JP2010157724A - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus capable of suppressing exposure defects. <P>SOLUTION: The exposure apparatus includes: an optical system that includes an emission surface from which exposure light is emitted; a first surface 41 that is disposed in at least a part of a surrounding of an optical path of the exposure light emitted from the emission surface; a supply port which is disposed in at least a part of a surrounding of the first surface opposite a space that the first surface faces and supplies a liquid to the space to fill the optical path with the liquid; and a recovery portion 60 that recovers at least a part of the liquid supplied from the supply port and flowing via a first aperture into a space portion 80 that a side surface of the optical system extending upward from a peripheral edge of the projection surface and/or in a radiation direction for the optical axis of the optical system faces. Here, the surface of the substrate disposed below the emission surface faces the emission surface and the first surface in at least a part of the exposure of the substrate, and the substrate is exposed with the exposure light from the emission surface via the liquid between the emission surface and the surface of the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus, an exposure method, and a device manufacturing method.

  In a manufacturing process of a micro device such as a semiconductor device or an electronic device, an immersion exposure apparatus that exposes a substrate with exposure light through a liquid, for example, as disclosed in the following patent document is known.

US Patent Application Publication No. 2006/0221315 US Patent Application Publication No. 2007/0081140 US Patent Application Publication No. 2008/0174748

  In the immersion exposure apparatus, a member in contact with the liquid may be contaminated. For example, if a foreign substance adheres to the member, exposure failure may occur, such as a defect formed in a pattern formed on the substrate due to the foreign substance. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide an exposure apparatus and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, in an exposure apparatus that exposes a substrate, an optical system having an exit surface that emits exposure light, and at least part of the periphery of the optical path of the exposure light that exits from the exit surface And a supply port that is disposed in at least part of the periphery of the first surface so as to face the space that the first surface faces, and that supplies liquid to the space to fill the optical path with liquid At least part of the liquid that has been supplied from the mouth and that has flowed through the first opening into the gap facing the side surface of the optical system that extends upward from the periphery of the emission surface and / or extends in the radial direction with respect to the optical axis of the optical system. A recovery unit for recovering, and in at least a part of the exposure of the substrate, the surface of the substrate disposed below the emission surface is opposed to the emission surface and the first surface, and between the emission surface and the surface of the substrate. Exposure of the substrate with exposure light from the exit surface through the liquid Apparatus is provided.

  According to a second aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to the third aspect of the present invention, the substrate is opposed to the first surface disposed in at least part of the periphery of the optical path of the optical system and the optical path of the exposure light emitted from the optical system. As described above, the liquid is supplied to the space from the supply port arranged in at least a part of the periphery of the first surface so as to face the space between the first surface and the substrate, The optical path between the exit surface and the substrate is filled with liquid, and the surface of the optical system that is supplied from the supply port and extends upward from the periphery of the exit surface and / or in the radial direction with respect to the optical axis of the optical system faces. An exposure method is provided that includes recovering at least a part of the liquid that has flowed into the gap, and exposing the substrate with exposure light from the exit surface through the liquid between the exit surface and the substrate. .

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method of the third aspect and developing the exposed substrate.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of this invention, generation | occurrence | production of a defective device can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is the figure which expanded a part of exposure apparatus which concerns on 1st Embodiment. It is the figure which looked at the liquid immersion member concerning a 1st embodiment from the upper part. It is a figure which shows the vicinity of the liquid immersion member which concerns on 1st Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX optically positions a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and the positions of the mask stage 1 and the substrate stage 2. Interferometer system 3 for measuring, illumination system IL for illuminating mask M with exposure light EL, projection optical system PL for projecting a pattern image of mask M illuminated with exposure light EL onto substrate P, and exposure light EL A liquid immersion member 4 capable of forming an immersion space LS so that at least a part of the optical path of the liquid crystal is filled with the liquid LQ, a chamber device 5 that houses at least the projection optical system PL, and a body that supports at least the projection optical system PL. 6 and a control device 7 for controlling the overall operation of the exposure apparatus EX.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a multilayer film formed on the base material. The multilayer film is a film in which a plurality of films including at least a photosensitive film are stacked. The photosensitive film is a film formed of a photosensitive material. Further, the multilayer film may include, for example, an antireflection film and a protective film (topcoat film) that protects the photosensitive film.

  The chamber device 5 includes a chamber member 5A that forms a substantially closed internal space 8, and an environment control device 5B that controls the environment (temperature, humidity, cleanliness, pressure, etc.) of the internal space 8. The body 6 is disposed in the internal space 8. The body 6 includes a first column 9 provided on the support surface FL and a second column 10 provided on the first column 9. The first column 9 includes a first support member 11 and a first surface plate 13 supported by the first support member 11 via a vibration isolator 12. The second column 10 includes a second support member 14 provided on the first surface plate 13 and a second surface plate 16 supported by the second support member 14 via a vibration isolator 15. In the present embodiment, the third surface plate 18 is disposed on the support surface FL via the vibration isolator 17.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 has a mask holding part 19 that holds the mask M so as to be releasable, and is movable on the guide surface 16G of the second surface plate 16 while holding the mask M. The mask stage 1 can move while holding the mask M with respect to the illumination region IR by the operation of the drive system 20. The drive system 20 includes a planar motor having a mover 20 </ b> A disposed on the mask stage 1 and a stator 20 </ b> B disposed on the second surface plate 16. A flat motor capable of moving the mask stage 1 is disclosed in, for example, US Pat. No. 6,452,292. The mask stage 1 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 20.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  A plurality of optical elements of the projection optical system PL are held by a holding member (lens barrel) 21. The holding member 21 has a flange 21F. The projection optical system PL is supported by the first surface plate 13 via the flange 21F. A vibration isolator can be provided between the first surface plate 13 and the holding member 21.

  The projection optical system PL has an exit surface 23 that emits the exposure light EL toward the image plane of the projection optical system PL. The exit surface 23 is disposed on the terminal optical element 22 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. The projection region PR includes a position where the exposure light EL emitted from the emission surface 23 can be irradiated. In the present embodiment, the emission surface 23 faces the −Z direction and is parallel to the XY plane. The exit surface 23 facing the −Z direction may be a convex surface or a concave surface.

