element 12 and the liquid immersion member 7 and at least one of the upper surface Pa of the substrate P and the upper surface 2U of the substrate stage 2. Exposure of the substrate P is performed while moving the stage 2.

  For example, in order to expose the first shot area S among the plurality of shot areas S on the substrate P, the control device 8 moves the first shot area S to an exposure start position. The control device 8 moves the first shot area S (substrate P) in the Y-axis direction with respect to the projection area PR of the projection optical system PL in a state where the liquid immersion space LS is formed. The exposure light EL is applied to the shot area S.

  After the exposure of the first shot area S is completed, the control device 8 moves the substrate P in the X-axis direction (with the liquid immersion space LS formed) in order to expose the next second shot area S. Alternatively, the second shot area S is moved to the exposure start position in a direction inclined in the XY plane with respect to the X-axis direction. The control device 8 exposes the second shot area S, similarly to the first shot area S.

  The control device 8 irradiates the shot area S with the exposure light EL while moving the shot area S in the Y-axis direction with respect to the projection area PR (scan exposure operation), and the exposure of the shot area S is completed. After that, while repeating the operation (stepping operation) for moving the next shot area S to the exposure start position, the plurality of shot areas S on the substrate P are filled with the projection optical system PL and the liquid LQ in the liquid immersion space LS. Exposure is performed sequentially. The exposure light EL is sequentially applied to the plurality of shot areas S of the substrate P.

  In the present embodiment, the control device 8 moves the substrate stage 2 so that the projection area PR of the projection optical system PL and the substrate P relatively move along a movement locus indicated by an arrow R1 in FIG. While exposing the projection area PR to the exposure light EL, the plurality of shot areas S of the substrate P are sequentially exposed to the exposure light EL via the liquid LQ. In at least a part of the movement of the substrate stage 2 during the exposure of the substrate P, the liquid immersion space LS is formed on the gap Ga.

Here, for example, when the liquid immersion space LS moves from above the cover member T onto the substrate P, there is a possibility that a part of the liquid LQ in the liquid immersion space LS is cut off and remains on the substrate P as droplets. There is.
For example, when the liquid immersion space LS moves in the order of the cover member T, the gap Ga, and the substrate P, the cover member T and the substrate P suddenly have a geometric shape (liquid immersion) due to the presence of the gap Ga. This changes the shape of the contact surface of the space LS with the cover member T, the substrate P, and the like. Due to the change in the geometric shape, the liquid LQ in the immersion space LS may flow such that at least a part of the liquid LQ remains on the substrate P.

  In the region A2, when the liquid immersion space LS moves from above the cover member T to above the substrate P, the contact area between the liquid LQ and the cover member T gradually decreases in the second convex portion GZ2. Abrupt geometric changes are mitigated. Therefore, the liquid LQ is smoothly separated from the cover member T, and the liquid LQ is prevented from remaining on the upper surface of the substrate P. The specifications of the second convex portion GZ2 formed in the region A2 may be appropriately selected according to the characteristics of the substrate P placed in the opening Th. Specifically, in the case of the substrate P into which the liquid LQ easily enters between the substrate P and the cover member T, for example, the value of the pitch PZ may be set large. Further, in the case of the substrate P in which the liquid LQ does not easily enter between the substrate P and the cover member T, for example, the value of the pitch PZ may be set small. Alternatively, in the case of the substrate P into which the liquid LQ easily enters between the substrate P and the cover member T, for example, the value of the protrusion amount ZL may be set to be large. Further, in the case of the substrate P in which the liquid LQ does not easily enter between the substrate P and the cover member T, for example, the value of the protrusion amount ZL may be set to be small.

  On the other hand, in the region A1, when the liquid immersion space LS moves from above the cover member T to above the substrate P, due to the presence of the notch portion PN in which the width of the opening gradually decreases, the above-mentioned sharp geometric shape is formed. Although the change is alleviated, there is a concern that the gap amount increases and the leakage amount of the liquid LQ through the gap increases. Therefore, in the present embodiment, the notch is set by making the specifications of the first projection GZ1 different from the specifications of the second projection GZ2 so as to reduce the gap amount. Partial liquid leakage peculiarity in the part PN can be reduced.

  As described above, in the present embodiment, by arranging the first convex portion GZ1 and the second convex portion GZ2 having different specifications according to the position of the notch portion PN on the substrate P, the liquid LQ Partial liquid leakage peculiarity can be reduced while suppressing residual, and as a result, occurrence of exposure failure can be suppressed.

