JP2011159865A - Liquid immersion member, immersion lithography apparatus, exposure method and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid immersion member capable of suppressing the occurrence of an exposure defect. <P>SOLUTION: The liquid immersion member forms a liquid immersion space by holding a first liquid between the member and an object so that the optical path of an exposure light irradiated to the object is filled with the first liquid. The liquid immersion member includes a recovery opening for recovering at least part of the first liquid on the object, a supply opening arranged outside of the recovery opening to the optical path for supplying a second liquid when facing the first liquid and not supplying the second liquid when not facing the first liquid, a recovery flow channel in which at least part of the first liquid recovered from the recovery opening flows, a supply flow channel in which at least part of the second liquid supplied to the supply opening flows, and a connecting flow channel which connects at least part of the recovery flow channel and the supply flow channel. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a liquid immersion member, an exposure apparatus, an exposure method, and a device manufacturing method.

  As an exposure apparatus used in a photolithography process, for example, an immersion exposure apparatus that exposes a substrate with exposure light via a liquid as disclosed in the following patent document is known.

US Patent Application Publication No. 2008/266533 US Patent Application Publication No. 2005/018155

  In an immersion exposure apparatus, when an immersion area is formed on an object such as a substrate, for example, when the object is moved at high speed, the liquid flows out or the liquid (film, droplet, etc.) remains on the object. There is a possibility of doing. As a result, an exposure failure may occur or a defective device may occur. On the other hand, when the object is moved at a low speed in order to hold the liquid satisfactorily, the throughput may be reduced.

  An object of an aspect of the present invention is to provide a liquid immersion member, an exposure apparatus, and an exposure method that can suppress the occurrence of exposure failure. Another object of the present invention is to provide a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, the liquid immersion that forms the immersion space by holding the first liquid with the object so that the optical path of the exposure light applied to the object is filled with the first liquid. A recovery port that recovers at least a part of the first liquid on the object, and is disposed outside the recovery port with respect to the optical path, and supplies the second liquid when facing the first liquid; A supply port that does not supply the second liquid when it does not face one liquid, a recovery channel through which at least a part of the first liquid recovered from the recovery port flows, and at least a part of the second liquid supplied to the supply port A liquid immersion member is provided that includes a supply flow path through which the liquid flows and a connection flow path connecting at least a part of the recovery flow path and the supply flow path.

  According to a second aspect of the present invention, there is provided an exposure apparatus that exposes a substrate with exposure light through a first liquid, the exposure apparatus including the liquid immersion member of the first aspect.

  According to a third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate using the exposure apparatus according to the second aspect and developing the exposed substrate.

  According to the fourth aspect of the present invention, there is provided an exposure method for exposing a substrate with exposure light through a first liquid, wherein the optical path of the exposure light between the exit surface of the optical member and the surface of the substrate is first. Forming an immersion space so as to be filled with liquid; irradiating the substrate with exposure light from the exit surface via the first liquid in the immersion space; and first liquid in the immersion space outside the optical path. The second liquid is supplied from the supply port when the supply port arranged outside the recovery port faces the first liquid with respect to the optical path. The second liquid is not supplied from the supply port when it does not face one liquid, and at least one of the second liquid supplied to the recovery channel and the supply port through which at least a part of the first liquid recovered from the recovery port flows. Through the connection flow path connecting the supply flow path through which the part flows between the supply flow path and the recovery flow path. And that at least one liquid and the second liquid flows, the exposure method comprising is provided.

  According to a fifth aspect of the present invention, there is provided a device manufacturing method comprising: exposing a substrate using the exposure method of the fourth aspect; and developing the exposed substrate.

  According to the aspect of the present invention, it is possible to suppress the occurrence of exposure failure. Moreover, according to the aspect of the present invention, the occurrence of defective devices can be suppressed.

It is a schematic block diagram which shows an example of the exposure apparatus which concerns on this embodiment. It is a sectional side view which shows the vicinity of the liquid immersion member which concerns on this embodiment. It is the figure which looked at the liquid immersion member concerning this embodiment from the lower surface side. FIG. 5 is a side sectional view showing a part of the liquid immersion member according to the present embodiment. It is a schematic diagram for demonstrating the liquid supply principle which concerns on this embodiment. It is a schematic diagram which shows the liquid immersion member which concerns on a comparative example. It is a schematic diagram which shows an example of operation | movement of the liquid immersion member which concerns on this embodiment. It is a schematic diagram which shows an example of operation | movement of the liquid immersion member which concerns on this embodiment. It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

    Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid. As will be described later, in the present embodiment, the first liquid LQ1 and the second liquid LQ2 are used as the liquid, and the exposure light EL is applied to the substrate P through the first liquid LQ1. In the present embodiment, water (pure water) is used as the first liquid LQ1. In the following description, the first liquid LQ1 and the second liquid LQ2 are collectively referred to as a liquid LQ as appropriate.

    In FIG. 1, an exposure apparatus EX optically positions a mask stage 1 that can move while holding a mask M, a substrate stage 2 that can move while holding a substrate P, and the positions of the mask stage 1 and the substrate stage 2. Interferometer system 3 for measuring, illumination system IL for illuminating mask M with exposure light EL, projection optical system PL for projecting a pattern image of mask M illuminated with exposure light EL onto substrate P, and exposure light EL The liquid immersion member 4 capable of forming the liquid immersion space LS so that at least a part of the optical path is filled with the first liquid LQ1, and the control device 5 for controlling the operation of the entire exposure apparatus EX. Further, the exposure apparatus EX includes a chamber apparatus 100 that controls at least the environment (at least one of pressure, temperature, humidity, and cleanness) of a space in which the substrate P irradiated with the exposure light EL is disposed. In the present embodiment, at least a part of the illumination system IL, the mask stage 1, the projection optical system PL, the liquid immersion member 4, and the substrate stage 2 are arranged in a space 100S formed by the chamber apparatus 100.

    The mask M includes a reticle on which a device pattern projected onto the substrate P is formed. The mask M includes a transmission type mask having a transparent plate such as a glass plate and a pattern formed on the transparent plate using a light shielding material such as chromium. A reflective mask can also be used as the mask M.

    The substrate P is a substrate for manufacturing a device. The substrate P includes, for example, a base material such as a semiconductor wafer and a multilayer film formed on the base material. The multilayer film is a film in which a plurality of films including at least a photosensitive film are stacked. The photosensitive film is a film formed of a photosensitive material. Further, the multilayer film may include, for example, an antireflection film and a protective film (topcoat film) that protects the photosensitive film.

The illumination system IL irradiates the predetermined illumination area IR with the exposure light EL. The illumination area IR includes a position where the exposure light EL emitted from the illumination system IL can be irradiated. The illumination system IL illuminates at least a part of the mask M arranged in the illumination region IR with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, far ultraviolet light (DUV light) such as bright lines (g line, h line, i line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, ArF Excimer laser light (wavelength 193 nm), vacuum ultraviolet light (VUV light) such as F ₂ laser light (wavelength 157 nm), or the like is used. In the present embodiment, ArF excimer laser light, which is ultraviolet light (vacuum ultraviolet light), is used as the exposure light EL.

    The mask stage 1 has a mask holding unit 6 that holds the mask M in a releasable manner, and can move on the guide surface 8 of the first surface plate 7 while holding the mask M. The mask stage 1 can move while holding the mask M with respect to the illumination region IR by the operation of the drive system 9. The drive system 9 includes a planar motor having a mover 9 </ b> A disposed on the mask stage 1 and a stator 9 </ b> B disposed on the first surface plate 7. A flat motor capable of moving the mask stage 1 is disclosed in, for example, US Pat. No. 6,452,292. The mask stage 1 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 9.