  In the present embodiment, the optical axis (optical axis in the vicinity of the image plane of the projection optical system PL) AX of the terminal optical element 22 is substantially parallel to the Z axis. Note that the optical axis defined by the optical element adjacent to the terminal optical element 22 may be regarded as the optical axis of the terminal optical element 22. In the present embodiment, the image plane of the projection optical system PL is substantially parallel to the XY plane including the X axis and the Y axis. In the present embodiment, the image plane is substantially horizontal. However, the image plane may not be parallel to the XY plane or may be a curved surface.

  The substrate stage 2 has a substrate holding portion 24 that holds the substrate P so as to be releasable, and is movable on the guide surface 18G of the third surface plate 18. The substrate stage 2 can move while holding the substrate P with respect to the projection region PR by the operation of the drive system 25. The drive system 25 includes a planar motor having a mover 25 </ b> A disposed on the substrate stage 2 and a stator 25 </ b> B disposed on the third surface plate 18. A flat motor capable of moving the substrate stage 2 is disclosed in, for example, US Pat. No. 6,452,292. The substrate stage 2 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 25.

  The substrate stage 2 has an upper surface 26 that is disposed around the substrate holding unit 24 and can face the emission surface 23. In the present embodiment, the substrate stage 2 is disposed at least at a part of the periphery of the substrate holding portion 24 as disclosed in US Patent Application Publication No. 2007/0177125 and the like, and the lower surface of the plate member T is disposed on the lower surface of the plate member T. It has the plate member holding | maintenance part 27 hold | maintained so that release is possible. In the present embodiment, the upper surface 26 of the substrate stage 2 includes the upper surface of the plate member T. The upper surface 26 is flat.

  In the present embodiment, the substrate holding unit 24 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The plate member holding portion 27 holds the plate member T so that the upper surface 26 of the plate member T and the XY plane are substantially parallel.

  The interferometer system 3 optically measures the position of the first interferometer unit 3A capable of optically measuring the position of the mask stage 1 (mask M) in the XY plane and the position of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of measuring. When executing the exposure process of the substrate P or when executing the predetermined measurement process, the control device 7 operates the drive systems 20 and 25 based on the measurement result of the interferometer system 3 to thereby perform the mask stage 1 (mask M) and position control of the substrate stage 2 (substrate P) are executed.

  The liquid immersion member 4 is disposed on at least a part of the periphery of the optical path of the exposure light EL so that the optical path of the exposure light EL emitted from the emission surface 23 is filled with the liquid LQ. The liquid immersion member 4 forms the liquid immersion space LS so that the optical path of the exposure light EL between the emission surface 23 and an object disposed at a position facing the emission surface 23 is filled with the liquid LQ. The immersion space LS is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object includes at least one of the substrate stage 2 (plate member T) and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the liquid immersion member 4 forms the liquid immersion space LS so that the optical path of the exposure light EL between the last optical element 22 and the substrate P is filled with the liquid LQ.

  The liquid immersion member 4 is disposed in the vicinity of the last optical element 22. In the present embodiment, the liquid immersion member 4 is supported by the support mechanism 28. In the present embodiment, the support mechanism 28 is supported by the first surface plate 13. In the present embodiment, the liquid immersion member 4 is suspended from the first surface plate 13 via the support mechanism 28.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 7 controls the mask stage 1 and the substrate stage 2 to perform predetermined scanning in the XY plane that intersects the optical axis AX (optical path of the exposure light EL) with the mask M and the substrate P. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 7 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  2 is a side sectional view showing the vicinity of the liquid immersion member 4, FIG. 3 is a view of the liquid immersion member 4 seen from above, and FIG. 4 is an enlarged view of a part of FIG.

  As shown in FIGS. 2, 3, and 4, in the present embodiment, the liquid immersion member 4 is an annular member. At least a part of the liquid immersion member 4 is disposed around a part of the optical path of the exposure light EL and the terminal optical element 22. As shown in FIG. 3, in the present embodiment, the outer shape of the liquid immersion member 4 in the XY plane is a circle. The outer shape of the liquid immersion member 4 may be another shape (for example, a rectangle).

  The liquid immersion member 4 faces the first surface 41 disposed at least at a part of the periphery of the optical path of the exposure light EL emitted from the emission surface 23 and the first space 51 where the first surface 41 faces. A supply port 75 for supplying the liquid LQ to the first space 51 in order to fill the optical path of the exposure light EL emitted from the emission surface 23 with the liquid LQ. 75 flows into the gap 80 facing the side surface 35 of the projection optical system PL extending from the periphery of the exit surface 23 and extending in the radial direction with respect to the optical axis AX of the projection optical system PL via the first opening 39. And a recovery unit 60 that recovers at least a part of the liquid LQ.

  In the present embodiment, the liquid immersion member 4 includes the second surface 42 that is disposed at least partially around the first surface 41 and disposed below (−Z side) the first surface 41. I have. The first surface 41 and the second surface 42 can face the surface (upper surface) of an object disposed below the liquid immersion member 4. In the present embodiment, the outer shapes of the first surface 41 and the second surface 42 in the XY plane are circular. Further, the inner edge of the second surface 42 in the XY plane is also circular.

  In the present embodiment, the first surface 41 and the second surface 42 cannot collect the liquid LQ. That is, in the present embodiment, the first surface 41 and the second surface 42 are not provided with a liquid recovery port. That is, in the present embodiment, no liquid recovery port is provided on the lower surface of the liquid immersion member 4 that faces the surface of the substrate P during exposure, other than the first opening 39 through which the exposure light EL passes. In the present embodiment, the first surface 41 and the second surface 42 are flat. The first space 51 between the first surface 41 and the surface (upper surface) of the object can hold the liquid LQ. In the present embodiment, the first surface 41 and the second surface 42 are each parallel to the XY plane (horizontal plane), but at least a part of the first surface 41 and / or the second surface 42 is the XY plane. The first surface 41 and the second surface 42 may not be parallel to each other. In the present embodiment, at least one of the first surface 41 and the second surface 42 may include a curved surface.