  In the above-described embodiment, the first convex portion GZ1 is provided at one position (6 o'clock position) on the −X side. However, the present invention is not limited to this. For example, a configuration may be provided at both the position on the −Y side (3 o'clock) shifted by 90 °. By adopting this configuration, the direction in which the substrate P is held by the first holding portion 31 can be handled in any case.

<Second embodiment>
Next, a second embodiment of the exposure apparatus EX will be described with reference to FIGS.
In these drawings, the same components as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and description thereof will be omitted. 7 and 8, the notch portion and the first convex portion on the substrate P are omitted for convenience.

  The exposure apparatus EX according to the present embodiment is provided with a scale member (measurement member) GT as a member with a gap Gm around the cover member T on the substrate stage 2. A third convex portion GZ3 having the same specifications as the above-described second convex portion GZ2 is provided at a position (outer edge portion, second edge portion) of the cover member T facing the scale member GT facing the gap Gm. It is formed along the extending direction of the gap Gm. Similarly to the cover member T described in the first embodiment, the first upper end is connected to the inner surface of the second edge portion of the cover member T facing the gap Gm and the inner surface of the third edge portion of the scale member GT. An inclined surface that is disposed below the inner surface and the first inner surface and that inclines downward as the distance from the gap Gm increases (see Ts in FIG. 3 as appropriate).

  In the exposure apparatus EX having the above configuration, when an encoder system that measures the position of the substrate stage 2 using the scale member GT is used, the liquid LQ moves between the cover member T and the scale member GT via the gap Gm. In this case, it is possible to suppress the liquid LQ from remaining using the above-mentioned convex portion GZ. Note that such an encoder system is disclosed in, for example, US Patent Application Publication No. 2007/0288121.

  The third convex portion GZ3 does not necessarily have to have the same specifications as the second convex portion GZ2, and may have different specifications. That is, the porous member 80 (see FIG. 3) is provided below the gap Ga between the substrate P and the cover member T, and the liquid LQ leaked through the gap Ga can be sucked and collected. Since the outer dimensional accuracy of the substrate P is lower than the outer dimensional accuracy of the scale member GT and the cover member T, the specifications of the second convex portion GZ2 of the cover member T are changed to those of the third convex portion GZ3. It is also possible to make the gap amount in the gap Ga larger than the gap amount in the gap Gm, for example, about 1 mm. More specifically, the protrusion amount ZL of the third protrusion GZ3 may be smaller than the protrusion amount ZL of the second protrusion GZ2. Alternatively, the pitch may be a value smaller than the pitch ZLP of the third convex portion GZ3 and the pitch ZP of the second convex portion GZ2. This suppresses the liquid LQ from remaining on the upper surface of the substrate P, and also suppresses the liquid LG from remaining on the scale member GT. As a result, the occurrence of exposure failure can be suppressed.

In the exposure operation of the present embodiment, the substrate stage 2 and the measurement stage 3 are moved together in a state where they are in contact with each other (hereinafter, appropriately referred to as a “scrum sweep operation”). An operation of moving the liquid immersion space LS between the substrate stage 2 and the measurement stage 3 while maintaining the liquid immersion space LS may be performed. The details of the scrum sweep operation are disclosed in, for example, U.S. Patent Application Publication No. 2010/0296068. In the present embodiment, a buffer member BF serving as a buffer when the substrate stage 2 and the measurement stage 3 perform the scrum sweep operation is provided on the substrate stage 2. A fourth convex portion GZ4 having the same specifications as the second convex portion GZ2 is provided at a position in the buffer member BF facing the measurement stage 3 and the scale member GT. With this configuration, when the liquid LQ moves from the measurement stage 3 to the substrate stage 2, it is possible to suppress the liquid LQ from remaining on the substrate stage 2. Note that the buffer member BF may be provided on the measurement stage 3 side instead of the substrate stage 2 side. Alternatively, buffer members BF may be provided on both sides of the substrate stage 2 and the measurement stage 3. Further, the fourth convex portion GZ4 provided on the buffer member BF does not necessarily need to have the same specifications as the second convex portion GZ2, and may have different specifications from the second convex portion GZ2. Specifically, for example, the protrusion amount ZL of the fourth protrusion GZ4 may be smaller than the protrusion amount ZL of the second protrusion GZ2.
Alternatively, the pitch PZ of the fourth protrusion GZ4 may be smaller than the pitch PZ of the second protrusion GZ2. Further, the fourth convex portion GZ4 does not necessarily need to be provided on both sides in the Y direction of the buffer member BF, and may be provided on at least one side.