    The projection optical system PL irradiates the predetermined projection region PR with the exposure light EL. The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. A plurality of optical elements of the projection optical system PL are held by a holding member (lens barrel) 10. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z axis. The projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

    The projection optical system PL has an exit surface 11 that emits the exposure light EL toward the image plane of the projection optical system PL. Of the plurality of optical elements of the projection optical system PL, the terminal optical element 12 closest to the image plane of the projection optical system PL has the exit surface 11. The projection region PR includes a position where the exposure light EL emitted from the emission surface 11 can be irradiated. In the present embodiment, the emission surface 11 faces the −Z direction (downward) and is parallel to the XY plane. The exit surface 11 facing the −Z direction may be a convex surface or a concave surface.

    In the present embodiment, the optical axis AX in the vicinity of the image plane of the projection optical system PL, that is, the optical axis AX of the terminal optical element 12 is substantially parallel to the Z axis. Note that the optical axis defined by the optical element adjacent to the terminal optical element 12 may be regarded as the optical axis of the terminal optical element 12. In the present embodiment, the image plane of the projection optical system PL is substantially parallel to the XY plane including the X axis and the Y axis. In the present embodiment, the image plane is substantially horizontal. However, the image plane may not be parallel to the XY plane or may be a curved surface.

  The substrate stage 2 is movable to a position (projection region PR) where the exposure light EL emitted from the emission surface 11 can be irradiated. The substrate stage 2 has a substrate holding part 13 that holds the substrate P in a releasable manner, and is movable on the guide surface 15 of the second surface plate 14. The substrate stage 2 can move while holding the substrate P with respect to the projection region PR by the operation of the drive system 16. The drive system 16 includes a planar motor having a mover 16 </ b> A disposed on the substrate stage 2 and a stator 16 </ b> B disposed on the second surface plate 14. A flat motor capable of moving the substrate stage 2 is disclosed in, for example, US Pat. No. 6,452,292. The substrate stage 2 can be moved in six directions, that is, the X axis, the Y axis, the Z axis, the θX, the θY, and the θZ directions by the operation of the drive system 16.

    The substrate stage 2 has an upper surface 17 that is disposed around the substrate holding unit 13 and that can face the emission surface 11. In the present embodiment, the substrate stage 2 is disposed at least at a part of the periphery of the substrate holding portion 13 as disclosed in US Patent Application Publication No. 2007/0177125 and the like, and the lower surface of the plate member T is disposed on the lower surface of the plate member T. It has the plate member holding part 18 hold | maintained so that release is possible. In the present embodiment, the upper surface 17 of the substrate stage 2 includes the upper surface of the plate member T. The upper surface 17 is flat. Note that the plate member T may not be releasable. In that case, the plate member holding part 18 can be omitted.

    In the present embodiment, the substrate holding unit 13 can hold the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The plate member holding portion 18 can hold the plate member T so that the upper surface 17 of the plate member T and the XY plane are substantially parallel.

    The interferometer system 3 optically measures the position of the first interferometer unit 3A capable of optically measuring the position of the mask stage 1 (mask M) in the XY plane and the position of the substrate stage 2 (substrate P) in the XY plane. And a second interferometer unit 3B capable of measuring. When executing the exposure process of the substrate P or when executing a predetermined measurement process, the control device 5 operates the drive systems 9 and 16 on the basis of the measurement result of the interferometer system 3, and the mask stage 1 (mask M) and position control of the substrate stage 2 (substrate P) are executed.

    The liquid immersion member 4 is disposed at least at a part around the optical path of the exposure light EL. In the present embodiment, at least a part of the liquid immersion member 4 is disposed at least at a part around the terminal optical element 12. The liquid immersion member 4 is ejected from the emission surface 11 and is exposed to the object so that the optical path K of the exposure light EL irradiated to the object disposed at a position facing the emission surface 11 is filled with the first liquid LQ1. In this way, the liquid immersion space LS is formed while holding the first liquid LQ1. The immersion space LS is a portion (space, region) filled with the liquid LQ. The immersion space LS is formed so that the optical path K of the exposure light EL between the emission surface 11 and the object is filled with the first liquid LQ1.

  In the present embodiment, the object that can form the immersion space LS with the liquid immersion member 4 includes an object that can move to a position where the exposure light EL emitted from the emission surface 11 can be irradiated. In the present embodiment, the object includes at least one of the substrate stage 2 (plate member T) and the substrate P held on the substrate stage 2. During the exposure of the substrate P, the liquid immersion member 4 forms the liquid immersion space LS so that the optical path of the exposure light EL between the last optical element 12 and the substrate P is filled with the first liquid LQ1.

  The liquid immersion member 4 has a lower surface 20 that can face the surface of an object disposed at a position facing the emission surface 11. The lower surface 20 is disposed on at least a part of the periphery of the optical path K of the exposure light EL emitted from the emission surface 11. In the present embodiment, at least a part of the lower surface 20 is substantially parallel to the XY plane. The lower surface 20 holds the first liquid LQ1 with the surface of the object so that the optical path K is filled with the first liquid LQ1. The first liquid LQ1 is held between at least a part of the lower surface 20 and the surface (upper surface) of the object to form an immersion space LS.

  In this embodiment, when the exposure light EL is irradiated to the substrate P, the immersion space LS is formed so that a partial region on the surface of the substrate P including the projection region PR is covered with the liquid LQ. At least a part of the gas-liquid interface (meniscus, edge) LG of the liquid LQ is formed between the lower surface 20 of the liquid immersion member 4 and the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a local liquid immersion method.

    The exposure apparatus EX of the present embodiment is a scanning exposure apparatus (so-called scanning stepper) that projects an image of the pattern of the mask M onto the substrate P while synchronously moving the mask M and the substrate P in a predetermined scanning direction. At the time of exposure of the substrate P, the control device 5 controls the mask stage 1 and the substrate stage 2 so that the mask M and the substrate P intersect with the optical axis AX (the optical path K of the exposure light EL) in a predetermined XY plane. Move in the scanning direction. In the present embodiment, the scanning direction (synchronous movement direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous movement direction) of the mask M is also the Y-axis direction. The control device 5 moves the substrate P in the Y-axis direction with respect to the projection region PR of the projection optical system PL, and in the illumination region IR of the illumination system IL in synchronization with the movement of the substrate P in the Y-axis direction. On the other hand, the substrate P is irradiated with the exposure light EL through the projection optical system PL and the first liquid LQ1 in the immersion space LS on the substrate P while moving the mask M in the Y-axis direction. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL.

  Next, the liquid immersion member 4 will be described. 2 is a side cross-sectional view showing the vicinity of the liquid immersion member 4, FIG. 3 is a view of the liquid immersion member 4 seen from the lower surface 20, and FIG. 4 is a side cross-sectional view showing a part of the liquid immersion member 4. . In the following description, the case where the object disposed at the position facing the emission surface 11 is the substrate P will be described as an example. However, as described above, the object is disposed at the position facing the emission surface 11. The object may be another member such as the substrate stage 2 (plate member T).

  2, 3, and 4, the liquid immersion member 4 includes a first supply port 21 that supplies the first liquid LQ <b> 1 and a recovery port 23 that recovers at least a part of the first liquid LQ <b> 1 in the liquid immersion space LS. And a second supply port 22 disposed outside the recovery port 23 with respect to the optical path K and capable of supplying the second liquid LQ2.

  In the present embodiment, the second liquid LQ2 is the same type as the first liquid LQ1. In the present embodiment, water (pure water) is used as the second liquid LQ2.