  In at least part of the exposure of the substrate P, the surface of the substrate P disposed below the emission surface 23 faces the emission surface 23, the first surface 41, and the second surface 42. In at least part of the exposure of the substrate P, the space between the emission surface 23 and the surface of the substrate P is filled with the liquid LQ. In at least a part of the exposure of the substrate P, the liquid LQ is held in the first space 51 between the first surface 41 and the surface of the substrate P. The substrate P is exposed with the exposure light EL from the emission surface 23 via the liquid LQ between the emission surface 23 and the surface of the substrate P.

  In the present embodiment, a part of the immersion space LS is formed by the liquid LQ held between the first surface 41 and the object. In the present embodiment, the immersion space LS is formed so that a part of the surface of the substrate P including the projection region PR is covered with the liquid LQ when the substrate P is irradiated with the exposure light EL. . The gas-liquid interface (meniscus, edge) LG1 of the liquid LQ in the immersion space LS can be formed between at least one of the first surface 41 and the second surface 42 and the surface of the substrate P. It is desirable to form between the inner edge of 42 and the substrate P. The exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  Hereinafter, for simplicity, the substrate P is disposed at a position facing the emission surface 23, the first surface 41, and the second surface 42, and the liquid LQ is held between the liquid immersion member 4 and the substrate P so that the liquid immersion is performed. A case where the space LS is formed will be described as an example. As described above, the liquid immersion space LS can be formed between the emission surface 23 and the liquid immersion member 4 and other members (such as the plate member T of the substrate stage 2).

  As described above, in the present embodiment, each of the first surface 41 and the second surface 42 is substantially parallel to the XY plane. As shown in FIG. 4 and the like, the first surface 41 faces the surface of the substrate P through the first gap G1, and the second surface 42 faces through the second gap G2. The second gap G2 is smaller than the first gap G1.

  In the present embodiment, the supply port 75 is disposed below the first surface 41. In the present embodiment, the supply port 75 is disposed between the first surface 41 and the second surface 42. In the present embodiment, the liquid immersion member 4 includes a third surface 43 that is disposed between the first surface 41 and the second surface 42 and faces the first space 51. The upper end of the third surface 43 is connected to the outer edge of the first surface 41. The lower end of the third surface 43 is connected to the inner edge of the second surface 42. The supply port 75 is disposed on the third surface 43.

  In the present embodiment, one supply port 75 is arranged on each of the + Y side and the −Y side with respect to the optical axis AX. One supply port 75 may be arranged on each of the + X side and the −X side with respect to the optical axis AX. The number of supply ports 75 may be three or more.

  The third surface 43 is disposed around the exposure light EL. The first space 51 is defined by the first surface 41 and the third surface 43. In the present embodiment, the third surface 43 is substantially parallel to the optical axis AX. Note that the third surface 43 may not be parallel to the optical axis AX. For example, the angle formed by the first surface 41 and the third surface 43 may be smaller than 90 degrees or larger than 90 degrees.

  In the present embodiment, the side surface 35 of the projection optical system PL includes at least one of the side surface 35A of the terminal optical element 22 and the outer surface 35B of the holding member 21. The side surface 35A of the last optical element 22 is a surface different from the exit surface 23 and is a surface through which the exposure light EL does not pass. The side surface 35 </ b> A is disposed around the emission surface 23. The side surface 35A is provided so as to extend upward from the periphery of the emission surface 23 and in a radial direction with respect to the optical axis AX (a direction perpendicular to the optical axis AX). That is, the side surface 35 </ b> A is inclined so as to extend upward (+ Z direction) from the periphery of the emission surface 23.

  The holding member 21 holds the last optical element 22. The outer surface 35B of the holding member 21 is disposed around the side surface 35A. The outer surface 35B is a surface through which the exposure light EL does not pass. The outer surface 35B is disposed so as to extend in the radial direction with respect to the optical axis AX.

  In the present embodiment, the liquid immersion member 4 is disposed around the fourth surface 44 and the fourth surface 44 facing the at least part of the emission surface 23 and facing the opposite direction to the first surface 41. It has a fifth surface 45 facing the side surface 35A of the optical element 22 and a sixth surface 46 disposed around the fifth surface 45 and facing the outer surface 35B of the holding member 21. In this embodiment, the last optical element 22 is held by the holding member 21 so that the side surface 35 is exposed, but the fifth surface 45 faces the holding member 21 or the sixth surface 46. The terminal optical element 22 may be held by the holding member 21 so that the terminal optical element 22 faces the terminal optical element 22.

  The liquid immersion member 4 includes a plate portion 37 disposed so that at least a part thereof faces the emission surface 23, and a main body portion 38 disposed at least around the terminal optical element 22. The first surface 41 and the fourth surface 44 are disposed on the plate portion 37. The fifth surface 45 and the sixth surface 46 are disposed in the main body portion 38.

  The first opening 39 is disposed in the plate portion 37. The exposure light EL emitted from the emission surface 23 can pass through the first opening 39. During the exposure of the substrate P, the exposure light EL emitted from the emission surface 23 is irradiated on the surface of the substrate P through the first opening 39. As shown in FIG. 3, in the present embodiment, the first opening 39 is long in the X-axis direction that intersects the scanning direction (Y-axis direction) of the substrate P.

  The fourth surface 44 faces the emission surface 23 via the third gap G3. The fifth surface 45 faces the side surface 35A via the fourth gap G4. The sixth surface 46 faces the outer surface 35B via the fifth gap G5.

  In the present embodiment, the fourth surface 44 and the exit surface 23 are substantially parallel. The fifth surface 45 and the side surface 35A are substantially parallel. The sixth surface 46 and the outer surface 35B are substantially parallel. The fourth surface 44 and the emission surface 23 do not have to be parallel. Further, the fifth surface 45 and the side surface 35A may not be parallel. Further, the sixth surface 46 and the outer surface 35B may not be parallel.

  The gap 80 includes a first gap 81 and a second gap 82. The first gap portion 81 includes a space between the side surface 35 </ b> A and the fifth surface 45. The first gap 81 extends in the radial direction with respect to the optical axis AX and upward (+ Z direction). In the present embodiment, the lower end portion 45 </ b> B of the fifth surface 45 defines the lower end of the first gap portion 81. The upper end 45T of the fifth surface 45 defines the upper end of the first gap 81.