  In the present embodiment, of the cover member T forming the gap Gm and the scale member GT, the configuration in which the third convex portion GZ3 is provided on the cover member T has been exemplified. However, the present invention is not limited thereto. A configuration in which it is provided, or a configuration in which both the cover member T and the scale member GT are provided. In the case where the convex portions are provided on both the cover member T and the scale member GT, for example, the same convex portion is formed such that one convex portion projects into a concave portion between the other convex portions so that the gap between the convex portions is constant. The phase may be shifted by a half pitch at the pitch.

In addition, as shown in FIG. 7, on the measurement stage 3, the same convex portion as described above may be provided on the cover member Q around the measurement member (measuring device) C for measuring the exposure light EL.
Thereby, when the liquid LQ moves through the gap Gn formed between the measurement member C and the cover member Q, it is also possible to suppress the liquid LQ from remaining on the measurement member C or the like. As the measurement member C, for example, an illuminance unevenness sensor disclosed in U.S. Pat. No. 4,465,368, an aerial image measurement device disclosed in U.S. Patent Application Publication No. 2002/0041377, and a U.S. Pat. An illuminance monitor disclosed in Japanese Patent Application Publication No. 2002/0061469 and a wavefront aberration measuring instrument disclosed in European Patent No. 1,079,223 are exemplified. The measurement member C also includes an alignment reference mark, an imaging device I provided on the measurement stage 3 for imaging the liquid immersion member 7 and the like from below, and the like. A configuration in which the above-described protrusion is provided on the cover member Q around these measurement members C may be adopted.
Further, the above-described convex portion may be provided on the cover member T around the measuring member C mounted on the substrate stage 2. As the measurement member C mounted on the substrate stage 2, for example, a sensor (AIS sensor) S that measures a spatial image of a measurement mark via the projection optical system PL is given. With the configuration in which the above-described convex portion is provided on the cover member T around the sensor S, the same operation and effect can be obtained.
The convex portion formed on the cover member T around the sensor S may have, for example, the same specifications as the third convex portion GZ3, or different specifications from the second convex portion GZ2 and the third convex portion GZ3. May be used. For example, the protrusion amount ZL of the protrusion formed on the cover member T around the sensor S may be smaller than the protrusion amount ZL of the second protrusion GZ2. Alternatively, the pitch PZ of the convex portion formed on the cover member T around the sensor S may be smaller than the pitch PZ of the second convex portion GZ2.
As described above, in the present embodiment, in the cover member T, the shape (the pitch PZ, the protrusion amount ZL, and the like) of the convex portion (the first convex portion GZ1 and the second convex portion GZ2) in the portion facing the substrate P is different. , And other protrusions (such as protrusions formed at a portion facing the third protrusion GZ3 and the sensor S).
In addition, each convex part (first convex part GZ1 to third convex part GZ3, convex part around the sensor S) formed on the cover member T described above, a convex part formed on the cover member Q, and a buffer It is not necessary that all the protrusions formed on the member BF be formed, and at least one of these may be formed.
Further, the convex portion GZ described in the present embodiment can be applied to other members in the exposure apparatus. Specifically, it is preferable that the liquid LQ remains such that the liquid LQ is in contact with the liquid LQ, such as the lower surface 14 of the liquid immersion member 7 (for example, the periphery of the lower surface 14) or the read head of the encoder system described above. It can be applied to parts that do not exist.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but it is needless to say that the present invention is not limited to the examples. The shapes, combinations, and the like of the respective constituent members shown in the above-described examples are merely examples, and can be variously changed based on design requirements and the like without departing from the gist of the present invention.

  For example, the shape of the convex portion shown in the above embodiment is an example, and in addition, as shown in FIG. 9A, an edge portion parallel to the distal end portion Tf is provided without providing an arc portion on the base portion Te. The configuration, as shown in FIG. 9 (b), is such that the side surfaces of each convex portion intersect at the base Te, and further, as shown in FIG. 9 (c), the side surfaces of each convex portion are also at the tip Tf. A configuration that intersects with a sharp end, a configuration in which an arc portion is provided on both the base Te and the tip Tf as shown in FIG.

