JP2010258453A - Liquid recovery system, exposure apparatus, exposure method, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid recovery system capable of suppressing occurrence of an exposure defect by suppressing remaining of a liquid, etc. <P>SOLUTION: The liquid recovery system is used for immersion exposure wherein a substrate is exposed to exposure light through a liquid. The liquid recovery system includes a first surface, a second surface directed differently from the first surface, a first porous member having a plurality of holes connecting the first and the second surfaces to each other, and a liquid recovery portion, at least the part of which faces the first surface across a first gap. The liquid recovery portion can recover a liquid flowing in the first gap through the holes of the first porous member from between the second surface and a body, and also can recover a liquid on the body not through the holes of the first porous member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a liquid recovery system, an exposure apparatus, an exposure method, and a device manufacturing method.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2008/0233512

  In an immersion exposure apparatus, when an object (for example, a substrate to be exposed) in which an immersion space (immersion area) is formed is moved at a high speed, the liquid leaks or the liquid (film, drop, etc.) on the object ) May remain. As a result, an exposure failure may occur or a defective device may occur. On the other hand, if the moving speed of the object is lowered in order to hold the liquid satisfactorily, the throughput may be lowered.

  An object of an aspect of the present invention is to provide a liquid recovery system, an exposure apparatus, and an exposure method that can suppress the occurrence of defective exposure by suppressing liquid residue and the like. Another object of the present invention is to provide a device manufacturing method capable of suppressing the occurrence of defective devices while suppressing a decrease in throughput.

  According to the first aspect of the present invention, there is provided a liquid recovery system for use in immersion exposure in which a substrate is exposed with exposure light through a liquid, the first surface and the second surface facing in a different direction from the first surface. And a first porous member having a plurality of holes connecting the first surface and the second surface, and a liquid recovery portion at least partially facing the first surface via the first gap, the liquid recovery portion Is capable of recovering the liquid flowing into the first gap from between the second surface and the object through the hole of the first porous member, and recovering the liquid on the object without passing through the hole of the first porous member. A possible liquid recovery system is provided.

  According to the second aspect of the present invention, there is provided a liquid recovery system for use in immersion exposure for exposing a substrate with exposure light through a liquid, a recovery flow path for recovering the liquid, a first surface, A second surface facing a direction different from the first surface, a first porous member having a plurality of holes connecting the first surface and the second surface, a third surface, a fourth surface facing a direction different from the third surface, And a plurality of holes connecting the third surface and the fourth surface, the third surface faces the recovery channel, and at least a part of the fourth surface faces the first surface via the first gap. Two porous members, and a first supply port for supplying a liquid between the first porous member and the second porous member, and the second surface and the object via the first porous member and the second porous member, A liquid recovery system for recovering the liquid in between is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a liquid, the exposure apparatus including the liquid recovery system according to the first and second aspects.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the third aspect and developing the exposed substrate.

  According to a fifth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a liquid, between an emission surface of an optical member that emits exposure light and a substrate facing the emission surface. Filling the optical path with a liquid, irradiating the substrate with exposure light through the optical member and the liquid, recovering the liquid on the substrate using the liquid recovery system according to the first and second aspects, Are provided.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure method according to the fifth aspect and developing the exposed substrate.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of this invention, generation | occurrence | production of a defective device can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is the figure which expanded a part of exposure apparatus which concerns on 1st Embodiment. It is a figure which shows the vicinity of the liquid immersion member which concerns on 1st Embodiment. It is a figure which shows an example of the 1st porous member which concerns on 1st Embodiment. It is a figure which shows an example of the 2nd porous member which concerns on 1st Embodiment. It is a figure which shows the vicinity of the liquid immersion member which concerns on 2nd Embodiment. It is a figure which shows the vicinity of the liquid immersion member which concerns on 3rd Embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the first embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  In FIG. 1, an exposure apparatus EX optically positions a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and the positions of the mask stage 1 and the substrate stage 2. Interferometer system 3 for measuring, illumination system IL for illuminating mask M with exposure light EL, projection optical system PL for projecting a pattern image of mask M illuminated with exposure light EL onto substrate P, and exposure light EL A liquid immersion member 4 capable of forming the liquid immersion space LS so that at least a part of the optical path is filled with the liquid LQ, a chamber device 5 that houses at least the projection optical system PL and the substrate stage 2, and at least the projection optical system PL. And a control device 7 for controlling the operation of the entire exposure apparatus EX.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

  The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a multilayer film formed on the base material. The multilayer film is a film in which a plurality of films including at least a photosensitive film are stacked. The photosensitive film is a film formed of a photosensitive material. Further, the multilayer film may include, for example, an antireflection film and a protective film (topcoat film) that protects the photosensitive film.

  The chamber device 5 includes a chamber member 5A that forms a substantially closed internal space 8, and an environment control device 5B that controls the environment (temperature, humidity, cleanliness, pressure, etc.) of the internal space 8. The substrate stage 2 moves in the internal space 8. The chamber device 5 adjusts at least the environment of the space (internal space 8) in which the substrate stage 2 moves.

  In the present embodiment, the body 6 is disposed in the internal space 8. The body 6 includes a first column 9 provided on the support surface FL and a second column 10 provided on the first column 9. The first column 9 includes a first support member 11 and a first surface plate 13 supported by the first support member 11 via a vibration isolator 12. The second column 10 includes a second support member 14 provided on the first surface plate 13 and a second surface plate 16 supported by the second support member 14 via a vibration isolator 15. In the present embodiment, the third surface plate 18 is disposed on the support surface FL via the vibration isolator 17.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light that is ultraviolet light (vacuum ultraviolet light) is used as the exposure light EL.

  The mask stage 1 has a mask holding part 19 that holds the mask M so as to be releasable, and is movable on the guide surface 16G of the second surface plate 16 while holding the mask M. The mask stage 1 can move while holding the mask M with respect to the illumination region IR by the operation of the drive system 20. The drive system 20 includes a planar motor having a mover 20 </ b> A disposed on the mask stage 1 and a stator 20 </ b> B disposed on the second surface plate 16. A flat motor capable of moving the mask stage 1 is disclosed in, for example, US Pat. No. 6,452,292. The mask stage 1 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 20.

  The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

  A plurality of optical elements of the projection optical system PL are held by a holding member (lens barrel) 21. The holding member 21 has a flange 21F. The projection optical system PL is supported by the first surface plate 13 via the flange 21F. A vibration isolator can be provided between the first surface plate 13 and the holding member 21.

  The projection optical system PL has an exit surface 23 that emits the exposure light EL toward the image plane of the projection optical system PL. The exit surface 23 is disposed on the terminal optical element 22 closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL. The projection region PR includes a position where the exposure light EL emitted from the emission surface 23 can be irradiated. In the present embodiment, the exit surface 23 faces the −Z direction and is parallel to the XY plane. The exit surface 23 facing the −Z direction may be a convex surface or a concave surface.

  In the present embodiment, the optical axis (optical axis in the vicinity of the image plane of the projection optical system PL) AX of the terminal optical element 22 is substantially parallel to the Z axis. Note that the optical axis defined by the optical element adjacent to the terminal optical element 22 may be regarded as the optical axis of the terminal optical element 22. In the present embodiment, the image plane of the projection optical system PL is substantially parallel to the XY plane including the X axis and the Y axis. In the present embodiment, the image plane is substantially horizontal. However, the image plane may not be parallel to the XY plane or may be a curved surface.

  The substrate stage 2 has a substrate holding portion 24 that holds the substrate P so as to be releasable, and is movable on the guide surface 18G of the third surface plate 18. The substrate stage 2 can move while holding the substrate P with respect to the projection region PR by the operation of the drive system 25. The drive system 25 includes a planar motor having a mover 25 </ b> A disposed on the substrate stage 2 and a stator 25 </ b> B disposed on the third surface plate 18. A flat motor capable of moving the substrate stage 2 is disclosed in, for example, US Pat. No. 6,452,292. The substrate stage 2 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 25.