  The second gap portion 82 includes a space between the outer surface 35 </ b> B and the sixth surface 46. The second gap 82 is fluidly connected to the upper end of the first gap 81. The second gap 82 extends in the radial direction with respect to the optical axis AX.

  The first gap portion 81 may be parallel to the optical axis AX. Further, the second gap 82 may not be perpendicular to the optical axis AX.

  The recovery unit 60 recovers at least a part of the liquid LQ that has flowed into the gap 80 (first gap 81) through the first opening 39. The first opening 39 faces the first space 51. At least a part of the liquid LQ supplied from the supply port 75 to the first space 51 can flow into the first gap portion 81 through the first opening 39. Further, the first opening 39 faces the surface of the substrate P in at least a part of the exposure of the substrate P. Therefore, at least a part of the liquid LQ on the substrate P can flow into the first gap 81 through the first opening 39.

  In the present embodiment, the first gap 81 is open to the atmosphere via the second opening 34 different from the first opening 39. In the present embodiment, the second opening 34 is disposed at the upper end of the first gap portion 81.

  The recovery unit 60 recovers at least part of the liquid LQ that has flowed into the first gap portion 81 from the first opening 39 via the second opening 34. The recovery unit 60 recovers the liquid LQ that has overflowed from the first gap portion 81. At least a part of the collection unit 60 is provided outside the upper end 45T in the radial direction with respect to the optical axis AX. Further, at least a part of the collection unit 60 faces the outer surface 35B in the second gap 82.

  In the present embodiment, the recovery unit 60 has a recess 61 provided on the outer side of the first gap 81 in the radial direction with respect to the optical axis AX (+ Z direction). The recess 61 is provided in the liquid immersion member 4. The recess 61 has an opening 61K facing upward. The recovery unit 60 recovers the liquid LQ that has flowed into the recess 61 through the opening 61K.

  The recess 61 is provided outside the upper end 45T in the radial direction with respect to the optical axis AX. In the present embodiment, the recess 61 is disposed around the sixth surface 46. In the XY plane, the recess 61 is annular. In addition, the recessed part 61 may be formed from the several recessed part arrange | positioned cyclically | annularly at predetermined intervals. In the present embodiment, the liquid immersion member 4 has a seventh surface 47 disposed around the recess 61. The seventh surface 47 is substantially parallel to the XY plane. In the present embodiment, the seventh surface 47 is disposed in substantially the same plane as the sixth surface 46. Note that the seventh surface 47 may be disposed above the sixth surface 46 (on the + Z side).

  The recess 61 includes a first inner surface 611 connected to the sixth surface 46, a second inner surface 612 facing the first inner surface 611 and connected to the seventh surface 47, a first inner surface 611, and a second inner surface 612. And a bottom portion 613 disposed between the two. The bottom part 613 faces upward (+ Z direction). The bottom 613 is disposed below (−Z side) from the upper end 45T. In the present embodiment, the bottom 613 is substantially parallel to the XY plane. Note that the bottom 613 may not be parallel to the XY plane. For example, the bottom 613 may be inclined with respect to the XY plane. Further, the bottom 613 may include a curved surface.

  In addition, the collection unit 60 includes a liquid guide unit 83 that guides the liquid LQ from the first gap 81 to the recess 61. In the present embodiment, the liquid guide portion 83 includes the sixth surface 46. In the present embodiment, the liquid guide portion 83 includes a space between the outer surface 35 </ b> B and the sixth surface 46. That is, the liquid guide part 83 is disposed in a part of the second gap part 82. The liquid guide portion 83 is formed to extend in the radial direction with respect to the optical axis AX from the upper end portion 45T.

  In the present embodiment, the liquid guide portion 83 is provided perpendicular to the optical axis AX (parallel to the XY plane), but may not be perpendicular to the optical axis AX. For example, the sixth surface 46 may be inclined downward from the upper end 45T.

  The recess 61 is provided outside the liquid guide portion 83 in the radial direction from the upper end 45T to the optical axis AX. The liquid LQ that has overflowed from the upper end of the first gap 81 is guided by the liquid guide 83 and flows into the recess 61.

  The recess 61 can store the liquid LQ from the first gap 81. The recess 61 prevents the liquid LQ from the first gap 81 from returning to the first gap 81 by storing the flowing liquid LQ. That is, the concave portion 61 functions as at least a part of a reserve portion that stores the liquid LQ from the first gap portion 81 so as not to return to the first gap portion 81.

  Further, the recovery unit 60 has a recovery port 62 that recovers the liquid LQ that has flowed into the recess 61. The recovery port 62 recovers the liquid LQ stored in the recess 61.

  In the present embodiment, the recovery port 62 is disposed inside the recess 61. In other words, the recovery port 62 is disposed below (−Z side) the opening 61 </ b> K of the recess 61. In the present embodiment, the recovery port 62 is disposed at the bottom 613 of the recess 61. That is, the bottom 613 of the recess 61 includes at least a part of the recovery port 62.

  In the present embodiment, the recovery port 62 is annular in the XY plane. The collection port 62 may be divided and arranged at a plurality of positions around the optical axis AX.

  A porous member 64 is disposed in the recovery port 62. The porous member 64 is a plate-like member including a plurality of holes (openings or pores). The porous member 64 may be a mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape.

  As described above, in the present embodiment, the first gap 81 is open to the atmosphere via the second opening 34. In the present embodiment, the first gap 81 is opened to the atmosphere via the second opening 34 and the second gap 82.

  As described above, the second gap portion 82 includes a space between the outer surface 35 </ b> B and the sixth surface 46. In the present embodiment, the second gap 82 includes a space between the outer surface 35 </ b> B and the recess 61 and a space between the outer surface 35 </ b> B and the seventh surface 47. The space between the outer surface 35 </ b> B and the seventh surface 47 is open to the atmosphere via the third opening 72.

  In other words, the first gap 81 is open to the space around the liquid immersion member 4 via the second opening 34 and the second gap 82. In other words, the first gap portion 81 is opened to the gas space (internal space 8) through which the interface of the liquid LQ of the immersion space LS is in contact via the second opening 34.