  Further, in the first embodiment, as shown in FIG. 5, in the region A1, the first convex portion GZ1 not having the shape in which the above-described unevenness is repeated is exemplified, but the present invention is not limited to this. For example, depending on the external dimensions of the substrate P, the gap Ga with the cover member T may be large. In such a case, in order to cause the liquid LQ to be sucked by the porous member 80, as shown in FIG. 10, a shape in which the above-described unevenness is repeated may be used, similarly to the second convex portion GZ2. The specifications of the first convex portion GZ1 in this configuration are finer pitches ZP and smaller protrusion amounts ZL than those of the second convex portions GZ2 (see FIG. 6). Further, in the first embodiment described above, the configuration in which the specifications of the convex portion are changed according to the position of the notch portion PN on the substrate P has been described. It is also possible to adopt a configuration in which the specifications of the convex portion are different at positions corresponding to the direction. In this case, it is preferable that the residual state of the liquid LQ is confirmed in advance in the scanning movement direction and the non-scanning direction, and the specifications of the projection are set for each direction according to the confirmed residual state.

  In each of the above-described embodiments, the optical path K on the emission side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the liquid LQ. As disclosed in the pamphlet of 2004/019128, an optical path on the incident side (object plane side) of the terminal optical element 12 may be a projection optical system filled with the liquid LQ.

  In the above embodiments, water is used as the exposure liquid LQ, but a liquid other than water may be used. As the liquid LQ, a film such as a photosensitive material (photoresist) that is transparent to the exposure light EL, has a high refractive index to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P Those which are stable to are preferred. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. Also, various fluids, for example, a supercritical fluid, can be used as the liquid LQ.

  The substrate P in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin-film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) and the like are applied.

  The exposure apparatus EX includes a step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by synchronously moving the mask M and the substrate P. Can be applied to a projection exposure apparatus (stepper) of the step-and-repeat type in which the pattern of the mask M is exposed collectively while the substrate is stationary, and the substrate P is sequentially moved stepwise.

  Further, in the step-and-repeat type exposure, a reduced image of the first pattern is transferred onto the substrate P using a projection optical system while the first pattern and the substrate P are almost stationary, and then the second pattern is exposed. When the substrate and the substrate P are almost stationary, the reduced image of the second pattern may be partially overlapped with the first pattern using the projection optical system, and may be collectively exposed on the substrate P (a batch exposure apparatus of a stitch method). ). Further, the present invention can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot exposure on the substrate is performed by one scanning exposure. The present invention can also be applied to an exposure apparatus that double-exposes substantially simultaneously. The present invention can also be applied to a proximity type exposure apparatus, a mirror projection aligner, and the like.

  In addition, the present invention relates to a twin-stage type exposure including a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796. Applicable to devices. For example, as shown in FIG. 11, the exposure apparatus EX may include two substrate stages 2001 and 2002. In that case, the object that can be arranged so as to face the emission surface 13 is one of the substrate stages, the substrate held on the one substrate stage, the other substrate stage, and the substrate held on the other substrate stage. Including at least one. In FIG. 11, the above-described measuring member (such as the sensor S) is omitted, but it goes without saying that the above-described convex portion may be provided in a portion of the cover member that faces the measuring member.

  Further, the present invention can be applied to an exposure apparatus including a plurality of substrate stages and a measurement stage.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto the substrate P, but may be an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin-film magnetic head, an imaging element (CCD). ), A micromachine, a MEMS, a DNA chip, or an exposure apparatus for manufacturing a reticle or a mask.

  In the above embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or a phase pattern or a dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaping mask (also referred to as an electronic mask, an active mask, or an image generator) for forming a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable shaping mask including the non-luminous image display element.

  In each of the above embodiments, the exposure apparatus including the projection optical system PL has been described as an example, but the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, a liquid immersion space is formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light via the optical member.

  An exposure apparatus (lithography system) for exposing a line and space pattern on a substrate P by forming interference fringes on the substrate P as disclosed in, for example, WO 2001/035168 pamphlet The present invention can also be applied to

  The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electric systems to ensure these various accuracy Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from various subsystems includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an assembling process for each subsystem before the assembling process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable that the manufacture of the exposure apparatus be performed in a clean room in which the temperature, cleanliness, and the like are controlled.

