JP2010003963A - Substrate holding device, exposure apparatus, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holding device which suppresses the ingress of a liquid into an undesired portion. <P>SOLUTION: The substrate holding device holds a substrate exposed to exposure light via a liquid. The substrate holding device is provided with: a table member having a substrate holding portion that releasably holds the substrate; a prescribed member which holds the table member or is supported by the table member; a channel which is formed on at least either of the table member and the prescribed member and is used for discharging a gas from a virtually closed first space formed between the table member and the prescribed member to suck and hold the table member and the prescribed member; and a seal member which is disposed along at least part of a contact portion surrounding the first space between the table member and the prescribed member and suppresses the circulation of a liquid between the table member and the prescribed member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate holding apparatus, an exposure apparatus, and a device manufacturing method.

As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known. The exposure apparatus includes a substrate holding device having a substrate holding unit that holds a substrate, and exposes the substrate held by the substrate holding unit.
US Patent Application Publication No. 2006/0139614 US Patent Application Publication No. 2007/0177125 US Pat. No. 7,199,858

  In the immersion exposure apparatus, for example, there is a possibility that the liquid may enter the inside of the substrate holding device through a gap around the substrate held by the substrate holding unit. For example, if the liquid enters or remains in a portion where the liquid is not desired, the substrate holding device may be thermally deformed or the substrate may be thermally deformed by heat of vaporization of the liquid. When such a problem occurs, there is a possibility that an exposure defect such as a defect occurs in a pattern formed on the substrate. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide a substrate holding device that can suppress the intrusion of liquid into an undesired portion. Another object of the present invention is to provide an exposure apparatus that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, there is provided a substrate holding device for holding a substrate exposed with exposure light through a liquid, a table member having a substrate holding portion for holding the substrate in a releasable manner, and the table member And a gas exhaust in a substantially closed first space formed between the table member and the predetermined member to adsorb the table member and the predetermined member. The flow path is provided in at least one of the table member and the predetermined member, and is disposed along at least a part of the contact portion between the table member and the predetermined member around the first space. There is provided a substrate holding device including a sealing member that suppresses the flow of liquid between the members.

  According to a second aspect of the present invention, there is provided an exposure apparatus that includes the substrate holding device of the first aspect and that exposes the substrate held by the substrate holding device through a liquid.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the second aspect and developing the exposed substrate.

According to the present invention, it is possible to suppress the penetration of liquid into an undesired part. Also according to the invention,
The occurrence of defective exposure can be suppressed, and the occurrence of defective devices can be suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX exposes a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and a mask M held by the mask stage 1 as exposure light. An illumination system IL that illuminates with EL, a projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and at least part of the optical path of the exposure light EL is filled with the liquid LQ. Are provided with a liquid immersion member 3 for forming a liquid immersion space LS, and a control device 4 for controlling the operation of the entire exposure apparatus EX.

The illumination system IL illuminates a predetermined illumination area IR with exposure light EL having a uniform illuminance distribution. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 is movable on the guide surface 6 of the base member 5 while holding the mask M. The guide surface 6 is substantially parallel to the XY plane. The mask stage 1 is movable in three directions, for example, an X axis, a Y axis, and a θZ direction by the operation of a drive system 7 including a linear motor, for example.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection region PR includes the irradiation position of the exposure light EL emitted from the projection optical system PL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  The substrate stage 2 is movable on the guide surface 9 of the base member 8 while holding the substrate P. The guide surface 9 is substantially parallel to the XY plane. In the present embodiment, the substrate stage 2 is movable in six directions including the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions by the operation of the drive system 10 including, for example, a linear motor.

  In the present embodiment, the position information of the mask stage 1 and the substrate stage 2 is measured by an interferometer system (not shown) including a laser interferometer. When executing the exposure processing of the substrate P or when executing the predetermined measurement processing, the control device 4 operates the drive systems 7 and 10 based on the measurement result of the interferometer system, and the mask stage 1 (mask M ) And the position control of the substrate stage 2 (substrate P).