  In the present embodiment, the “atmosphere” is a gas surrounding the liquid immersion member 4. In the present embodiment, the gas surrounding the liquid immersion member 4 is a gas in the internal space 8 formed by the chamber device 5. In the present embodiment, the chamber device 5 fills the internal space 8 with clean air using the environment control device 5B. Moreover, the chamber apparatus 5 adjusts the internal space 8 to substantially atmospheric pressure using the environment control apparatus 5B. Of course, the internal space 8 may be set higher than the atmospheric pressure.

  In the present embodiment, the second surface 42 is liquid repellent with respect to the liquid LQ. In the second surface 42, the contact angle of the liquid LQ is 90 ° or more, and may be 100 ° or more. In the present embodiment, the second surface 42 is formed of a film 73 that is liquid repellent with respect to the liquid LQ. The film 73 is formed of a liquid repellent material containing, for example, fluorine. Examples of the liquid repellent material include PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), and Teflon (registered trademark).

  In the present embodiment, the third surface 43 is also liquid repellent with respect to the liquid LQ. The third surface 43 is also formed of a film 73. Note that at least one of the second surface 42 and the third surface 43 may not be the surface of the liquid repellent film 73. For example, the liquid immersion member 4 may be formed of a liquid repellent material.

  In the present embodiment, the liquid immersion member 4 includes an air supply port 74 disposed at least at a part around the supply port 75. In the present embodiment, the air supply port 74 is disposed on the second surface 42. The air supply port 74 can supply gas to the second space 52 between the second surface 42 and the surface of the substrate P. The air supply port 74 supplies gas toward the surface of the object (substrate P) facing the second surface 42.

  In the present embodiment, the air supply port 74 is annular in the XY plane. The air supply port 74 may be divided and arranged at a plurality of positions around the optical axis AX.

  As shown in FIG. 2, the supply port 75 is connected to the liquid supply device 76 via a supply channel. In the present embodiment, the supply flow path includes a flow path formed inside the liquid immersion member 4 and a flow path formed inside the support mechanism 28. The liquid supply device 76 can supply clean and temperature-adjusted liquid LQ to the supply port 75. Note that a part of the supply channel may not be provided inside the support mechanism 28 that supports the liquid immersion member 4.

  The recovery port 62 is connected to the liquid recovery device 77 via a recovery flow path. In the present embodiment, the recovery channel includes a channel formed inside the liquid immersion member 4 and a channel formed inside the support mechanism 28. The liquid recovery device 77 includes a vacuum system (such as a valve that controls the connection state between the vacuum source and the recovery port 62), and can recover the liquid LQ by suction from the recovery port 62. Note that a part of the recovery channel may not be provided inside the support mechanism 28 that supports the liquid immersion member 4.

  The air supply port 74 is connected to a gas supply device 78 via an air supply channel. In the present embodiment, the air supply channel includes a channel formed inside the liquid immersion member 4 and a channel formed inside the support mechanism 28. The gas supply device 78 can supply clean and temperature-controlled humidity and gas to the air supply port 74. Note that the humidity of the gas supplied from the air supply port 74 is preferably the same as or higher than the humidity of the gas supplied to the internal space 8 by the environment control device 5B. Further, it is not necessary to provide a part of the air supply channel inside the support mechanism 28 that supports the liquid immersion member 4.

  The liquid LQ supplied from the supply port 75 to the first space 51 is supplied to the optical path of the exposure light EL emitted from the emission surface 23. Further, at least part of the liquid LQ in the first space 51 flows into the third space 53 between the emission surface 23 and the fourth surface 44 via the first opening 39, and passes through the third space 53. And flows into the first gap 81. At least a part of the liquid LQ that has flowed into the first gap 81 is recovered by the recovery unit 60.

  In the present embodiment, the upper surface side and the lower surface side of the porous member 64 are arranged such that only the liquid LQ passes from the upper surface side space (second gap portion 82) of the porous member 64 to the lower surface side space (recovery flow path). The pressure difference is controlled. In the present embodiment, the pressure of the second gap portion 82 on the upper surface side is released to the atmosphere and is controlled by the chamber device 5. The control device 7 controls the liquid recovery device 77 so that only the liquid LQ passes from the upper surface side to the lower surface side of the porous member 64, and adjusts the pressure on the lower surface side according to the pressure on the upper surface side. That is, the control device 7 collects only the liquid LQ from the first gap 81 through the hole of the porous member 64 and adjusts the gas so as not to pass through the hole of the porous member 64. A technique of adjusting only the pressure difference between one side and the other side of the porous member 64 and allowing only the liquid LQ to pass from one side to the other side of the porous member 64 is disclosed in, for example, US Pat. No. 7,292,313. Yes.

  Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  First, the control device 7 moves the substrate stage 2 holding the substrate P so that the emission surface 23 and the first surface 41 face the surface of the substrate P (or the upper surface 26 of the substrate stage 2). The first surface 41 and the surface of the substrate P face each other via the first gap G1, and the second surface 42 and the surface of the substrate P face each other via the second gap G2.

  The control device 7 delivers the liquid LQ from the liquid supply device 76 with the first surface 41 and the second surface 42 facing the surface of the substrate P. Further, the control device 7 operates the liquid recovery device 77. Further, the control device 7 operates the gas supply device 78.

  The liquid LQ delivered from the liquid supply device 76 is supplied from the supply port 75 to the first space 51 and is held between the first surface 41 and the surface of the substrate P. The liquid LQ supplied to the first space 51 is supplied to the optical path of the exposure light EL that is emitted from the emission surface 23. Thereby, the optical path of the exposure light EL between the emission surface 23 and the substrate P is filled with the liquid LQ.

  In the present embodiment, the immersion space LS is formed so that the first space 51 surrounded by the surface of the substrate P, the first surface 41, and the third surface 43 is substantially filled with the liquid LQ. The interface LG1 of the liquid LQ (immersion space LS) is formed between the inner edge of the second surface 42 (the lower end of the third surface 43) and the surface of the substrate P.