  The substrate stage 2 has an upper surface 26 that is disposed around the substrate holding unit 24 and can face the emission surface 23. In the present embodiment, the substrate stage 2 is disposed at least at a part of the periphery of the substrate holding portion 24 as disclosed in US Patent Application Publication No. 2007/0177125 and the like, and the lower surface of the plate member T is disposed on the lower surface of the plate member T. It has the plate member holding | maintenance part 27 hold | maintained so that release is possible. In the present embodiment, the upper surface 26 of the substrate stage 2 includes the upper surface of the plate member T. The upper surface 26 is flat.

  In the present embodiment, the substrate holding unit 24 can hold the substrate P such that the surface of the substrate P and the XY plane are substantially parallel. The plate member holding part 27 can hold the plate member T so that the upper surface 26 of the plate member T and the XY plane are substantially parallel to each other. The plate member T may not be releasable from the substrate stage 2. In that case, the plate member holding portion 27 can be omitted.

  The interferometer system 3 optically measures the position of the first interferometer unit 3A capable of optically measuring the position of the mask stage 1 (mask M) in the XY plane and the position of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of measuring. When executing the exposure process of the substrate P or when executing the predetermined measurement process, the control device 7 operates the drive systems 20 and 25 based on the measurement result of the interferometer system 3 to thereby perform the mask stage 1 (mask M) and position control of the substrate stage 2 (substrate P) are executed.

  The liquid immersion member 4 is disposed at least at a part around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 4 is disposed on at least a part of the periphery of the terminal optical element 22. The liquid immersion member 4 has a lower surface 30 that can be opposed to the surface (upper surface) of an object disposed at a position facing the emission surface 23. The liquid immersion member 4 forms the liquid immersion space LS so that the optical path of the exposure light EL between the emission surface 23 and an object disposed at a position facing the emission surface 23 is filled with the liquid LQ. A part of the liquid LQ that forms the immersion space LS is held between at least a part of the lower surface 30 and the surface (upper surface) of the object.

  The immersion space LS is a portion (space, region) filled with the liquid LQ. In the present embodiment, the object that can move to a position facing the emission surface 23 includes at least one of the substrate stage 2 (plate member T) and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the liquid immersion member 4 forms the liquid immersion space LS so that the optical path of the exposure light EL between the last optical element 22 and the substrate P is filled with the liquid LQ.

  In the present embodiment, the liquid immersion member 4 is supported by the support mechanism 28. In the present embodiment, the support mechanism 28 is supported by the first surface plate 13. In the present embodiment, the liquid immersion member 4 is suspended from the first surface plate 13 via the support mechanism 28.

  The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 7 controls the mask stage 1 and the substrate stage 2 to perform predetermined scanning in the XY plane that intersects the optical axis AX (optical path of the exposure light EL) with the mask M and the substrate P. Move in the direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 7 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the liquid LQ in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  Next, the liquid immersion member 4 will be described with reference to FIGS. 2 and 3. 2 is a side sectional view showing the vicinity of the liquid immersion member 4, and FIG. 3 is an enlarged view of a part of FIG. 2 and 3, the object disposed below the liquid immersion member 4 so as to face the emission surface 23 and the lower surface 30 is the substrate P.

  Hereinafter, for simplicity, the case where the substrate P is disposed at a position facing the emission surface 23 and the lower surface 30 and the liquid LQ is held between the liquid immersion member 4 and the substrate P to form the liquid immersion space LS. An example will be described. As described above, the liquid immersion space LS can be formed between the emission surface 23 and the liquid immersion member 4 and other members (such as the plate member T of the substrate stage 2).

  At least a part of the liquid immersion member 4 is disposed around a part of the optical path K of the exposure light EL and the terminal optical element 22. In the present embodiment, the liquid immersion member 4 is an annular member. In the present embodiment, the outer shape of the liquid immersion member 4 in the XY plane is a circle. The outer shape of the liquid immersion member 4 may be another shape (for example, a rectangle).

  In the present embodiment, the liquid immersion member 4 is disposed in at least a part of the periphery of the optical path K and the supply port 31 that supplies the liquid LQ to the optical path K of the exposure light EL that is emitted from the exit surface 23 of the last optical element 22. And a liquid recovery part 32 that can recover the liquid LQ and a recovery port 33 that is disposed in at least a part of the periphery of the optical path K and can recover the liquid LQ.

  Further, the liquid immersion member 4 includes a supply channel 34 for supplying the liquid LQ to the supply port 31, a recovery channel 35 for recovering the liquid LQ from the liquid recovery unit 32, and a liquid from the recovery port 33. And a recovery flow path 36 for recovering LQ. The supply channel 34, the recovery channel 35, and the recovery channel 36 are formed inside the liquid immersion member 4. The supply port 31 is disposed at one end of the supply flow path 34. The liquid recovery part 32 is disposed at one end of the recovery flow path 35. The collection port 33 is disposed at one end of the collection channel 36.

  The supply port 31 is connected to a liquid supply device 38 via a supply flow path 34 and a flow path 37 of a supply pipe. The liquid supply device 38 can supply clean and temperature-adjusted liquid LQ to the supply port 31.

  The liquid recovery unit 32 has a recovery port 39. The recovery port 39 is connected to a liquid recovery apparatus 41 via a recovery flow path 35 and a recovery pipe flow path 40. The liquid recovery device 41 includes a pressure adjusting device and can adjust the pressure of the recovery flow channel 35 via the flow channel 40. In the present embodiment, the liquid recovery apparatus 41 includes a vacuum system (such as a valve that controls the connection state between the vacuum source and the recovery port), and can adjust the recovery flow path 35 to a predetermined negative pressure. The liquid recovery device 41 can recover the liquid LQ by sucking the liquid LQ from the liquid recovery part 32 with the recovery flow path 35 set to a negative pressure. The liquid LQ recovered from the liquid recovery unit 32 is recovered by the liquid recovery device 41 via the recovery channel 35 and the channel 40.

  The recovery port 33 is connected to a liquid recovery device 43 via a recovery flow path 36 and a recovery pipe flow path 42. The liquid recovery device 43 includes a vacuum system (such as a valve for controlling the connection state between the vacuum source and the recovery port), and can recover the liquid LQ by suction from the recovery port 33.

  In the present embodiment, the liquid immersion member 4 includes a first porous member 44 and a second porous member 45. The first porous member 44 is disposed at a position that can face the substrate P. The second porous member 45 is disposed in the recovery port 39. In the present embodiment, the liquid recovery part 32 includes a recovery port 39 and a second porous member 45 disposed in the recovery port 39.

  The first porous member 44 includes a first surface 51, a second surface 52 that faces in a direction different from the first surface 51, and a plurality of holes 46 that connect the first surface 51 and the second surface 52. The second porous member 45 has a third surface 53, a fourth surface 54 facing in a direction different from the third surface 53, and a plurality of holes 47 connecting the third surface 53 and the fourth surface 54.

  The first porous member 44 is disposed on the liquid immersion member 4 so that the substrate P (object) faces the second surface 52. The liquid immersion member 4 supports at least a part of the first porous member 44.

  The second porous member 45 is disposed so that the third surface 53 faces the recovery flow path 35. The liquid immersion member 4 supports at least a part of the second porous member 45.

  In the present embodiment, the second porous member 45 is disposed such that at least a part of the fourth surface 54 faces the first surface 51 of the first porous member 44 via the first gap G1.