  FIG. 2 is a side sectional view showing an example of the liquid immersion member 3 and the substrate stage 2 according to the present embodiment, and FIG. 3 is an enlarged view of a part of FIG.

  As shown in FIGS. 2 and 3, the liquid immersion member 3 can form the liquid immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. The liquid immersion member 3 is disposed in the vicinity of the terminal optical element 11 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. In the present embodiment, the liquid immersion member 3 is an annular member and is disposed around the optical path of the exposure light EL.

  In the present embodiment, the liquid immersion member 3 is a liquid immersion member as disclosed in, for example, U.S. Patent Application Publication No. 2007/0132976 or European Patent Application Publication No. 1768170. Supply port 12 and a recovery port 13 for recovering liquid LQ. A porous member 14 is disposed in the recovery port 13. The last optical element 11 has an exit surface 15 that emits the exposure light EL toward the image plane of the projection optical system PL. The liquid immersion member 3 forms the liquid immersion space LS so that the optical path of the exposure light EL emitted from the emission surface 15 is filled with the liquid LQ. In the liquid immersion member 3, the optical path of the exposure light EL between the terminal optical element 11 and the object arranged at the irradiation position (projection region PR) of the exposure light EL emitted from the emission surface 15 is filled with the liquid LQ. Thus, the immersion space LS is formed. The liquid immersion member 3 has a lower surface 16 that can face the object, and can hold the liquid LQ between the lower surface 16 and the object. In the present embodiment, the lower surface 16 includes the lower surface of the porous member 14. In the present embodiment, the object that can be placed at the irradiation position of the exposure light EL includes an object that can move to the irradiation position. In the present embodiment, the object includes at least one of the substrate stage 2 and the substrate P held on the substrate stage 2.

  At least during exposure of the substrate P, the one end optical element 11 and the liquid immersion member 3 and the other side substrate so that the optical path of the exposure light EL emitted from the exit surface 15 of the end optical element 11 is filled with the liquid LQ. The liquid LQ is held between P and the liquid immersion space LS. In the present embodiment, when the exposure light EL is irradiated on the substrate P, the immersion space LS so that a partial region of the surface of the substrate P including the projection region PR of the projection optical system PL is covered with the liquid LQ. Is formed. At least a part of the interface (meniscus, edge) of the liquid LQ is formed between the lower surface 16 of the liquid immersion member 3 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method. The control device 4 executes the recovery operation of the liquid LQ using the recovery port 13 in parallel with the supply operation of the liquid LQ using the supply port 12, so that the terminal optical element 11 and the liquid immersion member 3 on one side and the other An immersion space LS can be formed with the liquid LQ between the substrate P (object) on the side.

  The substrate stage 2 includes a table member 18 having a first holding part 17 that holds the substrate P in a releasable manner, and a support member 19 that supports the table member 18. The table member 18 faces the substrate P on the upper surface 21 side (+ Z side). The table member 18 faces the support member 19 on the lower surface 20 side (−Z side). In the present embodiment, the substrate stage 2 includes a plate member T disposed around the substrate P as disclosed in, for example, US Patent Publication No. 2007/0177125. The plate member T is supported by the table member 18. The table member 18 faces the plate member T on the upper surface 21 side (+ Z side). The table member 18 includes a second holding portion 22 that holds the plate member T in a releasable manner. The second holding unit 22 is disposed around the first holding unit 17.

  In the present embodiment, the drive system 10 moves the support member 19. As the support member 19 moves, the table member 18 supported by the support member 19 and the plate member T and the substrate P held by the table member 18 move together with the support member 19.

  The plate member T has an opening TH in which the substrate P can be disposed. The plate member T held by the second holding unit 22 is disposed around the substrate P held by the first holding unit 17. The first holding unit 17 holds the substrate P inside the opening TH.