  The first supply port 21 supplies the first liquid LQ1 to the optical path K in at least part of the exposure of the substrate P. The recovery port 23 recovers at least a part of the first liquid LQ1 on the substrate P in at least a part of the exposure of the substrate P. The second supply port 22 supplies the second liquid LQ2 when facing the first liquid LQ1, and does not supply the second liquid LQ2 when not facing the first liquid LQ1.

  The liquid immersion member 4 includes at least one of the first liquid supply channel 24A through which at least a part of the first liquid LQ1 supplied to the first supply port 21 flows and the first liquid LQ1 recovered from the recovery port 23. A liquid recovery channel 26A through which the liquid flows, a second liquid supply channel 28A through which at least a part of the second liquid LQ2 supplied to the second supply port 22 flows, at least a part of the liquid recovery channel 26A and the second. A connection flow path 60 connecting the liquid supply flow path 28A is provided. The first liquid supply channel 24A, the liquid recovery channel 26A, the second liquid supply channel 28A, and the connection channel 60 are formed inside the liquid immersion member 4.

  In the present embodiment, the first supply port 21 is an opening at the end of the first liquid supply channel 24A. The recovery port 23 is an opening at the end of the liquid recovery flow path 26A. The second supply port 22 is an opening at the end of the second liquid supply channel 28A.

  In the present embodiment, the liquid immersion member 4 includes a partition wall 61 disposed between the liquid recovery channel 26A and the second liquid supply channel 28A. The connection channel 60 is an opening formed in at least a part of the partition wall 61. In the present embodiment, the second liquid supply channel 28A is disposed outside the liquid recovery channel 26A with respect to the radial direction with respect to the optical path K. The partition wall 61 has an inner surface 61A facing the liquid recovery channel 26A and an outer surface 61B facing the second liquid supply channel 28A. The connection channel 60 is formed at a predetermined position of the partition wall 61 so as to connect the inner surface 61A and the outer surface 61B. In the present embodiment, the connection channel 60 is formed in the vicinity of the lower end of the partition wall 61.

  In the present embodiment, a plurality of connection flow paths 60 are arranged around the optical path K (liquid recovery flow path 26 </ b> A) at intervals. In the present embodiment, the shape of the end portion of the connection channel 60 facing the liquid recovery channel 26A (second liquid supply channel 28A) is circular. The shape of the end portion may be a rectangle or a slit shape long in the circumferential direction of the optical path K. Further, the connection channel 60 may be formed in a slit shape so as to surround the optical path K.

  The liquid immersion member 4 has an opening 4K at a position facing the emission surface 11. The exposure light EL emitted from the emission surface 11 can pass through the opening 4K and irradiate the substrate P. The liquid immersion member 4 has a flat surface 4T that is disposed around the opening 4K and can face the surface of the substrate P. The flat surface 4T holds the first liquid LQ1 with the surface of the substrate P. At least a part of the lower surface 20 of the liquid immersion member 4 includes a flat surface 4T.

  The first supply port 21 supplies the first liquid LQ1 for forming the immersion space LS. The first supply port 21 is arranged at a predetermined portion of the liquid immersion member 4 so as to face the optical path K in the vicinity of the optical path K.

  The recovery port 23 is disposed at least at a part around the optical path K of the exposure light EL irradiated to the substrate P. The recovery port 23 can recover at least a part of the liquid LQ on the substrate P facing the lower surface 20 of the liquid immersion member 4. The recovery port 23 can face the surface of the substrate P. The recovery port 23 recovers the liquid LQ on the substrate P. The recovery port 23 is disposed at a predetermined portion of the liquid immersion member 4 that can face the surface of the substrate P. In the present embodiment, the recovery port 23 is disposed outside the first supply port 21 with respect to the optical path K. In the present embodiment, the recovery port 23 is disposed around the flat surface 4T.

  The second supply port 22 is disposed in at least a part of the periphery of the optical path K of the exposure light EL irradiated to the substrate P. The second supply port 22 supplies the second liquid LQ2 when facing the first liquid LQ1 supplied from the first supply port 21, and does not supply the second liquid LQ2 when not facing the first liquid LQ1. The surface of the substrate P can be opposed to the second supply port 22. The second supply port 22 supplies the second liquid LQ2 when facing the first liquid LQ1 on the substrate P, and does not supply the second liquid LQ2 when not facing the first liquid LQ1. In the present embodiment, the second supply port 22 is disposed at a predetermined portion of the liquid immersion member 4 that can face the surface of the substrate P. In the present embodiment, the second supply port 22 is disposed outside the recovery port 23 with respect to the optical path K. In the present embodiment, the second supply port 22 is disposed around the collection port 23. The recovery port 23 is disposed between the optical path K and the second supply port 22.

  The first supply port 21 is connected to the first liquid supply device 25 via a first liquid supply channel 24A and a channel 24B formed by the first supply pipe. The recovery port 23 is connected to the liquid recovery device 27 via a liquid recovery flow path 26A and a flow path 26B formed by a recovery pipe. The second supply port 22 is connected to the second liquid supply device 29 via a second liquid supply channel 28A and a channel 28B formed by the second supply rod.

  In the following description, the first liquid supply channel 24A and the channel 24B are collectively referred to as the first supply channel 24, and the liquid recovery channel 26A and the channel 26B are collectively referred to as the recovery channel. 26, and the second liquid supply flow path 28A and the flow path 28B are collectively referred to as the second supply flow path 28 as appropriate.

  The first liquid supply device 25 can deliver the clean and temperature-adjusted first liquid LQ1. The first liquid LQ1 delivered from the first liquid supply device 25 is supplied to the first supply port 21 via the first supply flow path 24.

  The liquid recovery device 27 includes a pressure adjustment device 27P that can adjust the pressure of the recovery flow path 26. The pressure adjusting device 27P can connect the recovery channel 26 to a vacuum system, for example, and can reduce the pressure of the recovery channel 26. The pressure adjusting device 27P may include a vacuum system. Further, the recovery flow path 26 may be connected to a pressure pump so that the pressure of the recovery flow path 26 can be increased. The liquid recovery device 27 can suck the liquid LQ through the recovery port 23 by reducing the pressure of the recovery flow path 26 using the pressure adjusting device 27P. The liquid LQ recovered from the recovery port 23 is recovered by the liquid recovery device 27 via the recovery channel 26.

  In the present embodiment, the control device 5 executes the recovery operation of the liquid LQ from the recovery port 23 in parallel with the supply operation of the first liquid LQ1 from the first supply port 21, thereby terminating the terminal on one side. A liquid immersion space LS can be formed with the liquid LQ (first liquid LQ1) between the optical element 12 and the liquid immersion member 4 and the object (substrate P) on the other side.

  The second liquid supply device 29 can deliver the clean and temperature-adjusted second liquid LQ2. The second liquid LQ <b> 2 delivered from the second liquid supply device 29 is supplied to the second supply port 22 via the second supply channel 28.

  The second liquid supply device 29 includes a pressure adjustment device 29P that can adjust the pressure of the second supply flow path 28. For example, the pressure adjusting device 29P can connect the second supply flow path 28 to a pressure pump, and can increase the pressure of the second supply flow path 28. Note that the pressure adjusting device 27P may include a pressurizing pump. Further, the second supply channel 28 may be connected to a vacuum system so that the pressure of the second supply channel 28 can be reduced. The second liquid supply device 29 can supply the second liquid LQ2 from the second supply port 22 by adjusting the pressure of the second supply flow path 28 using the pressure adjusting device 29P.