  In the present embodiment, the first porous member 44 is a plate-like member in which a plurality of small holes 46 are formed. The first porous member 44 is a member formed by processing a plate member (base material) to form a plurality of holes 46, and is also called a mesh plate. In the present embodiment, the first porous member 44 is made of titanium. The first porous member 44 may be made of stainless steel.

  In the present embodiment, the first surface 51 faces upward (+ Z direction) so as to face the fourth surface 54 via the first gap G1. The second surface 52 faces the reverse direction (−Z direction, downward direction) of the first surface 51. In the present embodiment, the upward direction is parallel to the optical axis AX and opposite to the direction in which the exposure light EL travels. The downward direction is parallel to the optical axis AX and is the direction in which the exposure light EL travels.

  In the present embodiment, the first surface 51 and the second surface 52 are substantially parallel. In the present embodiment, the first surface 51 and the second surface 52 are substantially parallel to the surface (XY plane) of the substrate P.

  Note that the first surface 51 and the second surface 52 may be non-parallel. Further, the first surface 51 may be inclined with respect to the XY plane. That is, the normal line of the first surface 51 may be non-parallel to the optical axis AX. The second surface 52 may be inclined with respect to the XY plane. Further, at least a part of the first surface 51 may be a curved surface, and at least a part of the second surface 52 may be a curved surface.

  In the present embodiment, the second porous member 45 is a plate-like member in which a plurality of small holes 47 are formed. In the present embodiment, the second porous member 45 is a mesh plate. In the present embodiment, the second porous member 45 is made of titanium. Note that the second porous member 45 may be formed of stainless steel.

  In the present embodiment, the third surface 53 faces the upward direction (+ Z direction) so as to face the recovery flow path 35. The fourth surface 54 faces the reverse direction (−Z direction, downward direction) of the third surface 53. At least a part of the fourth surface 54 is opposed to the first surface 51 via the first gap G1.

  In the present embodiment, the third surface 53 and the fourth surface 54 are substantially parallel. In the present embodiment, the third surface 53 and the fourth surface 54 are substantially parallel to the surface (XY plane) of the substrate P.

  Note that the third surface 53 and the fourth surface 54 may be non-parallel. Further, the third surface 53 may be inclined with respect to the XY plane. That is, the normal line of the third surface 53 may be non-parallel to the optical axis AX. Further, the fourth surface 54 may be inclined with respect to the XY plane. Further, at least a part of the third surface 53 may be a curved surface, and at least a part of the fourth surface 54 may be a curved surface.

  In the present embodiment, the liquid immersion member 4 includes a main body 48 disposed around the terminal optical element 22 and at least a part between the exit surface 23 of the terminal optical element 22 and the surface of the substrate P in the Z-axis direction. And a plate portion 49 disposed on the surface.

  The plate portion 49 has an opening 50 at a position facing the emission surface 23. The exposure light EL emitted from the emission surface 23 can pass through the opening 50. For example, during the exposure of the substrate P, the exposure light EL emitted from the emission surface 23 passes through the opening 50 and is irradiated on the surface of the substrate P through the liquid LQ. In the present embodiment, the opening 50 is long in the X-axis direction intersecting the scanning direction (Y-axis direction) of the substrate P.

  The plate portion 49 has an upper surface 60 that faces a part of the emission surface 23 and a lower surface 61 that can face the surface of the substrate P. Each of the upper surface 60 and the lower surface 61 is disposed around the opening 50. That is, each of the upper surface 60 and the lower surface 61 is disposed around the optical path K of the exposure light EL that is emitted from the exit surface 23 of the last optical element 22.

  In the present embodiment, the lower surface 30 of the liquid immersion member 4 includes the lower surface 61 of the plate portion 49 and the second surface 52 of the first porous member 44. The lower surface 61 of the plate portion 49 and the second surface 52 of the first porous member 44 hold the liquid LQ between the surface of the substrate P arranged at a position where the exposure light EL from the last optical element 22 can be irradiated. Is possible. The liquid LQ in the immersion space LS contacts at least the upper surface 60 and the lower surface 61 of the plate portion 49.

  In the present embodiment, the lower surface 61 is a flat surface. In the present embodiment, the lower surface 61 is substantially parallel to the surface (XY plane) of the substrate P. In the present embodiment, the upper surface 60 and the lower surface 61 are substantially parallel. Further, the emission surface 23 and the upper surface 60 and the lower surface 61 are substantially parallel.

  Note that the lower surface 61 may be inclined with respect to the XY plane. Further, the lower surface 61 and the emission surface 23 may be non-parallel, the upper surface 60 and the emission surface 23 may be non-parallel, or the upper surface 60 and the lower surface 61 may be non-parallel. Further, at least a part of the upper surface 60 may be a curved surface, and at least a part of the lower surface 61 may be a curved surface. Further, at least a part of the emission surface 23 may be a curved surface.

  In the following description, the lower surface 61 is appropriately referred to as a liquid contact surface 61. The liquid contact surface 61 is disposed around the optical path K of the exposure light EL emitted from the emission surface 23.

  In the present embodiment, the second surface 52 is disposed at least at a part of the periphery of the liquid contact surface 61, and is disposed away from the liquid contact surface 61 on the lower surface 30 of the liquid immersion member 4. That is, the first porous member 44 and the plate portion 49 are arranged so that the second gap G2 is formed between the outer edge 61E of the liquid contact surface 61 and the inner edge 52E of the second surface 52.

  The second gap G2 allows the liquid LQ on the substrate P to flow into the first gap G1 between the first porous member 44 and the second porous member 45 without passing through the hole 46 of the first porous member 44. Opening 55 is formed. The liquid LQ on the substrate P passes through a space 56 (first gap) between the first porous member 44 and the second porous member 45 from an opening 55 formed between the liquid contact surface 61 and the second surface 52. Can flow into G1).

  The liquid LQ on the substrate P can also flow into the space 56 between the first porous member 44 and the second porous member 45 through the hole 46 of the first porous member 44.

  In the present embodiment, the second surface 52 and the liquid contact surface 61 are disposed in substantially the same plane (in the XY plane). For example, during the exposure of the substrate P, the gap G3 between the second surface 52 and the surface of the substrate P and the gap G4 between the liquid contact surface 61 and the surface of the substrate P have substantially the same dimensions. In the present embodiment, the dimension of the gap G3 in the Z-axis direction is 10 to 500 microns. In the present embodiment, the dimension of the gap G3 in the Z-axis direction is smaller than the dimension of the gap G1 in the Z-axis direction. For example, the dimension of the gap G1 is 2 to 200 times the gap G3.

  In addition, the 2nd surface 52 and the liquid contact surface 61 do not need to be arrange | positioned in the same plane. For example, the second surface 52 may be disposed above the liquid contact surface 61 (position away from the surface of the substrate P), or disposed below the liquid contact surface 61 (position close to the surface of the substrate P). May be. Further, the second surface 52 and the liquid contact surface 61 may not be parallel. For example, at least a part of the second surface 52 may be inclined upward toward the outside in the radiation direction with respect to the optical path K of the exposure light EL (the optical axis AX of the terminal optical element 22).

  In the present embodiment, the second surface 52 is liquid repellent with respect to the liquid LQ. The contact angle of the second surface 52 with respect to the liquid LQ is, for example, 90 degrees or more. The receding contact angle of the second surface 52 with respect to the liquid LQ is 90 degrees or more.

  In the present embodiment, the second surface 52 is more repellent with respect to the liquid LQ than at least one of the first surface 51, the third surface 53, and the fourth surface 54.

  In the present embodiment, the second surface 52 is formed of a film that is liquid repellent with respect to the liquid LQ. In this embodiment, the material forming the film is a fluorine-based material containing fluorine. In this embodiment, the film is a film of PFA (Tetrafluoroethylene-perfluoroalkylvinyl ether copolymer). The film may be a film of PTFE (Poly tetrafluoroethylene), PEEK (polyetheretherketone), Teflon (registered trademark), or the like. The membrane may be “Cytop” manufactured by Asahi Glass Co., or “Novec EGC” manufactured by 3M.