  The table member 18 includes a first holding part 17 and a second holding part 22 on the upper surface 21 side (+ Z side). The first holding unit 17 faces the back surface of the substrate P. The first holding unit 17 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The second holding part 22 faces the back surface of the plate member T. The second holding unit 22 holds the plate member T so that the surface of the plate member T and the XY plane are substantially parallel. In the present embodiment, the surface of the substrate P held by the first holding unit 17 and the surface of the plate member T held by the second holding unit 22 are arranged in substantially the same plane (substantially) Is the same). The surface of the substrate P held by the first holding unit 17 and the surface of the plate member T held by the second holding unit 22 may not be flush with each other.

  In the present embodiment, the outer shape of the substrate P in the XY plane is substantially circular. The outer shape of the opening TH in the XY plane is substantially circular. In the present embodiment, the outer surface (outer edge) of the substrate P held by the first holding unit 17 and the inner surface (inner edge) of the opening TH of the plate member T held by the second holding unit 22 are predetermined. It arrange | positions so that it may oppose through the gap G.

  Each of the first holding part 17 and the second holding part 22 has a so-called pin chuck mechanism. The first holding portion 17 is disposed on the upper surface 21 of the table member 18, and includes a plurality of convex portions 23 that support the back surface of the substrate P, and a first peripheral wall 24 that is disposed around the plurality of convex portions 23 on the upper surface 21. And a suction port 25 provided on the inner upper surface 21 of the first peripheral wall 24 and capable of sucking a gas. The upper surface of the first peripheral wall 24 and the back surface of the substrate P can contact each other. The suction port 25 is connected to a suction device 27 including a vacuum system via a flow path 26 provided inside the table member 18 and the support member 19.

  The second holding portion 22 includes a second peripheral wall 28 disposed around the first peripheral wall 24 on the upper surface 21 of the table member 18, a third peripheral wall 29 disposed around the second peripheral wall 28 on the upper surface 21, Provided on the upper surface 21 between the second peripheral wall 28 and the third peripheral wall 29 and disposed on the upper surface 21 between the second peripheral wall 28 and the third peripheral wall 29 and supporting the back surface of the plate member T. And a suction port 31 capable of sucking gas. The upper surfaces of the second and third peripheral walls 28 and 29 and the back surface of the plate member T can contact each other. The suction port 31 is connected to a suction device 33 including a vacuum system via a flow path 32 provided inside the table member 18.

  In order to adsorb the substrate P and the first holding part 17 of the table member 18, the control device 4 operates the suction device 27, so that the back surface of the substrate P, the first peripheral wall 24 of the table member 18, and the upper surface 21. The gas in the substantially closed space 34 formed therebetween is exhausted using the suction port 25 and the flow path 26. The gas in the space 34 is exhausted (sucked) through the suction port 25 and the flow path 26, and the space 34 has a negative pressure, so that the upper surface of the first peripheral wall 24 and the back surface of the substrate P are in contact with each other. The back surface of P contacts the convex portion 23. In addition, the substrate P can be removed from the first holding unit 17 by stopping the exhaust operation (suction operation) using the suction port 25 and the flow path 26.

  In addition, the control device 4 operates the suction device 33 to adsorb the plate member T and the second holding portion 22 of the table member 18, and the rear surface of the plate member T and the second peripheral wall 28 of the table member 18. The gas in the substantially closed space 35 formed between the third peripheral wall 29 and the upper surface 21 is exhausted using the suction port 31 and the flow path 32. The gas in the space 35 is exhausted (sucked) through the suction port 31 and the flow path 32, and the space 35 becomes negative pressure, whereby the upper surfaces of the second and third peripheral walls 28 and 29 and the back surface of the plate member T , And the back surface of the plate member T contacts the convex portion 30. In addition, the plate member T can be removed from the second holding portion 22 by stopping the exhaust operation (suction operation) using the suction port 31 and the flow path 32.