  As shown in FIG. 12, for a micro device such as a semiconductor device, a step 201 for designing the function and performance of the micro device, a step 202 for manufacturing a mask (reticle) based on the design step, a substrate which is a base material of the device, as shown in FIG. Manufacturing the substrate 203, exposing the substrate with exposure light from the pattern of the mask, and developing the exposed substrate according to the above-described embodiment; and substrate processing step 204 including developing the exposed substrate. The device is manufactured through a device assembling step (including a processing process such as a dicing step, a bonding step, and a package step) 205, an inspection step 206, and the like.

  Note that the requirements of each of the above embodiments can be combined as appropriate. In some cases, some components may not be used. In addition, as far as permitted by laws and regulations, the disclosures of all the publications and U.S. patents relating to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated herein by reference.

2: substrate stage (stage), 8: control device, 12: terminal optical element (optical member)
Reference numeral 13: Exit surface 31: First holding part 32: Second holding part 80: Porous member A
Reference numeral 1 denotes a first area, A2 denotes a second area, EL denotes exposure light, EX denotes an exposure apparatus, Ga, Gm,
Gn: gap, GT: scale member (member, measuring member), GZ: convex portion,
GZ1: first projection (projection), GZ2: second projection (projection), LQ: liquid, L
S: liquid immersion space, P: substrate (object), S: shot area (exposure area), T: cover member (first member, defining member)

Claims (22)