  In the present embodiment, the first surface 51 is liquid repellent with respect to the liquid LQ. The contact angle of the first surface 51 with respect to the liquid LQ is, for example, 90 degrees or more. Similar to the second surface 52, the first surface 51 is formed by the surface of a liquid repellent film. The receding contact angle of the first surface 51 with respect to the liquid LQ is 90 degrees or more.

  In the present embodiment, the inner surface of the hole 46 is also liquid repellent with respect to the liquid LQ.

  The first porous member 44 is formed of a material that is liquid repellent with respect to the liquid LQ, and the second surface 52 is more liquid LQ than at least one of the first surface 51, the third surface 53, and the fourth surface 54. Alternatively, at least one of the first surface 51, the second surface 52, the third surface 53, and the fourth surface 54 may be formed on the surface of the film so as to be liquid repellent.

  In the present embodiment, the fourth surface 54 is lyophilic with respect to the liquid LQ. The contact angle of the fourth surface 54 with respect to the liquid LQ is smaller than 90 degrees, for example. In the present embodiment, the fourth surface 54 is formed of a titanium surface.

  In the present embodiment, the third surface 53 is lyophilic with respect to the liquid LQ. The third surface 53 is formed of a titanium surface. The inner surface of the hole 47 is also formed of a titanium surface and is lyophilic with respect to the liquid LQ.

  In the present embodiment, among the liquid repellency of the first surface 51, the second surface 52, the third surface 53, and the fourth surface 54 with respect to the liquid LQ, the second surface 52 has the highest liquid repellency. Note that the liquid repellency of the first surface 51 and the liquid repellency of the second surface 52 with respect to the liquid LQ may be substantially equal.

  FIG. 4 is a schematic diagram showing a part of the second surface 52 of the first porous member 44, and FIG. 5 is a schematic diagram showing a part of the fourth surface 54 of the second porous member 45. In the present embodiment, the shape of the hole 46 in a plane parallel to the second surface 52 is a circle. Further, the shape of the hole 47 in a plane parallel to the fourth surface 54 is a circle. In the present embodiment, the diameter (dimension) of the hole 46 is larger than the diameter (dimension) of the hole 47. For example, the diameter of the hole 46 is 500 to 5000 microns, and is 5 to 200 times the diameter of the hole 47. Thereby, the liquid LQ on the substrate P can smoothly flow into the space 56 through the hole 46. Note that not all of the plurality of holes 46 in the first porous member 44 have the same diameter. Similarly, all of the plurality of holes 47 of the second porous member 45 may not have the same diameter. Therefore, in the present embodiment, that the diameter of the hole 46 of the first porous member 44 is larger than the diameter of the hole 47 of the second porous member 46 is that the average of the diameters of the plurality of holes 46 of the first porous member 44 is The diameter of the plurality of holes 47 of the second porous member 46 is larger than the average of the diameters of the plurality of holes 47 of the second porous member 46, and the diameter of the smallest hole among the plurality of holes 46 of the first porous member 44 is Including larger than the diameter of the first hole.

  As shown in FIGS. 2 and 3, the liquid recovery part 32 is disposed above the first porous member 44. The liquid recovery part 32 can recover the liquid LQ that has flowed into the first gap G1 (space 56) through the hole 46 of the first porous member 44 from between the second surface 52 and the substrate P, and the substrate The liquid LQ on P can be collected without passing through the hole 46 of the first porous member 44. That is, the liquid recovery unit 32 includes the liquid LQ that flows into the first gap G1 (space 56) through the hole 46 of the first porous member 44 from between the second surface 52 and the surface of the substrate P, and the first porous member. The liquid LQ on the substrate P can be recovered from the second gap G2 (opening 55) between the liquid contact surface 61 and the second surface 52 without passing through the hole 46 of the member 44. The liquid LQ on the substrate P can flow into the first gap G1 through at least one of the hole 46 and the opening 55 of the first porous member 44. The liquid recovery part 32 can recover the liquid LQ on the substrate P that has flowed into the first gap G1.

  In the present embodiment, the liquid recovery unit 32 recovers at least part of the liquid LQ that has contacted the second porous member 45 through the holes 47 of the second porous member 45.

  In the present embodiment, the control device 7 is configured so that only the liquid LQ is sucked into the recovery channel 35 via the second porous member 45, that is, the gas is supplied to the recovery channel 35 via the second porous member 45. The liquid recovery apparatus 41 is controlled so as not to flow in, and the pressure of the recovery flow path 35 is adjusted. The control device 7 adjusts the pressure of the recovery flow path 35 so that only the liquid LQ is sucked into the recovery flow path 35 to adjust the pressure difference between the third surface 53 side and the fourth surface 54 side.

  In the present embodiment, the pressure in the space 56 on the fourth surface 54 side is released to the atmosphere through the hole 46 of the first porous member 44 and is controlled by the chamber device 5. In the present embodiment, the pressure in the space 56 between the liquid recovery part 32 and the first porous member 44 is higher than the pressure in the recovery flow path 35. The pressure in the space 56 is substantially equal to the pressure in the space on the second surface 52 side (the space between the first porous member 44 and the substrate P).

  The control device 7 controls the liquid recovery device 41 so that only the liquid LQ passes from the fourth surface 54 side to the third surface 53 side of the second porous member 45, and the pressure (recovery on the third surface 53 side). The pressure of the flow path 35) is adjusted. That is, the control device 7 collects only the liquid LQ through the hole 47 of the second porous member 45 and the pressure on the third surface 53 side so that the gas does not pass through the hole 47 of the second porous member 45. The difference from the pressure on the fourth surface 54 side is adjusted. A technique for adjusting only the pressure difference between one side and the other side of the porous member and allowing only the liquid LQ to pass from one side to the other side of the porous member is disclosed in, for example, US Pat. No. 7,292,313.

  In the present embodiment, the “atmosphere” is a gas surrounding the liquid immersion member 4. In the present embodiment, the gas surrounding the liquid immersion member 4 is a gas in the internal space 8 formed by the chamber device 5. In the present embodiment, the chamber device 5 fills the internal space 8 with clean air using the environment control device 5B. Moreover, the chamber apparatus 5 adjusts the internal space 8 to substantially atmospheric pressure using the environment control apparatus 5B. Of course, the internal space 8 may be set higher than the atmospheric pressure.

  In the present embodiment, the pressure in the space 56 may be higher than the pressure in the recovery flow path 35 and lower than the pressure in the space on the second surface 52 side.

  The supply port 31 is disposed at a predetermined portion of the liquid immersion member 4 so as to face the optical path K of the exposure light EL emitted from the emission surface 23. In the present embodiment, the main body 48 of the liquid immersion member 4 has an inner surface 62 that is above the emission surface 23 and faces at least a part of the projection optical system PL via a gap G5. The inner surface 62 includes an inner side surface 62A that faces at least a part of the side surface 22A of the last optical element 22, and an upper surface 62B that is disposed around the side surface 22A and faces the lower surface 22B facing downward (−Z direction). The side surface 22A and the lower surface 22B are surfaces different from the emission surface 23, and are surfaces through which the exposure light EL does not pass. The lower surface 22B may be a part of the last optical element 22 or a part of the holding member 21. In the present embodiment, the supply port 31 is disposed on the inner side surface 62A.

  In the present embodiment, the supply port 31 is disposed on each of the + Y side and the −Y side with respect to the opening 50 (the optical path K of the exposure light EL). The supply port 31 may be arranged on each of the + X side and the −X side with respect to the opening 50 (the optical path K of the exposure light EL). Further, the number of supply ports 31 is not limited to two. The supply port 31 may be disposed at three or more positions around the optical path K of the exposure light EL.