  The support member 19 has an upper surface 36 that can face the table member 18. The table member 18 is disposed on the lower surface 20 of the table member 18, and a convex portion 37 that can come into contact with the upper surface 36 of the support member 19, a fourth peripheral wall 38 disposed around the convex portion 37 on the lower surface 20, and the lower surface 20. 5 includes a fifth peripheral wall 39 disposed around the fourth peripheral wall 38 and a sixth peripheral wall 40 disposed around the fifth peripheral wall 39 on the lower surface 20. The lower surfaces of the fourth, fifth, and sixth peripheral walls 38, 39, and 40 and the upper surface 36 of the support member 19 can contact each other.

  The support member 19 includes a third holding portion 41 that holds the table member 18 in a releasable manner. The support member 19 has a third holding portion 41 on the upper surface 36 side (+ Z side). The third holding part 41 faces the lower surface 20 of the table member 18.

  The third holding portion 41 is disposed on the upper surface 36 of the support member 19 at a position that can face the lower surface 20 between the convex portion 37 and the fourth peripheral wall 38, and a suction port 42 that can suck gas, and the upper surface 36. , A suction port 43 that is disposed at a position that can face the lower surface 20 between the fifth peripheral wall 39 and the sixth peripheral wall 40 and that can suck gas. The suction port 42 is connected to a suction device 45 including a vacuum system via a flow path 44 provided inside the support member 19. The suction port 43 is connected to a suction device 47 including a vacuum system via a flow path 46 provided inside the support member 19.

  In order to adsorb the table member 18 and the third holding portion 41 of the support member 19, the control device 4 operates the suction device 45 to support the lower surface 20, the convex portion 37, the fourth peripheral wall 38 of the table member 18. The gas in the substantially closed space 48 formed between the upper surface 36 of the member 19 is exhausted using the suction port 42 and the flow path 44, and the suction device 47 is operated to operate the lower surface of the table member 18. The gas in the substantially closed space 49 formed between the 20, the fifth peripheral wall 39, the sixth peripheral wall 40, and the upper surface 36 of the support member 19 is exhausted using the suction port 43 and the flow path 46. The gases in the spaces 48 and 49 are exhausted (sucked) through the suction ports 42 and 43 and the flow paths 44 and 46, and the spaces 48 and 49 become negative pressure, whereby the fourth, fifth, and sixth peripheral walls 38. , 39, 40 and the upper surface 36 of the support member 19 are in contact with each other, and the table member 18 is sucked and held on the upper surface 36 of the support member 19. In addition, the table member 18 can be removed from the third holding portion 41 by stopping the exhaust operation (suction operation) using the suction ports 42 and 43 and the flow paths 44 and 46. In addition, in order to adsorb the table member 18 and the support member 19, the space formed between the table member 18 and the support member 19 is not limited to two, and there may be at least one space.

  In the present embodiment, a space 50 through which the liquid LQ can flow is formed below the gap G. The space 50 includes at least a part of the space formed around the first holding unit 17. The space 50 is a table that connects the space 50A between the first peripheral wall 24 and the second peripheral wall 25, the space 50B between the fourth peripheral wall 38 and the fifth peripheral wall 39, and the space 50A and the space 50B. And a passage 50 </ b> C formed in the member 18. The space 50 </ b> A is disposed around the first holding unit 17.

  The space 50 is connected to the substrate P on which the immersion space LS is formed and the space on the surface side (+ Z side) of the plate member T via the gap G. In other words, the space 50 is fluidly connected to the gap G formed around the substrate P held by the first holding unit 17.

  Further, in the present embodiment, the support member 19 is disposed at a position facing the space 50 on the upper surface 36 of the support member 19 in order to discharge the liquid LQ in the space 50, and has a suction port 52 capable of sucking fluid. Have. The suction port 52 can be connected to a liquid recovery apparatus 54 including a vacuum system via a flow path 53 provided inside the support member 19.