An exposure apparatus that irradiates exposure light to an upper surface of a substrate via a liquid,
An optical member having an emission surface from which the exposure light is emitted,
A first holding portion that holds the substrate in a releasable manner, and a first member having an upper surface and an edge portion that is a part of an outer edge of the upper surface and faces an edge of the held substrate in a circumferential direction. And a substrate holding device comprising:
In the edge portion of the first member, a plurality of protruding portions protruding toward the held substrate are formed side by side along the circumferential direction,
An exposure apparatus, wherein the edge portion includes a first region in which a protrusion having a first shape is arranged, and a second region in which a protrusion having a second shape different from the first shape is arranged.   2. The exposure apparatus according to claim 1, wherein the first area is arranged at a position corresponding to a position information section provided at a predetermined position on the held substrate.   The exposure apparatus according to claim 2, wherein a plurality of the first regions are arranged at different positions in the predetermined direction.   4. The exposure apparatus according to claim 1, wherein the first area and the second area are arranged at positions corresponding to a scanning movement direction at the time of exposure. 5.   The gap between the first member and the substrate in the first region is smaller than the gap between the first member and the substrate in the second region. The exposure apparatus according to claim 1.   6. The exposure apparatus according to claim 5, wherein a pitch of the protrusions in the first region is smaller than a width of a tip of the protrusion in the first region.   7. The projection according to claim 1, wherein the projection in the first region and the projection in the second region have a lower surface that is inclined downward from a tip thereof in a direction away from the first holding portion. The exposure apparatus according to claim 1.   The exposure apparatus according to claim 1, wherein the edge of the first member is arranged around the first holding unit. The first member has an opening in which the substrate can be arranged,
The exposure apparatus according to claim 8, wherein the opening is defined by the edge. A second member having a second upper surface movable below the optical member and adjacent to the first member via a gap, and having a second upper surface capable of forming a liquid immersion space; The edge portion includes a first edge portion extending in a predetermined direction along an edge of the substrate held by the first holding portion, and a second edge portion extending in a direction in which a gap between the substrate and the second member extends. And prepare,
The second member defines a part of an outer edge of the second upper surface, and includes a third edge portion facing the second edge portion,
At least one of the second edge portion of the first member and the third edge portion of the second member is formed with a projecting portion projecting toward the other side along the extending direction. Item 10. The exposure apparatus according to any one of Items 1 to 9. An exposure apparatus that irradiates exposure light to an upper surface of a substrate via a liquid,
An optical member having an emission surface from which the exposure light is emitted,
A substrate holding device including: a first holding unit that holds the substrate in a releasable manner; and a first member having an upper surface and an edge portion that defines a part of an outer edge of the upper surface,
A second member having a second upper surface that is movable below the optical member and adjacent to the first member via a gap, and that can form a liquid immersion space;
The edge portion of the first member extends in a predetermined direction so that an end of the substrate held by the first holding portion extends along a direction in which a gap between the first edge portion and the second member extends. An extended second edge portion,
The second member defines a part of an outer edge of the second upper surface, and includes a third edge portion facing the second edge portion,
Exposure in which at least one of the second edge of the first member and the third edge of the second member is formed with a protrusion protruding toward the other side along the extending direction. apparatus.   A gap amount between the first member and the second member in the protruding portion formed on at least one of the second edge portion and the third edge portion is a distance between the first member and the substrate. The exposure apparatus according to claim 10, wherein the gap amount is smaller than the gap amount.   13. The exposure apparatus according to claim 11, wherein the protruding portion has a lower surface that is inclined downward in a direction away from the distal end portion with respect to the first holding portion. 14. The protrusion is formed at the second edge portion,
14. The exposure apparatus according to claim 10, wherein the protruding portion of the second edge portion has a lower surface that is inclined downward from a tip portion toward the first holding portion. 15. A measurement device for measuring the characteristic of the exposure light further includes a holding device disposed in an opening formed on an upper surface thereof,
The exposure apparatus according to any one of claims 1 to 14, wherein a plurality of protrusions protruding toward the arranged measurement member are formed in the opening along the opening. An opening in which a measurement member is arranged is formed in the first member, and a plurality of protrusions projecting toward the arranged measurement member are formed in the opening along the opening. Item 16. The exposure apparatus according to any one of Items 1 to 15. An exposure apparatus that irradiates exposure light to an upper surface of a substrate via a liquid, an optical member having an emission surface from which the exposure light is emitted,
A first holding portion that holds the substrate in a releasable manner, and a first member having an upper surface and an edge portion that is a part of an outer edge of the upper surface and faces an edge of the held substrate along a circumferential direction. And a substrate holding device comprising:
An opening in which the measurement member is arranged is formed in the first member,
An exposure apparatus having a second region in which a plurality of protruding portions protruding toward the measurement member arranged are formed in the opening along the opening.   The exposure apparatus according to claim 16, wherein the measurement member measures a spatial image of the exposure light. Exposure of a substrate using the exposure apparatus according to any one of claims 1 to 18,
Developing the exposed substrate. An exposure method of irradiating exposure light to an upper surface of a substrate via a liquid,
An optical member having an emission surface from which the exposure light is emitted, an upper surface of the substrate held by a first holding portion that releasably holds the substrate, and an upper surface and a part of an outer edge of the upper surface, In a state where the liquid is immersed in the liquid between at least one of the upper surface of the first member having an end portion of the held substrate and an edge portion facing in the circumferential direction, the substrate is removed. Exposing, including
In the edge portion of the first member, a plurality of protruding portions protruding toward the held substrate are formed side by side along the circumferential direction,
The exposure method, wherein the edge portion includes a first region in which a protrusion having a first shape is arranged, and a second region in which a protrusion having a second shape different from the first shape is arranged. An exposure method of irradiating exposure light to an upper surface of a substrate via a liquid,
An optical member having an emission surface from which the exposure light is emitted, an upper surface of the substrate held by a first holding portion for releasably holding the substrate, and an edge defining an upper surface and a part of an outer edge of the upper surface Moving the first member having a portion below the optical member so that at least a portion of the first upper surface contacts the liquid immersion space;
Moving the second member below the optical member in a state adjacent to the first member with a gap below the optical member,
The edge portion of the first member extends in a predetermined direction so that an end of the substrate held by the first holding portion extends along a direction in which a gap between the first edge portion and the second member extends. An extended second edge portion,
The second member defines a part of an outer edge of the second upper surface, and includes a third edge portion facing the second edge portion,
Exposure in which at least one of the second edge of the first member and the third edge of the second member is formed with a protrusion protruding toward the other side along the extending direction. Method. An exposure method of irradiating exposure light to an upper surface of a substrate via a liquid,
An optical member having an emission surface from which the exposure light is emitted, an upper surface of the substrate held by a first holding portion that releasably holds the substrate, and an upper surface and a part of an outer edge of the upper surface, In a state where the liquid is immersed in the liquid between at least one of the upper surface of the first member having an end portion of the held substrate and an edge portion facing in the circumferential direction, the substrate is removed. Exposing, including
An opening in which the measurement member is arranged is formed in the first member,
An exposure method, comprising: a second region in which a plurality of protrusions protruding toward the arranged measurement member are formed in the opening along the opening.

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