  In the present embodiment, at least a part of the upper surface 60 of the plate portion 49 and the emission surface 23 face each other via the gap G6. The supply port 31 supplies the liquid LQ between the emission surface 23 and the upper surface 60. The liquid LQ from the supply port 31 is supplied to the optical path K of the exposure light EL that is emitted from the emission surface 23. Thereby, the optical path K of the exposure light EL is filled with the liquid LQ.

  The supply port 31 may be disposed on the inner side surface 62A so as to face the side surface 22A. Further, the supply port 31 may supply the liquid LQ between the side surface 22A and the inner side surface 62A. Further, the supply port 31 may be provided on the lower surface 30.

  In the present embodiment, the gap G5 between the projection optical system PL and the inner surface 62 of the liquid immersion member 4 is open to the atmosphere. The gap G5 is open to the atmosphere through the opening 63 facing the internal space 8. At least a part of the liquid LQ supplied from the supply port 31 flows into the gap G5.

  The collection port 33 is arranged at a position farther from the optical path K than the supply port 31. The collection port 33 is disposed on the inner side surface 62A. The recovery port 33 recovers at least a part of the liquid LQ between the side surface 22A and the inner side surface 62A. Thereby, the liquid LQ in the liquid immersion space LS is suppressed from flowing out of the liquid immersion member 4 via the upper surface 62B.

  In the present embodiment, in at least a part of the exposure of the substrate P, the supply operation of the liquid LQ by the supply port 31, the recovery operation of the liquid LQ by the liquid recovery unit 32, and the recovery operation of the liquid LQ by the recovery port 33 are performed. The immersion space LS having a predetermined size is formed so that the optical path K of the exposure light EL is filled with the liquid LQ.

  At least part of the liquid LQ supplied between the emission surface 23 and the upper surface 60 from the supply port 31 is supplied between the liquid contact surface 61 and the surface of the substrate P through the opening 50. The optical path K of the exposure light EL between the emission surface 23 and the surface of the substrate P is filled with the liquid LQ supplied from the supply port 31. Further, at least a part of the liquid LQ is held between the lower surface 30 including the liquid contact surface 61 and the second surface 52 and the surface of the substrate P, and forms a part of the immersion space LS.

  At least a part of the liquid LQ between the lower surface 30 and the surface of the substrate P is recovered by the liquid recovery unit 32. The liquid recovery part 32 recovers at least one of the liquid LQ that has flowed into the space 56 (first gap G1) via the hole 46 of the first porous member 44 and the liquid LQ that has flowed into the space 56 via the opening 55. To do.

  In the present embodiment, the immersion space LS is formed so that a part of the surface of the substrate P including the projection region PR is covered with the liquid LQ when the substrate P is irradiated with the exposure light EL. . The exposure apparatus EX of the present embodiment employs a local liquid immersion method.

  In the present embodiment, the gas-liquid interface (meniscus) of the liquid LQ in the immersion space LS includes the first interface LG1 disposed between the lower surface 30 and the surface of the substrate P facing the lower surface 30, and the side surface. 22A and 2nd interface LG2 arrange | positioned between inner surface 62A. In the example illustrated in FIGS. 2 and 3, the interface LG <b> 1 is disposed between the second surface 52 of the first porous member 44 and the surface of the substrate P.

  Next, a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The control device 7 makes the emission surface 23 of the projection optical system PL and the lower surface 30 of the liquid immersion member 4 face the surface of the substrate P (or the upper surface 26 of the substrate stage 2). The control device 7 executes the liquid LQ supply operation by the supply port 31, the liquid LQ recovery operation by the liquid recovery unit 32, and the liquid LQ recovery operation by the recovery port 33 in parallel, and the terminal optical element 22. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 23 and the substrate P facing the emission surface 23 is filled with the liquid LQ, and exposure of the substrate P is started.

  The control device 7 emits the exposure light EL from the illumination system IL, and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is emitted from the emission surface 23 of the projection optical system PL. The control device 7 irradiates the substrate P with the exposure light EL from the emission surface 23 via the projection optical system PL and the liquid LQ between the emission surface 23 and the surface of the substrate P. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  As described above, the exposure apparatus EX of the present embodiment is a scanning exposure apparatus, and the liquid LQ is held between the emission surface 23 and the substrate P in at least a part of the exposure of the substrate P. In a state where the immersion space LS is formed, the substrate P is moved in a predetermined direction in the XY plane. For example, during irradiation of exposure light EL to the substrate P (during scan exposure), the substrate P moves in the Y-axis direction with respect to the last optical element 22 and the liquid immersion member 4. Further, when sequentially exposing a plurality of shot areas on the substrate P, when the next second shot area is exposed after the exposure of the first shot area, the substrate P is placed on the last optical element 22 and the liquid immersion member 4. On the other hand, it moves (step movement), for example, in the X-axis direction or in an inclination direction with respect to the X-axis in the XY plane. Further, the movement is not limited to movement during scan exposure and step movement, and the substrate P may move under various movement conditions while holding the liquid LQ between the substrate P and the emission surface 23.

  The movement conditions of the substrate P are the movement speed, acceleration (deceleration), and movement distance (movement when moving from the first position to the second position in the XY plane) in a predetermined direction (for example, -Y direction) in the XY plane. At least one of (distance).

  In the present embodiment, since the first porous member 44 is disposed at a position close to the substrate P, for example, when the substrate P is moved at a high speed, moved at a high acceleration, and when the moving distance is increased. In addition, it is possible to prevent the liquid LQ from leaking out from the space between the liquid immersion member 4 and the substrate P or the liquid LQ (film, droplet, etc.) remaining on the substrate P.

  That is, since the gap G3 between the second surface 52 of the first porous member 44 and the surface of the substrate P is small, the liquid LQ in the immersion space LS between the lower surface 30 (second surface 52) and the surface of the substrate P The dimension of the interface LG1 (the dimension in the direction (Z direction) parallel to the normal to the surface of the substrate P) can be reduced. Accordingly, even when the substrate P is moved at a high speed, moved at a high acceleration, and when the moving distance is increased, the liquid LQ leaks from the space between the liquid immersion member 4 and the substrate P, the substrate It is possible to prevent the liquid LQ (film, droplet, etc.) from remaining on the P.

  For example, when the gap between the surface of the substrate P and the lower surface of the liquid immersion member is large and the dimension of the interface LG1 of the liquid LQ formed on the substrate P is large, the substrate P is moved at a high speed in a predetermined direction in the XY plane. In this case, the interface LG1 of the liquid LQ is likely to move with the substrate P, and the possibility of forming a film on the substrate P increases. As a result, the liquid LQ may leak from the space between the liquid immersion member and the surface of the substrate P, or may remain on the substrate P as a film, a droplet, or the like.

  In the present embodiment, the liquid recovery unit 32 is disposed away from the object (substrate P), but the gap G3 between the second surface 52 of the first porous member 44 and the surface of the substrate P is small, that is, the first. Since the dimension of the interface LG1 between the second surface 52 and the surface of the substrate P is reduced, leakage of the liquid LQ and the like can be suppressed.

  Further, since at least a part of the liquid LQ on the substrate P can flow into the space 56 through the opening 55, it is smoothly recovered by the liquid recovery part 32.