  The liquid recovery device 54 can discharge the liquid LQ that has entered the space 50 through the gap G from the space 50. When discharging the liquid LQ existing in the space 50, the control device 4 operates the liquid recovery device 54. By the operation of the liquid recovery device 54, the liquid LQ in the space 50 is sucked (recovered) by the liquid recovery device 54 via the suction port 52 and the flow path 53. Thus, the space 50 constitutes at least a part of the liquid LQ discharge channel. In the present embodiment, the operation of discharging the liquid LQ in the space 50 using the liquid recovery apparatus 54 is executed when the substrate P is not exposed. For example, when the liquid LQ exists in the space 50, the control device 4 recovers the liquid after the exposure of the first substrate P is completed and before the exposure of the next second substrate P is started. The device 54 is activated. The discharging operation may be executed continuously or intermittently when the substrate P is exposed.

  In the present embodiment, the substrate stage 2 includes seal members 61, 62, and 63. The seal member 61 is arranged to suppress the flow of the liquid LQ between the table member 18 and the plate member T. The seal member 61 is disposed along a contact portion between the upper surface of the second peripheral wall 28 and the back surface of the plate member T. That is, the seal member 61 is disposed at a part of the periphery of the space 35 (inner periphery). A contact portion between the upper surface of the second peripheral wall 28 and the back surface of the plate member T is located between the space 50 and the space 35 and is adjacent to the space 50. The seal member 61 is disposed in the space 35 so as to be adjacent to the second peripheral wall 28 in order to prevent the liquid LQ from entering the space 35 from the space 50.

  The seal member 62 is disposed to suppress the flow of the liquid LQ between the table member 18 and the support member 19. The seal member 62 is disposed along the contact portion between the lower surface of the fourth peripheral wall 38 and the upper surface 36 of the support member 19. That is, the seal member 62 is disposed in a part of the periphery of the space 48 (outer periphery). A contact portion between the lower surface of the fourth peripheral wall 38 and the upper surface 36 of the support member 19 is located between the space 50 and the space 48 and is adjacent to the space 50. The seal member 62 is disposed in the space 48 so as to be adjacent to the fourth peripheral wall 38 in order to prevent the liquid LQ from entering the space 48 from the space 50.

  The seal member 63 is disposed to suppress the flow of the liquid LQ between the table member 18 and the support member 19. The seal member 63 is disposed along a contact portion between the lower surface of the fifth peripheral wall 39 and the upper surface 36 of the support member 19. That is, the seal member 63 is disposed in a part of the space 49 (inner periphery). A contact portion between the lower surface of the fifth peripheral wall 39 and the upper surface 36 of the support member 19 is located between the space 50 and the space 49 and is adjacent to the space 50. The seal member 63 is disposed in the space 49 so as to be adjacent to the fifth peripheral wall 39 in order to prevent the liquid LQ in the space 50 from entering the space 49.

  Each of the sealing members 61, 62, 63 is annular. In the present embodiment, each of the seal members 61, 62, 63 is a lip packing. The lip packing includes at least one of U packing, V packing, and L packing. In the present embodiment, the seal members 61, 62, 63 are made of a resin containing, for example, silicon or fluorine.

  The seal member 61 is disposed in the space 35 along the second peripheral wall 28. The seal member 61 is disposed so that at least a part thereof is in contact with the second peripheral wall 28 and the plate member T. The seal member 62 is disposed in the space 48 along the fourth peripheral wall 38. The seal member 62 is disposed so that at least a part thereof is in contact with the fourth peripheral wall 38 and the support member 19. The seal member 63 is disposed in the space 49 along the fifth peripheral wall 39. The seal member 63 is disposed so that at least a part thereof is in contact with the fifth peripheral wall 39 and the support member 19.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described. The substrate stage 2 that holds the substrate P before exposure by the first holding unit 17 is disposed at a position facing the terminal optical element 11 and the liquid immersion member 3. The control device 4 forms an immersion space LS between the terminal optical element 11 and the immersion member 3 and the substrate P, and starts an exposure operation for the substrate P. The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 4 controls the mask stage 1 and the substrate stage 2 to move the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and to move the substrate P in the Y-axis direction. In synchronization, the exposure light is exposed to the substrate P through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction with respect to the illumination region IR of the illumination system IL. Irradiate EL. Thereby, the substrate P is exposed with the exposure light EL, and an image of the pattern of the mask M is projected onto the substrate P.