  In the present embodiment, the porous member 50 is disposed in the opening (recovery port) 23 at the end of the liquid recovery channel 26A. The porous member 50 is a plate-like member including a plurality of holes (openings or pores). Note that a mesh filter, which is a porous member in which a large number of small holes are formed in a mesh shape, may be disposed in the opening (recovery port) 23. In the present embodiment, the lower surface 20 of the liquid immersion member 4 includes the surface (lower surface) of the porous member 50. In at least part of the exposure of the substrate P, the lower surface of the porous member 50 faces the substrate P. In the present embodiment, the recovery port 23 includes an end portion of the hole 36 of the porous member 50 facing the substrate P. The liquid LQ on the substrate P is collected through the hole 36 of the porous member 50.

  In the present embodiment, the porous member 30 is disposed in the opening (second supply port) 22 at the end of the second liquid supply channel 28A. The porous member 30 is a plate-like member including a plurality of holes (openings or pores). A mesh filter that is a porous member in which a large number of small holes are formed in a mesh shape may be disposed in the opening (second supply port) 22. In the present embodiment, the lower surface 20 of the liquid immersion member 4 includes the surface (lower surface) of the porous member 30. In at least part of the exposure of the substrate P, the lower surface of the porous member 30 faces the substrate P. In the present embodiment, the second supply port 22 includes an end portion of the hole 33 of the porous member 30 facing the substrate P. When the first liquid LQ1 on the substrate P is disposed so as to face the hole 33 of the porous member 30, the second liquid LQ2 passes through the hole 33 of the porous member 30 and the lower surface 20 of the liquid immersion member 4. It is supplied to the space SP between the surface of the substrate P.

  In the present embodiment, the inner surface 33S of the hole 33 of the porous member 30 is liquid repellent with respect to the liquid LQ. In the present embodiment, the porous member 30 is made of titanium, and the inner surface 33S is subjected to a liquid repellent treatment that improves liquid repellency. In the present embodiment, the liquid repellent treatment includes a treatment (for example, a coating treatment) for forming a film of a liquid repellent material on the inner surface 33S. In the present embodiment, the inner surface 33S is formed by the surface of a polytetrafluoroethylene (PFA) or polytetrafluoroethylene (PTFE) film.

  2 and 4, the substrate P is almost stationary. In the present embodiment, when the substrate P is substantially stationary, the gas-liquid interface of the liquid LQ (first liquid LQ1) in the immersion space LS between the lower surface 20 of the liquid immersion member 4 and the surface of the substrate P. LG is disposed between the lower surface of the porous member 50 and the surface of the substrate P. 2 and 4, the first liquid LQ1 does not face the second supply port 22 (the hole 33 of the porous member 30). In the state shown in FIGS. 2 and 4, the second supply port 22 does not supply the second liquid LQ2.

  Next, the principle of the liquid supply operation using the second supply port 22 will be described. As described above, in the present embodiment, the second supply port 22 includes the end of the hole 33 of the porous member 30 and supplies the second liquid LQ2 when facing the first liquid LQ1, and the first The second liquid LQ2 is not supplied when it does not face the liquid LQ1. In the present embodiment, when the first liquid LQ1 existing in the space SP between the lower surface 20 of the liquid immersion member 4 and the surface of the substrate P is in contact with the second supply port 22, the second supply port 22 is in contact with the space SP. Supply liquid LQ2.

  FIG. 5 is a schematic view showing the vicinity of the porous member 30. As shown in FIG. 5, in the present embodiment, the porous member 30 is a plate-like member, and has a first surface 31 and a second surface 32 facing the opposite direction of the first surface 31. The hole 33 of the porous member 30 is formed so as to connect the first surface 31 and the second surface 32. A plurality of holes 33 are formed. A plurality of holes 33 are arranged around the optical path K. A plurality of holes 33 are arranged in the radial direction with respect to the optical path K.

  In the present embodiment, the porous member 30 has an opening (second supply port) such that the first surface 31 faces the space SP and the second surface 32 faces the second liquid supply channel 28A. 22 is arranged. The space SP is a space between the first surface 31 (lower surface 20) and the surface of the substrate P (object). At least a part of the first liquid LQ1 in the immersion space LS can flow in the space SP.

  In the present embodiment, when the first surface 31 faces the first liquid LQ1, the second liquid LQ2 is supplied from the hole 33 in the first surface 31, and the first surface 31 does not face the first liquid LQ1. The pressure difference between the first surface 31 and the second surface 32 is adjusted so that the second liquid LQ2 is not supplied from the hole 33 in the first surface 31. In the present embodiment, the pressure in the space SP is adjusted by the chamber apparatus 100 and is substantially constant. In the present embodiment, the pressure in the space SP is atmospheric pressure. Note that the pressure in the space SP may not be atmospheric pressure. Further, it may not be adjusted by the chamber apparatus 100. In the present embodiment, the adjustment of the pressure difference between the first surface 31 and the second surface 32 includes the adjustment of the pressure of the second liquid supply channel 28A. In the present embodiment, the control device 5 uses the pressure adjusting device 29P of the second liquid supply device 29 to adjust the pressure of the second liquid supply flow path 28A, so that the first surface 31 and the second surface 32 Adjust the pressure difference.

  In the present embodiment, when the first liquid LQ1 in the space SP comes into contact with the second supply port 22 (hole 33), the first liquid 31 is supplied from the hole 33 to the space SP. The pressure difference with the second surface 32 is adjusted.

  In the present embodiment, the control device 5 is supplied with the second liquid LQ2 from the hole 33 when the first liquid LQ1 comes into contact with the hole 33 according to the characteristics of the first liquid LQ1 and the characteristics of the porous member 30. The pressure of the second liquid supply channel 28A is adjusted so that the second liquid LQ2 is not supplied from the hole 33 when the first liquid LQ1 does not contact the hole 33. In other words, in the present embodiment, the second liquid LQ2 is supplied only from the hole 33 in contact with the first liquid LQ1, and the second liquid LQ2 is not supplied from the hole 33 not in contact with the first liquid LQ1. In addition, the pressure difference between the first surface 31 and the second surface 32 is adjusted.

  In the present embodiment, by controlling the pressure difference between the first surface 31 and the second surface 32 to satisfy a predetermined condition described later, only the hole 33 of the porous member 30 in contact with the first liquid LQ1 is formed. Accordingly, the second liquid LQ2 is supplied from the second liquid supply channel 28A to the space SP.

    In FIG. 5, the substrate P is disposed so as to face the porous member 30 with a gap therebetween, and a space SP in which the first liquid LQ1 can flow is formed between the first surface 31 and the surface of the substrate P. . FIG. 5 illustrates a state in which the gas-liquid interface LG of the first liquid LQ1 in the immersion space LS is formed between the first surface 31 of the porous member 30 and the surface of the substrate P. In FIG. 5, a gas space and a liquid space are formed between the porous member 30 and the substrate P. In FIG. 5, the liquid space is an immersion space LS. The gas space is a space outside the liquid space (immersion space LS) between the porous member 30 and the substrate P.

  In FIG. 5, a gas space is formed between the first hole 33 a of the porous member 30 and the substrate P. A liquid space is formed between the second hole 33 b of the porous member 30 and the substrate P. Further, the second liquid supply channel 28A that the second surface 32 faces is filled with the second liquid LQ2. The upper end of the first hole 33a and the upper end of the second hole 33b are in contact with the second liquid LQ2 of the second liquid supply channel 28A and are covered with the second liquid LQ2 of the second liquid supply channel 28A. In the following description, the second liquid supply channel 28A is appropriately referred to as a channel space.