  In the present embodiment, the liquid LQ supplied from the supply port 75 to the first space 51 is suppressed from flowing into the second space 52. That is, in this embodiment, the movement of the interface LG1 of the liquid LQ in the immersion space LS in the XY plane from the third surface 43 is suppressed, and the expansion of the immersion space LS is suppressed. Yes.

  In the present embodiment, the first surface 41 is opposed to the surface of the substrate P via the first gap G1, and the second surface 42 disposed around the first surface 41 is the surface of the substrate P and the second gap. Opposite via G2. The second gap G2 is smaller than the first gap G1, and is about 0.1 to 0.3 mm, for example. Therefore, the movement of the interface LG1 to the outside of the third surface 43 is suppressed in the radial direction with respect to the optical axis AX. That is, since the second gap G2 is minute, the position of the interface LG1 is maintained between the inner edge of the second surface 42 and the surface of the substrate P by the surface tension of the liquid LQ as shown in FIG. The Thereby, the liquid LQ in the immersion space LS is suppressed from flowing into the second space 52.

  In the present embodiment, since the second surface 42 is liquid repellent with respect to the liquid LQ, the liquid LQ is more effectively prevented from flowing into the second space 52. In the present embodiment, since the third surface 43 is provided so as to extend upward from the inner edge of the second surface 42 and face the optical path, the liquid immersion space LS is enlarged. Is suppressed. Further, since the third surface 43 is liquid repellent with respect to the liquid LQ, this also suppresses the expansion of the immersion space LS.

  In the present embodiment, an air supply port 74 is provided, and gas is supplied toward the surface of the substrate P outside the inner edge of the second surface 42 with respect to the optical axis AX. Thereby, the expansion of the immersion space LS is suppressed by the force of the gas supplied from the air supply port 74. That is, the air supply port 74 forms a gas seal between the surface of the substrate P and the second surface 42. Accordingly, the liquid LQ is prevented from flowing out, and the movement of the interface LG1 is restricted.

  In the present embodiment, the outer shape of the first surface 41 and the inner edge of the second surface 42 are circular, and the outer shape of the immersion space LS in the XY plane is also approximately circular. As a result, the restraining force from all directions of the interface LG1 of the immersion space LS toward the center acts almost evenly. Thereby, the expansion of the immersion space LS is effectively suppressed.

  When the liquid LQ is supplied from the supply port 75 to the first space 51 in a state where the expansion of the immersion space LS is suppressed, the exposure light EL passes through at least a part of the liquid LQ in the first space 51. It flows into the 1st space | gap part 81 open | released by the atmosphere through the 1st opening 39 and the 3rd space 53. FIG. When the liquid LQ flows into the first gap 81, the position of the surface of the liquid LQ in the first gap 81 moves (rises) in the + Z direction. That is, the liquid LQ flows upward in the first gap 81 extending upward. When the supply of the liquid LQ from the supply port 75 is continued, at least a part of the liquid LQ in the first gap 81 overflows from the upper end (upper end 45T) of the first gap 81. The liquid LQ that has overflowed from the first gap 81 is collected by the collection unit 60 disposed outside the upper end of the first gap 81. That is, the liquid LQ that has overflowed from the first gap 81 is guided by the liquid guide 83 and then flows into the recess 61. The liquid LQ that has flowed into the recess 61 is recovered from the recovery port 62 (porous member 64).

  In the present embodiment, the pressure difference between the upper surface side and the lower surface side of the porous member 64 is controlled so that only the liquid LQ passes from the upper surface side to the lower surface side of the porous member 64. The liquid LQ can be recovered while suppressing the occurrence of vibration and the generation of heat of vaporization.

  In the present embodiment, the collection unit 60 stores the liquid LQ on the substrate P collected through the first opening 39 and the first gap 81 in the concave portion 61, and thus is collected through the first gap 81. It is possible to prevent the liquid LQ from returning to the first gap 81. By storing the liquid LQ from the first gap 81 in the recess 61 so that the liquid LQ recovered through the first gap 81 does not return to the first gap 81, for example, the liquid that has contacted the porous member 64 LQ is prevented from returning to the first space 51 and the optical path of the exposure light EL through the first gap portion 81.

  Next, a method for exposing the substrate P will be described. As described above, the control device 7 supplies the liquid LQ from the supply port 75, and the liquid LQ is provided between the first surface 41 and the surface of the substrate P so that the optical path of the exposure light EL is filled with the liquid LQ. And the immersion space LS is formed. Further, at least a part of the liquid LQ on the substrate P flows into the first gap 81 through the first opening 39. The recovery unit 60 recovers the liquid LQ from the first gap 81. In parallel with the liquid supply operation using the supply port 75, the control device 7 executes the liquid recovery operation using the recovery unit 60, and forms the immersion space LS so that the optical path of the exposure light EL is filled with the liquid LQ. To do. Moreover, the control apparatus 7 supplies gas from the air supply port 74, and forms a gas seal.

  The control device 7 indicates that the liquid LQ collected from the first gap 81 to the collection unit 60 returns to the first space 51 (the optical path of the exposure light EL) via the first gap 81 and the first gap 81. The exposure of the substrate P is started while suppressing the expansion of the immersion space LS using the second gap G2 and the like.

  The control device 7 emits the exposure light EL from the illumination system IL, and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is emitted from the emission surface 23 of the projection optical system PL. The control device 7 irradiates the substrate P with the exposure light EL from the emission surface 23 via the liquid LQ between the emission surface 23 and the substrate P. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL. Even during exposure of the substrate P, the liquid LQ supplied from the supply port 75 flows from the first opening 39 and is recovered by the recovery unit 60 via the first gap portion 81.

  As described above, according to the present embodiment, the supply port 75 is provided so as to face the first space 51, and the liquid LQ that has flowed into the first gap portion 81 through the first opening 39 is collected. Therefore, the structure of the lower surface of the liquid immersion member 4 facing the surface of the substrate P can be simplified. Therefore, it is possible to prevent foreign matter from adhering to the lower surface of the liquid immersion member 4 in contact with the liquid LQ and the lower surface from being contaminated.