  As shown in FIG. 3, a liquid immersion space LS is formed above the gap G, and the liquid LQ may enter the space 50 through the gap G. As described above, when the liquid LQ enters the space 50, the control device 4 can discharge the liquid LQ in the space 50 using the liquid recovery device 54.

  In the present embodiment, since the seal members 61, 62, and 63 are provided, even when the liquid LQ exists in the space 50, the liquid LQ in the space 50 enters the spaces 35, 48, and 49. Can be suppressed.

  For example, when the liquid LQ enters the space 35 and it is difficult to remove the liquid LQ, the substrate stage 2 may be thermally deformed or the substrate P may be thermally deformed by the heat of vaporization of the liquid LQ. There is sex. Further, when the liquid LQ is sucked from the suction port 31 for making the space 35 have a negative pressure, the operation of the suction device 33 may be affected.

  Similarly, when the liquid LQ enters the spaces 48 and 49, the substrate stage 2 is thermally deformed, the substrate P is thermally deformed, or the operation of the suction devices 45 and 47 is affected by the heat of vaporization of the liquid LQ. There is a possibility.

  According to the present embodiment, since the seal members 61, 62, and 63 are provided, it is possible to prevent the liquid LQ from entering the spaces 35, 48, and 49. Therefore, it is possible to prevent the occurrence of the above problems.

  As described above, according to the present embodiment, it is possible to suppress the liquid LQ from entering the spaces 35, 48, and 49 where the presence of the liquid LQ is not desired. Therefore, the occurrence of exposure failure can be suppressed, and the occurrence of defective devices can be suppressed.

  In addition, according to the present embodiment, the sealing members 61, 62, and 63 can suppress the penetration (reverse flow) of the liquid LQ from the spaces 35, 48, and 49 into the space 50.

  In the above-described embodiment, a seal member can be provided at a position adjacent to the first peripheral wall 24 in order to prevent the liquid LQ in the space 50 from entering the space 34.

  In the above-described embodiment, for example, in order to prevent the liquid LQ in the space 50 from entering the space 35, instead of the seal member 61 or in addition to the seal member 61, along the second peripheral wall 28, A seal member may be disposed in the space 50. Similarly, in order to prevent the liquid LQ in the space 50 from entering the space 48, a seal member is disposed in the space 50 along the fourth peripheral wall 38 instead of the seal member 62 or in addition to the seal member 62. May be. Similarly, in order to prevent the liquid LQ in the space 50 from entering the space 49, a seal member is disposed in the space 50 along the fifth peripheral wall 39 in place of or in addition to the seal member 63. can do.

  Moreover, you may provide only in part, without providing continuously along a surrounding wall (28, 38, 39).

  Moreover, you may arrange | position a sealing member in some of them, without arrange | positioning a sealing member to each of the some surrounding wall (28, 38, 39) adjacent to the space 50. FIG.

  In the above-described embodiment, the convex portion 37, the fourth peripheral wall 38, the fifth peripheral wall 39, and the sixth peripheral wall 40 are formed on the table member 18 in order to form the space 48, the space 49, and the space 50. However, at least a part of these may be formed on the support member 19. That is, it is only necessary that a convex portion and / or a peripheral wall be formed on at least one of the table member 18 and the support member 19 so that the space 48, the space 49, and the space 50 are formed.