5, the pressure of the space SP between the first hole 33a of the porous member 30 and the substrate P (pressure of the first surface 31 of the porous member 30) is Pa, and the pressure of the flow path space above the porous member 30 ( The pressure at the second surface 32 of the porous member 30 is Pb, the hole diameter (diameter) of the holes 33a and 33b is d, the contact angle of the inner surface 33S of the hole 33 with respect to the second liquid LQ2 (first liquid LQ1) is θ, When the surface tension of the two liquid LQ2 (first liquid LQ1) is γ, in this embodiment,
(4 × γ × cos θ) / d ≧ (Pa−Pb) (1)
Satisfy the conditions. In the formula (1), the hydrostatic pressure of the second liquid LQ2 on the porous member 30 is not taken into consideration for the sake of simplicity.

  In the present embodiment, the inner surface 33S of the hole 33 is liquid repellent with respect to the second liquid LQ2. In the present embodiment, the contact angle of the inner surface 33S of the hole 33 with respect to the second liquid LQ2 is 90 degrees or more. In the present embodiment, the contact angle of the inner surface 33S of the hole 33 with respect to the second liquid LQ2 is 110 degrees or more.

  When the above-described condition is satisfied, the second liquid LQ2 in the flow path space flows (supplied) into the space SP through the hole 33 (33b) with which the first liquid LQ1 is in contact. On the other hand, the second liquid LQ2 in the flow path space is suppressed from flowing (supplied) into the space through the hole 33 (33a) where the first liquid LQ1 is not in contact. That is, the first liquid LQ1 is brought into contact by adjusting at least one of the contact angle θ, the hole diameter d, the surface tension γ of the liquid LQ, the pressure Pa, and Pb so as to satisfy the condition of the above formula (1). The second liquid LQ2 is supplied only from the hole 33 (33b), and the supply of the second liquid LQ2 from the hole 33 (33a) not in contact with the first liquid LQ1 is stopped.

    In the present embodiment, the pressure Pa of the space, the diameter d of the hole 33, the contact angle θ of the inner surface 33S of the hole 33 with respect to the liquid LQ, and the surface tension γ of the liquid LQ are constant. The control device 5 uses the second liquid supply device 29 to fill the second supply flow path 28 (second liquid supply flow path 28A) filled with the second liquid LQ2 so as to satisfy the condition of the above-described expression (1). The pressure difference between the first surface 31 and the second surface 32 is adjusted.

  For example, the control device 5 may adjust the pressure difference between the first surface 31 and the second surface 32 by adjusting the pressure of the space SP using the chamber device 100, or the chamber device 100 and the second device 32. The pressure difference between the first surface 31 and the second surface 32 may be adjusted by adjusting the pressures of both the space SP and the channel space (second liquid supply channel 28A) using the liquid supply device 29. .

  Further, as shown in FIG. 4, in this embodiment, the porous member 50 disposed in the recovery port 23 is connected to the third surface 34 facing the space SP in which the first liquid LQ1 flows and the liquid recovery flow channel 26A. It has a fourth surface 35 that faces, and a plurality of holes 36 that connect the third surface 34 and the fourth surface 35. In the present embodiment, at least a part of the first liquid LQ1 is recovered through the porous member 50 due to the pressure difference between the third surface 34 and the fourth surface 35. The control device 5 adjusts the pressure difference between the third surface 34 and the fourth surface 35 by using the liquid recovery device 27 (pressure adjusting device 27P) to adjust the pressure in the liquid recovery flow path 26A. The control device 5 makes the pressure of the liquid recovery flow path 26 </ b> A (pressure of the fourth surface 35) lower than the pressure of the space SP (pressure of the third surface 34) so that the third surface 34 and the fourth surface 35 The liquid LQ can be recovered through the porous member 50 by generating the pressure difference. The control device 5 may adjust the pressure in the space SP using the chamber device 100 to adjust the pressure difference between the third surface 34 and the fourth surface 35, or the chamber device 100 and the liquid recovery device. The pressure difference between the third surface 34 and the fourth surface 35 may be adjusted by adjusting the pressures of both the liquid recovery flow path 26 </ b> A and the space SP using both of them.

  Note that only the liquid LQ in the space SP may be recovered through the porous member 50, or both the liquid LQ and the gas in the space SP may be recovered. An example of a technique for adjusting the pressure difference between one surface and the other surface of the porous member so that only the liquid is recovered through the porous member is disclosed in U.S. Pat. No. 7,292,313 and U.S. Patent Application Publication. No. 2006/0152697, which is incorporated herein by reference in its entirety.

  Next, an example of a method for exposing the substrate P using the exposure apparatus EX having the above-described configuration will be described.

  The control device 5 supplies the first liquid LQ1 from the first supply port 21 in a state where the emission surface 11 and the lower surface 20 are opposed to the surface of the substrate P (or the upper surface 17 of the substrate stage 2). Further, the control device 5 starts recovery using the recovery port 23. The first liquid LQ1 supplied from the first supply port 21 is supplied to the optical path K of the exposure light EL emitted from the emission surface 11. At least a part of the first liquid LQ1 supplied from the first supply port 21 is supplied between the flat surface 4T and the surface of the substrate P through the opening 4K, and the flat surface 4T and the surface of the substrate P are in contact with each other. Held in between. Further, at least a part of the first liquid LQ1 is held between the third surface 34 of the porous member 50 and the surface of the substrate P. At least a part of the first liquid LQ1 that has contacted the third surface 34 of the porous member 50 is recovered through the holes 36 of the porous member 50. As a result, the first liquid LQ1 supplied from the first supply port 21 fills the optical path K of the exposure light EL between the emission surface 11 and the surface of the substrate P with the first liquid LQ1. An immersion space LS is formed between at least a part of the lower surface 20 and the surface of the substrate P.

  Further, the control device 5 fills the second liquid supply channel 28A with the second liquid LQ2 delivered from the second liquid supply device 29, and satisfies the condition of the above-described formula (1). The pressure of the supply flow path 28A is adjusted. In a state where the first liquid LQ1 is not in contact with the first surface 31, the second liquid LQ2 in the second liquid supply channel 28A is not moved to the space SP through the hole 33. In other words, in a state where the first liquid LQ1 is not in contact with the first surface 31, the second liquid LQ2 in the second liquid supply channel 28A does not fall onto the surface of the substrate P through the hole 33.

  The control device 5 executes the supply of the first liquid LQ1 from the first supply port 21 and the recovery of the liquid LQ from the recovery port 23 in parallel, and exposure light between the emission surface 11 and the substrate P. The immersion space LS is formed so that the EL optical path is filled with the first liquid LQ1. The control device 5 executes the recovery of the liquid LQ from the recovery port 23 in parallel with the supply of the first liquid LQ1 from the first supply port 21, and a part of the surface of the substrate P is locally localized in the first liquid LQ1. In the state where the immersion space LS is formed so as to be covered, exposure of the substrate P is started.

    The control device 5 emits the exposure light EL from the illumination system IL and illuminates the mask M with the exposure light EL. The exposure light EL from the mask M is emitted from the emission surface 11 of the projection optical system PL. The control device 5 irradiates the substrate P with the exposure light EL from the emission surface 11 through the first liquid LQ1 in the immersion space LS between the emission surface 11 and the substrate P. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed with the exposure light EL. During the exposure of the substrate P, the supply of the first liquid LQ1 from the first supply port 21 and the recovery of the liquid LQ from the recovery port 23 are performed in parallel. The recovery port 23 recovers at least a part of the liquid LQ in the immersion space LS outside the optical path K.