  Further, at least a part of the liquid LQ between the second surface 52 of the first porous member 44 and the surface of the substrate P can flow into the space 56 through the hole 46 of the first porous member 44. Therefore, in the radial direction with respect to the optical axis AX, the interface LG1 between the second surface 52 of the first porous member 44 and the surface of the substrate P is greatly separated from the optical axis AX, or the immersion space LS is enlarged in the XY plane. It is suppressed. In other words, even when the substrate P moves in a predetermined direction in the XY plane, at least a part of the liquid LQ between the second surface 52 of the first porous member 44 and the surface of the substrate P is the first porous member 44. Since the liquid flows into the space 56 through the hole 46, the interface LG1 between the first porous member 44 and the substrate P (the liquid LQ is restrained from moving (enlarging) in the predetermined direction. Further, the interface LG1. Even when the liquid LQ moves in the predetermined direction, at least a part of the liquid LQ can flow into the space 56 through the hole 46 of the first porous member 44. Therefore, the interface LG1 moved in the predetermined direction Since the liquid can be quickly returned in the reverse direction, leakage of the liquid LQ can be more effectively suppressed.

  In addition, as described above, in the present embodiment, since the liquid recovery unit 32 is disposed at a position farther from the object (substrate P) than the first porous member 44, the liquid recovery unit 32 is contaminated. Is suppressed.

  For example, when the second porous member 45 of the liquid recovery unit 32 is disposed at a position close to the surface of the substrate P, the possibility that the fourth surface 54 is contaminated increases. Further, when the fourth surface 54 is lyophilic with respect to the liquid LQ, for example, it is released from the substrate P during the exposure of the substrate P and mixed into the liquid LQ in the immersion space LS as contaminants (foreign matter, particles). There is a high possibility that the substance (for example, an organic substance such as a photosensitive material) adheres to the fourth surface 54 in contact with the liquid LQ. As a result, the possibility that the second porous member 45 is contaminated increases.

  In the present embodiment, since the second porous member 45 is disposed at a position farther from the substrate P than the first porous member 44, contamination of the second porous member 45 is suppressed. Further, since the contamination of the second porous member 45 is suppressed, the liquid recovery performance of the liquid recovery unit 32 is maintained.

  Further, since the contamination of the second porous member 45 is suppressed, only the liquid LQ can be sucked into the recovery channel 35 via the second porous member 45.

  Further, since the second porous member 45 is disposed away from the object (substrate P), it is possible to suppress the object (substrate P) from being contaminated due to the contamination of the second porous member 45.

  On the other hand, the surface of the first porous member 44 (at least one of the first surface 51, the second surface 52, and the inner surface of the hole 46) is liquid repellent with respect to the liquid LQ. Therefore, even if the first porous member 44 is disposed at a position close to the substrate P, it is possible to prevent contaminants from adhering to the surface of the first porous member 44. That is, since the surface of the first porous member 44 is liquid repellent, even if it contacts with the liquid LQ, contaminants present in the liquid LQ are suppressed from adhering to the surface of the first porous member 44.

  Even if contaminants adhere to the surface of the first porous member 44, the contaminants do not stay on the surface of the first porous member 44, but move away from the surface of the first porous member 44 and from the liquid recovery unit 32. There is a high possibility of recovery. Accordingly, it is possible to suppress the contaminants from continuously adhering to the surface of the first porous member 44 and the aggregation (growth) of the contaminants on the surface of the first porous member 44. Therefore, due to contamination of the first porous member 44, contaminants (foreign matter) adhere to the surface of the substrate P, adhere to the upper surface 26 of the substrate stage 2, or the liquid LQ supplied from the supply port 31 is removed. Contamination and movement on the optical path K of the exposure light EL are suppressed.

  In addition, since the first porous member 44 is disposed at a position where maintenance can be easily performed (cleanable and replaceable), when the first porous member 44 is contaminated, the first porous member 44 is smoothly moved. Can be maintained.

  As described above, it is possible to prevent the liquid LQ from leaking out or remaining on the surface of the object (substrate P or the like) facing the lower surface 30. Therefore, it is possible to suppress the occurrence of exposure failure while suppressing a decrease in throughput.

  In the present embodiment, the surface of the first porous member 44 (at least one of the first surface 51, the second surface 52, and the inner surface of the hole 46) may be lyophilic with respect to the liquid LQ. For example, the surface of the first porous member 44 is more lyophilic with respect to the liquid LQ according to the characteristics (material) of the substance that may be released from the substrate P. When the contamination of the first porous member 44 can be suppressed, the surface of the first porous member 44 may be lyophilic with respect to the liquid LQ.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 6 is a diagram illustrating an example of the liquid immersion member 4B according to the second embodiment. A characteristic part of the second embodiment different from the first embodiment is that the second surface 52B of the first porous member 44B is not arranged away from the liquid contact surface 61 on the lower surface 30B of the liquid immersion member 4B. It is in. That is, the opening (55) is not provided in the lower surface 30B of the liquid immersion member 4B according to the second embodiment.

  Also in this embodiment, since the gap G3 between the second surface 52B of the first porous member 44B and the surface of the substrate P is small, leakage of the liquid LQ and the like can be suppressed. In the present embodiment, the liquid LQ on the substrate P can flow into the space 56B between the first porous member 44B and the second porous member 45 through the hole 46B of the first porous member 44B. Therefore, the liquid recovery part 32 can recover the liquid LQ that has flowed into the space 56 through the hole 46B of the first porous member 44B. For example, by appropriately determining the number, size and position of the holes 46B of the first porous member 44B, the thickness of the first porous member 44B (distance between the first surface 51B and the second surface 52B), etc. The liquid LQ between the first porous member 44B and the substrate P can smoothly flow into the space 56B through the hole 46B of the first porous member 44B.

  In the present embodiment, the liquid immersion member 4B is not provided with the opening 55, and the liquid LQ on the object (substrate P) flows into the space 56B via the first porous member 44B. Contamination of the portion 32 (second porous member 45 can also be suppressed.

  In the present embodiment, the liquid immersion member 4B includes an air supply port 81 that supplies the gas GW to the gap G5. The air supply port 81 is disposed so as to face the gap G5. In the present embodiment, the air supply port 81 is disposed on the inner side surface 62A of the liquid immersion member 4B facing the side surface 22A of the last optical element 22. The inner side surface 62A is disposed around the side surface 22A and faces the side surface 22A via the gap G5.

  In the present embodiment, the air supply port 81 supplies a gas GW having a humidity higher than the humidity of the internal space 8 adjusted by the chamber device 5 to the gap G5. The air supply port 81 supplies the gas GW so that the gas GW contacts the interface LG2 of the liquid LQ that has flowed into the gap G5.

  The air supply port 81 is connected to a gas supply device (not shown) via the internal flow path of the liquid immersion member 4B. The gas supply device supplies a gas with higher humidity than the gas supplied from the chamber device 5 to the internal space 8 to the air supply port 81. In the present embodiment, the gas supply device supplies the same kind of gas as the gas in the internal space 8 to the air supply port 81. Further, the gas supply device humidifies the gas supplied to the supply port 81 with the same kind of liquid vapor as the liquid LQ. In the present embodiment, the chamber device 5 fills the internal space 8 with clean air, and the air supply port 81 supplies air humidified with water vapor to the gap G5.

  In the present embodiment, the liquid immersion member 4B includes a recovery port 82 that is disposed so as to face the gap G5 and recovers at least a part of the gas GW supplied from the air supply port 81. In the present embodiment, the recovery port 82 is disposed on the inner side surface 62A of the liquid immersion member 4B. Further, the recovery port 82 can recover the liquid LQ in the gap G5.

  In the present embodiment, the recovery port 82 is disposed above the air supply port 81. The recovery port 82 is disposed above the air supply port 81 and adjacent to the air supply port 81.

  Since the gas GW is supplied from the air supply port 81 so as to come into contact with the interface LG2 of the liquid LQ, the liquid LQ is suppressed from being vaporized. Therefore, it is possible to suppress the occurrence of at least one temperature change of the liquid LQ, the liquid immersion member 4B, and the object (substrate P) facing the liquid immersion member 4B due to the heat of vaporization of the liquid LQ.