  For example, when the structure (shape) is complicated by providing a recovery port for recovering the liquid LQ on the lower surface of the liquid immersion member 4 facing the surface of the substrate P or providing a porous member at the recovery port, the lower surface There is a possibility that foreign matter is likely to adhere to the surface. For example, when the porous member is disposed at a position facing the surface of the substrate P, foreign matter generated from the substrate P (for example, a part of the photosensitive film or the top coat film forming the surface of the substrate P) is porous. There is a possibility of adhering to the member. When the adhered foreign matter is emitted into the optical path of the exposure light EL during exposure of the substrate P or mixed into the liquid LQ of the immersion space LS, an exposure defect such as a pattern defect occurs in the substrate P. there's a possibility that. In addition, when the structure (shape) of the lower surface is complicated, for example, even when there are many uneven portions, foreign matter generated from the substrate P may easily adhere to the lower surface.

  According to this embodiment, the first gap portion 81 is provided, and the liquid LQ that has flowed into the first gap portion 81 through the first opening 39 through which the exposure light EL passes is disposed at a position that does not face the surface of the substrate P. The lower surface of the liquid immersion member 4 that is recovered by the recovered recovery unit 60 and that faces the surface of the substrate P has a simple structure. Accordingly, it is possible to suppress foreign matter from adhering to the lower surface of the liquid immersion member 4. Moreover, since the structure of the lower surface of the liquid immersion member 4 is simple, even if a foreign object adheres to the lower surface of the liquid immersion member 4, the lower surface of the liquid immersion member 4 can be cleaned smoothly and satisfactorily.

  In the present embodiment, the first gap 81 is open to the atmosphere via the second opening 34. The third space 53 that is fluidly connected to the first gap 81 is also open to the atmosphere. Accordingly, the liquid LQ in the first space 51 can smoothly flow into the third space 53 and the first gap portion 81 via the first opening 39. Therefore, expansion of the immersion space LS can be suppressed.

  In the present embodiment, the recovery unit 60 is configured so that the liquid LQ recovered from the first gap 81 does not return to the first gap 81. That is, the liquid LQ from the first gap 81 is stored in the recess 61. Therefore, for example, even when the porous member 64 of the recovery unit 60 is contaminated, the liquid LQ that has contacted the porous member 64 (the liquid LQ that may be contaminated) passes through the first gap portion 81. It is possible to suppress return (reverse flow) to the optical path of the space 51 and the exposure light EL. Therefore, occurrence of exposure failure can be suppressed.

  Further, when the porous member 64 is contaminated, the contamination of the liquid LQ that contacts the porous member 64 can be suppressed by replacing the contaminated porous member 64 with a new porous member 64.

  Note that the liquid guide portion 83 (sixth surface 46) provided between the upper end portion 45T and the concave portion 61 may be omitted. That is, the concave portion 61 may be provided so as to be adjacent to the upper end portion 45T.

  In the above-described embodiment, the supply port 75 is provided on the third surface 43, but may be provided on the first surface 41. That is, the supply port 75 may be disposed downward on the first surface 41.

  In the above-described embodiment, the porous member 64 is disposed in the recovery port 62 of the recovery unit 60 so that only the liquid LQ passes from one side of the porous member 64 to the other side. However, the liquid LQ may be recovered together with the gas. Further, the porous member may not be disposed in the recovery port 62.

  In the above-described embodiment, the liquid LQ in the first space 51 flows into the first gap portion 81 through the first opening 39 through which the exposure light EL passes, but faces the surface of the substrate P. An opening different from the first opening 39 through which the exposure light EL passes is provided in at least a part of the first surface 41, and the liquid LQ in the first space 51 is caused to flow into the first gap portion 81 through the opening. May be.

  In the above-described embodiment, the air supply port 74 may be omitted.

  In the above-described embodiment, for example, when the movement of the interface LG1 of the liquid LQ can be suppressed by the gas from the air supply port 74, the second surface 42 does not have to be disposed below the first surface 41. Good.

  In the above-described embodiment, at least a part of the second surface 42 may not be liquid repellent with respect to the liquid LQ.

  In the above-described embodiment, the member having the first surface 41 and the member having the second surface 42 may be different members. The member having the third surface 43 may be a member different from at least one of the member having the first surface 41 and the member having the second surface.

  In the above-described embodiment, the first surface 41 may not be disposed between the emission surface 23 and the substrate P. In this case, the first surface 41 may be disposed flush with the emission surface 23 or above the emission surface 23.

  In the above-described embodiment, the surface of the last optical element 22 through which the exposure light EL does not pass does not have to have a surface (side surface 35A) extending upward (+ Z direction) from the periphery of the emission surface 23. For example, the surface of the last optical element 22 through which the exposure light EL does not pass may extend substantially parallel to the exit surface 23 (in a direction perpendicular to the optical axis AX).

  Further, the side surface 35 of the projection optical system PL through which the exposure light EL does not pass may be disposed in substantially the same plane (on the same plane) as the exit surface 23 in at least a part of the periphery of the exit surface 23. That is, the side surface 35 may be arranged so as to extend in the radial direction with respect to the optical axis AX without extending upward from the periphery of the emission surface 23. Further, the side surface 35 may be substantially parallel to the optical axis AX. That is, the side surface 35 may be arranged so as to extend upward from the peripheral edge of the emission surface 23 without extending in the radial direction with respect to the optical axis AX.

  In the above-described embodiment, the first gap portion 81 into which the liquid LQ flows through the first opening 39 is open to the atmosphere via the second gap portion 82 and overflows from the first gap portion 81. The liquid LQ is recovered by the recovery unit 60, but the first gap 81 and the second gap 82 are substantially closed spaces, and the fluid (liquid LQ) of the first gap 81 and / or the second gap 82 is used. And / or gas) may be recovered by the recovery unit 60.

  In the above-described embodiment, the liquid LQ flows into the second gap 82 and is collected by the collection unit 60. However, instead of the collection unit 60 or in addition to the collection unit 60, the first gap A recovery unit that recovers the liquid LQ of the unit 81 may be provided.