    As described above, the exposure apparatus EX of the present embodiment is a scanning exposure apparatus. In at least a part of the exposure of the substrate P, the first liquid LQ1 is held between at least a part of the emission surface 11 and the lower surface 20 and the substrate P (in a state where the immersion space LS is formed). The substrate P is moved in a predetermined direction in the XY plane. For example, during irradiation of the exposure light EL to the substrate P (during scan exposure), the substrate P moves in the Y axis direction with respect to the last optical element 12 and the liquid immersion member 4. Further, in the case where a plurality of shot areas on the substrate P are sequentially exposed, when the next second shot area is exposed after the exposure of the first shot area, the substrate P is placed on the terminal optical element 12 and the liquid immersion member 4. On the other hand, it moves (step movement), for example, in the X-axis direction or in an inclination direction with respect to the X-axis in the XY plane. The substrate P is not limited to movement during scan exposure and step movement, and the substrate P moves under various movement conditions while holding the first liquid LQ1 between at least part of the emission surface 11 and the lower surface 20. there is a possibility.

    The movement conditions of the substrate P are the movement speed, acceleration (deceleration), and movement distance (movement when moving from the first position to the second position in the XY plane) in a predetermined direction (for example, -Y direction) in the XY plane. At least one of (distance).

    In the present embodiment, when the second supply port 22 arranged outside the recovery port 23 with respect to the optical path K faces the first liquid LQ1, the second liquid LQ2 is supplied from the second supply port 22; Since the second liquid LQ2 is not supplied from the second supply port 22 when the second supply port 22 does not face the first liquid LQ1, for example, when the substrate P (substrate stage 2) is moved at high speed or high acceleration In addition, it is possible to prevent the liquid LQ from leaking out of the space SP between the liquid immersion member 4 and the substrate P or the liquid LQ (film, droplets, etc.) remaining on the substrate P.

    FIG. 6 is a schematic diagram showing the behavior of the immersion space LS when the immersion member 400 according to the comparative example is used. The liquid immersion member 400 is not provided with the second supply port (22). When the substrate L moves at high speed in the −Y direction with the liquid Lq held between the last optical element 12 and the liquid immersion member 400 and the surface of the substrate p, the liquid on the −Y side with respect to the optical path K There is a high possibility that at least part of the liquid Lq forming the immersion space Ls is thinned on the substrate p. That is, in the comparative example shown in FIG. 6, the upper end of the gas-liquid interface Lg of the liquid Lq (the gas-liquid interface Lg and the liquid immersion member 400) in the radial direction with respect to the optical axis AX due to the movement of the substrate p in the −Y direction. There is a possibility that the distance (deviation amount) LJ between the position PJ1 at the intersection with the lower surface 420 and the position PJ2 at the lower end of the gas-liquid interface Lg (the intersection between the gas-liquid interface Lg and the surface of the substrate p) may increase. As a result, the liquid Lq may be thinned on the substrate P. The thinned liquid LQ cannot come into contact with the recovery port (porous member), and as a result, there is a high possibility that the liquid LQ will not be recovered from the recovery port, and the space between the liquid immersion member 400 and the surface of the substrate P is increased. The possibility of leaking out or remaining on the substrate p increases.

    7 and 8 are schematic views for explaining the behavior of the liquid immersion space LS when the liquid immersion member 4 according to the present embodiment is used. FIG. 7 shows the behavior of the immersion space LS when the substrate P moves in the −Y direction while the liquid LQ is held between at least a part of the emission surface 11 and the lower surface 20 and the surface of the substrate P. 8 and 8 are diagrams illustrating the behavior of the immersion space LS when the substrate P moves in the + Y direction.

  In the present embodiment, since the second supply port 22 provided outside the recovery port 23 with respect to the optical path K supplies the second liquid LQ2 between the lower surface 20 and the surface of the substrate P, the lower surface 20 and the substrate The thinning of the first liquid LQ1 between the P surfaces can be prevented. Since the second supply port 22 supplies the second liquid LQ2 when facing the first liquid LQ1, the first liquid LQ1 can be prevented from being thinned.

  For example, as shown in FIG. 7, when the substrate P moves in the −Y direction, the gas-liquid interface LG of the liquid LQ in the immersion space LS also moves in the −Y direction as the substrate P moves. In the present embodiment, when the gas-liquid interface LG moves in the −Y direction and the first liquid LQ1 in the immersion space LS contacts the hole 33 (second supply port) of the porous member 30, the first liquid LQ1. The second liquid LQ is supplied from the hole 33 (second supply port) of the porous member 30 with which is contacted. The second liquid LQ2 from the hole 33 (second supply port) of the porous member 30 is supplied to the immersion space LS. Thereby, the thin film formation of the first liquid LQ1 is suppressed.

  The second liquid LQ2 supplied from the second supply port 22 (hole 33) is recovered from the recovery port 23 together with the first liquid LQ1 supplied from the first supply port 21.

  The hole 33 (second supply port) of the porous member 30 is disposed at a position where at least part of the first liquid LQ1 in the immersion space LS can come into contact with the first liquid LQ1 in the immersion space LS before thinning. Has been. In other words, the size of the recovery port 23 in the radial direction with respect to the optical path K according to the movement condition of the substrate P so that the first liquid LQ1 in the immersion space LS can continue to contact the porous member 50 of the recovery port 23. The second supply port 22 is disposed around the collection port 23. Therefore, the first liquid LQ1 can contact the hole 33 of the porous member 30 before the first liquid LQ1 in the immersion space LS is thinned. Then, when the first liquid LQ1 contacts the hole 33 of the porous member 30, the second liquid LQ2 is supplied from the hole 33 to the immersion space LS. Thereby, the thin film formation of the first liquid LQ1 is suppressed.

  In the present embodiment, when the position PJ2 at the lower end of the gas-liquid interface LG of the liquid LQ moves in the -Y direction, before the distance (deviation amount) LJ between the position PJ1 at the upper end and the position PJ2 at the lower end increases. The position PJ1 of the upper end contacts the hole 33 of the porous member 30, and the second liquid LQ2 is supplied from the hole 33 to the immersion space LS. That is, the second liquid LQ2 is supplied from the hole 33 (second supply port 22) of the porous member 30 facing the substrate P before the shift amount LJ increases due to the movement of the substrate P, and thus the first liquid LQ1. Can be reduced.

  In the present embodiment, a plurality of second supply ports 22 (holes 33 of the porous member 30) are arranged in the radial direction with respect to the optical path K, and at least a predetermined direction in which the substrate P moves (Y-axis direction in FIG. 7). ). Therefore, even if the gas-liquid interface LG moves in the −Y direction as the substrate P moves, the second liquid LQ2 is supplied from the hole 33 corresponding to the position of the gas-liquid interface LG. Therefore, for example, even if the movement distance of the substrate P in the −Y direction becomes long, the second liquid LQ2 can be supplied from the plurality of holes 33 to the immersion space LS, so that the thinning of the first liquid LQ1 is suppressed. be able to.

  As shown in FIG. 8, when the substrate P moves in the + Y direction, the gas-liquid interface LG of the liquid LQ in the immersion space LS also moves in the + Y direction as the substrate P moves. For example, when the substrate P moves in the + Y direction after the substrate P moves in the −Y direction as shown in FIG. 7, the thinning of the first liquid LQ1 in the immersion space LS on the −Y side with respect to the optical path K is reduced. It is suppressed. Further, as shown in FIG. 8, when the substrate P moves in the + Y direction (or when the substrate P is almost stationary), the first liquid LQ1 in the immersion space LS flows between the hole 33 of the porous member 30 and the substrate P. There may be situations that do not exist between the surface. That is, there is a possibility that the hole 33 of the porous member 30 does not face (not contact) the first liquid LQ1. As shown in FIG. 8, in this embodiment, when the hole 33 of the porous member 30 does not face (not contact) the first liquid LQ1, the hole 33 (second supply port 22) of the porous member 30 is 2 Liquid LQ2 is not supplied. Therefore, for example, the supply of the second liquid LQ2 to the outside of the gas-liquid interface LG of the immersion space LS is suppressed. In the present embodiment, since the inner surface 33S of the hole 33 is liquid repellent with respect to the second liquid LQ2, the supply of the second liquid LQ2 to the outside of the gas-liquid interface LG is sufficiently suppressed. Therefore, it is possible to suppress the second liquid LQ2 from being scattered, the second liquid LQ2 remaining on the substrate P, and the outflow from the space SP between the liquid immersion member 4 and the substrate P.