  Note that at least one of the seal members 61, 62, 63 may be squeeze packing. The squeeze packing includes at least one of an O-ring, an X-ring, and a D-ring.

  In addition, although the liquid LQ of the above-mentioned embodiment is pure water, it may be liquid other than pure water. The liquid LQ is a film such as a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P. Stable ones are preferable.

  The substrate P of the present embodiment is not limited to a semiconductor wafer for manufacturing a semiconductor device, but a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask (reticle) used in an exposure apparatus (synthesis). Quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  Further, as the exposure apparatus EX, a twin stage type having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, etc. It can also be applied to other exposure apparatuses.

  Furthermore, as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, etc., a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or various photoelectric devices. The present invention can also be applied to an exposure apparatus that includes a measurement stage equipped with a sensor. An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

  In the above-described embodiment, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL.

  The exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. The In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 4, a microdevice such as a semiconductor device includes a step 201 for performing a function / performance design of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from a mask and developing the exposed substrate according to the above-described embodiment, device assembly It is manufactured through steps (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, the disclosures of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a sectional side view which shows an example of the liquid immersion member and substrate stage which concern on this embodiment. It is the figure which expanded a part of FIG. It is a flowchart which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 3 ... Liquid immersion member, 4 ... Control apparatus, 17 ... 1st holding | maintenance part, 18 ... Table member, 19 ... Support member, 25 ... Suction port, 26 ... Channel, 31 ... Suction port, 32 ... Flow path, 34 ... space, 35 ... space, 42 ... suction port, 43 ... suction port, 44 ... flow path, 46 ... flow path, 48 ... space, 49 ... space, 50 ... space, 61 ... seal member, 62 ... Seal member, 63 ... Seal member, G ... Gap, LQ ... Liquid, EL ... Exposure light, EX ... Exposure apparatus, P ... Substrate, T ... Plate member

Claims (14)

A substrate holding device for holding a substrate exposed with exposure light through a liquid,
A table member having a substrate holding portion for releasably holding the substrate;
A predetermined member that supports the table member or is supported by the table member;
The table member and the predetermined member are used for gas exhaustion in a substantially closed first space formed between the table member and the predetermined member to adsorb the table member and the predetermined member. A flow path provided in at least one of
A seal member that is disposed along at least a part of the contact portion between the table member and the predetermined member around the first space, and that suppresses the flow of liquid between the table member and the predetermined member; A substrate holding apparatus comprising:   The substrate holding apparatus according to claim 1, wherein the contact portion is located between a second space in which a liquid can flow and the first space.   The substrate holding apparatus according to claim 2, wherein the contact portion is adjacent to the second space.   The substrate holding apparatus according to claim 2, wherein the seal member is disposed in the first space.   The substrate holding apparatus according to claim 2, wherein the seal member is disposed between the contact portion and the second space.   The substrate holding apparatus according to claim 2, wherein the second space includes at least a part of a space formed around the substrate holding unit.   The substrate holding apparatus according to claim 2, wherein the second space includes a space fluidly connected to a gap formed around the substrate held by the substrate holding unit.   The substrate holding apparatus according to claim 2, wherein the second space includes a liquid discharge channel.   The substrate holding device according to claim 1, wherein the seal member includes a lip packing.   The substrate holding device according to claim 1, wherein the table member has the substrate holding portion on a first side and faces the predetermined member on a second side opposite to the first side.   The substrate holding device according to claim 1, wherein the table member has the substrate holding portion on a first side and faces the predetermined member on the first side.   The substrate holding apparatus according to claim 1, wherein the predetermined member includes a plate member disposed around the substrate. A substrate holding device according to any one of claims 1 to 12, comprising:
An exposure apparatus that exposes a substrate held by the substrate holding device through a liquid. Exposing the substrate using the exposure apparatus according to claim 13;
Developing the exposed substrate; and a device manufacturing method.

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