  In each of the above-described embodiments, the liquid immersion member (4 and the like) can be provided with a temperature adjustment mechanism as disclosed in, for example, US Patent Application Publication No. 2008/0106707. For example, the temperature of the liquid immersion member can be adjusted by flowing a temperature adjustment liquid through a flow path formed inside the liquid immersion member.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 22 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in International Publication No. 2004/019128. As described above, a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 22 is also filled with the liquid LQ may be employed.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  Further, for example, as disclosed in US Pat. No. 6,897,963, US Patent Application Publication No. 2007/0127006, etc., a reference stage on which a reference mark is formed, and / or a substrate stage for holding a substrate, and / or The present invention can also be applied to an exposure apparatus that includes various photoelectric sensors and a measurement stage that does not hold a substrate to be exposed. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 5, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 4 ... Liquid immersion member, 7 ... Control apparatus, 22 ... End optical element, 23 ... Ejection surface, 34 ... 2nd opening, 35 ... Side surface, 39 ... 1st opening, 41 ... 1st surface, 42 ... 2nd surface, 43 ... 3rd surface, 45T ... upper end part, 60 ... collection | recovery part, 61 ... recessed part, 62 ... collection | recovery port, 64 ... porous member, 74 ... air supply port, 75 ... supply port, 80 ... space | gap part , 81 ... 1st gap part, 82 ... 2nd gap part, 83 ... Liquid guide part, AX ... Optical axis, EL ... Exposure light, EX ... Exposure apparatus, LQ ... Liquid, LS ... Immersion space, P ... Substrate, PL ... Projection optical system

Claims (26)

In an exposure apparatus that exposes a substrate,
An optical system having an exit surface for emitting exposure light;
A first surface disposed on at least a part of the periphery of the optical path of the exposure light emitted from the emission surface;
A supply port that is arranged in at least a part of the periphery of the first surface so as to face the space facing the first surface, and supplies the liquid to the space in order to fill the optical path with the liquid;
The air that has been supplied from the supply port and has flowed in through a first opening into a gap facing the side surface of the optical system that extends upward from the periphery of the emission surface and / or extends in a radial direction with respect to the optical axis of the optical system. A recovery unit for recovering at least a part of the liquid,
In at least a part of the exposure of the substrate, the surface of the substrate disposed below the emission surface is opposed to the emission surface and the first surface,
An exposure apparatus that exposes the substrate with the exposure light from the emission surface via a liquid between the emission surface and the surface of the substrate. The first opening includes an opening through which the exposure light passes,
The exposure apparatus according to claim 1, wherein at least a part of the liquid supplied from the supply port flows into the gap through the first opening.   The exposure apparatus according to claim 1, wherein the supply port is disposed in the same plane as the first surface. A second surface disposed on at least a part of the periphery of the first surface and disposed below the first surface;
The exposure apparatus according to claim 1, wherein a surface of the substrate disposed below the emission surface faces the second surface in at least a part of the exposure of the substrate.   The exposure apparatus according to claim 4, wherein the supply port is disposed below the first surface.   The exposure apparatus according to claim 4, wherein the supply port is disposed between the first surface and the second surface. A third surface provided between the first surface and the second surface and facing the space;
The exposure apparatus according to claim 6, wherein the supply port is disposed on the third surface.   The exposure apparatus according to claim 7, wherein the third surface is substantially parallel to an optical axis of the optical system.   The exposure apparatus according to claim 4, wherein the second surface is liquid repellent with respect to the liquid.   The exposure apparatus according to claim 1, wherein the gap is opened to an atmosphere through a second opening different from the first opening.   The exposure apparatus according to claim 1, wherein the recovery unit recovers the liquid overflowed from the gap. Further comprising an upper end defining the upper end of the gap,
The exposure apparatus according to claim 1, wherein at least a part of the recovery unit is provided outside the upper end in a radial direction with respect to the optical axis of the optical system.   The said collection | recovery part has a recessed part provided facing the outer side of the said space | gap part in the radiation | emission direction with respect to the optical axis of the said optical system, and collect | recovers the said liquid which flowed into the said recessed part. The exposure apparatus according to any one of the above. The recovery part has a liquid guide part extending in a radial direction with respect to the optical axis of the optical system from an upper end part defining an upper end of the gap part
The exposure apparatus according to claim 13, wherein the concave portion is provided outside the liquid guide portion in a radial direction with respect to the optical axis of the optical system from the upper end portion.   The exposure apparatus according to claim 13 or 14, wherein a bottom portion of the concave portion is disposed below the upper end portion.   The exposure apparatus according to claim 13, wherein the recovery unit has a recovery port that recovers the liquid that has flowed into the recess.   The exposure apparatus according to claim 16, wherein the recovery port is disposed inside the recess.   The exposure apparatus according to claim 16 or 17, further comprising a porous member disposed in the recovery port.   19. The exposure apparatus according to claim 18, wherein a pressure difference between one side and the other side of the porous member is controlled so that only liquid passes from one side of the porous member to the other side.   The exposure apparatus according to any one of claims 16 to 19, wherein the recovery port recovers the liquid that has flowed into the recess together with the gas.   21. The exposure apparatus according to any one of claims 1 to 20, further comprising an air supply port arranged at least at a part around the supply port. The optical system includes an optical member having the exit surface, and a holding member that holds the optical member,
The exposure apparatus according to any one of claims 1 to 21, wherein the side surface includes at least one of a surface of the optical member and a surface of the holding member. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 22,
Developing the exposed substrate; and a device manufacturing method. Moving the substrate so that the substrate faces the first surface disposed at least in the periphery of the optical path of the optical system and the optical path of the exposure light emitted from the exit surface of the optical system; ,
A liquid is supplied to the space from a supply port arranged at least part of the periphery of the first surface so as to face the space between the first surface and the substrate, and the emission surface and the substrate Filling the optical path between and with the liquid;
Collect at least a portion of the liquid supplied from the supply port and flowing into the gap facing the surface of the optical system extending upward from the periphery of the exit surface and / or extending in the radial direction with respect to the optical axis of the optical system To do
Exposing the substrate with the exposure light from the exit surface through a liquid between the exit surface and the substrate.   25. The exposure method according to claim 24, wherein at least a part of the liquid supplied from the supply port is recovered through the opening through which the exposure light passes and the gap. Exposing the substrate using the exposure method according to claim 24 or 25;
Developing the exposed substrate; and a device manufacturing method.

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