  In the present embodiment, since the liquid immersion member 4 has the connection flow path 60, the liquid LQ is interposed between the liquid recovery flow path 26A and the second liquid supply flow path 28A via the connection flow path 60. Is distributed. In the present embodiment, the second liquid supply channel 28A is filled with the second liquid LQ2 supplied from the second liquid supply device 29. Further, the liquid LQ in the space SP is recovered from the recovery port 23, and the liquid recovery flow path 26A is also filled with the liquid LQ. Therefore, while the recovery operation of the liquid LQ from the recovery port 23 and the supply operation of the second liquid LQ2 from the second supply port 22 are performed satisfactorily, the liquid recovery flow channel 26A and the second recovery channel 26A are connected via the connection flow channel 60. The liquid LQ is circulated between the liquid supply channel 28A.

  By flowing the liquid LQ between the liquid recovery channel 26A and the second liquid supply channel 28A via the connection channel 60, for example, the liquid recovery channel 26A and the second liquid supply channel 28A At least one of the liquid LQ can be prevented from stagnating, staying, or slowing down the flow rate. Therefore, for example, the clean second liquid LQ2 can be continuously supplied from the second supply port 22. Further, it is possible to suppress the temperature of the liquid immersion member 4 from being changed due to the stagnation or retention of the liquid LQ. For example, even when the recovery port 23 (the porous member 50) recovers the gas together with the liquid LQ from the space SP, the second liquid LQ2 of the second liquid supply channel 28A whose temperature is adjusted passes through the connection channel 60. Therefore, the temperature change due to the heat of vaporization can be suppressed.

    In the above description, the case where the immersion space LS of the liquid LQ is formed on the substrate P has been described. However, the substrate stage 2 (plate member T) or the substrate stage 2 (plate member T) and the substrate are described. The same applies to the case where the immersion space LS of the liquid LQ is formed so as to straddle P.

    As described above, according to the present embodiment, the second liquid LQ2 is supplied when facing the first liquid LQ1, and the second supply port not supplying the second liquid LQ2 when not facing the first liquid LQ1. 22 is provided, it is possible to prevent the liquid LQ from flowing out or the liquid LQ from remaining on the object (substrate P, substrate stage 2, etc.). Therefore, the occurrence of defective exposure and the occurrence of defective devices can be suppressed.

  In addition, since the connection flow path 60 is provided, it is possible to prevent the contaminated liquid LQ from being supplied or a temperature change from occurring.

  Note that the shape (structure) of the porous member 50 disposed in the recovery port 23 and the porous member 30 disposed in the second supply port 22 may be the same or different. For example, the size of the hole 36 included in the porous member 50 and the size of the hole 33 included in the porous member 30 may be the same or different. Further, the shape of the hole 36 and the shape of the hole 33 may be the same or different. Further, the number of holes 36 per unit area that the porous member 50 has and the number of holes 33 per unit area that the porous member 30 has may be the same or different. Further, the thickness of the porous member 50 (distance between the third surface 34 and the fourth surface 35) and the thickness of the porous member 30 (distance between the first surface 31 and the second surface 32) may be the same or different. May be.

  In the present embodiment, the flat surface 4T, the third surface 34 of the porous member 50, and the first surface 31 of the porous member 30 are arranged in substantially the same plane. The 3rd surface 34 may be arrange | positioned upwards with respect to 4T, and may be arrange | positioned below. For example, the first surface 31 may be disposed above or below the third surface 34. Further, there may be a step on at least one of the first surface 31 and the third surface 34. Further, at least a part of the first surface 31 and the third surface 34 may be inclined with respect to the XY plane, or may include a curved surface.

  In the above-described embodiment, the inner surface 33S of the hole 33 of the porous member 30 is liquid repellent with respect to the liquid LQ. However, if the desired performance can be exhibited, the contact angle of the inner surface 33S with respect to the liquid LQ. However, it may be about 90 degrees or 90 degrees or less.

  In the above-described embodiment, the first surface 31 of the porous member 30 may be liquid repellent or lyophilic with respect to the liquid LQ. The second surface 32 may be liquid repellent or lyophilic with respect to the liquid LQ. Further, the third surface 34 of the porous member 50 may be liquid repellent or lyophilic with respect to the liquid LQ. The fourth surface 35 may be liquid repellent or lyophilic with respect to the liquid LQ. The inner surface of the hole 36 of the porous member 50 is preferably lyophilic with respect to the liquid LQ. Here, the liquid repellency with respect to the liquid LQ includes a surface state in which the contact angle with respect to the liquid LQ is larger than 90 degrees. The lyophilicity with respect to the liquid LQ includes a surface state in which the contact angle with respect to the liquid LQ is smaller than 90 degrees.

  In the above-described embodiment, the porous member disposed in the recovery port 23 and the porous member disposed in the second supply port 22 may be separate or integrated.

  In the above-described embodiment, the connection channel 60 is formed in a part of the partition wall 61. However, for example, a connection channel is formed between the lower end surface of the partition wall 61 and the upper surface of the porous member. May be.

  In the present embodiment, the porous member 30 (mesh filter) is disposed as the second supply port 22, but the porous member 30 may not be used. Further, the porous member 50 may not be used as the recovery port 23.

  In the above-described embodiment, the size of the end (opening) of the connection channel 60 facing the liquid recovery channel 26A and the end (opening) of the connection channel 60 facing the second liquid supply channel 28A. May be the same size or different. Also, the shape may be different.

  In the above-described embodiment, the recovery port 23 and the second supply port 22 are provided in one member (the liquid immersion member 4), but the liquid immersion member 4 includes the recovery port 23 and A first member having the liquid recovery flow path 26 </ b> A and a second member having the second supply port 22 and the second liquid supply flow path 28 may be included. Further, the first member and the second member may be arranged apart from each other. In that case, the first member and the second member are connected by a connecting pipe, and the connecting flow formed by the connecting pipe forms the liquid recovery flow path 26A of the first member and the second liquid supply flow path 28A of the second member. You may connect by a road.

  In the above-described embodiment, an air supply port for supplying gas may be provided outside the second supply port 22 in the radiation direction with respect to the optical path. The gas supplied from the air supply port can prevent the liquid LQ from flowing out or remaining.

    In the above-described embodiment, the optical path on the exit side (image plane side) of the terminal optical element 12 of the projection optical system PL is filled with the first liquid LQ1, but for example, in WO 2004/019128 Pamphlet As disclosed, it is possible to employ a projection optical system PL in which the optical path on the incident side (object plane side) of the last optical element 12 is also filled with the first liquid LQ1.

    In each of the above-described embodiments, water is used as the first liquid LQ1, but a liquid other than water may be used. As the first liquid LQ1, a photosensitive material (photoresist) that is transmissive to the exposure light EL, has a high refractive index with respect to the exposure light EL, and forms the surface of the projection optical system PL or the substrate P, etc. Those which are stable with respect to these films are preferred. For example, as the first liquid LQ1, a fluorinated liquid such as hydrofluoroether (HFE), perfluorinated polyether (PFPE), or fomblin oil can be used. In addition, various fluids such as a supercritical fluid can be used as the first liquid LQ1.