  Further, at least a part of the gas GW supplied from the air supply port 81 is recovered from the recovery port 82. This suppresses the gas GW from the air supply port 81 from flowing out from between the liquid immersion member 4B and the projection optical system PL to the outside (atmosphere).

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 7 is a diagram illustrating an example of the liquid immersion member 4C according to the third embodiment. A characteristic part of the third embodiment different from the first and second embodiments is that a supply port 70 for supplying the liquid LQ is provided between the first porous member 44C and the second porous member 45.

  As shown in FIG. 7, the liquid immersion member 4 </ b> C includes a supply port 31 that supplies the liquid LQ to the optical path K of the exposure light EL, and a supply port 70 that is different from the supply port 31. The supply port 70 supplies the liquid LQ between the first porous member 44C and the second porous member 45. In the present embodiment, the liquid LQ supplied from the supply port 70 and the liquid LQ supplied from the supply port 31 are the same type of liquid.

  The liquid LQ supplied from the supply port 70 and the liquid LQ supplied from the supply port 31 may be different types of liquid. Further, the liquid LQ supplied from the supply port 70 and the liquid LQ supplied from the supply port 31 may be the same type of liquid and may have different temperatures or different degrees of cleanliness.

  Similar to the above-described embodiment, the first porous member 44C and the second porous member 45 are arranged such that the first surface 51C and the fourth surface 54 face each other with the first gap G1 therebetween. The supply port 70 supplies the liquid LQ to the space 56C (first gap G1) between the first porous member 44C and the second porous member 45.

  In the present embodiment, the supply port 70 is disposed in the vicinity of the outer edge 61E of the liquid contact surface 61 close to the second surface 52C (the inner edge 44E of the first porous member 44C). In the present embodiment, the liquid immersion member 4 </ b> C has an inner surface 71 that faces the space 56 </ b> C between the first porous member 44 </ b> C and the second porous member 45. The inner surface 71 includes a surface connecting the inner edge 39E (the inner edge 45E of the second porous member 45) close to the optical axis AX of the recovery port 39 and the outer edge 61E (44E) of the liquid contact surface 61. The supply port 70 is disposed on the inner surface 71. That is, in the present embodiment, the supply port 70 faces the radiation direction with respect to the optical axis AX (the direction away from the optical axis AX). In the present embodiment, the inner surface 71 is inclined upward toward the outer side in the radial direction with respect to the optical axis AX. The inner surface 71 may be parallel to the optical axis AX. In the present embodiment, the supply port 70 is disposed closer to the first porous member 44C than the second porous member 45 in the direction parallel to the optical axis AX.

  Also in the present embodiment, the second surface 52 </ b> C is not separated from the liquid contact surface 61. The liquid LQ on the substrate P can flow into the space 56C through the hole 46C of the first porous member 44C. Similar to the above-described embodiment, the liquid recovery unit 32 including the second porous member 45 recovers the liquid LQ in the space 56 </ b> C through the holes 47 of the second porous member 45. Thus, in the present embodiment, the liquid LQ between the second surface 52C and the surface of the substrate P is recovered in the recovery flow path 35 via the first porous member 44C and the second porous member 45. .

  In the present embodiment, the liquid LQ supplied from the supply port 70 has a flow in a direction away from the optical path K of the exposure light EL. That is, in the present embodiment, the supply port 70 supplies the liquid LQ toward the outside in the radial direction with respect to the optical axis AX.

  In the present embodiment, the supply port 70 supplies the liquid LQ in a direction substantially parallel to the XY plane. The supply port 70 may supply the liquid LQ on the outer side and the upper side in the radial direction with respect to the optical axis AX.

  In the present embodiment, the supply port 70 is disposed at a position where the liquid LQ that has flowed into the first gap G1 (space 56C) from above the substrate P through the hole 46C of the first porous member 44C can come into contact. As shown in FIG. 7, the supply port 70 is disposed at a position where the supply port 70 is immersed in the liquid LQ that has flowed into the first gap G1 through the hole 46C of the first porous member 44C.

  The supply port 70 promotes the flow of the liquid LQ from the first surface 51C of the first porous member 44C to the fourth surface 54 of the second porous member 45 by supplying the liquid LQ to the first gap G1.

  The supply port 70 is immersed in the liquid LQ flowing into the first gap G1 from above the substrate P through the hole 46C of the first porous member 44C (in contact with the liquid LQ), and liquid is supplied to the first gap G1. LQ is supplied. As a result, the liquid LQ that has flowed into the first gap G1 from above the substrate P flows smoothly toward the second porous member 45 of the liquid recovery unit 32.

  As described above, according to the present embodiment, the supply port 70 for supplying the liquid LQ is provided between the first porous member 44C and the second porous member 45C. The first porous member 44C and the second porous member 45C can be smoothly recovered. That is, when the supply port 70 supplies the liquid LQ, the liquid LQ that has flowed into the first gap G1 via the first porous member 44C can be satisfactorily sent to the liquid recovery unit 32. Therefore, it is possible to recover the liquid LQ satisfactorily while suppressing the movement (expansion) of the interface LG1 (liquid LQ) between the first porous member 44C and the substrate P.

  In the third embodiment, the second surface 52C may be disposed away from the liquid contact surface 61. That is, the opening 55 may be provided between the liquid contact surface 61 and the second surface 52C.

  In the second and third embodiments described above, when the outflow of the gas GW to the internal space 8 (atmosphere) is allowed, the recovery port 82 may not be provided.

  Also in the second and third embodiments described above, it is not necessary to provide the air supply port 81 and the recovery port 82 as in the first embodiment.

  Note that the air supply port 81 or the air supply port 81 and the recovery port 82 may be provided in the liquid immersion member 4 of the first embodiment described above.

  In the first to third embodiments described above, the shapes of the holes 46 (46B, 46C) and the holes 47 are substantially circular, but may be polygons such as hexagons and octagons. Further, the shape of the hole 46 (46B, 46C) may be different from the shape of the hole 47. A plurality of holes having different shapes may exist in one porous member.

  In the first to third embodiments described above, the recovery port 33 may be omitted.

  In the first to third embodiments described above, the flat portion facing the first porous member (51, 51B, 51C) is provided outside the liquid recovery portion 32 (second porous member 45) with respect to the optical axis AX. Is provided. That is, in the present embodiment, the upper surface of the space 56 includes the lower surface 54 of the second porous member 45 and a flat portion around it, but no flat portion is provided around the lower surface 54 of the second porous member 45. In addition, the upper surface of the space 56 may be formed only by the lower surface 54 of the second porous member 45.

  In the first to third embodiments, the liquid recovery unit 39 recovers only the liquid LQ from the space (56, 56B, 56C) through the second porous member 45 into the recovery channel 35. Although the pressure of the flow path 35 is adjusted, the pressure of the recovery flow path 35 may be adjusted so that the liquid LQ flows into the recovery flow path 35 together with the gas via the second porous member 45.

  In each of the above-described embodiments, the optical path on the exit side (image plane side) of the terminal optical element 22 of the projection optical system PL is filled with the liquid LQ. For example, this is disclosed in International Publication No. 2004/019128. As described above, it is possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 22 is also filled with liquid. The liquid filled in the optical path on the incident side of the last optical element 22 may be the same type of liquid as the liquid LQ, or may be a different type of liquid.

  In addition, although the liquid LQ of each above-mentioned embodiment is water, liquids other than water may be sufficient. For example, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, or the like can be used as the liquid LQ. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  Further, for example, as disclosed in US Pat. No. 6,897,963, US Patent Application Publication No. 2007/0127006, etc., a reference stage on which a reference mark is formed, and / or a substrate stage for holding a substrate, and / or The present invention can also be applied to an exposure apparatus that includes various photoelectric sensors and a measurement stage that does not hold a substrate to be exposed. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above-described embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in Japanese Patent No. 6778257, a variable shaped mask (also known as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. May be used). The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. Even when the projection optical system PL is not used in this way, the exposure light is irradiated onto the substrate via an optical member such as a lens, and an immersion space is formed in a predetermined space between the optical member and the substrate. It is formed.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX of the present embodiment maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 8, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate which is a base material of the device. Manufacturing step 203, substrate processing step 204 including exposing the substrate with exposure light using a mask pattern according to the above-described embodiment, and developing the exposed substrate, device assembly step (dicing process, (Including processing processes such as a bonding process and a packaging process) 205, an inspection step 206, and the like.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 1 ... Mask stage, 2 ... Substrate stage, 5 ... Chamber apparatus, 8 ... Internal space, 22 ... Terminal optical element, 23 ... Ejection surface, 30 ... Lower surface, 31 ... Supply port, 32 ... Liquid recovery part, 35 ... Recovery flow 41, liquid recovery device, 44 ... first porous member, 45 ... second porous member, 46 ... hole, 47 ... hole, 51 ... first surface, 52 ... second surface, 53 ... third surface, 54 ... 4th surface, 61 ... liquid contact surface, 70 ... supply port, AX ... optical axis, EL ... exposure light, EX ... exposure apparatus, K ... optical path, P ... substrate, PL ... projection optical system, LG1 ... interface, LG2 ... Interface, LQ ... Liquid, LS ... Immersion space

Claims (33)

A liquid recovery system used for immersion exposure in which a substrate is exposed with exposure light through a liquid,
A first surface, a second surface facing in a different direction from the first surface, and a first porous member having a plurality of holes connecting the first surface and the second surface;
A liquid recovery part at least partially facing the first surface via the first gap,
The liquid recovery part can recover the liquid that has flowed into the first gap from between the second surface and the object through the hole of the first porous member, and the liquid on the object can be recovered from the first surface. A liquid recovery system capable of recovering without passing through the holes of the porous member.   The liquid recovery system according to claim 1, wherein the liquid on the object has an opening through which the liquid can flow into the first gap without passing through the hole of the first porous member. A liquid contact surface disposed around the optical path of the exposure light;
The second surface is disposed at least partially around the liquid contact surface and away from the liquid contact surface;
The liquid recovery system according to claim 1, wherein the liquid recovery unit is capable of recovering the liquid on the object from between the liquid contact surface and the second surface.   The liquid recovery system according to claim 3, wherein the second surface and the liquid recovery surface are arranged in substantially the same plane.   The liquid recovery system according to claim 1, wherein the second surface is liquid repellent with respect to the liquid.   The liquid recovery system according to claim 1, wherein the first surface is liquid repellent with respect to the liquid. The liquid recovery part includes a second porous member,
The liquid recovery system according to any one of claims 1 to 6, wherein at least a part of the liquid that has contacted the second porous member is recovered through the holes of the second porous member. The liquid recovery unit includes a recovery flow path for recovering a liquid,
The second porous member has a third surface facing the recovery channel, a fourth surface facing a different direction from the third surface, and opposed to the first surface via the first gap, and the third The liquid recovery system according to claim 7, further comprising a plurality of holes connecting a surface and the fourth surface. A pressure adjusting device for adjusting the pressure of the recovery flow path;
The liquid recovery system according to claim 8, wherein the pressure adjusting device adjusts the pressure of the recovery channel so that only the liquid is sucked into the recovery channel.   The pressure in the space between the liquid recovery part and the first porous member is higher than the pressure in the recovery flow path and is approximately equal to the pressure in the space on the second surface side or the pressure in the space on the second surface side. 10. A liquid recovery system according to claim 9 lower.   The liquid recovery system according to claim 7, wherein the hole of the first porous member is larger than the hole of the second porous member.   The liquid recovery according to any one of claims 7 to 11, wherein a dimension of the gap between the first porous member and the second porous member is larger than a dimension of the gap between the first porous member and the object. system.   The liquid recovery system according to claim 1, further comprising a first supply port that supplies a liquid between the liquid recovery unit and the first porous member. A liquid recovery system used for immersion exposure in which a substrate is exposed with exposure light through a liquid,
A recovery channel for recovering the liquid;
A first surface, a second surface facing in a different direction from the first surface, and a first porous member having a plurality of holes connecting the first surface and the second surface;
A third surface, a fourth surface facing in a direction different from the third surface, and a plurality of holes connecting the third surface and the fourth surface, the third surface facing the recovery flow path, A second porous member in which at least a part of the fourth surface opposes the first surface via a first gap;
A first supply port for supplying a liquid between the first porous member and the second porous member,
A liquid recovery system for recovering a liquid between the second surface and the object via the first porous member and the second porous member. A liquid contact surface disposed around the optical path of the exposure light;
The liquid recovery system according to claim 14, wherein the second surface is disposed on at least a part of the periphery of the liquid contact surface.   The liquid recovery system according to claim 15, wherein the second surface and the liquid contact surface are disposed in substantially the same plane. The liquid contact surface has an edge close to the second surface;
The liquid recovery system according to claim 15 or 16, wherein the first supply port is disposed in the vicinity of the edge of the liquid contact surface.   The liquid recovery system according to any one of claims 14 to 17, wherein the liquid supplied from the first supply port has a flow toward a direction away from an optical path of the exposure light.   The said 1st supply port is arrange | positioned in the position which the liquid which flowed into the said 1st gap from the said object through the hole of the said 1st porous member can contact. Liquid recovery system.   The said 1st supply port accelerates | stimulates the flow of the liquid from the said 1st surface of the said 1st porous member to the said 4th surface of the said 2nd porous member by supplying a liquid to the said 1st gap. The liquid recovery system according to any one of 14 to 19.   The liquid recovery system according to any one of claims 13 to 20, wherein the second surface is liquid repellent with respect to the liquid.   The liquid recovery according to any one of claims 14 to 21, wherein the second surface is more repellent to the liquid than at least one of the first surface, the third surface, and the fourth surface. system.   The liquid recovery system according to any one of claims 14 to 22, wherein the first surface is liquid repellent with respect to the liquid. A pressure adjusting device for adjusting the pressure of the recovery flow path;
The liquid recovery system according to any one of claims 14 to 23, wherein the pressure adjusting device adjusts the pressure of the recovery channel so that only the liquid is sucked into the recovery channel.   The pressure in the space between the first porous member and the second porous member is higher than the pressure in the recovery flow path and is substantially equal to the pressure in the space on the second surface side or in the space on the second surface side. The liquid recovery system of claim 24, wherein the liquid recovery system is lower than the pressure.   The liquid recovery system according to any one of claims 14 to 25, wherein the hole of the first porous member is larger than the hole of the second porous member.   27. The liquid recovery according to any one of claims 14 to 26, wherein a dimension of a gap between the first porous member and a second porous member is larger than a dimension of a gap between the first porous member and the object. system.   The liquid recovery system according to claim 1, wherein the object includes the substrate. An exposure apparatus that exposes a substrate with exposure light through a liquid,
An exposure apparatus comprising the liquid recovery system according to any one of claims 1 to 28. An optical member having an exit surface for emitting the exposure light;
30. An exposure apparatus according to claim 29, further comprising: a second supply port that supplies the liquid to an optical path of exposure light emitted from an emission surface of the optical member. Exposing the substrate using the exposure apparatus of claim 29 or 30,
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a liquid,
Filling an optical path between the exit surface of the optical member that emits the exposure light and the substrate facing the exit surface with a liquid;
Irradiating the substrate with the exposure light via the optical member and the liquid;
An exposure method comprising: recovering a liquid on the substrate using the liquid recovery system according to claim 1. Exposing the substrate using the exposure method of claim 32;
Developing the exposed substrate. A device manufacturing method.

Images