  In each of the above-described embodiments, the second liquid LQ2 is the same type as the first liquid LQ1, but may be a different type. For example, the first liquid LQ1 may be water (pure water) and the second liquid LQ2 may be a fluorinated liquid.

    As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

    As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

    Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

    Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot area on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

    Further, the exposure apparatus EX is a twin stage type having a plurality of substrate stages as disclosed in, for example, US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. The exposure apparatus may be used. In this case, the immersion space LS can be formed on each substrate stage or across a plurality of substrate stages. A supply port that supplies the second liquid LQ2 when facing the first liquid LQ1 and does not supply the second liquid LQ2 when not facing the first liquid LQ1 is provided in each of the plurality of substrate stages. Alternatively, it may be provided on some substrate stages.

    In addition, the exposure apparatus EX has a substrate stage for holding a substrate and a reference mark as disclosed in, for example, US Pat. No. 6,897,963 and US Patent Application Publication No. 2007/0127006. An exposure apparatus including a reference member and / or various photoelectric sensors and a measurement stage that does not hold the substrate to be exposed may be used. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages. In this case, the immersion space LS can be formed on the measurement stage or across the substrate stage and the measurement stage. Further, a supply port that supplies the second liquid LQ2 when facing the first liquid LQ1 and does not supply the second liquid LQ2 when not facing the first liquid LQ1 may be arranged on the measurement stage.

    The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

    In each of the above-described embodiments, the position information of each stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited to this. For example, a scale (diffraction grating) provided in each stage You may use the encoder system which detects this.

    In the above-described embodiment, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. As disclosed in US Pat. No. 6,778,257, a variable shaped mask (also called an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. ) May be used. Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.

    In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL. For example, an immersion space can be formed between an optical member such as a lens and the substrate, and the substrate can be irradiated with exposure light through the optical member.

    Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

    The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

    As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204, including substrate processing (exposure processing) including exposing the substrate with exposure light from the pattern of the mask and developing the exposed substrate according to the above-described embodiment, It is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.

    Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

DESCRIPTION OF SYMBOLS 2 ... Substrate stage, 4 ... Liquid immersion member, 20 ... Lower surface, 21 ... 1st supply port, 22 ... 2nd supply port, 23 ... Recovery port, 26 ... Recovery flow path, 26A ... Liquid recovery flow path, 27 ... Liquid Recovery device, 27A ... pressure adjustment device, 28 ... second supply flow channel, 28A ... second liquid supply flow channel, 29 ... second liquid supply device, 29P ... pressure adjustment device, 30 ... porous member, 31 ... first surface 32 ... second surface, 33 ... hole, 33S ... inner surface, 34 ... third surface, 35 ... fourth surface, 36 ... hole, 50 ... porous member, 60 ... connection channel, 61 ... partition wall, EL ... exposure light , EX ... exposure device, K ... optical path, LQ1 ... first liquid, LS ... immersion space, P ... substrate, SP ... space

Claims (19)

An immersion member that holds the first liquid between the object and forms an immersion space so that the optical path of the exposure light applied to the object is filled with the first liquid;
A recovery port for recovering at least a part of the first liquid on the object;
A supply port that is disposed outside the recovery port with respect to the optical path, supplies a second liquid when facing the first liquid, and does not supply the second liquid when not facing the first liquid;
A recovery channel through which at least a part of the first liquid recovered from the recovery port flows;
A supply flow path through which at least a part of the second liquid supplied to the supply port flows;
A connection channel connecting at least a part of the recovery channel and the supply channel;
An immersion member comprising:   The liquid immersion member according to claim 1, wherein the supply port supplies the second liquid when the first liquid comes into contact.   3. The liquid immersion member according to claim 1, wherein a surface of the object can be opposed to the supply port, and the second liquid is supplied when facing the first liquid on the object. A first porous member disposed at an end of the supply flow path;
The liquid supply member according to any one of claims 1 to 3, wherein the supply port includes an end of a hole of the first porous member.   The liquid immersion member according to claim 4, wherein an inner surface of the hole is liquid repellent with respect to the second liquid. The first porous member has a first surface facing a space in which the first liquid flows and a second surface facing the supply flow path,
The second liquid is supplied from the hole in the first surface when the first surface faces the first liquid, and in the first surface when the first surface does not face the first liquid. The liquid immersion member according to claim 4 or 5, wherein a pressure difference between the first surface and the second surface is adjusted so that the second liquid is not supplied from the hole.   The liquid immersion member according to claim 6, wherein the adjustment of the pressure difference includes adjustment of a pressure of the supply flow path. A holding surface that is disposed on at least a part of the periphery of the optical path and holds the first liquid between the surface of the object so that the optical path is filled with the first liquid;
The liquid immersion member according to any one of claims 4 to 7, wherein the holding surface includes a surface of the first porous member.   The supply port supplies the second liquid between the holding surface and the surface of the object to prevent thinning of the first liquid between the holding surface and the surface of the object. The liquid immersion member according to 8. A holding surface that is disposed on at least a part of the periphery of the optical path and holds the first liquid between the surface of the object so that the optical path is filled with the first liquid;
The supply port supplies the second liquid between the holding surface and the surface of the object to prevent thinning of the first liquid between the holding surface and the surface of the object. The liquid immersion member according to any one of 1 to 7. In a state where the liquid is held between the holding surface and the surface of the object, the object is moved in a predetermined direction within a predetermined plane substantially parallel to the holding surface,
The liquid supply member according to claim 8, wherein a plurality of the supply ports are arranged in the predetermined direction. A second porous member disposed at an end of the recovery channel;
The liquid immersion member according to claim 1, wherein the recovery port includes an end of a hole of the second porous member. The second porous member has a third surface facing a space in which the first liquid flows, and a fourth surface facing the recovery flow path,
The liquid immersion member according to claim 12, wherein at least a part of the first liquid is recovered through the second porous member due to a pressure difference between the third surface and the fourth surface.   The liquid immersion member according to claim 1, wherein the second liquid is the same type as the first liquid. An exposure apparatus that exposes a substrate with exposure light through a first liquid,
An exposure apparatus comprising the liquid immersion member according to claim 1. Exposing the substrate using the exposure apparatus according to claim 15;
Developing the exposed substrate. A device manufacturing method. An exposure method for exposing a substrate with exposure light through a first liquid,
Forming an immersion space so that the optical path of the exposure light between the emission surface of the optical member and the surface of the substrate is filled with the first liquid;
Irradiating the substrate with the exposure light from the exit surface via the first liquid in the immersion space;
Recovering at least a portion of the first liquid in the immersion space from the recovery port outside the optical path;
When a supply port arranged outside the recovery port with respect to the optical path faces the first liquid, the second liquid is supplied from the supply port, and when the supply port does not face the first liquid Not supplying the second liquid from the supply port;
Via a connection channel connecting a recovery channel through which at least a part of the first liquid recovered from the recovery port flows and a supply channel through which at least a part of the second liquid supplied to the supply port flows An exposure method comprising: flowing at least one of the first liquid and the second liquid between the supply channel and the recovery channel. The supply port includes an end portion of a hole of a porous member disposed at an end portion of the supply flow path,
The exposure method according to claim 17, wherein an inner surface of the hole is liquid repellent with respect to the second liquid. Exposing the substrate using the exposure method according to claim 17 or 18,
Developing the exposed substrate. A device manufacturing method.

Images